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Solid State Diffusion Kinetics of Intermetallic Compound Formation in Composite SolderSees, Jennifer A. (Jennifer Anne) 05 1900 (has links)
The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and morphology of the two intermetallic phases (Cu6Sn5 and Cu3Sn) that form between a Cu substrate and Sn/Pb solder under different aging and annealing conditions.
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Effect of Microstructure Changes on Mechanical Properties of La₆₆Al₁₄(Cu, Ni)₂₀ Amorphous and Crystalline AlloysZhang, Yong, Lee, Irene Mei Ling, Tan, Hao, Jing, Qin, Li, Yi 01 1900 (has links)
The microstructure, and phase selections of La₆₆Al₁₄(Cu, Ni)₂₀ alloy were studied by Bridgman solidifications, and composite materials of dendrites in amorphous matrix or micro- and nano- sized eutectic matrix were formed with different cooling rates. The volume fraction of the dendrite phase reaches a maximum at the cooling rate of about 15 K/s, the secondary dendrite arm spacing λ₂ decreases from 4.3 µm to 0.6 µm with the increasing of cooling rate R, and obeys the equation of λ₂R⁰.⁵⁷=1.74µm(K/s)R⁰.⁵⁷. The compression strength, as well as the elastic strain limit of the dendrite/amorphous matrix composite are 600 MPa, and 2.3%, respectively. Improved ductility was observed for the dendrite amorphous matrix composites with more dendrite phase by slow cooling rate. / Singapore-MIT Alliance (SMA)
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Laser Soldered Eutectic Die-Bonding Processes in the LED PackagingChan, Wei-yi 19 July 2012 (has links)
The effect of laser power pattern on the temperature and thermal stress distributions in LED die bonding process is investigated in this work. The wavelength of 940nm diode laser source is used in this study. The laser light is focus on the back of an AlN substrate. The eutectic Au80Sn20 solder metallized between die and substrate is soldered by the heat conducted from the controlled laser power. The finite element package software-MSC. Marc is employed to simulate the laser soldering process. The thermal-elastic-plastic models of the solid elements are used. The temperature dependent material properties are applied to characterize the temperature variation effect during the die bonding. The measured temperature data have also been used to derive the absorption coefficient, conductivity, specific heat of AlN substrate and the convection coefficient in free convection via the inverse engineering process. A difference between the simulated and measured temperature can be kept in 10%. The temperature and thermal stress distributions during the die bonding process have been simulated and studied. The distributions of residual stress induced in this die bonding process have also been studied. The effects of different laser soldering parameters, e.g. focus shift, defocus, inclined angle, on the die bonding are also studied.
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Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic Pb-Sn and Pb-free solders /Huang, Xingjia. January 2003 (has links)
Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
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The Effect of Nanoparticle Concentration on Thermo-physical Properties of Alumina-nitrate NanofluidShao, Qian 02 October 2013 (has links)
The objective of this study was to determine how Al2O3 nanoparticle concentration affected the specific heat, heat of fusion, melting point, thermal diffusivity and thermal conductivity of Alumina-Nitrate nanofluids.
Al2O3 nanoparticles were dispersed in a eutectic of sodium nitrate and potassium nitrate (60:40 for mole fraction) to create nanofluids using a hot plate evaporation method and an air dryer method. The nominal Al2O3 (alumina) mass fraction was between 0 and 2%, and was determined as the ratio of the mass of Al2O3 nanoparticles to the total mass of the nanofluid. After the preparation of the nanofluids, Neutron Activation Analysis (NAA) was used to measure the actual Al2O3 mass fraction in the nanofluids. The specific heat, heat of fusion, and melting point were measured with a Modulated Differential Scanning Calorimeter (MDSC). The thermal diffusivity and thermal conductivity were measured with Laser Flash Analysis (LFA).
The MDSC results showed that the addition of Al2O3 nanoparticles enhanced the specific heat of the nanofluids synthesize from both methods. There was a parabolic relation between the specific heat and the Al2O3 mass fraction for the nanofluids synthesized from the hot plate evaporation method, with a maximum 31% enhancement at 0.78% Al2O3 mass fraction. The nanofluids synthesized from the air dryer method also resulted in enhanced specific heats which were higher at the same Al2O3 mass fraction than those of the nanofluids synthesized from the hot plate evaporation method. It was not determined why this enhancement occurred. The results also showed that the introduction of Al2O3 nanoparticles had no significant effect on the heat of fusion and melting point of the nanofluids synthesized from either method.
The LFA results showed that adding Al2O3 nanoparticles decreased the thermal diffusivity and the thermal conductivity of the nitrate eutectic.
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Wear and microstructure of eutectoid steels /Danks, Daniel, January 1989 (has links)
Thesis (Ph. D.)--Oregon Graduate Center, 1989.
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Co-deformation of a two-phase FCC/BCC material /Sinclair, Chad. January 2001 (has links)
Thesis (Ph.D.) -- McMaster University, 2001. / Includes bibliographical references (leaves 229-236). Also available via World Wide Web.
