Accelerometer sensors fabricated with micromachining technologies started to take place of yesterday&rsquo / s bulky sensors in many application areas. The application areas include a wide range from consumer electronics and health systems to military and aerospace applications. Therefore, the performance requirements extend form 1 &mu / g&rsquo / s to 100 thousand g&rsquo / s. However, high performance strategic grade MEMS accelerometer sensors still do not exist in the literature. Smart designs utilizing the MEMS technology is necessary in order to acquire high performance specifications. This thesis reports a high performance accelerometer with a new process by making the use of bulk micromachining technology. The new process includes the utilization of Silicon-on-Insulator (SOI) wafer and its buried oxide (BOX) layer. The BOX layer helps to realize interdigitated finger structures, which commonly find place in surface micromachined CMOS-MEMS capacitive accelerometers. The multi-metal layered CMOS-MEMS devices inherently incorporate interdigitated finger structures. Interdigitated finger structures are highly sensitive to acceleration in comparison with comb-finger structures, which generally find usage in bulk-micromachined devices, due to absence of anti-gap. The designed sensors based on this fabrication process is sought to form a fully-differential signal interfaced sensor with incorporation of the advantages of high sensitive interdigitated finger electrodes and high aspect ratio SOI wafer&rsquo / s bulk single crystal silicon device. Under the light of the envisaged process, sensor designs were made, and verified using a computing environment, MATLAB, and a finite element analysis simulator, CoventorWARE. The verified two designs were fabricated, and all the tests, except the centrifuge test, were made at METU-MEMS Research Center. Among the fabricated sensors, the one designed for the high performance achieves a capacitance sensitivity of 178 fF with a rest capacitance of 8.1 pF by employing interdigitated finger electrodes, while its comb-finger implementation can only achieve a capacitance sensitivity of 75 fF with a rest capacitance of 10 pF.

The objective of this research is to develop novel capacitive micromachined ultrasonic transducer (CMUT) arrays for intravascular ultrasonic (IVUS) imaging along with the fabrication processes to allow for monolithic integration of CMUTs with custom CMOS electronics for improved performance. The IVUS imaging arrays include dual-ring arrays for forward-looking volumetric imaging in coronary arteries and annular-ring arrays with dynamic focusing capabilities for side-looking cross sectional imaging applications. Both are capable of integration into an IVUS catheter 1-2 mm in diameter. The research aim of monolithic integration of CMUTs with custom CMOS electronics has been realized mainly through the use of sloped sidewall vias less than 5 µm in diameter, with only one additional masking layer as compared to regular CMUT fabrication. Fabrication of CMUTs has been accomplished with a copper sacrificial layer reducing isolation layers by 50%. Modeling techniques for computational efficient analysis of CMUT arrays were developed for arbitrary geometries and further expanded for use with larger signal analysis. Dual-ring CMUT arrays for forward-looking volumetric imaging have been fabricated with diameters of less than 2 mm with center frequencies at 10 MHz and 20 MHz, respectively, for an imaging range from 1 mm to 1 cm. These arrays, successfully integrated with custom CMOS electronics, have generated 3D volumetric images with only 13 cables necessary. Performance from optimized fabrication has reduced the bias required for a dual-ring array element from 80 V to 42 V and in conjunction with a full electrode transmit array, it was shown that the SNR can be improved by 14 dB. Simulations were shown to be in agreement with experimental characterization indicated transmit surface pressure in excess of 8 MPa. For side-looking IVUS, three versions of annular CMUT arrays with dynamic focusing capabilities have been fabricated for imaging 1 mm to 6 mm in tissue. These arrays are 840 µm in diameter membranes linked to form 8 ring elements with areas that deviate by less than 25 %. Through modeling and simulation undesirable acoustic cross between ring elements was reduced from -13 dB to -22 dB.

