The current stimuli of climate change and rising oil prices have spurred the development of hybrid electric (HEV), and battery electric vehicles (BEV): collectively termed EVs. However, the battery technology needs much development: at the time of writing, the range of a BEV is too low to be practical in many situations. A critical limitation is the sensitivity of batteries to temperature: the heat generated during operation affects their performance and reduces the lifetime. This study investigates battery cooling using cooling plates: thin rectangular fabrications inserted between battery cells. A coolant pumped through internal channels absorbs heat and transports it away from the battery. Previous studies of liquid heat exchangers have indicated that the geometry of the channels plays a significant role in the performance; however, there is a lack of rigorous numerical optimization applied to EV cooling plates. By developing a numerical optimization framework utilizing parametric geometry generation and computational fluid dynamics, this research has investigated the characteristics of optimum cooling plate geometry with respect to three objectives: average temperature, temperature uniformity, and coolant pressure drop. By applying each objective separately, improvements of up to 70% have been made compared to a reference design. The influence of boundary conditions on performance and optimum design has been assessed, and multi-objective optimization has investigated the trade-off between competing objective functions. Although care should be taken when extrapolating the results beyond the geometry and conditions in the study, some general design principles can be proposed. Objectives of average temperature and pressure drop can both be satisfied by a common design with wide cooling channels, but different characteristics are needed for temperature uniformity. Additional assessments have revealed that optimizations of temperature uniformity are especially sensitive to the boundary conditions, whereas the other objective functions are largely insensitive. The optimization process developed in this work can be applied to any potential cooling plate design and will lead to gains in the targeted performance measure. In doing so, the performance of the EV will be incrementally improved, thereby advancing the day when an EV is not only an environmental choice, but also a practical choice. / Thesis (Master, Mechanical and Materials Engineering) -- Queen's University, 2011-09-07 16:24:14.6

For semiconductor processors temperature increases leakage current, which in turn in- creases the temperature of the processor. This increase in heat is seen by other parts of the processor since heat is diffusive across a processor die. In this way, cores are thermally coupled to one another such that when the temperature of one core increases, the temperatures of all cores on the same die can also increase. This increase in temperature and power consumption is not accompanied by any increase in performance. Cores on a chip can also be performance coupled to one another since cores can share data between them. These interactions between cores present new challenges to microarchitects who seek to optimize the energy consumption of a chip multiprocessor (CMP) comprised of multiple symmetric or asymmetric processing cores. This thesis seeks to understand and model the impact of thermal coupling effects between adjacent cores in a chip multiprocessor starting with measurements with a commercial multi-core processor. The hypothesis is that the thermal coupling of compute cores will be influenced by the adjacent core’s performance characteristics. Specifically, we expect thermal coupling is related to the nature of the workloads, e.g. compute intensive workloads will increase coupling over memory intensive workloads. However, we find that simpler parameters such as frequency of operation have more impact on coupling behaviors than the workload behaviors such as memory intensity or instruction retirement rates. A model is developed to capture thermal coupling effects and enable schemes to mitigate its impact.

The heat flux demands for electronics cooling applications are quickly approaching the limits of conventional thermal management systems. To meet the demand of next generation electronics, a means for rejecting high heat fluxes at low temperatures in a compact system is an urgent need. To answer this challenge, in this work a gasketed chevron plate heat exchanger in conjunction with a slurry consisting of highly endothermic solid ammonium carbamate and a heat transfer fluid. A reduced-order 1-dimensional model was developed and used to solve the coupled equations for heat, mass, and momentum transfer. The feasibility of this chosen design for satisfying the heat rejection load of 2kW was also explored in this study. Also, a decomposition reaction using acetic acid and sodium bicarbonate was conducted in a plate heat exchanger (to simulate a configuration similar to the ammonium carbamate reactions). This enabled the experimental validation of the numerical predictions for the momentum transfer correlations used in this study (which in turn, are closely tied to both the heat transfer correlations and chemical kinetics models). These experiments also reveal important parameters of interest that are required for the reactor design. A numerical model was developed in this study and applied for estimating the reactor size required for achieving a power rating of 2 kW. It was found that this goal could be achieved with a plate heat exchanger weighing less than 70 kg (~100 lbs) and occupying a volume of 29 L (which is roughly the size of a typical desktop printer). Investigation of the hydrodynamic phenomena using flow visualization studies showed that the flow patterns were similar to those described in previous studies. This justified the adaptation of empirical correlations involving two-phase multipliers that were developed for air-water two-phase flows. High-speed video confirmed the absence of heterogeneous flow patterns and the prevalence of bubbly flow with bubble sizes typically less than 0.5 mm, which justifies the use of homogenous flow based correlations for vigorous gas-producing reactions inside a plate heat exchanger. Absolute pressure measurements - performed for experimental validation studies - indicate a significant rise in back pressure that are observed to be several times greater than the theoretically estimated values of frictional and gravitational pressure losses. The predictions from the numerical model were found to be consistent with the experimental measurements, with an average absolute error of ~26%

