This Masters thesis investigates the effects of post growth rapid thermal annealing on colloidal CdTe nanoparticles. This novel process has not previously been applied to colloidal nanoparticles. It is found that rapid thermally annealing with temperatures up to 400°C, the number of defect bonds in the semiconductor core will decrease and the zincblende structural phase will prevail. These findings are identified using Raman spectroscopy enhanced in a liquid core waveguide and corroborated using a variety of other analysis techniques. What is also important is that while the semiconductor core is changing, the optical characteristics of the material remain nominally unchanged. Additionally, a circulatory peristaltic pump system that is suitable for future in situ monitoring was developed and used to investigate the length effects of Teflon capillary tubes as a liquid core waveguide for Raman spectroscopy.

This Masters thesis investigates the effects of post growth rapid thermal annealing on colloidal CdTe nanoparticles. This novel process has not previously been applied to colloidal nanoparticles. It is found that rapid thermally annealing with temperatures up to 400°C, the number of defect bonds in the semiconductor core will decrease and the zincblende structural phase will prevail. These findings are identified using Raman spectroscopy enhanced in a liquid core waveguide and corroborated using a variety of other analysis techniques. What is also important is that while the semiconductor core is changing, the optical characteristics of the material remain nominally unchanged. Additionally, a circulatory peristaltic pump system that is suitable for future in situ monitoring was developed and used to investigate the length effects of Teflon capillary tubes as a liquid core waveguide for Raman spectroscopy.

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The ability to fabricate semiconductor wafers with spatially selected regions of different bandgap material is required for the fabrication of monolithic photonic integrated circuits (PIC's). Although this subject has been studied for three decades and many semiconductor engineering approaches have been proposed, the problem of achieving reproducible results has constantly challenged scientists and engineers. This concerns not only the techniques relaying on multiple sequential epitaxial growth and selective area epitaxy, but also the conventional quantum well intermixing (QWI) technique that has been investigated as a post-growth approach for bandgap engineering. Among different QWI techniques, those based on the use of different lasers appear to be attractive in the context of high-precision and the potential for cost-effective bandgap engineering. For instance, a tightly focused beam of the infrared (IR) laser could be used for the annealing of small regions of a semiconductor wafer comprising different quantum well (QW) or quantum dot (QD) microstructures. The precision of such an approach in delivering wafers with well defined regions of different bandgap material will depend on the ability to control the laser-induced temperature, dynamics of the heating-cooling process and the ability to take advantage of the bandgap engineering diagnostics. In the frame of this thesis, I have investigated IR laser-induced QWI processes in QW wafers comprising GaAs/A1GaAs and InP/InGaAsP microstructures and in InAs QD microstructures grown on InP substrates. For that purpose, I have designed and set up a 2-laser system for selective area rapid thermal annealing (Laser-RTA) of semiconductor wafers. The advantage of such an approach is that it allows carrying out annealing with heating-cooling rates unattainable with conventional RTA techniques, while a tightly focused beam of one of the IR lasers is used for `spot annealing'. These features have enabled me to introduce a new method for iterative bandgap engineering at selected areas (IBESA) of semiconductor wafers. The method proves the ability to deliver both GaAs and InP based QW/QD wafers with regions of different bandgap energy controlled to better than « 1nm of the spectral emission wavelength. The IBESA technique could be used for tuning the optical characteristics of particular regions of a QW wafer prepared for the fabrication of a PIC. Also, this approach has the potential for tuning the emission wavelength of individual QDs in wafers designed, e.g., for the fabrication of single photon emitters. In the 1st Chapter of the thesis, I provide a short review of the literature on QWI techniques and I introduce the Laser - RTA method. The 2nd Chapter is devoted to the description of the fundamental processes related to the absorption of laser light in semiconductors. I also discuss the results of the finite element method applied for modeling and semi-quantitative description of the Laser - RTA process. Details of the experimental setup and developed procedures are provided in the 3rd Chapter. The results concerning direct bandgap engineering and iterative bandgap engineering are discussed in the 4th and 5th Chapters, respectively.

