abstract: In this dissertation research, conventional and aberration-corrected (AC) transmission electron microscopy (TEM) techniques were used to evaluate the structural and compositional properties of thin-film semiconductor compounds/alloys grown by molecular beam epitaxy for infrared photo-detection. Imaging, diffraction and spectroscopy techniques were applied to TEM specimens in cross-section geometry to extract information about extended structural defects, chemical homogeneity and interface abruptness. The materials investigated included InAs1-xBix alloys grown on GaSb (001) substrates, InAs/InAs1-xSbx type-II superlattices grown on GaSb (001) substrates, and CdTe-based thin-film structures grown on InSb (001) substrates. The InAsBi dilute-bismide epitaxial films were grown on GaSb (001) substrates at relatively low growth temperatures. The films were mostly free of extended defects, as observed in diffraction-contrast images, but the incorporation of bismuth was not homogeneous, as manifested by the lateral Bi-composition modulation and Bi-rich surface droplets. Successful Bi incorporation into the InAs matrix was confirmed using lattice expansion measurements obtained from misfit strain analysis of high-resolution TEM (HREM) images. Analysis of averaged intensity line profiles in HREM and scanning TEM (STEM) images of the Ga-free InAs/InAs1-xSbx type-II strained superlattices indicated slight variations in layer thickness across the superlattice stack. The interface abruptness was evaluated using misfit strain analysis of AC-STEM images, electron energy-loss spectroscopy and 002 dark-field imaging. The compositional profiles of antimony across the superlattices were fitted to a segregation model and revealed a strong antimony segregation probability. The CdTe/MgxCd1-xTe double-heterostructures were grown with Cd overflux in a dual-chamber molecular beam epitaxy with an ultra-high vacuum transfer loadlock. Diffraction-contrast images showed that the growth temperature had a strong impact on the structural quality of the epilayers. Very abrupt CdTe/InSb interfaces were obtained for epilayers grown at the optimum temperature of 265 °C, and high-resolution imaging using AC-STEM revealed an interfacial transition region with a width of a few monolayers and smaller lattice spacing than either CdTe or InSb. / Dissertation/Thesis / Doctoral Dissertation Materials Science and Engineering 2017

Electron beam induced current (EBIC) and atom probe tomography (APT) were used in this study to determine electrical activities and impurity compositions at extended defects in multicrystalline silicon (mc-Si) samples. The results provide, for the first time, information regarding the chemical species present at defects whose electrical activity has previously been measured. A new APT specimen fabrication process was developed with the ability to select a specific defect for APT analysis. Development of the APT specimen fabrication process proceeded by first selecting and optimising the preferential etching for nano-scale defect delineation. Three etchants were evaluated, namely Secco, Sirtl and Dash, from which the Secco etch was selected. Three parameters were optimised to produce etch pits with geometries that meet the requirements imposed by APT specimen fabrication methods. The optimum parameters were 0.05M potassium dichromate concentration, 20°C etch temperature, and 30sec etch time. In the second stage, marking techniques were developed in order for the defects to be located throughout the APT specimen fabrication process. However, it became apparent that the conventional APT specimen fabrication method could not be used to fabricate APT specimens containing selected defects in a mc-Si sample. This led to the development of a novel APT specimen fabrication approach which allowed APT specimens to be fabricated, reproducibly, containing grain boundaries and isolated dislocations. In order to evaluate accurately iron contamination in mc-Si, four atom probe parameters were optimised to maximise detection sensitivity: the evaporation rate, the laser beam energy, the pulse repetition rate and the specimen temperature. The optimisation process can be divided in to two parts. In the first part, a matrix of pre-sharpened single-crystal silicon specimens was subjected to a variety of experimental parameters. The optimised parameters were determined to be 0.3% evaporation rate, 0.5nJ beam energy, 160kHz repetition rate and 55K specimen temperature. The second part was to determine the iron detection efficiency –the percentage of detected Fe ions that can be correctly identified as Fe– and sensitivity using these parameters to analyse a specially prepared iron calibration specimen. The values were determined to be a detection efficiency of about 35% and sensitivity of 54ppm or 2.70x10¹⁸ atom/cm³. The APT specimen fabrication process and the optimised APT analysis parameters were used to analyse four extended defects in mc-Si samples subjected to three different processing conditions, namely gold-contaminated, as-grown and phosphorus diffusion gettering (PDG). The important aspects of the analysis are listed below: • Gold was not detected at the grain boundary and its associated dislocations in the gold-contaminated specimen. The binding enthalpy of gold to such defects is thus less than 0.63eV. • Iron was not detected in any specimen. • Copper was observed at the grain boundary in the as-grown specimen in the form of individual atoms as well as clusters with diameters ranging between 4nm and 9nm. The electrical activity of the grain boundary was about 58%. • Nickel and carbon were detected at the grain boundary in the post-PDG specimen with the former having platelet structures with diameters and thicknesses ranging between 4nm-7nm and 2nm-4nm, respectively. The recombination strength of the defect was about 22%. • Two nickel clusters were found at the isolated dislocation in the post-PDG specimen. The clusters were spherical with an average diameter of 10nm. The distance between the two clusters was 35nm. The recombination strength of the defect was about 4%.

