Os resíduos de equipamentos elétricos e eletrônicos é um dos fluxos de resíduos que mais cresce no mundo. O aumento na produção destes equipamentos como resultado dos avanços tecnológicos e a sua rápida obsolescência promovem o aumento de geração deste tipo de resíduos. Portanto, este trabalho tem como objetivo estudar a recuperação de níquel presente no licor de lixiviação de placas de circuito impresso de telefones celulares obsoletos, através da aplicação de processos hidrometalúrgicos e eletrometalúrgico. Inicialmente, foram preparadas soluções sintéticas a partir da composição química do licor de lixiviação das frações magnética (MA) e não magnética (NMA) das placas de circuito impresso cominuídas. Os elementos presentes nas soluções são: ferro, zinco, níquel e alumínio. Posteriormente, foi realizada uma etapa de remoção do ferro, através de precipitação seletiva. A morfologia e a composição química do precipitado foram analisadas através de Microscopia Eletrônica de Varredura (MEV) e EDS, respectivamente. A composição química das soluções resultantes da precipitação foi determinada através da técnica de espectrofotometria de absorção atômica. Através do processo de precipitação conseguiu-se uma porcentagem de remoção de ferro na solução NMA de 99,6% e na solução MA de 99,9%, porém, observou-se também a coprecipitação de zinco, alumínio e níquel. Com as soluções resultantes desta etapa, foi realizada a purificação das soluções através de extração por solvente, utilizando Cyanex 272 como agente extratante. As variáveis estudadas nos ensaios de extração por solvente foram: pH, concentração do extratante, relação fase aquosa/orgânica (A/O) e temperatura. . Além disso, também foi determinado o número de contatos necessários para a extração de ferro, zinco e alumínio, obtendo assim, uma solução aquosa contendo unicamente níquel. Finalmente, foram realizados os ensaios de eletrodeposição para a obtenção de níquel metálico. Foi avaliado o efeito da temperatura sobre o filme depositado. A morfologia dos depósitos e a espessura da camada foram analisadas através do MEV, verificando que o aumento da temperatura influencia nas características do depósito obtido. / Electric and electronic waste (e-waste) is one of the fastest growing waste streams in the world. Continuous increasing production owing to the technological advances and the products consumption rise, all together with the rapid obsolescence of this scrap promotes the necessity of exchange and the increasing of generate waste. Therefore, the aim of this work is to study a recovering of nickel from leach liquor of cell phones printed circuit boards, through of hydrometallurgical and electrometallurgical process application. Firstly, was prepared synthetic solutions of both magnetic (MA) and nonmagnetic (NMA) fractions of printed circuit boards. The metal ions present in the synthetic solutions are: iron, zinc, nickel and aluminium. Afterwards was realized the iron removal stage, through both selective precipitation and solvent extraction process, in order to make a comparison of these techniques. The precipitates were analyzed across of scanning electron microscope (SEM), and the chemical composition of these solutions through atomic absorption spectrometry (AAS). With selective precipitation it was obtained 99,6% and 99,9% of iron removal with selective precipitation in NMA and MA solutions, respectively. Therefore, it was also observed co-precipitation of zinc, aluminium and nickel. With solutions after precipitation stage was carried out the solutions purification through solvent extraction using cyanex 272 as extractant. Solvent extraction test were studied different parameters, such as: equilibrium pH, extractant concentration, aqueous-organic (A/O) ratio and temperature. It was also determinates the stages number required for iron, zinc and aluminium extraction, to obtain nickel in aqueous solution uniquely. Finally, was carried out the electrodeposition test for obtain metallic nickel. Was analyzed the effect of temperature on the deposited layer. Surface Morphology and thickness of the deposits were evaluated by MEV, verifying that temperature increasing influences on deposited layer.