Αντικείμενο της παρούσας διπλωματικής εργασίας είναι η μελέτη τεχνικών θερμικής διαχείρισης ολοκληρωμένων κυκλωμάτων. Μελετώνται διαφορετικοί τρόποι βέλτιστης απαγωγής της θερμότητας καθώς και μέθοδοι μέτρησης θερμοκρασίας με την χρήση ψηφιακών κυκλωμάτων. / Subject of this diploma thesis is the research of various methods of integrated circuit thermal management. Different methods of optimal heat removal have been compared and digital temperature sensing techniques have been studied.

Monte Carlo based statistical approach to solve Boltzmann Transport Equation (BTE) has become a norm to investigate heat transport in semiconductors at sub-micron regime, owing mainly to its ability to characterize realistically sized device geometries qualitatively. One of the primary issues with this technique is that the approach predominantly uses empirically fitted phonon dispersion relations as input to determine the properties of phonons so as to predict the thermal conductivity of specified material geometry. The empirically fitted dispersion relations assume harmonic approximation thereby failing to account for thermal expansion, interaction of lattice waves, effect of strain on spring stiffness, and accurate phonon-phonon interaction. To circumvent this problem, in this work, a coupled molecular mechanics-Monte Carlo (MM-MC) platform has been developed and used to solve the phonon Boltzmann Transport Equation (BTE) for the calculation of thermal conductivity of several novel and emerging nanostructures. The use of the quasi-anharmonic MM approach (as implemented in the open source NEMO 3-D software toolkit) not only allows one to capture the true atomicity of the underlying lattice but also enables the simulation of realistically-sized structures containing millions of atoms. As compared to the approach using an empirically fitted phonon dispersion relation, here, a 17% increase in the thermal conductivity for a silicon nanowire due to the incorporation of atomistic corrections in the LA (longitudinal acoustic) branch alone has been reported. The atomistically derived thermal conductivity as calculated from the MM-MC framework is then used in the modular design and analysis of (i) a silicon nanowire based thermoelectric cooler (TEC) unit, and (ii) a GaN/InN based nanostructured light emitting device (LED). It is demonstrated that the use of empirically fitted phonon bandstructure parameters overestimates the temperature difference between the hot and the cold sides and the overall cooling efficiency of the system, thereby, demanding the use of the BTE derived thermal conductivity in the calculation of thermal conductivity. In case of the light-emitting device, the microscopically derived material parameters, as compared to their bulk and fitted counterparts, yielded ~3% correction (increase) in optical efficiency. A non-deterministic approach adopted in this work, therefore, provides satisfactory results in what concerns phonons transport in both ballistic and diffusive regimes to understand and/predict the heat transport phenomena in nanostructures.