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Casting and analysis of squeeze cast aluminium silicon eutectic alloy : a thesis presented in partial fulfilment of the requirements for the degree of Doctor of Philosophy in Mechanical Engineering at the University of Canterbury, Christchurch, New Zealand /Smillie, Matthew. January 2006 (has links)
Thesis (Ph. D.)--University of Canterbury, 2006. / Typescript (photocopy). Includes bibliographical references (p. [161]-166). Also available via the World Wide Web.
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Amitraz Solid Dosage FormWalbrugh, Lushane 21 August 2007 (has links)
This study considered the use of urea eutectics as fast release solid dosage carrier forms for the acaricide N-methylbis (2,4-xylyliminomethyl) methylamine (AmitrazTM). Wettol D2 and Arkopal N090 were chosen as the wetting agent and dispersants respectively. Their optimum levels were determined as the surfactant concentrations that yielded a minimum in the dispersion viscosity of a concentrated (30% m/m) Amitraz suspension. The optimum dosage levels were found to be ca. 2% Arkopal N090 and ca. 1% Wettol D2. Eutectic phase diagrams were obtained using the melting-cooling method. The components were ground together into a fine powder and heated in a glass tube immersed in a silicon oil bath. The liquid was allowed to cool down and solidify at ambient conditions. The time-dependant temperature change of the sample was tracked with a thermocouple. The data was captured in real time on a personal computer and analysed using an Excel spreadsheet programme. The melt-cast method was used to prepare eutectic mixtures. They were characterised using DSC, DTA, XRD and Light Microscopy. The XRD peaks showed the presence of the two separate crystal structures for the eutectic mixture constituents. The urea – CaBr2.2H2O combination was initially considered as carrier for Amitraz. However, this eutectic system was found to be too hygroscopic. Small additions of PEG 6000 improved the tablet strength but decreased the dissolution rate. Urea and acetamide formed a eutectic at ± 46oC with a composition of ca. 40 % m/m urea. Unfortunately acetamide is a suspected carcinogen. Therefore the urea - 1,3-dimethylurea was selected as Amitraz carrier system instead. The eutectic mixture comprised 40% m/m urea and 60% m/m 1,3-dimethylurea, which melt at ± 56oC. The melt-press method was used to prepare Amitraz containing pellets measuring 5 mm thick and 33 mm ö and weighing about 5,0 g. It was possible to suspend Amitraz powder in the eutectic melt mixture provided it remained in powder form. However, when liquefied (by melting), phase separation occurred. Thus the temperature of the eutectic mixture should be kept below the 80oC melting point of Amitraz. The dissolution tests were performed in a 10-liter Pyrex glass beaker with normal tap water (± 25oC). The time taken for complete dissolution was measured with a stopwatch. These results were confirmed with turbidity tests. Starch-based super disintegrants were used in an attempt to enhance the dissolution rate of the pellets. Explotab® improved the dissolution rate of 30% and 40% m/m Amitraz formulations slightly. The best formulation obtained in this study had the following composition (in m/m): 30% Amitraz; 8% CaCO3; 1 % Wettol D2; 2% Arkopal N090; 10% Explotab® and 49% urea – 1,3-dimethylurea eutectic. Such tablets disintegrated within 6,5 minutes when suspended in water. / Dissertation (MSc (Applied Science))--University of Pretoria, 2007. / Chemical Engineering / MSc / unrestricted
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Deep Eutectic Solvents: À la Carte Solvents for Cross-Coupling ReactionsMarset, Xavier 18 June 2019 (has links)
En la presente memoria se describe el uso de líquidos eutécticos sostenibles (DESs en inglés) como medios de reacción, empleando diferentes catalizadores metálicos para llevar a cabo la síntesis de compuestos orgánicos de interés en química orgánica. En el Primer Capítulo se detalla el uso de un catalizador heterogéneo de cobre soportado sobre magnetita en el acoplamiento cruzado deshidrogenante de tetrahidroisoquinolinas en mezclas eutécticas. En el Segundo Capítulo se pormenoriza sobre la síntesis de un complejo tipo pinza de paladio y su empleo en la reacción de acoplamiento cruzado de Hiyama, tanto en mezclas eutécticas como en glicerol, como medios sostenibles de reacción. Asimismo, y con el fin de mejorar la compatibilidad de los catalizadores de paladio en estos líquidos eutécticos, se detalla el diseño y la síntesis de fosfinas catiónicas, las cuales han probado su efectividad como ligandos de paladio en reacciones típicas de acoplamiento cruzado (Suzuki, Heck y Sonogashira) en diferentes mezclas eutécticas. Finalmente, en el Tercer Capítulo se describen reacciones multicomponente de acoplamiento cruzado para la formación de enlaces C-S. Por un lado, se ha desarrollado una metodología para la inserción de SO2 catalizada por paladio a partir de ácidos borónicos y metabisulfito de sodio. Por otro lado, una variante de la metodología anterior permitió la síntesis de sulfonamidas sustituyendo los ácidos borónicos por compuestos de triarilbismuto y nitrocompuestos bajo catálsis de cobre. En este último caso, una nueva mezcla eutéctica ha sido descrita y caracterizada, tanto físco-química como biológicamente.
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