The global greenhouse gas CO2 emission from the transportation sector is very significant. To reduce this gas emission, EU has set an average target of not more than 95 CO2/km for new passenger cars by the year 2020. A great reduction is still required to achieve the CO2 emission target in 2020, and many different approaches are being considered. This thesis focuses on the thermal management of the engine as an area that promise significant improvement of fuel efficiency with relatively small changes. The review of the literature shows that thermal management can improve engine efficiency through the friction reduction, improved air-fuel mixing, reduced heat loss, increased engine volumetric efficiency, suppressed knock, reduce radiator fan speed and reduction of other toxic emissions such as CO, HC and NOx. Like heat loss and friction, most emissions can be reduced in high temperature condition, but this may lead to poor volumetric efficiency and make the engine more prone to knock. The temperature trade-off study is conducted in simulation using a GT-SUITE engine model coupled with the FE in-cylinder wall structure and cooling system. The result is a map of the best operating temperature over engine speed and load. To quantify the benefit of this map, eight driving styles from the legislative and research test cycles are being compared using an immediate application of the optimal temperature, and significant improvements are found for urban style driving, while operation at higher load (motorway style driving) shows only small efficiency gains. The fuel consumption saving predicted in the urban style of driving is more than 4%. This assess the chance of following the temperature set point over a cycle, the temperature reference is analysed for all eight types of drive cycles using autocorrelation, lag plot and power spectral density. The analysis consistently shows that the highest volatility is recorded in the Artemis Urban Drive Cycle: the autocorrelation disappears after only 5.4 seconds, while the power spectral density shows a drop off around 0.09Hz. This means fast control action is required to implement the optimal temperature before it changes again. Model Predictive Control (MPC) is an optimal controller with a receding horizon, and it is well known for its ability to handle multivariable control problems for linear systems with input and state limits. The MPC controller can anticipate future events and can take control actions accordingly, especially if disturbances are known in advance. The main difficulty when applying MPC to thermal management is the non-linearity caused by changes in flow rate. Manipulating both the water pump and valve improves the control authority, but it also amplifies the nonlinearity of the system. Common linearization approaches like Jacobian Linearization around one or several operating points are tested, by found to be only moderately successful. Instead, a novel approach is pursued using feedback linearization of the plant model. This uses an algebraic transformation of the plant inputs to turn the nonlinear systems dynamics into a fully or predominantly linear system. The MPC controller can work with the linear model, while the actual control inputs are found using an inverse transformation. The Feedback Linearization MPC of the cooling system model is implemented and testing using MathWork Simulink®. The process includes the model transformation approach, model fitting, the transformation of the constraints and the tuning of the MPC controller. The simulation shows good temperature tracking performance, and this demonstrates that a MPC controller with feedback linearization is a suitable approach to thermal management. The controller strategy is then validated in a test rig replicating an actual engine cooling system. The new MPC controller is again evaluated over the eight driving cycles. The average water pump speed is reduced by 9.1% compared to the conventional cooling system, while maintaining good temperature tracking. The controller performance further improves with future disturbance anticipation by 20.5% for the temperature tracking (calculated by RMSE), 6.8% reduction of the average water pump speed, 47.3% reduction of the average valve movement and 34.0% reduction of the average radiator fan speed.