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Ces travaux de thèse sont consacrés à l’étude de l’activation des dopants implantés dans le carbure de silicium. L’objectif est de proposer des conditions d’implantation optimisées pour réaliser le dopage de type n dans le 3C-SiC et de type p dans le 4H-SiC.Nous avons tout d’abord étudié les implantations de type n dans le 3C-SiC. Pour cela, des implantations de N, de P et une co-implantation N&P avec les recuits d’activation associés ont été étudiés. L’implantation d’azote suivie d’un recuit à 1400°C-30min a permis une activation proche de 100% tout en conservant une bonne qualité cristalline. Une étude sur les propriétés électriques des défauts étendus dans le 3C-SiC a également été réalisée. A l’aide de mesures SSRM, nous avons mis en évidence l’activité électrique de ces défauts, ce qui rend difficile la réalisation de composants électroniques sur le 3C-SiC.Nous avons ensuite réalisé une étude du dopage de type p par implantation d’Al dans le 4H-SiC, en fonction de la température d’implantation et du recuit d’activation. Nous avons pu montrer qu’une implantation à 200°C suivie d’un recuit à 1850°C-30min donne les meilleures résultats en termes de propriétés physiques et électriques. / This work was dedicated to the activation of implanted dopants in 3C-SiC and 4H-SiC. The goal is to propose optimized process conditions for n-type implantation in 3C-SiC and for p-type in 4H-SiC.We have first studied the n-type implantation in 3C-SiC. To do so, N, P implantations, N&P co-implantation and the associated annealings were performed. The nitrogen implanted sample, annealed at 1400°C-30 min evidences a dopant activation rate close to 100% while maintaining a good crystal quality. Furthermore, the electrical properties of extended defects in 3C-SiC have been studied. Using the SSRM measurements, we have evidenced for the first time that these defects have a very high electrical activity and as a consequence on future devices.Then, we have realized a study on p-type doping by Al implantation in 4H-SiC with different implantation and annealing temperatures. Al implantation at 200°C followed by an annealing at 1850°C-30min lead to the best results in terms of physical and electrical properties.