We report on a novel silicon nanowire-based field effect transistor with integrated ferroelectric gate oxide. The concept allows tuning the carrier transport in a non-volatile approach by switching the polarization in the ferroelectric layer close to the source Schottky-junction. We interpret the results in terms of tuning the transmissibility of the Schottky-junction for charge carriers. The experimental results provide a first step towards the integration of memory-in-logic concepts with reconfigurable nanowire transistors.

Low cost, rapid and high thermal by IR heating, rapid cooling and high efficiency, there are RTP (Rapid Thermal Processing) properties. We can use RTP for annealing, diffusion, contacting, oxidation and others. Rapid temperature change and IR heating can be followed positive effects in the silicon substrate. This paper is focused on annealing by RTP. Wafers were p-type monocrystalline CZ silicon with different bulk minority carrier lifetime. Minority carrier lifetime was measured by MW-PCD (Microwave Photoconductance Decay) before and after thermal processing.

Integration of high-K Metal-Insulator-Metal (MIM) capacitors in the Back-end-of-line (BEOL) is a topic of interest for the further development of the process at KTH Royal Institute of Technology. MIM-capacitors benefit from having constant capacitance values over a range of voltages and/or frequencies. One significant limitation in the development of better MIM-capacitors is the temperature consideration for BEOL processes. For the process at KTH Institute of Technology the temperature should not exceed 600 °C, as this would damage underlying devices. This work aims to fabricate aluminium oxide MIM-capacitors as a standard BEOL process performed at low temperature, which has been achieved via atomic layer deposition (ALD). The fabricated aluminium oxide MIM-capacitors had a good quality factor, series resistance and low dissipation. The capacitance for a 10 nm thick aluminium oxide insulator layer was 1 µF/cm2, which exceeds the set requirement. This work also aimed to make ferroelectric aluminium doped hafnium oxide MIM-capacitors using ALD. The doping ratio was varied in ALD as this had been found to affect formation of the ferroelectric crystal phase after a rapid thermal annealing step. Three wafers of 20 nm thick hafnium oxide and differing ratios were found to not be ferroelectric. The intermediate doping ratio was found to appear slightly anti-ferroelectric. A 10 nm thick doped hafnium oxide of intermediate doping was also fabricated and was found to be ferroelectric with a remnant polarisation of 1 µC/cm2. Though this polarisation is relatively small, it shows that top electrode induced strain due to lattice mismatch could be responsible for the ferroelectric properties of the capacitor. The quality of the hafnium based capacitors seemed worse in comparison to the aluminium oxide capacitors, which is suspected to be due to oxygen vacancies, resulting in a high loss tangent. While this first experiment showed promising results, the ferroelectric remnant polarisation should be increased by an order of magnitude and the electrical benchmark values should be improved before these hafnium oxide MIM-capacitors can be used in the BEOL process. / Integratie van high-K MIM-condensatoren in de Back-end-of-line (BEOL) is een onderwerp van belang voor de ontwikkeling van het proces bij de KTH. MIM-condensatoren profiteren van een constante capaciteitswaarde over een reeks spanningen en/of frequenties. Een belangrijke beperking bij de ontwikkeling van betere MIM-condensatoren is het temperatuur limiet voor BEOL-processen. Bij de KTH moet de temperatuur niet hoger zijn dan 600 °C, omdat dit de onderliggende apparaten zou beschadigen. Dit werk heeft tot doel aluminiumoxide MIM-condensatoren te fabriceren als een standaard BEOL-proces met lage temperatuur, en heeft dit inderdaad bereikt via atomaire laagafzetting (ALD). De gefabriceerde aluminiumoxide MIM-condensatoren hadden een goede kwaliteitsfactor, serieweerstand en lage dissipatie. De capaciteit voor een 10 nm dikke aluminiumoxide-isolatorlaag was 1µF/cm2, hoger dan de gestelde eisen. Dit werk was ook gericht op het maken van ferro-elektrische aluminium gedoteerde hafniumoxide MIM-condensatoren met behulp van ALD. De doteringsverhouding werd gevarieerd in ALD, aangezien bleek dat dit de vorming van de ferro-elektrische kristalfase faciliteerde na een snelle thermische gloeistap. Drie wafers van 20 nm dik hafniumoxide en verschillende verhoudingen bleken niet ferro-elektrisch te zijn. De tussenliggende doteringsverhouding bleek enigszins anti-ferro-elektrisch te zijn. Een 10 nm dik gedoteerd hafniumoxide met intermediaire dotering werd ook gefabriceerd en bleek ferro-elektrisch te zijn met een restpolarisatie van 1 µC/cm2. Hoewel deze polarisatie relatief klein is, toont het aan dat de door de topelektrode geïnduceerde spanning als gevolg van roostermismatch verantwoordelijk zou kunnen zijn voor de ferro-elektrische eigenschappen van de condensator. De kwaliteit van de op hafnium gebaseerde isolator leek slechter in vergelijking met die van aluminiumoxide, hetgeen kan worden toegeschreven aan gebrek van zuurstof in het rooster, wat in een groot verlies resulteert. De ferro-elektriciteit moet met een orde van grootte worden verhoogd en de elektrische benchmarks moeten ook verhoogd worden voordat deze hafniumoxide MIM-condensatoren kunnen worden gebruikt in het BEOLproces. Sleutelwoorden: atomaire laagafzetting (ALD), Ferro-elektrisch, Metaal-Isolator- Metaal (MIM) condensator, lage temperatuur, snelle thermische gloeiing.