This dissertation reports on the design and implementation of a high-frequency, tri-axial capacitive resonant gyroscopes integrated on a single chip. The components that construct tri-axial rotation sensing consist of a yaw, a pitch and a roll device. The yaw-rate gyroscope has a wide bandwidth and a large full-scale range, and operates at a mode-matched condition with DC polarization voltage of 10V without frequency tuning requirement. The large bandwidth of 3kHz and expected full-scale range over 30,000˚/sec make the device exhibit fast rate response for rapid motion sensing application. For the pitch-and-roll rate sensing, an in-plane drive-mode and two orthogonal out-of-plane sense-modes are employed. The rotation-rate sensing from lateral axes is performed by mode-matching the in-plane drive-mode with out-of-plane sense-modes to detect Coriolis-force induced deflection of the resonant mass. To compensate process variations and thickness deviations in the employed silicon-on-insulator (SOI) substrates, large electrostatic frequency tunings of both the drive and sense modes are realized. A revised high aspect ratio combined polysilicon and silicon (HARPSS) process is developed to resolve the Coriolis response that exists toward out-of-plane direction while drive-mode exists on in-plane, and tune individual frequencies with minimal interference to unintended modes. To conclude and overcome the performance limitation, design optimization of high-frequency tri-axial gyroscopes is suggested. Q-factor enhancement through reduction of thermoelastic damping (TED) and optimizations of physical dimensions are suggested for the yaw disk gyroscope. For the pitch-and-roll gyroscope, scaling property of physical dimension and its subsequent performance enhancement are analyzed.

This dissertation presents the design, fabrication, and characterization of low-voltage capacitive RF MEMS switches. Although, RF MEMS switches have shown superior performance as compared to the existing solid-state semiconductor switches and are viable alternate to the present and the future communication systems, not been able to match the commercial standards due to their poor reliability. Dielectric charging due high actuation is one of the major concerns that limit the reliability of these switches. Hence, the focus of this thesis is on the development of low actuation voltage RF MEMS switches without compromising much on their RF and dynamic performances i.e., low insertion loss and high isolation. Four different switch topologies are studied and discussed. Electromechanical and electromagnetic modelling is presented to study the effect of various components that comprise a MEMS switch on the transient and the RF behaviour. The analytical expressions for switching and release times are established in order to estimate the switching and release times. An in-house developed surface micromachining process is adapted for the micro fabrication. This process eliminates the need for an extra mask used for the anchors and restricts the overall process to four-masks only. These switches are fabricated on 500 µm thick glass substrate. A 0.5 µm thick gold film is used as the structural material. For the final release of the switch, chemical wet etching technique is employed. The fabricated MEMS switches are characterized mechanically and electrically by measuring mechanical resonant frequency, quality factor, pull-in, and pull-up voltages. Since, low actuation voltage switches have slow response time. One of the key objectives of this thesis is to realize switches with fast response time at low actuation voltage. Measurements are performed to estimate the switching and release times. The measured Q-factors of switches are found to be in between 1.1 -1.4 which is the recommended value for Q in MEMS switches for a suppressed oscillation after the release. Furthermore, the effect of hole size on the switching dynamics is addressed. RF measurements are carried out to measure the S-parameters in order to quantify the RF performance. The measured results demonstrate that these switches need low actuation voltage in range of 4.5 V to 8.5 V for the actuation. The measured insertion loss less than -0.8 dB and isolation better than 30 dB up to 40 GHz is reported. In addition, the robustness of realized switches is tested using in-house developed Lab View-based automated measurement test set-up. The reliability test analysis shows no degradation in the RF performance even after 10 millions of switching cycles. Overall yield of 70 -80% is estimated in the present work. Finally, the experimentally measured results presented in this work prove the successful development of low actuation voltage capacitive RF MEMS switches and also offers that even with 0.5 µm thick gold film better reliability for MEMS switches can be achieved.

