The hydrogen (H2) gas sensing mechanism driving 3C-SiC resistive gas sensors is investigated in this work in which two hypotheses are proposed. One hypothesis involves the surface adsorption of H2 on the sensor surface with the adsorbed molecules influencing the flow of current in a resistive gas sensor, termed the surface adsorption detection mechanism. The second hypothesis includes the transfer of heat from the sensor to the gas, producing a change in the temperature of the device when the heat transfer characteristics of the gas change, termed the thermal detection mechanism. The heat transfer characteristics of the gas are dependent on the thermal conductivity of the gas, a property which is a strong function of gas composition. Thus, the thermal detection mechanism mainly detects changes in the thermal conductivity of a gas or gas mixture.Initial experiments suggested the surface adsorption mechanism as the detection mechanism of resistive 3C-SiC gas sensors. However, these experiments were performed in the absence of device temperature measurements. Recent experiments in which the device temperature was measured with a resistance temperature detector (RTD) in thermal contact with the device strongly support the thermal detection mechanism as being responsible for hydrogen gas detection. Experimental observations show the temperature of the resistive 3C-SiC hydrogen gas sensors changes greatly with changing hydrogen gas composition. For example, a 3C-SiC/SOI resistive sensor biased at 10 Vdc displayed a change in temperature from ~400°C to ~216°C, correlating to a change in current from ~41 mA to ~6mA, upon the introduction of 100% H2. The this 3C-SiC/SOI resistive sensor, this large decrease in temperature caused a large increase in resistance which is detected as a decrease in current. Several different experiments have also been performed to confirm the thermal detection mechanism hypothesis.

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This dissertation is focused on thermal transport at nanometer scale point and line constrictions and in nanowires with sawtooth surface roughness. To better understand thermal transport at a point contact such as that at the tip-sample junction of a scanning probe microscope, a Non Equilibrium Molecular Dynamics (NEMD) method is employed to calculate the temperature distribution and thermal resistance of a nanoscale point constriction formed between two silicon substrates. The simulation reveals surface reconstruction at the two free silicon surfaces and at the constriction. The radius of the heated zone in the cold substrate approaches a limit of about 20 times the average nearest-neighbor distance of boron doping atoms when the constriction radius (a) is reduced below the inter-dopant distance. The phonon mean free path at the constriction is suppressed by diffuse phonon-surface scattering and phonon-impurity scattering. The MD thermal resistance is close to the ballistic resistance when a is larger than 1 nm, suggesting that surface reconstruction does not reduce the phonon transmission coefficient significantly. When a is 0.5 nm and comparable to the dominant phonon wavelength, however, the NEMD result is considerably lower than the calculated ballistic resistance because bulk phonon dispersion and bulk potential are not longer accurate. The MD thermal resistance of the constriction increases slightly with increasing doping concentration due to the increase in the diffusive resistance. The NEMD method is further employed to calculate the temperature distribution and thermal resistance at nanoscale line constrictions formed between two silicone substrates. Similar to the nano point constriction, the thermal resistance at the nano line constriction is dominated by the ballistic resistance for constriction width in the range of 1 nm to 12 nm. An additional question that this dissertation seeks to answer is whether one can engineer the surface roughness on a nanowire to facilitate phonon backscattering so as to reduce the thermal conductivity below the diffuse surface limit. Monte Carlo simulation is used to show that phonon backscattering can occur at sawtooth surfaces of a silicon nanowire, suppressing the thermal conductivity below the diffuse surface limit. Asymmetric sawtooth nanowire surfaces can further cause phonon rectification, making the axial thermal conductance of the nanowire direction dependent. The phonon backscattering and rectification effects can be employed to enhance the thermoelectric figure of merit of nanowires. / text