Abstract The demands toward the development of simple and cost-effective fabrication methods of metallic structures with high lateral resolution on different substrates - applied in many fields of technology, such as in microelectronics, optoelectronics, micromechanics as well as in sensor and actuator applications - gave the idea to perform this research. Due to its simplicity, laser-assisted chemical liquid-phase deposition (LCLD) has been investigated and applied for the metallization of surfaces having practical importance (Si, GaAs, SiO2, Si3N4, etc.) since the beginning of the 80s. By the invention of novel substrates (polyimide, porous silicon), it was adequate to work out new precursors or just adopt old ones and optimise LCLD in order to fabricate metallic micro-patterns upon these materials for various purposes. According to the motivations mentioned above, LCLD was utilized for the fabrication of palladium (Pd) micro-patterns on polyimide (PI), polyimide/copper flexible printed circuit boards (PCBs), fused silica (SiO2) and silicon (Si). The selective metallization of porous silicon (PS) has been carried out with nickel (Ni). Depending on the types of lasers, either the focusing (Ar+ laser beam) or diaphragm projection (KrF and XeCl excimer laser pulses) method was employed. In the course of the work, various precursors of the corresponding metals have been investigated and utilized. In the beginning, the pyrolytic decomposition of palladium-amine complex ions ([Pd(NH3)4]2+) on PI by a scanned and focused Ar+ laser beam was optimised and discussed. Thick (up to several micrometers) and narrow (~ 10 μm) Pd conductor lines with electrical conductivity close to that of the bulk were obtained. In the continuation of these investigations, the precursor was developed further. [Pd(NH3)4]2+ was mixed with the solution of formaldehyde (HCOH) in order to induce the reduction of the metal complex ions. To our knowledge, we were the first - so far - who applied this solution and described the reaction. With the proper choice of the laser parameters, thin Pd films as catalyst layers for electroless copper plating were deposited utilizing Ar+ and excimer lasers as well. The chemically plated copper deposits - upon the obtained Pd film - have excellent electrical and good mechanical properties. In the second part of the thesis, three practical applications (metallization of via holes drilled in PI/Cu flexible PCBs, end-mirror fabrication on single-mode optical fibers, and carbon nanotube growth on Pd activated Si and Si/SiO2 substrates) of Pd LCLD were realized. The previously presented [Pd(NH3)4]2+ and [Pd(NH3)4]2+/HCOH precursors were employed for creating the catalyst Pd layers for the carbon nanotube chemical vapor-phase deposition and for the autocatalytic electroless chemical copper plating, respectively. Finally, a simple novel method was introduced for the area-selective metallization of PS. Since the surface of PS reduces spontaneously most metals from their aqueous solutions, it is difficult to realize localized metal deposition from liquid-phase precursors on it. We proposed the application of a stable Ni plating bath from which the metal deposits only when the PS is irradiated with photons having wavelength shorter than 689 nm, thus making possible an area-selective laser-assisted metal deposition. The deposited metal structures and patterns were analysed by field emission scanning electron microscopy (FESEM) equipped with energy dispersive spectrometer (EDS), by the milling and imaging modes of a focused ion beam system (FIB), optical microscopy, profilometry, resistance, and by reflectance measurements.

No description available.

This research focuses on developing a model to predict the yield of a printed circuit board manufactured on a given assembly line. Based on an extensive literature review as well as discussion with industrial partners, it was determined that there is no tool available for assisting engineers in determining reliable estimates of their production capabilities as they introduce new board designs onto their current production lines. Motivated by this need, a more in-depth study of manufacturing yield as well as the electronic assembly process was undertaken. The relevant literature research was divided into three main fields: process modeling, board design, and PCB testing. The model presented in this research combines elements from process modeling and board design into a single yield model. An optimization model was formulated to determine the fault probabilities that minimize the difference between actual yield values and predicted yield values. This model determines fault probabilities (per component type) based on past production yields for the different board designs assembled. These probabilities are then used to estimate the yields of future board designs. Two different yield models were tested and their assumptions regarding the nature of the faults were validated. The model that assumes independence between faults provided better yield predictions. A preliminary case study was performed to compare the performance of the presented model with that of previous models using data available from the literature. The proposed yield model predicts yield within 3% of the actual yield value, outperforming previous regression models that predicted yield within 10%, and artificial neural network models that predicted yield within 5%. A second case study was performed using data gathered from actual production lines. The proposed yield model continued to provide very good yield predictions. The average difference with respect to the actual yields from this case study ranged between 1.25% and 2.27% for the lines studied. Through sensitivity analysis, it was determined that certain component types have a considerably higher effect on yield than others. Once the proposed yield model is implemented, design suggestions can be made to account for manufacturability issues during the design process. / Master of Science