Ultrasonic sensors are well known for various applications such as NDT, ultrasound imaging, and proximity sensing. Conventional ultrasound transducers are bulky, work at notoriously high voltages, and consume significant power. Microfabrication techniques are leading to a paradigm shift in the field of ultrasonics by enabling development of low power - small footprint ultrasound transducers. This work focuses on the development of piezoelectric type flexural mode micromachined ultrasound transducer also known as PMUTs. We start by establishing a system level analytical model of a PMUT and use it to offer insights into scaling of the performance of the transducer with respect to various design parameters. In this analysis we give special attention to residual stresses thus establishing a contrast between membrane type and plate type PMUTs. After going through various steps of material development and microfabrication, we obtain arrays of PMUTs with different designs. PZT thin films deposited by sol-gel method are used as the piezoelectric layer in the multilayer stack. Further, we present a thorough characterization of fabricated PMUTs which includes measurement of the piezoelectric properties of the embedded PZT thin film, electrical impedance of the electromechanical transducer, its vibrational charac-teristics and acoustic radiation from a single PMUT cell. We also develop a pre-amplifier circuit for a PMUT receiver and present its working as a simple proximity sensor. After establishing the repeatability and predictability of our PMUT sensors we delve into application development beyond ultrasound imaging. Experiments and analysis of PMUTs submerged in water show strong structural-acoustic coupling between the PMUT membrane and the surrounding fluid. We hypothesize the applicability of this feature to sense changes in the acoustic environment of a PMUT. To this end, we integrate an array of PMUTs with a micro-fluidic chip and study the changes in the vibrational behaviour of the PMUT in response to change in the air-water ratio in a closed cell around a PMUT membrane. We also present our preliminary results on presence of micro-bubbles in the closed cell around the PMUT.

This thesis work provides an insight into the design of Force-amplifying Compliant Mechanisms (FaCMs) that are integrated with micromachined resonant accelerometers to increase their sensitivity. An FaCM, by mechanically amplifying the inertial force, enhances the shift in the resonance frequency of the beams used for sensing the acceleration whose effect causes an axial force on the beams. An extensive study on different configurations of resonators namely, single beam resonator, single-ended tuning fork (SETF), and double-ended tuning fork (DETF), is carried out to gain insights about their resonant behavior. The influence of the boundary conditions on the sensor’s sensitivity emerged from the study. We found that not only the force-amplification factor but also the multi-axial stiffness of the FaCM and proof-mass influence the resonance frequency of the resonator as well as the bandwidth of the modified sensor for certain configurations but not all. Thus, four lumped parameters were identified to quantify the effectiveness of an FaCM. These parameters determine the boundary condition of the sensing beams and also the forces and the moment transmitted to them. Also presented in this work is a computationally efficient model, called the Lumped Parameter Model (LPM) for evaluation of the sensitivity. An analytical expression for the frequency-shift of the sensing resonator beams is obtained by considering the FaCM stiffness parameters as well as the lumped stiffness of the suspension of the inertial mass. Various FaCMs are evaluated and compared to understand how the four lumped parameters influence the sensor’s sensitivity. The FaCMs are synthesized using topology optimization to maximize the net amplification factor with the volume constraint. One of the FaCMs outperforms the lever by a factor of six. Microfabrication of resonant accelerometer coupled with FaCM and comb-drive actuator is carried out using a silicon-on-insulator process. Finally, the selection map technique, a compliant mechanism redesign methodology is used for enhancing the amplification of FaCMs. This technique provides scope for further design improvement in FaCMs for given sensor specifications.