Inversores de sistemas fotovoltaicos são equipamentos de eletrônica de potência que fornecem energia elétrica em corrente alternada (CA) a partir de uma fonte de energia elétrica em corrente contínua (CC), no caso, os módulos fotovoltaicos. Estes inversores quando em operação aumentam sua temperatura. Este aumento de temperatura é indesejável, porém é inerente ao seu funcionamento. Equipamentos eletrônicos possuem um limite seguro de temperatura de operação, acima do qual podem ocorrer instabilidades de operação, redução da vida útil ou até mesmo falha drástica. O conhecimento da eficiência de conversão elétrica e das perdas responsáveis pelo aquecimento é importante para o adequado dimensionamento de inversores quando aplicados em sistemas fotovoltaicos conectados à rede, assim como para o desenvolvimento do inversor como produto. Para proteção, para aumento da vida útil, para maior confiabilidade, para maior estabilidade e para maior segurança de operação de componentes, inversores possuem rotinas em seus algoritmos de controle com estratégias automatizadas dedicadas ao gerenciamento térmico. Estas rotinas de proteção e gerenciamento térmico, sempre quando acionadas, tendem a reduzir a capacidade de conversão de potência do inversor, seja pelo acionamento de um ventilador auxiliar, seja pelo deslocamento do ponto de operação em máxima potência. Fabricantes de inversores tratam deste assunto pelo termo “temperature derating” (em inglês) Esta tese apresenta um estudo relacionado a influência da temperatura sobre o desempenho de inversores fotovoltaicos conectados à rede. Avalia tipos de estratégias de gerenciamento térmico e proteção de uso corrente em inversores comerciais. Apresenta resultados de ensaios experimentais para determinação de parâmetros térmicos característicos dos inversores. Descreve um modelo preditivo da temperatura de operação em regime transiente. A partir da determinação experimental de parâmetros térmicos, o modelo preditivo de temperatura de operação foi implementado no software de simulação dinâmica para dimensionamento e avaliação de sistemas fotovoltaicos FVCONECT, desenvolvido no LABSOL/UFRGS, estando o mesmo apto para simular a operação e estimar perdas anuais de desempenho energético decorrentes das rotinas de gerenciamento térmico, dos seus efeitos e das limitações impostas durante a operação de inversores fotovoltaicos conectados à rede. Um dos resultados da simulação é a evolução da temperatura do inversor, permitindo avaliar a frequência e amplitude dos ciclos térmicos ao qual o inversor é submetido e, consequentemente, determinar uma estimativa para durabilidade do inversor. / Photovoltaic inverters are electronic power devices that provide electrical energy in alternating current (AC) from a source of electrical energy in direct current (DC) - a photovoltaic generator, in this case. Inverters increase their temperature when in operation. This rise in temperature is not desirable, but inherent to its operation. Any electronic equipment has a safe operating temperature limit. When this limit is surpassed, operating instability, life reduction or even drastic failure may occur. The knowledge of the electrical conversion efficiency and the losses responsible for the heating is important for the proper sizing of grid-tie inverters in photovoltaic systems, as well as for the development of the inverter as a product. In order to increase the useful life of the device and its components, for greater reliability, safety, stability and security of operation, inverters have routines in their algorithms of control with automated strategies dedicated to the thermal management. These protection and thermal management routines, whenever activated, tend to reduce the power conversion capacity of the inverter, either by the activation of an auxiliary fan or by the displacement of the operating point at maximum power. Inverter manufacturers address this issue by the term "temperature derating". This thesis presents a methodology to evaluate the influence of the performance of different strategies to avoid excessive temperature of the inverter components on its performance and durability It is also made an evaluation of different thermal management strategies and protection used in commercial inverters. Results of experimental tests for determination of thermal parameters characteristic of the inverters are presented. A predictive model of transient operating inverter temperature is also described. From the experimental determination of thermal parameters, the predictive model of operating temperature was implemented to the FVCONECT, a dynamic simulation software for sizing and evaluation of photovoltaic systems developed in LABSOL / UFRGS. With this modification, the software was able to simulate the operation and estimate losses of energy due to the thermal management routines, their effects and the limitations imposed during the operation of grid-tie inverters. One of the results of the simulation is the evolution of the inverter temperature, allowing to evaluate the frequency and amplitude of thermal cycles to which the inverter is subjected and, as a consequence, an estimate of durability of the inverter.

High efficiency multi-junction (MJ) solar cells were packaged onto receiver systems. The efficiency change of concentrator cells under continuous high intensity illumination was done. Also, assessment of the receiver design on the overall performance of a Fresnel-type concentration system was investigated. We present on receiver designs including simulation results of their three-dimensional thermal operation and experimental results of tested packaged receivers to understand their efficiency in real world operation. Thermal measurements from solar simulators were obtained and used to calibrate the model in simulations. The best tested efficiency of 36.5% is obtained on a sample A receiver under 260 suns concentration by the XT-30 solar simulator and the corresponding cell operating temperature is ~30.5°C. The optimum copper thickness of a 5 cm by 5 cm simulated alumina receiver design was determined to be 6 mm and the corresponding cell temperature under 1000 suns concentration is ~36°C during operation.

