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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
181

Dynamic responses of PCB under product level free drop impact

Yu, Da. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.
182

Initialization and progression of damage in lead free electronics under drop impact

Iyengar, Deepti Raju, Lall, Pradeep, January 2008 (has links) (PDF)
Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 100-111).
183

Flip chip and heat spreader attachment development

Li, Yuquan. Johnson, Robert Wayne, January 2009 (has links)
Thesis (Ph. D.)--Auburn University. / Abstract. Includes bibliographical references (p. 91-100).
184

Advanced process window design for 01005 assemblies

Ramasubramanian, Arun Shrrivats. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008. / Includes bibliographical references.
185

Pad cratering characterizing crack propagation and the effects of humidity and reflow on reliability /

Godbole, Gaurav Vinod. January 2009 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.
186

Evaluation of the effects of processing conditions on shear strength in Pb-free surface mount assembly

Bukhari, Sarfaraz. January 2004 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2004. / Includes bibliographical references.
187

Thermal processes and solidification kinetics of evolution of the microstructure of Sn-xAg-yCu solder alloys

Kinyanjui, Robert. January 2005 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Multidisciplinary Program in Materials Science and Engineering, 2005. / Includes bibliographical references.
188

Effects of Lanthanum doping on the microstructure and mechanical behavior of a SnAg alloy

Pei, Min. January 2007 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2007. / Neu, Richard W., Committee Member ; Sanders, Thomas H. Jr., Committee Member ; Wong, C.P., Committee Member ; McDowell, David L., Committee Member ; Qu, Jianmin, Committee Chair.
189

A systematic approach for selection of best PB-free printed circuit board (PCB) surface finish

Subbarayan, Guhan. January 2007 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references (leaves 203-208).
190

Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly

Ramkumar, S. Manian. January 2008 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references (leaves 278-290).

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