This thesis presents novel radio frequency microelectromechanical (RF MEMS) circuits based on the three-dimensional (3-D) micromachined coplanar transmission lines whose geometry is re-configured by integrated microelectromechanical actuators. Two types of novel RF MEMS devices are proposed. The first is a concept of MEMS capacitors tuneable in multiple discrete and well-defined steps, implemented by in-plane moving of the ground side-walls of a 3-D micromachined coplanar waveguide transmission line. The MEMS actuators are completely embedded in the ground layer of the transmission line, and fabricated using a single-mask silicon-on-insulator (SOI) RF MEMS fabrication process. The resulting device achieves low insertion loss, a very high quality factor, high reliability, high linearity and high self actuation robustness. The second type introduces two novel concepts of area efficient, ultra-wideband, MEMS-reconfigurable coupled line directional couplers, whose coupling is tuned by mechanically changing the geometry of 3-D micromachined coupled transmission lines, utilizing integrated MEMS electrostatic actuators. The coupling is achieved by tuning both the ground and the signal line coupling, obtaining a large tuneable coupling ratio while maintaining an excellent impedance match, along with high isolation and a very high directivity over a very large bandwidth. This thesis also presents for the first time on RF nonlinearity analysis of complex multi-device RF MEMS circuits. Closed-form analytical formulas for the IIP3 of MEMS multi-device circuit concepts are derived. A nonlinearity analysis, based on these formulas and on  measured device parameters, is performed for different circuit concepts and compared to the simulation results of multi-device  conlinear electromechanical circuit models. The degradation of the overall circuit nonlinearity with increasing number of device stages is investigated. Design rules are presented so that the mechanical parameters and thus the IIP3 of the individual device stages can be optimized to achieve a highest overall IIP3 for the whole circuit.The thesis further investigates un-patterned ferromagnetic NiFe/AlN multilayer composites used as advanced magnetic core materials for on-chip inductances. The approach used is to increase the thickness of the ferromagnetic material without increasing its conductivity, by using multilayer NiFe and AlN sandwich structure. This suppresses the induced currents very effectively and at the same time increases the ferromagnetic resonance, which is by a factor of 7.1 higher than for homogeneous NiFe layers of same thickness. The so far highest permeability values above 1 GHz for on-chip integrated un-patterned NiFe layers were achieved. / <p>QC 20140328</p>

Simultaneously achieving high-sensitivity and a large resonance frequency of micromachined accelerometers is difficult because of the inherent trade-off between the two. In this thesis, we present a mechanical displacement-amplifying technique that is amenable to micromachining to enhance sensitivity without compromising on the resonance frequency and cross-axis sensitivity. Depending on the requirements of sensitivity alone or sensitivity and resonance frequency, Displacement-amplifying Compliant Mechanisms (DaCMs) are designed using the selection map-based technique, which indicates the limits of what is possible for given specifications on size and microfabrication. In order to prove the benefits of a DaCM, we modified the designs of two very sensitive capacitive micromachined accelerometers from the literature by incorporating DaCMs and showed that, within the same footprint on the chip, the displacement sensitivity could be enhanced by more than 60% while the resonance frequency was also improved by more than 30%. As the focus of the thesis is to explore the integration of DaCMs into accelerometers, the analytical, computational, and practical aspects are discussed in detail. Both single and dual axis in-plane accelerometers are considered. The fabrication processes used are Silicon-on-Insulator Multi-user MEMS Processes (SOIMUMPs) and a customized Silicon-on-Insulator (SOI) based process. The fabricated accelerometers are packaged and brought to the product form. They were tested at the die level as well as in the packaged form. Under dynamic conditions, the measured amplification factor of the fabricated single-axis in-plane accelerometer was observed to be 11. The overall dimension of the accelerometer was 4.25 mm × 1.25 mm. The first in-plane natural frequency of the fabricated accelerometer was found to be 6.25 kHz. The voltage sensitivity of the packaged accelerometer with the DaCM measured 26.7 mV/g at 40 Hz with differential capacitance sensitivity of 3926 ppm/g around the base capacitance of 0.75 pF. The fabricated dual-axis accelerometer has a special configuration of twelve folded-beam suspension blocks that de-couple any displacements along the two in-plane orthogonal axes. The decoupling feature is retained even after adding the DaCMs along both the axes. The total device size was 8.6 mm × 8.6 mm. The device was also fabricated and packaged inside a ceramic flat-pin package using hybrid die-to-die wire-bonding. Die-level dynamic characterization showed that the average geometric advantage achieved using the DaCMs is 6.2 along both the in-plane axes. The measured axial voltage sensitivity of about 580 mV/g for both the axes was achieved with a cross-axial sensitivity of less than 2% and a natural frequency of 920 Hz. The static capacitance sensitivity was found to be 0.296 × 106 ppm/g with a base capacitance of 0.977 pF. Also presented in this work is a wide-band dual-axis accelerometer without an amplifying mechanism. Its first two in-plane modal frequencies measured 14.2 kHz. The measured sensitivity of the packaged accelerometer along both the axes of the device was found to be 62 mV/g at 200 Hz. Aiming at towards cost-effective accelerometers for small-volume markets, we also developed a single-axis and two dual-axis meso-scale spring-steel in-plane accelerometers equipped with Allegro A1395 linear Hall-effect sensors for sensing the displacement of the proof-mass. The single-axis in-plane meso-scale accelerometer also contains a DaCM. It is observed through simulation that the single-axis design with a DaCM is 39% more sensitive and has 41% more bandwidth compared to a single-axis design without a DaCM. The measured sensitivity of the fabricated single-axis spring-steel accelerometer with a DaCM was found to be 71.4 mV/g with a minimum resolvable acceleration of 14 milli-g. The unique features of the first generation of dual-axis accelerometers are that a rechargeable Li-ion battery adds to the proof-mass. It also contains a de-coupling mechanism that can decompose any planar acceleration into its axial components. The second generation of dual-axis accelerometers is more compact in size. All the mechanical elements of the accelerometers are made of EN J42/AISI 1080 spring steel foil machined using Wire-cut Electro-Discharge- Machining. The measured sensitivity of the first generation of dual-axis meso-scale accelerometers is 78 and 108 mV/g along the X and Y axes whereas the second generation device exhibits a sensitivity of 40 mV/g for both the axes. The thesis concludes that the sensitivity of a displacement-based sensor can be improved using a suitably designed DaCM without compromising the resonance frequency and hence the bandwidth. Furthermore, the work describing the development of meso-scale accelerometers also establishes spring steel as a viable material for meso-scale applications.