Cette thèse a été motivée par l’étude d’un procédé innovant de production de substrats ultra-minces (d’épaisseur variant de 15 μm à 70 μm), basé sur l’implantation d’hydrogène à haute énergie, dans notre cas comprise entre 1MeV et 2.5MeV. Une telle implantation suivie d’un traitement thermique approprié, conduit au détachement d’un film mince autoporté, appelé « substrat ultra-mince ». L’intérêt de ce procédé de détachement est purement économique, car il ne génère presque aucune perte de matière première. Nous l’avons particulièrement utilisé pour produire des substrats ultra-minces de silicium (100), pour la production des cellules PV bas-coûts. Dans le but d’élargir les champs d’applications du procédé, le détachement de substrats ultra-minces de deux autres matériaux (le Ge et le SiC) très utilisés en électronique a aussi été étudié. Ainsi, dans cette étude, les paramètres optimaux d’implantation (énergie et fluence) et de recuits conduisant au détachement de grandes surfaces de Si(100) ont tout d’abord été investigués. Ensuite, l’application technologique du procédé proposé a été validée par la réalisation des cellules solaires au moyen des substrats ultrafins de Si détachés (50 μm et 70 μm d’épaisseur). Les performances PV obtenues ont été assez proches de celles obtenues avec une cellule référence réalisée sur un substrat standard. Par la suite, une étude détaillée faite par TEM et par FTIR sur les défauts étendus à différents stades de recuits a permis de mettre en lumière la nature et la distribution spatiale des défauts précurseurs de la fracture dans le Si après implantation à haute énergie. Enfin, des essais de détachements réalisés avec le Ge et le SiC, lesquels ont été comparés au cas du Si, ont permis d’en savoir plus sur les critères de détachement. En effet, plus le matériau sera rigide, i.e. plus il aura un module d’Young élevé, plus la fluence et la température de recuit nécessaires pour le détachement seront élevées. / The motivation of this thesis was the study of an innovative process for the production of ultra-thin substrates (with thicknesses between 15 μm and 70 μm), based on the high energy hydrogen implantation, in our case in the range of 1 MeV to 2.5 MeV. Such an implantation followed by an appropriate thermal annealing, lead to the delamination of a freestanding thin layer, that we call “ultra-thin substrate”. The benefit of this delamination process is purely economic, since almost no raw material is lost. We have particularly used this process to produce ultra-thin (100) Si substrates, for the production of low-cost PV solar cells. In order to extend the process application fields, the delamination of ultra-thin substrates of two other materials (Ge and SiC) widely used in electronics has been also studied. In our work, the optimal implantation parameters (energy and fluence) and thermal annealing, leading to the delamination of large areas of Si (100) were first investigated. Subsequently, in order to validate the technological application of our process, solar cells have been performed with ultra-thin silicon substrates delaminated, with thicknesses of 50 μm and 70 μm. Results of PV performances obtained were quite close to those obtained with a reference solar cell achieved on a standard substrate. After that, in order to highlight the nature and the spatial distribution of fracture precursor defects after high energy hydrogen implantation in silicon, which had not yet done so far the subject of specific studies, characterizations have been carried out at different annealing stages, by means of TEM and FTIR. Finally, delamination results obtained with Ge and SiC, which were compared to the case of Si, helped us to learn more about delamination criteria. Indeed, we observed that, as the material rigidity increase, i.e. as the Young modulus is higher, the fluence and temperature require for the delamination will be also high.

De récents travaux consacrés à l’étude des propriétés des matériaux aux petites échelles ont souligné des différences exceptionnelles dans le comportement mécanique des nano-objets par rapport aux matériaux massifs. Dans le cas du silicium, une transition fragile-ductile à température ambiante a été observée lorsque la taille des échantillons est réduite. Cependant, les défauts et les mécanismes à l’origine de ce changement de comportement n’ont pas été clairement identifiés. Ce travail repose sur l’étude post mortem de nanopiliers déformés, en utilisant différentes techniques de microscopie électronique. Les nanopiliers étudiés ont été préparés par gravure plasma et déformés en compression à température ambiante. Les résultats obtenus durant cette thèse, confirment la différence de comportement des nano-objets par rapport au matériau massif. Par ailleurs, une grande variété de défauts produits lors de la compression a été observée. L’orientation cristallographique de l’axe de sollicitation semble avoir un impact important sur les mécanismes à l’origine du comportement ductile observé. La comparaison entre images HRTEM expérimentales et simulées témoigne de la propagation simultanée de dislocations partielles et