As silicon-based transistor technology continues to scale ever downward, anticipation of the fundamental limitations of ultimately-scaled devices has driven research into alternative device technologies as well as new materials for interconnects and packaging. Additionally, as power dissipation becomes an increasingly important challenge in highly miniaturized devices, both the implementation and verification of high mobility, high thermal conductivity materials, such as low dimensional carbon nanomaterials, and the experimental investigation of heat transfer in the nanoscale regime are requisite to continued progress. This work furthers the current understanding of structure-property relationships in low dimensional carbon nanomaterials, specifically carbon nanotubes (CNTs) and graphene, through use of combined thermal conductance and transmission electron microscopy (TEM) measurements on the same individual nanomaterials suspended between two micro-resistance thermometers. Through the development of a method to measure thermal contact resistance, the intrinsic thermal conductivity, [kappa], of multi-walled (MW) CNTs is found to correlate with TEM observed defect density, linking phonon-defect scattering to the low [kappa] in these chemical vapor deposition (CVD) synthesized nanomaterials. For single- (S) and double- (D) walled (W) CNTs, the [kappa] is found to be limited by thermal contact resistance for the as-grown samples but still four times higher than that for bulk Si. Additionally, through the use of a combined thermal transport-TEM study, the [kappa] of bi-layer graphene is correlated with both crystal structure and surface conditions. Theoretical modeling of the [kappa] temperature dependence allows for the determination that phonon scattering mechanisms in suspended bi-layer graphene with a thin polymeric coating are similar to those for the case of graphene supported on SiO₂. Furthermore, a method is developed to investigate heat transfer through a nanoscale point contact formed between a sharp silicon tip and a silicon substrate in an ultra high vacuum (UHV) atomic force microscope (AFM). A contact mechanics model of the interface, combined with a heat transport model considering solid-solid conduction and near-field thermal radiation leads to the conclusion that the thermal resistance of the nanoscale point contact is dominated by solid-solid conduction. / text

The ongoing search for energy conservation in built structures and during the construction process prompted this thesis work to explore the use of sustainable technologies for floor heating systems. The thesis work explores the use of thermoplastic material as a sustainable substitute material for future floor heating systems. Concrete materials are presently used extensively for floor heating systems. Thermoplastic materials are seldom used for floor heating and the primary focus of this thesis is to explore the suitability & adaptability of thermoplastics as an innovative energy saving floor heating material. A thorough study of energy demands and the impact on environment due to greenhouse gas emissions has been done. Thermoplastic materials are environmental friendly and light weight. They exhibit high thermal conductivity which is favourable for the floor heating systems. A design technique has been developed for the use of thermoplastic materials as an energy efficient floor heating material. The present technique creates a new modular floor heating system. The design technique uses thermoplastic material of size 2.4m x1.2m with embedded electric heaters. Thermoplastic foam panels act as a single building block. A numerical simulation has been carried out to study the heat transfer characteristics of the proposed material. Limited experiments were conducted to verify the validity of the simulation results. The results from the experiments indicate good agreement with simulation results. The energy savings from the thermoplastic floor heating systems have been compared with that of electrical floor heating systems. The adaptability of the new floor heating system in terms of energy savings and cost benefit analysis is also discussed. / sustainable floor heating system

The A2Mo3O12 family, where A3+ is a large trivalent cation, can show interesting thermal properties such as negative thermal expansion, also known as thermomiotic behavior, where the overall volume of the material contracts with increasing temperature. A selection of compounds in this family, namely HfMgMo3O12, In2Mo3O12, Y2Mo3O12, Al2Mo3O12, In(HfMg)0.5Mo3O12, and In1.5(HfMg)0.25Mo3O12, have been synthesized using solid-state and mechanical activation techniques as well as a simplified sol-gel approach (Al2Mo3O12). Coefficients of thermal expansion were found to range from large-negative to low-positive in the orthorhombic phase, including near-zero in In(HfMg)0.5Mo3O12 and In1.5(HfMg)0.25Mo3O12. This set of materials provided insight into the role of low-frequency phonon modes in open-framework materials. Low-temperature heat capacity and thermal conductivity measurements confirmed that low-frequency modes were active in thermomiotic materials, and also present to some extent in all members of the open-framework A2Mo3O12 family examined. A clear correlation exists between the magnitude and sign of the coefficient of thermal expansion in the orthorhombic phase and the contribution of low-energy modes to the low-temperature heat capacity, with negative thermal expansion materials having a larger contribution. The low-frequency phonon modes result in low thermal conductivity and reduced phonon mean free paths when compared to conventional ceramics and indicate that these low values are characteristic of open-framework materials in NTE families even if the materials in the families are not thermomiotic themselves.

