Growing concern over adverse health effects from low level lead exposure motivated reassessment of lead occurrence in drinking water, from the perspective of 1) possibly eliminating lead from new brass materials, and 2) performance testing of existing products. During the course of this thesis work, it was discovered that several cases of childhood lead poisoning in North Carolina, South Carolina and Washington D.C. occurred from contaminated potable water. That disconcerting finding prompted additional work into 3) deficiencies in existing lead testing of drinking water samples, and 4) impacts of water treatment steps on lead leaching. Meters, components, and fittings manufactured from non-leaded brass (< 0.25 percent lead content) are increasingly specified for use in water distribution systems and premise plumbing, in response to California's Proposition 65 and the proposed Lead Free Drinking Water Act. An in-depth review of the available literature revealed that non-leaded brass releases minimal amounts of lead and other contaminants of concern to drinking water. There is legitimate concern about the corrosion resistance and longevity of these non-leaded alloys in the range of waters that will be encountered in practice. Nonetheless, when the potential impacts to manufacturers, utilities and consumers are considered, non-leaded brasses appear to be attractive albeit at slightly higher cost. For existing leaded brass products, concerns have been raised over potential limitations of performance standards used to certify the products as "safe" in the marketplace. The ANSI/NSF 61 Section 9 test is the industry standard, and its protocol is critically evaluated from the perspective of the leaching solution chemistry. Testing indicated that the protocol water is reasonably representative of a typical water supply. However, some lower pH and lower alkalinity waters can be much more aggressive than the existing section 9 water, and for potable water with these characteristics, problems with higher than desired lead leaching may occur. It may be desirable to tighten the standard's pass/fail lead criterion in order to account for this problem in practice. Several cases of childhood lead poisoning from water have been recently encountered, which prompted environmental assessments. It was visually obvious that some of the lead particles ingested by these children, present in water from the tap, were not completely dissolving in the standard method with weak acid recommended by the US EPA. A laboratory investigation proved that up to 80% particulate lead in water samples could be "missed" by the standard protocol. Unfortunately, tests with simulated gastric fluid revealed that much of this particulate lead would be bioavailable in the presence of chloride, warmer temperatures and lower pH inside the human stomach. It is recommended that water utilities be alert to this possible problem and that environmental assessments of lead poisoned children use stronger digestions to detect lead in water. Several of the lead poisoning instances occurred after the utility changed both disinfectant chemicals (from chlorine to chloramine) and coagulant types. Although authorities initially thought chloramine was the cause based on experiences in Washington D.C., bench scale studies in this work proved that a change in coagulant from aluminum sulfate to either ferric chloride or polyaluminum chloride was in fact the main reason of the lead spikes. The reduction in sulfate and increase in chloride increased the chloride to sulfate mass ratio of the water supply. A higher chloride to sulfate mass ratio triggered much higher (2.3-40 times more) lead leaching from solder connected to copper pipe. The adverse effects of the increase in the ratio could not be eliminated by adding a corrosion inhibitor. / Master of Science

Advancements in machine learning and artificial intelligence has created opportunities for vast improvements in the manufacturing sector. This study was conducted at a world-leading manufacturing company with the goal to assist in the development of a framework for application of machine learning in the company's operational workflow. Specifically, with the aim to investigate the potential benefits and pitfalls when utilizing machine learning to supervise a laser soldering process. This thesis analyzes and designs all the required steps for a machine learning approach for this specific manufacturing process. This included (1) image capturing, (2) preprocessing, (3) modelling, (4) testing and (5) functional tool. The thesis also discusses strategies for dealing with limitations posed by the industrial environment, for example unattainable process data and imbalanced datasets. In conclusion, it became evident that for a machine learning approach in an industrial setting it is crucial to understand the underlying process, the importance of a reliable data collection setup as well as the necessity of a proper framework. The thesis also proposes a sliding window approach as a preprocessing method for similar image classification tasks. / Framsteg inom maskininlärning och artificiell intelligens har banat vägen för omfattande förbättringar inom tillverkningsindustrin. Denna studie genomfördes på ett världsledande tillverkningsföretag för att stödja utvecklingen av ett ramverk kring hur maskininlärning kan appliceras inom deras operativa flöde. Syftet var specifikt att undersöka de potentiella fördelarna och fallgroparna med att utnyttja maskininlärning för övervakning av en laserlödningsprocess.  Denna rapport undersökte och konstruerade alla nödvändiga steg för hur maskininlärning kan appliceras på denna specifika produktionsprocess. Detta inkluderar (1) bildtagning, (2) dataförbehandling, (3) modellering, (4) testning och (5) slutgiltig implementation. Rapporten diskuterar även strategier för att hantera de begränsningar som uppstod på grund av den industriella miljön, till exempel otillgänglig processdata och obalanserad data.  Avslutningsvis, så var det uppenbart att förståelsen för den underliggande processen, vikten av en tillförlitlig anordning för datainsamlig samt behovet för ett tillbörligt ramverk för maskininlärning inom företaget är avgörande. Rapporten förslår även en "sliding window" ansats som preprocessering metod för liknade cases inom bildklassificering.