Approved for public release, distribution is unlimited / This research involves the development of a human-body motion tracking system constructed with the use of commercial off-the-shelf (COTS) components. The main component of the system investigated in this thesis is the Control Interface Unit (CIU). The CIU is a component designed to receive data from the magnetic, angular rate, and gravity (MARG) sensors and prepare them to be transmitted through a wireless configuration. A simple and effective algorithm is used to filter the sensor data without singularities, providing the measured attitude in the quaternion form for each human limb. Initial calibration of the MARG sensors is also performed with the use of linear calibrating algorithms. The testing and evaluation of the whole system is performed by MATLABʼ and SIMULINKʼ simulations, and by the realtime visualization using a human avatar designed with the X3D graphics specifications. Through this research, it is discovered that the MARG sensors had to be redesigned to overcome an erratum on the Honeywell magnetometer HMC1051Z data sheet. With the redesigned MARG sensors, the testing results showed that the CIU was performing extremely well. The overall motion tracking system is capable of tracking human body limb motions in real time. / Lieutenant Junior Grade, Hellenic Navy

The resonance frequency of electrostatically actuated micromachined beams can be tuned substantially by applying a DC voltage bias, first by decreasing the frequency until the onset of pull-in and then by increasing it by the virtue of contact. With the objective of modeling and designing the micromechanical structures after pull-in, a semi-analytical method was developed to determine the length of the contact between the beam and the substrate. The semi-analytical method which is validated on the straight beams is extended for the folded beam structures. This method provides a tool to the microsystem designer to quickly evaluate the deformed configuration of the folded beams after pull-in without the time-intensive contact analysis. This tool is used to design the micro‐speaker elements suitable for emitting low frequency sounds. Multiple instabilities after the pull-in were numerically observed and it was shown that the resonant frequency of an L-shaped beam can be varied in different frequency bands. The speaker element can emit any frequency in a given range, as the resonant frequency of the beam structures can be tuned both before and after pull-in. Operating the speaker element at resonance maximizes the efficiency of the speaker design because the amplitude of vibration is maximum at the resonance frequency. Furthermore, the interplay between the torsional and bending loads is used to minimize the out-of-plane deflection under self weight. A selection criterion is employed to choose a beam structure with optimum stiffness and natural frequency. Beam-based micro-speaker element designs with single and multi-layered suspended structures are proposed. Practical considerations such as volume displacement, mode shapes and dynamic coupling are discussed, on the basis of which design guidelines for a speaker element are proposed. Squeeze film effects and nonlinearity due to the midplane stretching is integrated into the transient analysis model to analyze the effect on the stroke of beam operating at resonance. A comparison between various speaker elements is presented.