• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 3
  • 2
  • Tagged with
  • 5
  • 5
  • 3
  • 3
  • 3
  • 2
  • 2
  • 2
  • 2
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

Pipelined floating point divider with built-in testing circuits

Lyu, Chuang-nan January 1988 (has links)
No description available.
2

Ultra Low Power IEEE 802.15.4/ZIGBEE Compliant Transceiver

Hussien, Faisal A. 2009 December 1900 (has links)
Low power wireless communications is the most demanding request among all wireless users. A battery life that can survive for years without being replaced, makes it realistic to implement many applications where the battery is unreachable (e.g. concrete walls) or expensive to change (e.g underground applications). IEEE 802.15.4/ZIGBEE standard is published to cover low power low cost applications, where the battery life can last for years, because of the 1% duty cycle of operation. A fully integrated 2.4GHz IEEE802.15.4 Compliant transceiver suitable for low power, low cost ZIGBEE applications is implemented. Direct conversion architecture is used in both Receiver and Transmitter, to achieve the minimum possible power and area. The chip is fabricated in a standard 0.18um CMOS technology. In the transmit mode, the transmitter chain (Modulator to PA) consumes 25mW, while in the receive mode, the iv receiver chain (LNA to Demodulator) consumes 5mW. The Integer-N Frequency Synthesizer consumes 8.5mW. Other Low power circuits are reported; A 13.56 Passive RFID tag and a low power ADC suitable for Built-In-Testing applications.
3

System-level design and RF front-end implementation for a 3-10ghz multiband-ofdm ultrawideband receiver and built-in testing techniques for analog and rf integrated circuits

Valdes Garcia, Alberto 17 September 2007 (has links)
This work consists of two main parts: a) Design of a 3-10GHz UltraWideBand (UWB) Receiver and b) Built-In Testing Techniques (BIT) for Analog and RF circuits. The MultiBand OFDM (MB-OFDM) proposal for UWB communications has received significant attention for the implementation of very high data rate (up to 480Mb/s) wireless devices. A wideband LNA with a tunable notch filter, a downconversion quadrature mixer, and the overall radio system-level design are proposed for an 11-band 3.4-10.3GHz direct conversion receiver for MB-OFDM UWB implemented in a 0.25mm BiCMOS process. The packaged IC includes an RF front-end with interference rejection at 5.25GHz, a frequency synthesizer generating 11 carrier tones in quadrature with fast hopping, and a linear phase baseband section with 42dB of gain programmability. The receiver IC mounted on a FR-4 substrate provides a maximum gain of 67-78dB and NF of 5-10dB across all bands while consuming 114mA from a 2.5V supply. Two BIT techniques for analog and RF circuits are developed. The goal is to reduce the test cost by reducing the use of analog instrumentation. An integrated frequency response characterization system with a digital interface is proposed to test the magnitude and phase responses at different nodes of an analog circuit. A complete prototype in CMOS 0.35mm technology employs only 0.3mm2 of area. Its operation is demonstrated by performing frequency response measurements in a range of 1 to 130MHz on 2 analog filters integrated on the same chip. A very compact CMOS RF RMS Detector and a methodology for its use in the built-in measurement of the gain and 1dB compression point of RF circuits are proposed to address the problem of on-chip testing at RF frequencies. The proposed device generates a DC voltage proportional to the RMS voltage amplitude of an RF signal. A design in CMOS 0.35mm technology presents and input capacitance <15fF and occupies and area of 0.03mm2. The application of these two techniques in combination with a loop-back test architecture significantly enhances the testability of a wireless transceiver system.
4

Development of Robust Analog and Mixed-Signal Circuits in the Presence of Process- Voltage-Temperature Variations