Tato práce se zabývá problematikou battery packů. V první části popisuje návrh battery packu z hlediska volby baterií, jejich tvaru, velikosti, typu a konfigurace zapojení. Dále uvádí vliv těchto charakteristik na výkonnost battery packu a jeho spolehlivost. Zabývá se problematikou termálního managementu battery packů a jeho vlivu na životní cyklus baterií. V druhé části se zabývá praktickým návrhem konceptu battery packu pro Lithium-polymerové baterie. Kalorimetricky je zde zjištěno množství produkovaného tepla při vybíjení, které je poté využito v CFD simulaci chlazení článku.

Les nouveaux composants à semi-conducteur de type grand gap ont été développés pour des applications de conversion de puissance en raison de leurs hautes fréquences de commutation (de centaine kHz à quelques MHz) et pertes faibles. Afin de bien profiter ses avantages, la technologie des circuits imprimés (PCB) est intéressante pour une intégration à haute densité de puissance grâce à sa flexibilité et son faible coût. Cependant, à cause de la mauvaise conductivité thermique du matériau FR-4 utilisé pour le substrat PCB et la haute densité de puissance réalisée, il est primordial de trouver des solutions thermiques pour améliorer les performances thermiques de la structure de PCB. Dans cette thèse, trois solutions thermiques pour les structures de PCB ont été proposées, y compris des solutions avec des vias thermiques, de cuivre épais sur le substrat de PCB ainsi que des dispositifs de refroidissement thermoélectrique (TEC). Nos études sont basées sur la modélisation électrothermique et la méthode d’éléments finis en 3D. Tout d’abord, l’optimisation des paramètres des vias (diamètre, épaisseur de placage, surface formée par des vias, la distance entre des vias etc.) a été réalisée pour optimiser l’effet de refroidissement. Ensuite, on constate que les performances thermiques des structures de PCB peuvent être améliorées en utilisant cuivre épais sur le substrat de PCB. Cuivre épais augmente le flux thermique latéral dans la couche de cuivre. Les influences de l’épaisseur de cuivre (35 à 500 µm) ont été étudiées. Cette solution est facile à réaliser et peut être combinée à d’autres solutions de refroidissement. Enfin, le dispositif thermoélectrique comme les modules Peltier est une technologie de refroidissement local. Les influences des paramètres de Peltier (Propriétés du matériau thermoélectrique, nombre d’éléments Peltier, distance entre la source de chaleur et les dispositifs Peltier, etc.) ont été identifiées. Il est démontré que des modules Peltier ont l’application potentielle pour le développement d’intégration de PCB attendu que son active contrôle des températures. / The emerging wide bandgap (WBG) semiconductor devices have been developed for power conversion applications instead of silicon devices due to higher switching frequencies (from few 100 kHz to several MHz) and lower on-state losses resulting in a better efficiency. In order to take full advantage of the WBG components, PCB technology is attractive for high power density integration thanks to its flexibility and low cost. However, due to poor thermal conductivity of the commonly used material Flame Retardant-4 (FR4), efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrates. So it is of the first importance to seek technological means in order to improve the thermal performances. In this thesis, three main thermal management solutions for PCB structures have been investigated including thermal vias, thick copper thickness on the PCB substrate as well as thermoelectric cooling (TEC) devices. Our studies are based on the electro-thermal modeling and 3D finite element (FE) methods. Firstly, optimization of the thermal via parameters (via diameter, via plating thickness, via-cluster surface, via pattern, pitch distance between vias etc.) has been realized to improve their cooing performances. We presented and evaluated thermal performances of the PCB structures by analyzing the thermal resistance of the PCB substrate with different thermal vias. Secondly, it is found that thermal performances of the PCB structures can be enhanced by using thick copper thickness on top of the PCB substrate, which increases the lateral heat flux along the copper layer. Influences of the copper thickness (35 µm to 500 µm) has been discussed. This solution is easy to realize and can be combined with other cooling solutions. Thirdly, thermoelectric cooler like Peltier device is a solid-state cooling technology that can meet the local cooling requirements. Influences of Peltier parameters (Thermoelectric material properties, number of Peltier elements, distance between the heating source and the Peltier devices etc.) have been identified. All these analyses demonstrate the potential application of Peltier devices placed beside the heating source for PCB structures, which is a benefit for developing the embedding technology in such structures.

