In this study, two types of chemical mechanical polishing wastewaters (designated Cu-CMP wastewater and mixed-CMP wastewater, respectively) from a wafer fabrication plant was treated by a simultaneous electrocoagulation/electrofiltration (EC/EF) process using laboratory-prepared TiO2/Al2O3 composite membranes. First, tubular membrane supports of Al2O3 were prepared by the extrusion method. Then the slip composed of nanoscale TiO2 (prepared by sol-gel process) and 1 wt% of corn starch was applied on the aforementioned tubular membrane supports by the dip-coating method, followed by sintering to obtain tubular TiO2/Al2O3 composite membranes. These tubular inorganic composite membranes then were incorporated into an EC/EF treatment module for the treatment of CMP wastewaters. The permeate qualities were evaluated. In addition, the effects of different operating modes (i.e., the flow-through mode and recirculation mode) on membrane flux and permeate quality were conducted. Finally, the effects of changing the backwash time and backwash cycle on the membrane flux were also investigated. Experimental results have shown that the slip containing 75 v/v% of TiO2 sol and 25 v/v% of corn starch solution would yield a membrane layer with a thickness of 13 £gm and a pore size of 15 nm. On the CMP wastewater treatment, the removal efficiencies of copper ion and total organic carbon (TOC) were found to increase with the increasing electric field strength. This relationship, however, did not apply to other water quality items. Under the optimal operating conditions of using the recirculation mode, the removal efficiencies for turbidity and TOC for Cu-CMP wastewater were determined to be 98% and 90%, respectively. Similarly, a turbidity of < 1 NTU (a removal efficiency of 99%) was obtained for mixed-CMP wastewater. By using the same optimal operating conditions for the recirculation mode to treat Cu-CMP wastewater, initial fluxes of 300 L/h¡Em2 and 280 L/h¡Em2 were obtained for the flow-through mode and recirculation mode, respectively. The corresponding initial fluxes for mixed-CMP wastewater were 370 L/h¡Em2 and 360 L/h¡Em2, respectively. For the case of the recirculation mode, the removal efficiencies of total solids content, silicon, copper ion, TOC, and turbidity for Cu-CMP wastewater were 71%, 85%, 72%, 90% and 99%, respectively. The corresponding removal efficiencies of 68%, 88%, 78%, 90% and 99%, respectively were determined for the case of the flow-through mode. On the other hand, the removal efficiencies of total solids content, silicon, TOC, and turbidity for mixed-CMP wastewater using the recirculation mode were 76%, 84%, 78% and 99%, respectively; whereas 78%, 86%, 72% and 99%, respectively for the flow-through mode. Based on the above findings, the operating mode is not a significant parameter in influencing the membrane flux and quality. Permeate obtained in this work was found to be recyclable for the use in irrigation and make-up water for cooling towers. Backwashing was found to be important to the membrane flux in this study.

The goal of this thesis is to develop a novel polishing tool system. This system can be attached to a CNC machine and execute a precision polishing job mainly for an axially symmetric free surface. The precision polishing job is to remove the error surface profile on the work to improve its form precision, which was left by the previous machining process. An inferential rule, which was based on a top-down planning strategy, was utilized to gradually decompose the design goals of the tool system to facilitate the process for generating all of the possible design proposals. The major design goal is to render all the rotational axes of the tool system to exactly intersect at the tool center. To analyze the effects of the structure and interface stiffness of tool system on the major goal, the finite element method was adopted. Further, the homogeneous transformation scheme is applied to establish the forward kinematic error of the designed system and to analyze the effect of different manufacturing and assembly errors on the major goal.Accordingly, two novel polishing tool systems were developed. The simulation study indicated that the total errors after assembly at the tool center and the two rotation axes were dominated by the stiffness at the interfaces of the tool system, in addition to the influence of structure stiffness. An assembly strategy was then proposed in the study to reduce the total error.

Thesis (M.S.)--University of Missouri, School of Mines and Metallurgy, 1940. / The entire thesis text is included in file. Typescript. Illustrated by author. Title from title screen of thesis/dissertation PDF file (viewed March 9, 2010) Includes bibliographical references (p. 60-62) and index (p. 63-64).

Not available / text

No description available.

This dissertation presents a series of studies relating to kinetics and kinematics of inter-layer dielectric and metal chemical mechanical planarization processes. These are also evaluated with the purposes of minimizing environmental and cost of ownership impact.The first study is performed to obtain the real-time substrate temperature during the polishing process and is specifically intended to understand the temperature distribution across the polishing wafer during the chemical mechanical planarization process. Later, this technique is implemented to study the effect of slurry injection position for optimum slurry usage. It is known that the performance of chemical mechanical planarization depends significantly on the polishing pad and the kinematics involved in the process. Variations in pad material and pad grooving type as well as pressure and sliding velocity can affect polishing performance. One study in this dissertation investigates thermoset and thermoplastic pad materials with different grooving methods and patterns. The study is conducted on multiple pressure and sliding velocity variations to understand the characteristic of each pad. The analysis method elaborated in this study can be applied generically.A subsequent study focuses in a slurry characterization technique. Slurry, a critical component in chemical mechanical planarization, is typically a water-based dispersion of fine abrasive particles with various additives to control material removal rate and microscratches. Simultaneous turbidity and low angle light scattering methods under well-defined mixing conditions are shown to quantify the stability of abrasive particle from aggregations. Further contribution of this dissertation involves studies related to the spectral analysis of raw shear force and down force data obtained during chemical mechanical planarization. These studies implemented Fast Fourier Transforms to convert force data from time to frequency domain. A study is performed to detect the presence of larger, defect-causing particles during polishing. In a further application on diamond disc conditioning work is performed to achieve optimum break-in time and an optimum conditioning duty cycle. Studies on spectral analysis are also extended to planarization of shallow trench isolation pattern wafers to monitor the polishing progress in real-time.

No description available.

No description available.

No description available.

No description available.