Yes / Data envelopment analysis (DEA) is a technique for identifying the best practices of a given set of decision-making units (DMUs) whose performance is categorized by multiple performance metrics that are classified as inputs and outputs. Although DEA is regarded as non-parametric, the sample size can be an issue of great importance in determining the efficiency scores for the evaluated units, empirically, when the use of too many inputs and outputs may result in a significant number of DMUs being rated as efficient. In the DEA literature, empirical rules have been established to avoid too many DMUs being rated as efficient. These empirical thresholds relate the number of variables with the number of observations. When the number of DMUs is below the empirical threshold levels, the discriminatory power among the DMUs may weaken, which leads to the data set not being suitable to apply traditional DEA models. In the literature, the lack of discrimination is often referred to as the “curse of dimensionality”. To overcome this drawback, we provide a simple approach to increase the discriminatory power between efficient and inefficient DMUs using the well-known pure DEA model, which considers either inputs only or outputs only. Three real cases, namely printed circuit boards, Greek banks, and quality of life in Fortune’s best cities, have been discussed to illustrate the proposed approach. / panish Ministry of Economy, Industry and Competitiveness (Ministerio de Economía, Industria y Competitividad), the State Research Agency (Agencia Estatal de Investigación) and the European Regional Development Fund (Fondo Europeo de Desarrollo Regional) under grant MTM2016-79765-P (AEI/FEDER, UE).

Det här projektet har utförts i samarbete med företaget Eskilstuna Elektronikpartner AB (EEPAB). Företaget arbetar med tillverkning av kretskort där de använder sig av ytmontering och hålmontering. Vissa mönsterkort kan vara böjda och kan därmed orsaka problem i Surface Mount Device (SMD)-linan. Syftet med projektet var att ta fram en fixtur som gör mönsterkorten planare vilket innebär att minska höjdskillnaden mellan högsta och lägsta punkten på korten. Detta för att effektivisera och förhindra stopp i produktionen. Två forskningsfrågor togs fram som fungerade som ett stöd under projektets gång: F1:Hur förbättras produktionen i en SMD-lina när mönsterkorten hålls plana? F2:Vilka faktorer bör beaktas när en fixtur tas fram för en SMD-lina? Projektet har följt en produktutvecklingsprocess där fokuset har legat på konceptstadiet. Data har samlats in genomen litteraturstudie, intervjuer samt ett formulär. Projektet resulterade i ett slutgiltigt koncept i form av en fixtur. Resultatet i projektet visar att genom att spänna fast mönsterkortets kortsidor så minskas nedböjningen. Genom planare mönsterkort minskas risken för fel mängdapplicering av lödpasta som i sin tur kan orsaka kortslutning eller en öppen slutning. Att problemen med fel mängd lödpasta minskas leder även till att manuellt arbete som tvättning och applicering av lödpasta kan reduceras. När lödpasta appliceras för hand är det även svårt att veta om rätt mängd har applicerats, detta kan även leda till problem under lödningen. Sedan kan det konstateras att designen av fixturen måste samspela med alla maskiner i SMD-linan för att inte orsaka problem eller hindra maskinerna från att utföra dess arbete. Utifrån ett koncepttest visade det sig att det framtagna konceptet gör mönsterkorten cirka 42% planare. Detta bör kunna minska problemen i SMD-linan och spara in tiden det tar att åtgärda dessa problem. Koncepttestet utfördes inte i den rätta maskinen och måste därmed undersökas ordentligt. Det var endast ett sorts mönsterkort som testades, dessa faktorer är exempel på felkällor. I framtiden bör ett flertal olika mönsterkort testas för att få en högre reliabilitet. Det behövs även tas fram en exakt tolerans för när mönsterkorten är för böjda och problem uppstår. I dagsläget finns endast maskinens egentolerans som inte stämmer särskilt bra och en generell tolerans för SMD-linor.