abstract: The proposed research mainly focuses on employing tunable materials to achieve dynamic control of radiative heat transfer in both far and near fields for thermal management. Vanadium dioxide (VO2), which undergoes a phase transition from insulator to metal at the temperature of 341 K, is one tunable material being applied. The other one is graphene, whose optical properties can be tuned by chemical potential through external bias or chemical doping. In the far field, a VO2-based metamaterial thermal emitter with switchable emittance in the mid-infrared has been theoretically studied. When VO2 is in the insulating phase, high emittance is observed at the resonance frequency of magnetic polaritons (MPs), while the structure becomes highly reflective when VO2 turns metallic. A VO2-based thermal emitter with tunable emittance is also demonstrated due to the excitation of MP at different resonance frequencies when VO2 changes phase. Moreover, an infrared thermal emitter made of graphene-covered SiC grating could achieve frequency-tunable emittance peak via the change of the graphene chemical potential. In the near field, a radiation-based thermal rectifier is constructed by investigating radiative transfer between VO2 and SiO2 separated by nanometer vacuum gap distances. Compared to the case where VO2 is set as the emitter at 400 K as a metal, when VO2 is considered as the receiver at 300 K as an insulator, the energy transfer is greatly enhanced due to the strong surface phonon polariton (SPhP) coupling between insulating VO2 and SiO2. A radiation-based thermal switch is also explored by setting VO2 as both the emitter and the receiver. When both VO2 emitter and receiver are at the insulating phase, the switch is at the “on” mode with a much enhanced heat flux due to strong SPhP coupling, while the near-field radiative transfer is greatly suppressed when the emitting VO2 becomes metallic at temperatures higher than 341K during the “off” mode. In addition, an electrically-gated thermal modulator made of graphene covered SiC plates is theoretically studied with modulated radiative transport by varying graphene chemical potential. Moreover, the MP effect on near-field radiative transport has been investigated by spectrally enhancing radiative heat transfer between two metal gratings. / Dissertation/Thesis / Doctoral Dissertation Mechanical Engineering 2016

Modern high frequency electronic devices are continually becoming smaller in area but capable of generating higher RF power, thereby increasing the dissipated power density. For many microwave devices, for example the planar Gunn diode, standard thermal management may no longer be sufficient to effectively remove the increasing dissipated power. The work has looked at the design and development of an active micro-cooler, which could be fully integrated with the planar Gunn diode at wafer level as a monolithic microwave integrated circuit (MMIC). The work also resulted in the further development of novel thermal measurement techniques, using micro-particle sensors with infra-red (IR) thermal microscopy and for the first time to measure thermal profiles along the channel of the planar Gunn diode. To integrate the gallium arsenide (GaAs) based planar Gunn diode and micro-cooler, it was first necessary to design and fabricate individual GaAs based planar Gunn diodes and micro-coolers for thermal and electrical characterisation. To obtain very small area micro-coolers, superlattice structures were investigated to improve the ratio between the electrical and thermal conductivities of the micro-cooler. To measure the specific contact resistivity of the superlattice based micro-cooler contacts, the Reeves & Harrison TLM (transmission line method) was used as it included both horizontal and vertical components of the contact resistance. It was found, for the GaAs based micro-cooler, only small amounts of cooling (< 0.4 °C) could be obtained, therefore the novel temperature measurement method using micro-particle sensors placed on both the anode and cathode contacts was utilised. The bias probes used to supply DC power to the micro-coolers were found to thermally load these very small structures, which led to anomalously high measured cooling temperatures of > 1°C. A novel approach of determining if the measured cooling temperature was due to cooling or probe loading was developed. A 1D model for the integrated micro-cooler was developed and the results indicated that when the micro-cooler was used as a cooling element in a monolithic microwave integrated circuit, the supporting substrate thickness was very important. Simulation showed to obtain cooling the substrate thickness had to be very thin (< 50 μm), which may preclude the use of GaAs micro-coolers as part of a monolithic microwave integrated circuit.

abstract: Multicore processors have proliferated in nearly all forms of computing, from servers, desktop, to smartphones. The primary reason for this large adoption of multicore processors is due to its ability to overcome the power-wall by providing higher performance at a lower power consumption rate. With multi-cores, there is increased need for dynamic energy management (DEM), much more than for single-core processors, as DEM for multi-cores is no more a mechanism just to ensure that a processor is kept under specified temperature limits, but also a set of techniques that manage various processor controls like dynamic voltage and frequency scaling (DVFS), task migration, fan speed, etc. to achieve a stated objective. The objectives span a wide range from maximizing throughput, minimizing power consumption, reducing peak temperature, maximizing energy efficiency, maximizing processor reliability, and so on, along with much more wider constraints of temperature, power, timing, and reliability constraints. Thus DEM can be very complex and challenging to achieve. Since often times many DEMs operate together on a single processor, there is a need to unify various DEM techniques. This dissertation address such a need. In this work, a framework for DEM is proposed that provides a unifying processor model that includes processor power, thermal, timing, and reliability models, supports various DEM control mechanisms, many different objective functions along with equally diverse constraint specifications. Using the framework, a range of novel solutions is derived for instances of DEM problems, that include maximizing processor performance, energy efficiency, or minimizing power consumption, peak temperature under constraints of maximum temperature, memory reliability and task deadlines. Finally, a robust closed-loop controller to implement the above solutions on a real processor platform with a very low operational overhead is proposed. Along with the controller design, a model identification methodology for obtaining the required power and thermal models for the controller is also discussed. The controller is architecture independent and hence easily portable across many platforms. The controller has been successfully deployed on Intel Sandy Bridge processor and the use of the controller has increased the energy efficiency of the processor by over 30% / Dissertation/Thesis / Ph.D. Electrical Engineering 2013

