The development of monolithic microwave integrated circuits (MMICs) has enabled the expansion of multiple circuit elements on a single piece of semiconductor, enclosed in a package with connecting leads. Attributable to the widespread use of wireless circuits and sub-systems, MMICs meet stringent demands for smaller chip area, low loss and low cost. These require highly integrated MMICs with compact features. This thesis provides valuable insight into the design of compact multifunctional MMICs using three-dimensional (3-D) multilayer technology. The proposed technology offers compact, hence low-cost solutions, where all active and passive components are fabricated vertically on the same substrate and no expensive via hole or backside processing is required. The substrate used in this work contains pre-fabricated 0.5 µm pseudomorphic High Electron Mobility Transistor (pHEMT) GaAs active devices. The performances of the uncommitted and committed pHEMTs are compared in terms of their DC, small-signal and large-signal RF measurements and modelling results. Committed pHEMT refers to the pHEMT that is connected to multilayer circuit, whereas uncommitted pHEMT is not. The effect of integrating committed pHEMTs with multilayer passive components is studied and the suitability of the multilayer fabrication processing is assessed. Using this technology, two pHEMT Schottky diodes with 120 µm and 200 µm gate widths are designed, fabricated and extensively characterised by I-V, C-V and S-parameter measurements. The information gained from the measurements is then used to extract all unknown equivalent circuit model parameters using high-frequency on-wafer microwave probing. The measured results showed good agreement with the modelled ones over the frequency range up to 40 GHz. Preliminary demonstrations of the use of these pHEMT Schottky diodes in microwave limiter and detector circuit applications are also discussed, showing promising results. Finally, the implementation of 3-D multilayer technology is shown for the first time in single-pole single-throw (SPST) and single-pole double-throw (SPDT) switches design by utilising the pre-fabricated pHEMTs. The design and analysis of the switches are demonstrated first through simulation using TriQuint's Own Model - Level 3 (TOM3). Three optimised SPST and SPDT pHEMT switching circuits which can address applications ranging from L to X bands are successfully fabricated and tested. The performance of the pHEMT switches is comparable to those of the current state-of-the-art, while simultaneously offering compact circuits with the advantages of integration with other MMIC components. All works reported in this thesis should facilitate foundry design engineers towards further development of 3-D multilayer technology.

Radio-frequency (RF) switches are widely used in electrical systems, telecommunications, and wireless applications. In RF systems, it is often desirable to change the signal path effectively, by us-ing couplers, duplexers, and RF switches for signal division and combining. Typically, in modern RF systems, the RF switch is mostly capitalized in order to reduce the RF footprint but with efficient switch characteristics. A simple method to reduce transceiver space requirement is to integrate RF switches with the frontend module on a single chip. Recent advances in Gallium Nitride (GaN) technology allows RF designers to design faster, smaller, and efficient components using this technology. With high data rates in demand for wireless communication systems, wideband characteristics are needed in modern systems [1]. Therefore, it is desirable to design wideband circuits; such as, mixers, amplifiers, and switches. In this work, a comprehensive study of NRC GaN150 HEMT is conducted to design broadband RF switches. Single pole and double pole switch topologies operating at 1-12 GHz are designed to evaluate GaN 0.15μm RF switches. The main objectives were to design compact sized switches, while having high power handling, low insertion loss, high isolation and high return loss. Additionally, a transmit-receive switch is designed for integration into a frontend module and further fabricated to operate at 10 GHz. There are many applications of RF switches in an RF transceiver, one of which is an impedance tuner. Impedance tuner are attractive for many applications where mobile devices are used for wireless communications. As mobile technology continues to evolve, they are designed to be com-pact, leaving minimal space for the antenna. Consequently, the radiating element is often electrically small and sensitive to near-field coupling requiring tuning. Matching networks aim to tune matching conditions; for example, loading effects due to human hand [2]. For such situations, specialized matching networks can be designed to account for specific loading environmental effects. However, for mobile systems, the environment is unknown; thereby, yielding unpredictable antenna loading, especially for electrically small antennas that have rapidly changing real and imaginary impedance. As a result, it is necessary to design a reconfigurable impedance-matching network to account for possible load impedances. In this work, a 16-bit reconfigurable impedance tuner design comprising of passive microwave components and NRC GaN 0.15μm FET operating at X-band is presented to evaluate its performance for integration with the frontend module on a single chip to reduce cost and increase efficiency of the system.

RF switches are an essential building block in numerous applications, including tactical radar systems, satellite communications, global positioning systems (GPS), automotive radars, wireless communications, radio astronomy, radar transceivers, and various instrumentation systems. For many of these applications the circuits have to operate reliably under extreme operating conditions, including conditions outside the domain of commercial military specifications. The objective of this thesis is to present the design procedure, simulation, and measurement results for Radio Frequency (RF) switches in 130 nm Silicon Germanium (SiGe) BiCMOS process technology. The novelty of this work lies in the proposed new topology of an ultrahigh-isolation single-pole, single-throw (SPST) and a single pole, four-throw (SP4T) nMOS based switch for multiband microwave radar systems. The analysis of cryogenic temperature effects on these circuits and devices are discussed in this work. The results shows that several key-figures-of-merits of a switch, like insertion loss, isolation, and power handling capability (P1dB) improve at cryogenic temperatures. These results are important for several applications, including space-based extreme environment application where FET based circuits would need to operate reliably across a wide-range of temperature.

State-of-the-art SiGe BiCMOS technologies leverage the maturity of deep-submicron silicon CMOS processing with bandgap-engineered SiGe HBTs in a single platform that is suitable for a wide variety of high performance and highly-integrated applications (e.g., system-on-chip (SOC), system-in-package (SiP)). Due to their bandgap-engineered base, SiGe HBTs are also naturally suited for cryogenic electronics and have the potential to replace the costly de facto technologies of choice (e.g., Gallium-Arsenide (GaAs) and Indium-Phosphide (InP)) in many cryogenic applications such as radio astronomy. This work investigates the response of mixed-signal circuits (both RF and analog circuits) when operating in extreme environments, in particular, at cryogenic temperatures and in radiation-rich environments. The ultimate goal of this work is to attempt to fill the existing gap in knowledge on the cryogenic and radiation response (both single event transients (SETs) and total ionization dose (TID)) of specific RF and analog circuit blocks (i.e., RF switches and voltage references). The design approach for different RF switch topologies and voltage references circuits are presented. Standalone Field Effect Transistors (FET) and SiGe HBTs test structures were also characterized and the results are provided to aid in the analysis and understanding of the underlying mechanisms that impact the circuits' response. Radiation mitigation strategies to counterbalance the damaging effects are investigated. A comprehensive study on the impact of cryogenic temperatures on the RF linearity of SiGe HBTs fabricated in a new 4th-generation, 90 nm SiGe BiCMOS technology is also presented.