Chemically ordered FePt is one of the most promising materials to reach the ultimate limitations in storage density of future magnetic recording devices due to its high uniaxial magnetocrystalline anisotropy and a corrosion resistance superior to rare-earth based magnets. In this study, FePt and FePt/Cu bilayers have been sputter deposited at room temperature onto thermally oxidized silicon wafers, glass substrates and self-assembled arrays of spherical SiO2 particles with diameters down to 10 nm. Millisecond flash lamp annealing, as well as conventional rapid thermal annealing was employed to induce the phase transformation from the chemically disordered A1 phase into the chemically ordered L10 phase. The influence of the annealing temperature, annealing time and the film thickness on the ordering transformation and (001) texture evolution of FePt films with near equiatomic composition was studied. Whereas flash lamp annealed FePt films exhibit a polycrystalline morphology with high chemical L10 order, rapid thermal annealing can lead to the formation of chemically ordered FePt fifilms with (001) texture on amorphous SiO2/Si substrates. The resultant high perpendicular magnetic anisotropy and large coercivities up to 40 kOe are demonstrated. Simultaneuosly to the ordering transformation, rapid thermal annealing to temperatures exceeding 600 °C leads to a break up of the continuous FePt film into separated islands. This dewetting behavior was utilized to create regular arrays of FePt nanostructures on SiO2 particle templates with periods down to 50 nm. The addition of Cu improves the (001) texture formation and chemcial ordering for annealing temperatures T < 600 °C. In addition, the magnetic anisotropy and the coercivity of the ternary FePtCu alloy can be effectively tailored by adjusting the Cu content. The prospects of FePtCu based exchange spring media, as well as the magnetic properties of FePtCu nanostructures fabricated using e-beam and nanoimprint lithography have been investigated.