parfaites dans les plans {111}. De plus, des événements plastiques ont également été observés dans des plans {115}. Divers mécanismes de déformation possibles impliqués lors de la compression des piliers sont décrits à partir des observations microscopiques. Un modèle tenant compte de l’influence sur la mobilité des dislocations des interactions entre systèmes de glissement est proposé afin d’expliquer la transition fragile-ductile observé aux petites échelles / Several recent works devoted to the study of the properties of materials at small scales have revealed exceptional differences in the mechanical behavior of nano-objects as compared to bulk material. In the case of silicon, a brittle-ductile transition at room temperature has been observed when the sample size decreases. However, the extended defects and mechanisms behind this behavioral change have not been clearly identified. This work is based on the post mortem study of deformed nanopillars, using different electron microscopy techniques. The studied nano-pillars of 100 nm in diameter were prepared by plasma etching (RIE) and deformed in compression at room temperature. The results obtained during this thesis confirm the difference in the behavior of nano-objects compared to bulk material. Moreover, a large variety of defects produced during plastic deformation has been observed. The crystallographic orientation of the deformation axis seems to have a significant impact on the mechanisms behind the observed ductile behavior. The comparison between experimental and simulated HRTEM images notably evidences the simultaneous propagation of partial and perfect dislocations in {111} planes. In addition, unexpected plastic events have also been observed in {115} planes. Various possible deformation mechanisms involved during the nano-compression of the pillars are described, based on the microscopic observations. Finally, a model considering the influence of interactions between various activated systems on the mobility of dislocations is proposed to explain the brittle-ductile transition observed at small scales in silicon

La motivation de cette thèse est la production innovante de germes ultra-minces de silicium cristallin. L’utilisation de tels germes dans un procédé de fabrication de cellules solaires permettrait une réduction importante de la consommation de silicium, qui compte déjà pour 60% du coût de production des panneaux solaires de première génération. Dans le cadre de cette thèse, une méthode pionnière de détachement de germes minces a été mise en oeuvre. Dans cette méthode, une contrainte induite mécaniquement est guidée par des défauts étendus induits par l’implantation d’hydrogène. Par cette méthode, le détachement de germes minces d’environ 710nm d’épaisseurs a été obtenu. Le but est ensuite d’utiliser ces germes pour faire croitre du silicium cristallin avec des épaisseurs variables à souhait, soit une technique kerf-free : sans pertes. Cette étude présente ainsi les étapes menant à la mise en oeuvre de ce procédé : en premier lieu, un état de l’art des méthodes de détachement de films ultra-minces existants est réalisé. Celui-ci nous a ainsi guidés vers l’implantation d’hydrogène en tant que méthode viable du guidage de la fracture. Par la suite, différents tentatives de détachement de germes ultra-minces ont été réalisés puis caractérisés, notamment par MEB, MET, AFM et DRX. Dans de bonnes conditions de collage et de croissance de défauts, le détachement de germes ultra-minces de silicium cristallin a été réalisé. Par la suite, la croissance et la cristallisation de couches de silicium amorphe a été réalisée sur les germes détachés. Pour finir, certaines couches détachées ont été utilisées pour la production de cellules solaires prototypes. / The goal of this thesis is to find an innovative way to produce ultra-thin crystalline silicon seeds. The use of such seeds in a solar cell production process could lead to a significant reduction of the silicon consumption, which cost alone is worth 60% of the total cost of a first generation solar panel. Within the context of this PhD thesis, a pioneer seed exfoliation method was implemented. This method use the defects induced by hydrogen implantation to guide a stress-induced spalling process. This method has allowed the exfoliation of 710nm-thick crystalline silicon seeds. These seeds will then be used for the growth of crystalline silicon layers of any desired thickness, hence a totally kerf-free method. This thesis work presents the steps leading to the implementation of this process: firstly, the state of the art of ultra-thin films exfoliation methods is reviewed, which guided us towards the use of hydrogen implantation as a crack guide. Then, different ultra-thin seeds exfoliation processes were tried and characterized, specifically by SEM, TEM, AFM and XRD. In the right conditions of bonding and defects growth, ultra-thin silicon seeds were successfully exfoliated. The growth and crystallization of amorphous silicon layers on these seeds were then studied. Finally, several exfoliated layers were used for the production of prototype solar cells.