Onabajo, Marvin Olufemi 2011 May 1900 (has links)
Continued improvements of transceiver systems-on-a-chip play a key role in the advancement of mobile telecommunication products as well as wireless systems in biomedical and remote sensing applications. This dissertation addresses the problems of escalating CMOS process variability and system complexity that diminish the reliability and testability of integrated systems, especially relating to the analog and mixed-signal blocks. The proposed design techniques and circuit-level attributes are aligned with current built-in testing and self-calibration trends for integrated transceivers. In this work, the main focus is on enhancing the performances of analog and mixed-signal blocks with digitally adjustable elements as well as with automatic analog tuning circuits, which are experimentally applied to conventional blocks in the receiver path in order to demonstrate the concepts. The use of digitally controllable elements to compensate for variations is exemplified with two circuits. First, a distortion cancellation method for baseband operational transconductance amplifiers is proposed that enables a third-order intermodulation (IM3) improvement of up to 22dB. Fabricated in a 0.13µm CMOS process with 1.2V supply, a transconductance-capacitor lowpass filter with the linearized amplifiers has a measured IM3 below -70dB (with 0.2V peak-to-peak input signal) and 54.5dB dynamic range over its 195MHz bandwidth. The second circuit is a 3-bit two-step quantizer with adjustable reference levels, which was designed and fabricated in 0.18µm CMOS technology as part of a continuous-time SigmaDelta analog-to-digital converter system. With 5mV resolution at a 400MHz sampling frequency, the quantizer's static power dissipation is 24mW and its die area is 0.4mm^2. An alternative to electrical power detectors is introduced by outlining a strategy for built-in testing of analog circuits with on-chip temperature sensors. Comparisons of an amplifier's measurement results at 1GHz with the measured DC voltage output of an on-chip temperature sensor show that the amplifier's power dissipation can be monitored and its 1-dB compression point can be estimated with less than 1dB error. The sensor has a tunable sensitivity up to 200mV/mW, a power detection range measured up to 16mW, and it occupies a die area of 0.012mm^2 in standard 0.18µm CMOS technology. Finally, an analog calibration technique is discussed to lessen the mismatch between transistors in the differential high-frequency signal path of analog CMOS circuits. The proposed methodology involves auxiliary transistors that sense the existing mismatch as part of a feedback loop for error minimization. It was assessed by performing statistical Monte Carlo simulations of a differential amplifier and a double-balanced mixer designed in CMOS technologies.
5

On-chip testing of A/D and D/A converters:static linearity testing without statistically known stimulus

Korhonen, E. (Esa) 12 October 2010 (has links)
Abstract The static linearity testing of analog-to-digital and digital-to-analog converters (ADCs and DACs) has traditionally required test instruments with higher linearity and resolution than that of the device under test. In this thesis ways to test converters without expensive precision instruments are studied. A novel calculation algorithm for the ADC differential non-linearity (DNL) and integral non-linearity (INL) estimation is proposed. The algorithm assumes that two stimuli with constant offset between them are applied to the ADC under test and that the code density histograms for both stimuli are recorded. The probability density function (PDF) of the stimulus is then solved using simple calculations so that DNL and INL of the ADC can be estimated without a priori known stimuli. If a DAC is used to generate the stimulus to ADC, all inputs and outputs are digital and the new algorithm can be used to obtain the PDF of the DAC output. Moreover, the PDF of DAC actually characterizes its INL and DNL so that this all-digital test configuration enables a simultaneous testing of both converters thanks to the new algorithm. The proposed algorithm is analyzed thoroughly both mathematically and by carrying out several simulations and experimental tests. On the basis of the analysis it is possible to approximate the impending estimation error and select the optimal value for the offset between the stimuli. In theory, the accuracy of the algorithm proposed equals that of the standard histogram method with ideal stimulus, but in practice, the accuracy is limited by that of the offset between the stimuli. Therefore, special attention is paid to development of an accurate and small offset generator which enables ratiometric test setup and solves the problems in the case of reference voltage drift. The proposed on-chip offset generator is built using only four resistors and switches. It occupies 122·22 μm2 in a 130 nm CMOS process and accuracy is appropriate for the INL testing of 12-bit converters from rail-to-rail. Based on the analysis of the influence of resistor non-linearity on the accuracy of offset, it is possible to improve the offset generator further. With discrete resistors, the INL of 16-bit ADCs was tested using a 12-bit signal generator. The proposed simple algorithm and tiny offset generator are considered to be important steps towards built-in DNL and INL testing of ADCs and DACs.

Page generated in 0.0642 seconds