The objective of this research was to design aluminum powder metallurgy (PM) alloys and processing strategies that yielded sintered products with thermal properties that rivaled those of the cast and wrought aluminum alloys traditionally employed in heat sink manufacture. Research has emphasized PM alloys within the Al-Mg-Sn system. In one sub-theme of research the general processing response of each PM alloy was investigated through a combination of sintering trials, sintered density measurements, and microstructural assessments. In a second, the thermal properties of sintered products were studied. Thermal conductivity was first determined using a calculated approach through discrete measurements of specific heat capacity, thermal diffusivity and density and subsequently verified using a transient plane source technique on larger specimens. Experimental PM alloys achieved >99% theoretical density and exhibited thermal conductivity that ranged from 179 Wm-1K-1 to 225 Wm-1K-1. Thermal performance was largely dominated by the amount of magnesium present within the aluminum grains and in turn, bulk alloy chemistry. Data confirmed that the novel PM alloys were highly competitive with even the most advanced heat sink materials such as wrought 6063 and 6061. Two methods of thermal analysis were employed in order to determine the thermal conductivity of each alloy. This first consisted of individual analysis of the specific heat capacity (Cp), thermal diffusivity (?) and density (?) as a function of temperature for each alloy. The thermal conductivity (K) was subsequently determined through the relationship: K=C_p ??. The second means of thermal analysis was a direct thermal conductivity measure using a transient plane source (TPS). The thermal diffusivity and density of samples were both found to decrease with temperature in a linear fashion. Conversely, the specific heat capacity was found to increase with temperature. The only measured thermal property that appeared to be influenced by the alloy chemistry was the thermal diffusivity (and subsequently the calculated thermal conductivity). Both means of thermal analysis showed high thermal conductivity in alloys with low concentrations of magnesium, demonstrating the significance of having alloying elements in solid solution with aluminum. Overall, several alloys were developed using a press and sinter approach that produced higher levels of thermal conductivity than conventional aluminum heat sink materials. The highest thermal conductivity was achieved by alloy Al-0.6Mg-1.5Sn with a calculated value of 225.4 Wm-1K-1. This novel aluminum PM alloy was found to exceed both wrought 6061 and 6063 (195 and 217 Wm-1K-1 respectively). Furthermore, PM alloy Al-0.6Mg-1.5Sn was found to have a significant advantage over die-cast A390 (142 Wm-1K-1).

There is a growing need to better understand the relationship between time, strain rate, and temperature on the load-deformation behaviour of clay soils in engineering applications. These applications may include: infrastructure constructed in northern regions where climate change is a growing concern; disposal of nuclear waste; and, industrial structures, such as furnaces, foundries, and refrigeration plants. Temperature variations may induce changes in internal pressure in the soil, swelling and shrinkage, and affect the mechanical properties of the soil. This thesis presents thermal numerical modeling for two instrumented field sites in northern Manitoba. Thermal conductivity testing on samples from these sites and field data are used to calibrate these thermal numerical models. Various boundary conditions are examined. The capabilities of the models are evaluated to determine if the models adequately simulate and predict changes in temperature in geotechnical structures. A discussion is presented on the strengths and weaknesses in the models and the predictive capabilities of the models. The thesis then shifts into understanding the concepts of thermoplasticity and viscoplasticity and the mathematics relating these concepts. Mathematical models that describe these concepts are examined and compared with traditional soil mechanics approaches. The concepts of thermoplasticity and viscoplasticity are combined in an encompassing elastic thermo-viscoplastic (ETVP) model using a semi-empirical framework. A sensitivity analysis is used to evaluate quantitatively the response of the model. The model is then validated qualitatively against published laboratory data. Applications of the ETVP model are discussed.

Natural geomaterials exhibit a wide range in size, physical properties, chemical properties, and mechanical behaviors. Soils that are composed of mixtures of particles with different physical and chemical properties pose a challenge to characterization and quantification of the engineering properties. This study examined the behavior of particulate mixtures composed of differently sized silica particles, mixtures composed of aluminosilicate and organic carbon particles, and mixtures composed of particles with approximately three orders of magnitude difference in particle size. This experimental investigation used elastic, electromagnetic, and thermal waves to characterize and to quantify the small to intermediate strain behavior of the mixtures. The mechanical property of stiffness of mixed materials (e.g. binary mixtures of silica particles and fly ashes with various carbon and biomass contents) was evaluated through the stiffness of active grain contacts, and the stiffness of particles which carry applied load, using the physical concepts of intergranular void ratio and interfine void ratio. Additionally, the change in both contact mode/stiffness and electrical property due to the presence of nano-sized particles (i.e., iron oxides) on the surface of soil grains was evaluated according to applied stress, packing density, iron coating density, and substrate sand particle size. Finally, the biomass fraction and total organic carbon content of mixtures was used to quantify the electrical and thermal conductivities when particulate organic was mixed with aluminosilicate particles.

Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. In response to this shift, finding multifunctional materials with excellent thermal conductivity and tailored electrical properties are becoming increasingly important. For this research thesis, three different studies were conducted to develop and characterize thermally conductive polymer composites. In the first study, a PPS matrix was combined with different types of carbon-based fillers to determine the effects of filler’s size, shape, and orientation on thermal conductivity. In the second study, effects of adding ceramic- and carbon- based fillers on the tailored thermal and electrical properties of composites were investigated. Lastly, the possibility of improving the thermal conductivity by introducing and aligning polymer fibers in the composites was investigated. The composites were characterized with respect to their physical, thermal, and electrical properties to propose possibilities of application in the electronic packaging industries.