Sn-Pb solder has long been used in the Electronics industry. But, due to its toxic nature and environmental effects, certain restrictions are made on its use and therefore many researchers are looking to replace it. Sn-3.0Ag-0.5Cu (SAC) solders are suggested as lead-free replacements but their coarse microstructure and formation of hard and brittle Inter-Metallic Compounds (IMCs) like Ag₃Sn and Cu₆Sn₅ have limited their use in high temperature applications. In this research work, RE elements, mostly lanthanum (La), are used as potential additives to SAC alloys. They reduce the surface free energy, refine the grain size and improve the mechanical and wetting properties of SAC alloys. An extensive experimental work has been performed on the microstructure evolution, bulk mechanical properties, individual phase (matrix and IMCs) mechanical properties, creep behavior and wettability performance of the SAC and SAC-La alloys, with different (La) doping. SEM and EDS have been used to follow the continuous growth of the IMCs at 150°C and 200°C and thus provide a quantitative measure in terms of their size, spacing and volume fraction. Grain size is measured at regular intervals starting from 10 hours up to 200 hours of thermal aging using Optical Microscope with cross polarized light. Bulk mechanical properties are evaluated using tensile tests at low strain rates. Individual phase mechanical properties like Young's modulus, hardness, strain rate sensitivity index and bulge effects are characterized with nanoindentation from 100 µN up to 5000 µN loadings at different temperatures of 25°C, 45°C, 65°C and 85°C. Creep experiments are performed at elevated temperatures with good fitting of Dorn creep and back-stress creep models. Activation energy measurements are made at 40°C, 80°C and 120°C. Wettability testing on copper substrates is used for surface tension, wetting force and contact angle measurements of SAC and SAC-La doped alloys at 250°C and 260°C.

Le développement à grande échelle des microbatteries pour des applications diverses comme l’alimentation de secours de certains composants électroniques dans les téléphones portables nécessite une compatibilité avec le procédé de solder-reflow employé dans le domaine de la microélectronique. Dans ce contexte, cette étude porte sur la mise au point d’un nouveau procédé de réalisation de couches minces d’oxysulfures de titane lithiés (LixTiOySz) pour une utilisation en tant qu’électrode positive dans une microbatterie Li-ion. Tout d’abord ce travail a débuté par la synthèse et la caractérisation de plusieurs compositions de sulfures de titane lithiés à l’état massif par réaction en solution de TiS2 ou TiS3 avec le n-butyllithium mais aussi par réaction à l’état solide à haute température entre les précurseurs TiS2, Li2S et Ti. Par la suite, des couches minces de LixTiOySz ont été déposées par pulvérisation cathodique radiofréquence à effet magnétron de cibles réalisées à partir des matériaux lithiés à l’état massif. La composition chimique de ces dépôts dépend de celle de la cible utilisée ce qui permet d’obtenir des couches plus ou moins riches en lithium et en soufre. En revanche, elles sont toutes très mal cristallisées, denses et elles ne présentent pas de structuration particulière. Enfin, les caractérisations électrochimiques des dépôts de LixTiOySz, à la fois en électrolyte liquide et solide, ont permis de mettre en évidence une corrélation entre leur composition chimique et leur comportement électrochimique. Globalement, ces dernières sont performantes, compatibles avec le solder-reflow et donc tout à fait intéressante pour l’application. / Large-scale development of microbatteries for various applications such as back-up power sources for cell phone electronic components needs suitability with reflowing process that is often used in microelectronic. Here we report on the development of a new realization process to produce lithiated titanium oxysulfides (LixTiOySz) thin films for use as positive electrode in Li-ion microbatteries. First of all, this work began with synthesis and characterization of several lithiated titanium sulfides compounds prepared by reaction between TiS2 or TiS3 with n-butyllithium but also by solid state reaction at high temperature between TiS2, Li2S and Ti. Then, LixTiOySz thin films were sputtered by magnetron effect radio-frequency sputtering from targets made of lithiated materials previously synthesized. The chemical composition of those films depends on the target one and allows obtaining thin films with different lithium and sulfur contents. In contrast, they are all amorphous, dense and they don’t have a morphological structuration. Finally, electrochemical characterizations of thin films, both in liquid and solid electrolyte, have highlighted a correlation between their chemical composition and their electrochemical behavior. Taken as a whole, LixTiOySz thin films are powerful, suitable with reflowing process and thus very interesting for the application.