Introducing an electric thermostat to the thermal management system is a way of actively controlling the temperature of the engine, which has been shown to have several possible gains regarding power, fuel consumption, emissions and engine durability. Complexity, cost and durability are key concerns that have led to no heavy duty truck on the market having an electrically controllable thermostat. This emphasizes the need for exploring alternative solutions that enables electric control of the thermostat according to the needs of heavy commercial vehicles. Several concepts have been generated to solve this problem and a model based approach in Simulink, Matlab and GT Suite was used for the development and evaluation. The most promising concept of combining a BLDC electric motor with a wax body enables electric control with a downsized actuator and full fail-safe function while showing improvements in temperature control performance compared to a traditional wax thermostat. This thesis has increased the knowledge on the subject and could allow for implementing an electrically controlled thermostat in future Scania heavy duty trucks, leading to a more durable engine with lower fuel consumption and emissions.

Additive manufacturing (AM) is a manufacturing technique that adds material, such as polymers, ceramics, and metals, in patterned layers to build three-dimensional parts for applications related to medicine, aviation, and energy. AM processes for metals like selective laser melting (SLM) hold the unique advantage of fabricating metal parts with complex architectures that cannot be produced by conventional manufacturing techniques. Thermal transport can be a focal point of unique AM products and is likewise important to metal AM processes. This dissertation investigates AM metal meshes with spatially varied thermal conductivities that can be used to maximize the charge and discharge rates for thermal energy storage and thermal management by phase change materials (PCMs). Further, manufacturing these meshes demands excellent thermal control in the metal powder bed for SLM processes. Since the thermal conductivities of metal powders specific to AM were previously unknown, we made pioneering measurements of such powders as a function of gas infiltration. In the past, thermal transport was improved in phase change materials for energy storage by adding spatially homogeneous metal foams or particles into PCMs to create composites with uniformly-enhanced (UE) thermal conductivity. Spatial variation can now be realized due to the emergence of metal AM processes whereby graded AM meshes are inserted into PCMs to create PCM composites with spatially-enhanced (SE) thermal conductivity. As yet, there have been no studies on what kind of spatial variation in thermal conductivity can further improve charge and discharge rates of the PCM. Making such mesh structures, which exhibit unsupported overhangs that limit heat dissipation pathways during SLM processes, demands understanding of heat diffusion within the surrounding powder bed. This inevitably relies on the precise knowledge of the thermal conductivity of AM metal powders. Currently, no measurements of thermal conductivity of AM powders have been made for the SLM process. In chapter 2 and 3, we pioneer and optimize the spatial variation of metal meshes to maximize charge and discharge rates in PCMs. Chapter 2 defines and analytically determines an enhancement ratio of charge rates using spatially-linear thermal conductivities in Cartesian and cylindrical coordinates with a focus on thermal energy storage. Chapter 3 further generalizes thermal conductivity as a polynomial function in space and numerically optimizes the enhancement ratio in spherical coordinates with a focus on thermal management of electronics. Both of our studies find that higher thermal conductivities of SE composites near to the heat source outperform those of UE composites. For selected spherical systems, the enhancement ratio reaches more than 800% relative to existing uniform foams. In chapter 4, the thermal conductivities of five metal powders for the SLM process were measured using the transient hot wire method. These measurements were conducted with three infiltrating gases (He, N2, and Ar) within a temperature range of 295-470 K and a gas pressure range of 1.4-101 kPa. Our measurements indicate that the pressure and the composition of the gas have a significant influence on the effective thermal conductivity of the powder. We find that infiltration with He provides more than 300% enhancement in powder thermal conductivity, relative to conventional infiltrating gases N2 and Ar. We anticipate that this use of He will result in better thermal control of the powder bed and thus will improve surface quality in overhanging structures.