- About
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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 181 to 190 of 316 (0.03 seconds)| 181 |
Modeling and experiments of underfill flow in a large die with a non-uniform bump patternZheng, Leo Young. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.
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| 182 |
Effect of thermal and mechanical factors on single and multi-chip BGA packagesNg, Siu Lung. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
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| 183 |
Dynamic responses of PCB under product level free drop impactYu, Da. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.
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| 184 |
Initialization and progression of damage in lead free electronics under drop impactIyengar, Deepti Raju, Lall, Pradeep, January 2008 (has links) (PDF)
Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 100-111).
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| 185 |
Flip chip and heat spreader attachment developmentLi, Yuquan. Johnson, Robert Wayne, January 2009 (has links)
Thesis (Ph. D.)--Auburn University. / Abstract. Includes bibliographical references (p. 91-100).
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| 186 |
Advanced process window design for 01005 assembliesRamasubramanian, Arun Shrrivats. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008. / Includes bibliographical references.
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| 187 |
Pad cratering characterizing crack propagation and the effects of humidity and reflow on reliability /Godbole, Gaurav Vinod. January 2009 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.
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| 188 |
Evaluation of the effects of processing conditions on shear strength in Pb-free surface mount assemblyBukhari, Sarfaraz. January 2004 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2004. / Includes bibliographical references.
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| 189 |
Thermal processes and solidification kinetics of evolution of the microstructure of Sn-xAg-yCu solder alloysKinyanjui, Robert. January 2005 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Multidisciplinary Program in Materials Science and Engineering, 2005. / Includes bibliographical references.
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| 190 |
Effects of Lanthanum doping on the microstructure and mechanical behavior of a SnAg alloyPei, Min. January 2007 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2007. / Neu, Richard W., Committee Member ; Sanders, Thomas H. Jr., Committee Member ; Wong, C.P., Committee Member ; McDowell, David L., Committee Member ; Qu, Jianmin, Committee Chair.
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