The ever-increasing levels of greenhouse gas emissions has led to the scientific community starting to explore the viability of electrical aircraft system, with the most prominent research and product development for hybrid electric system, which forms the transition phase from combustion to fully electric aircrafts. The primary objective of this thesis is to find solutions towards thermal management of the electrical components of a hybrid electric aircraft propulsion system, which generate a significant amount of heat while operating at heavy load conditions required to propel an aircraft. In view of these objectives a micro channel cold plate liquid cooling system, has been dynamically modelled using a combination of lumped parameter and thermal resistance methods of heat transfer analysis. The study investigates the prospects of using Mobil Jet Oil II, typically used as an aircraft lubricant as a coolant for the thermal management system. The primary components of this model are lithium ion battery, DC-AC inverter, permanent magnet motor, cross flow finned micro channel heat exchanger, centrifugal pump and ducts. The electrical components have been dimensioned according to energy storage and load requirements considering their efficiencies and gravimetric power/energy. The system has been simulated and analyzed under different scenarios considering the coolant inlet temperature, air temperature across the heat exchanger and on two-time horizons. Analysis has been done to study the dynamic trends of the component temperature and the coolant at different stages of the system. The scope of the study includes an evaluation of the added weight of the thermal management system under different time horizons and their comparison with results from a reference study. From the simulation results it can be concluded that Mobil Jet Oil II is a promising option as a coolant and therefore its use as a common fluid for gas turbine lubrication and as coolant, will benefit the aircraft as now no extra coolant reservoir is required, allowing reduction in weight carried by the aircraft.

This dissertation presents the development of two unique measurement platforms. <br><br>The first system is a high-temperature Z-Meter. This system is designed to simultaneously measure the electrical resistivity, Seebeck coefficient, and thermal conductivity of a thermoelectric sample to accurately determine the figure of merit, ZT, for that material. It is designed to operated at sample temperatures of up to 1000C, and with temperature gradients on the order of 500C across the sample. This system also provides <i>in situ</i> load monitoring for contact pressure and allows the user to adjust loading during the experiment. <br><br>The second part of this dissertation focuses on the development of enhanced composite phase change material (PCM) heat sinks to improve passive thermal management in mobile electronics. We present a new design for a composite PCM heat sink and utilize off-the-shelf PCMs to show characterize the performance. In order to accurately investigate the performance enhancement of these designs, we develop a turn-key thermal management evaluation platform to allow the user complete control over the power profiles and cycling applied to the test chip, as well as providing <i>in situ</i> temperature monitoring within the chip. The proposed package designs show significant improvement in the length of time extended before reaching the cut-off temperature within the heatfluxes tested, 6 - 14 W/cm^2, and accomplish this while weighing less than the equivalent sensible heat storage design.<br><br><br><br>

Pillared-graphene structure (PGS) is a novel three-dimensional structure consists of parallel graphene sheets that are separated by carbon nanotube (CNT) pillars that is proposed for efficient thermal management of electronics. For microscale simulations, finite element analyses were carried out by imposing a heat flux on several PGS configurations using a Gaussian pulse. The temperature gradient and distribution in the structures was evaluated to determine the optimum design for heat transfer. The microscale simulations also included conducting a mesh-independent study to determine the optimal mesh element size and shape. For nanoscale simulations, Scienomics MAPS software (Materials And Processes Simulator) along with LAMMPS (Large-scale Atomic/ Molecular Massively Parallel Simulator) were used to calculate the thermal conductivity of different configurations and sizes of PGS. The first part of this research included investigating PGS when purely made of carbon atoms using non-equilibrium molecular dynamics (NEMD). The second part included investigating the structure when supported by a copper foil (or substrate); mimicking production of PGS on copper. The micro- and nano-scale simulations show that PGS has a great potential to manage heat in micro and nanoelectronics. The fact that PGS is highly tunable makes it a great candidate for thermal management applications. The simulations were successfully conducted and the thermal behavior of PGS at the nanoscale was characterized while accounting for phonon scattering the graphene/CNT junction as well as when PGS is supported by a copper substrate.

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