Ce mémoire présente les efforts effectués pour réduire l'angle de perte de couches de pentoxyde de tantale amorphes telles qu'utilisées pour les miroirs de LIGO. Afin d'améliorer le niveau de relaxation des couches, celles-ci ont été déposées par pulvérisation cathodique magnétron à des températures allant de 50 °C à 480 °C, elles ont subi un recuit thermique rapide, elles ont été implantées par des ions d'oxygène, elles ont été déposées par pulvérisation cathodique magnétron en appliquant une tension de polarisation sur le substrat lors du dépôt allant de 0 V à -450 V et elles ont été déposées par pulvérisation cathodique magnétron pulsée à haute puissance dans le cadre de différentes expériences. L'angle de perte, l'épaisseur, la rugosité, l'indice de réfraction, la composition atomique, la contrainte, l'état de relaxation et le module de Young des couches ont par la suite été trouvés à l'aide de l'ellipsométrie spectralement résolue, la spectrométrie de rétrodiffusion de Rutherford, la détection des reculs élastiques, la spectroscopie Raman, la diffraction de rayons X et la nano-indentation. Il a été trouvé que la température de dépôt améliorait légèrement le degré de relaxation des couches jusqu'à 250 °C, mais qu'elle avait peu d'impact après recuit. Aussi, lors de dépôt à température de la pièce, une forte tension de polarisation réduit l'angle de perte, mais cet effet est encore une fois perdu suite au recuit. Les autres méthodes mentionnées ci-dessus n'ont pas influencé le degré de relaxation des couches selon l'angle de perte, la spectroscopie Raman et la diffraction de rayons X. Cette recherche a été réalisée avec le support financier du CRSNG et du FRQNT (numéro de dossier 206976). / This master's thesis presents the experiments made to reduce the loss angle of tantala coatings similar to those used in LIGO. To improve the relxation level of the coatings they were deposited by magnetron sputtering at temperatures varying from 50 °C to 480 °C. They were also subjected to rapid thermal annealing, and oxygen implantation. In another experiment, the coatings were deposited by magnetron sputtering with substrate biasing varying from 0 V to -450 V at room temperature and at 250 °C. Finally, the coatings of tantala were deposited by high power impulse magnetron sputtering. The loss angle, thickness, roughness, refractive index, atomic composition, stress, the relaxation state and Young's modulus of the coatings were characterized using spectroscopic ellipsometry, Rutherford backscattering, elastic recoil detection, Raman spectroscopy, X-ray diffraction and nanoindentation. It was found that the deposition temperature improved the loss angle until it reached 250 °C. However, annealing the coatings had a superior impact and the influence of the deposition temperature was not visible after annealing. When was applied a high bias to the susbtrate at room temperature, the obtained coating was slightly more relaxed than when a low bias was applied but this effect is, once again, insignificant after annealing. The other methods of deposition mentioned did not improve the loss angle or modify the relaxation state found by Raman spectroscopy and X-ray diffraction of the tantala coatings. This research was made with the financial support of the NSERC and of the FRQNT (file number 206976).

Chemically ordered FePt is one of the most promising materials to reach the ultimate limitations in storage density of future magnetic recording devices due to its high uniaxial magnetocrystalline anisotropy and a corrosion resistance superior to rare-earth based magnets. In this study, FePt and FePt/Cu bilayers have been sputter deposited at room temperature onto thermally oxidized silicon wafers, glass substrates and self-assembled arrays of spherical SiO2 particles with diameters down to 10 nm. Millisecond flash lamp annealing, as well as conventional rapid thermal annealing was employed to induce the phase transformation from the chemically disordered A1 phase into the chemically ordered L10 phase. The influence of the annealing temperature, annealing time and the film thickness on the ordering transformation and (001) texture evolution of FePt films with near equiatomic composition was studied. Whereas flash lamp annealed FePt films exhibit a polycrystalline morphology with high chemical L10 order, rapid thermal annealing can lead to the formation of chemically ordered FePt fifilms with (001) texture on amorphous SiO2/Si substrates. The resultant high perpendicular magnetic anisotropy and large coercivities up to 40 kOe are demonstrated. Simultaneuosly to the ordering transformation, rapid thermal annealing to temperatures exceeding 600 °C leads to a break up of the continuous FePt film into separated islands. This dewetting behavior was utilized to create regular arrays of FePt nanostructures on SiO2 particle templates with periods down to 50 nm. The addition of Cu improves the (001) texture formation and chemcial ordering for annealing temperatures T < 600 °C. In addition, the magnetic anisotropy and the coercivity of the ternary FePtCu alloy can be effectively tailored by adjusting the Cu content. The prospects of FePtCu based exchange spring media, as well as the magnetic properties of FePtCu nanostructures fabricated using e-beam and nanoimprint lithography have been investigated.