Denna rapport utreder möjligheten till en mönsterkortslösning för en kabelbaserad kraftenhet. Denna kraftenhet är en låda som består av flera komponenter som exempelvis kraftenheter för 24V, 100V, filter och motorstyrkort för två axlar samt kraftfördelning. Kablarna i enheten är tidskrävande och dessutom kostsamma. Därför har enheten idag både hög produktionskostnad och produktionstid. Kablarna tillför, utöver höga kostnader, risk för störningar och p.g.a. mängden kablar ökar svårigheten att felsöka enheten. Simuleringar har genomförts med LT-Spice för olika RC-filter för styrsignalerna i kraftenheten. Vidare har ett kretsschema konstruerats baserat på ritningen av lådan och alla kablar som ska reduceras och hanteras av mönsterkortet. Med kretsschemat skapades en layout för mönsterkortet. Denna layout representerar alla komponenter och hur kopparledningarna ska placeras. Det ledde till att mönsterkortet utvecklades som en möjlig lösning till kraftenheten. / This report investigates the possibility for a PCB (Printed circuit board) solution for a cable-based power unit. This power unit is a box which contains multiple components as for example power units for 24v, 100v, filter and motor control boards fort wo shafts and power supply. The cables in the unit are complicated and hard to construct and also expensive. Therefore, the unit has a high production cost and high production time. Besides high costs the cables also add risks for interference and because of the amount of cables it also raises the difficulty to debug the unit. Simulations have been done with LT-Spice for constructions of different RC-filters for the steering signals in the power unit. Furthermore, a circuit diagram has been drawn based on the drawing of the power unit and all the cables that are to be reduced and handled by the circuit board. The circuit board layout was designed based on the circuit diagram. Which led to a circuit board being developed as a possible solution for the power unit.

Master of Science / Department of Mechanical and Nuclear Engineering / Akira T. Tokuhiro / The Secure Transportable Autonomous Reactor – Liquid Metal system combines a Generation IV nuclear reactor with an advanced Supercritical Carbon Dioxide (S-CO[subscript]2) Brayton power conversion cycle. The Brayton cycle was selected as the power conversion cycle due to its high efficiency, small turbomachinery size, and competitive cost due to reduced complexity as compared to a traditional Rankine cycle. Overall system thermal efficiency is closely tied to the performance of the precooler and recuperators. The Printed Circuit Heat Exchanger (PCHE) manufactured by Heatric is being considered for use as both the precooler and recuperator in the STAR-LM system due to its high effectiveness, wide temperature and pressure operating range, small size, and low cost. PCHEs have been used primarily in the hydrocarbon processing industry to date, and are relatively new in being considered for nuclear applications. In this study, a PCHE is investigated using S-CO[subscript]2 and water as the heat transfer media in conditions relevant to the precooler in the STAR-LM system. Experiments conducted with small temperature differences across the PCHE revealed that the heat transfer coefficient is strongly correlated with the temperature-dependent specific heat near the pseudocritical point. The STAR-LM precooler outlet temperature is near the pseudocritical point, making this region of interest to this work. Testing was conducted to determine the effect of property variation near the precooler outlet in conditions with large temperature differences in the PCHE. These tests revealed that maintaining the precooler outlet temperature near the pseudocritical point does not have a significant effect on heat transfer coefficients in the PCHE under large temperature difference test conditions. Computational Fluid Dynamics (CFD) models were developed to simulate fluid flow and heat transfer in the PCHE. A 2D, 4-channel, zig-zag model was found to reproduce the outlet temperatures to within approximately 15% relative error. The 3D straight channel model reproduced the experimental data to within 3% relative error for the cases simulated. Both of these models predicted the water side outlet temperatures to within 20% relative error.

ITC/USA 2005 Conference Proceedings / The Forty-First Annual International Telemetering Conference and Technical Exhibition / October 24-27, 2005 / Riviera Hotel & Convention Center, Las Vegas, Nevada / This paper discusses using the CAN (Control Area Network) Bus protocol for control and status of flight test data acquisition systems. The application of the CAN (Control Area Network) on an F/A-18 aircraft will be discussed in detail.

The main purpose of this thesis was to develop a printed circuit board for Autoliv Electronics AB. This circuit board should be placed in their test equipment to support some of their camera vision systems used in cars. The main task was to combine the existing hardware into one module. To be able to achieve this, the most important factors in designing a printed circuit board was considered. A satisfying power distribution network is the most crucial one. This was accomplished by using decoupling capacitors to achieve low enough impedance for all circuits. Calculations and simulations were executed for all integrated circuits to find the correct size and numbers of capacitors. The impedance of the circuit board was tested with a network analyzer to confirm that the impedance were low enough, which was the case. System functionality was never tested completely, due to delivery problems with some external equipment.