This thesis deals with the methodology of testing the wetting characteristics for different material and process effects in the double-plated base material. Testing is performed by wetting balance method. There is designed procedure to calculate the angles on each side of the non-homogeneous material. The Design of Experiments method is used to interpret the results, by using this method are also interpreted electrical and mechanical properties of solder joints. The correlation with wetting characteristics is discussed.

Electromigration (EM) and thermomigration (TM) reliability of Pb-free solder joints are emerging as critical concerns in advanced packages. In this study, EM and TM phenomena in Sn-2.5Ag solder joints with thick Cu or thin Ni under-bump metallurgy (UBM) were investigated. A series of EM tests were performed to obtain activation energy (Q) and current density exponent (n), and to understand failure mechanisms. Joule heating was also taken into account. Q and n values were determined as follows: for Cu UBM solders, Q = 1.0 eV and n = 1.5; for Ni UBM solders, Q = 0.9 and n = 2.2. Important factors limiting EM reliability of Pb-free solder joints were found to be UBM dissolution with extensive intermetallic compound (IMC) growth and current crowding. IMC growth without current stressing was found to follow the parabolic growth law whereas linear growth law was observed for Cu₆Sn₅ and Ni₃Sn₄ under high current stressing. For Cu UBM solders, the apparent activation energy for IMC growth was consistent with the activation energy for EM, which supports that EM failure was closely related to IMC growth. In contrast, for Ni UBM solders the apparent activation energy was higher than the EM activation energy. It was suggested that the EM failure in the Ni UBM solders could be associated with more than one mass transport mechanism. The current crowding effect was analyzed with different thicknesses of Ni UBM. It was found that the maximum current density in solder could represent the current density term in Black's equation better than the average current density. FEM studies demonstrated that current crowding was mainly controlled by UBM thickness, metal trace design, and passivation opening diameter. A large temperature gradient of the order of 10³ °C/cm was generated across the sample to induce noticeable TM and to compare its effect against that of EM. TM-induced voiding was observed in Ni UBM solders while UBM dissolution with IMC formation occurred in Cu UBM solders. However, the relative effect of TM was found to be several times smaller than that of EM even at this large temperature gradient. / text

Saab Microwave Systems, SMW is a supplier of radar systems. The circuit boards that are operating in their radars have components which solder joints contains lead. However, the EU directive RoHs and WEEE are causing SMW to prepare for a transition to lead free solder joints. The objective of this thesis is to gain deeper knowledge of lead free solder joints. Brittle fractures in solder joints is a type of failure that might increase in a transition to lead free solder joints. The brittle fractures are induced by the creation of the intermetallic phases which are formed during soldering. The amount and composition of the intermetallics affects the mechanical strength of the joint. An intermetallic layer is thickened during heat exposure as during soldering, thermal aging and rework. The focus of this thesis was to investigate how rework affect the brittleness of the lead free solder joint and thereby how the intermetallic layers change depending on chemical composition, design and reflow cycles. Two types of components and two types of solder materials (SnPb and SAC305) were studied. To study the mechanical properties of the joint a shear testing device was used. This is a way of measuring the reliability of the joint when subjected to mechanical shock. The intermetallic layers were examined in a Scanning Electron Microscope and the fracture surfaces were studied in a optical microscope, a scanning electron microscope and a stereomicroscope. The heat spread over the board where examined by soldering thermocouples to the board and plotting the values of time and temperature. The results showed that the rework process did not have any significant impact of the intermetallic growth. The adjecent and distant components were not damaged during rework. A lead free rework process can therefor be preformed successfully at SMW. The intermetallic layers formed at the interface between the a lead free solder and a nickel finish grew faster than an intermetallic layer formed between a leaded solder and a nickel finish. The presence of nickel could therefore have a more negative effect on the intermetallic growth rate for the lead free material compared to the leaded.

Sabemos que em placas de circuito impresso montadas com tecnologia SMD Surface Mount Device podem ocorrer problemas com a migração eletroquímica. O fenômeno aparece principalmente porque os novos encapsulamentos possuem terminais com espaçamentos muito próximos. A migração eletroquímica pode tornar-se um potencial problema no processo de soldagem eletrônica quando é utilizado a tecnologia Lead Free na montagem das placas. O processo de migração eletroquímica ocorre quando temos metal, isolante e metal, em ambiente de alta umidade e sobre polarização elétrica, o metal deixa a posição inicial em forma de íon e se redeposita sobre o isolante. Em uma placa de circuito impresso, dois terminais adjacentes podem tornar-se eletrodos, dessa forma as dendritas crescem do cátodo para o ânodo. Podem aparecer diferentes morfologias com diferentes elementos envolvidos no processo de migração, dependendo da composição da pasta de solda ou acabamento da placa de circuito impresso. Uma estrutura do tipo pente comb feita sobre laminado FR4 foi utilizada nos experimentos. A distância entre as trilhas foram de 102 e 254 mícrons para simular uma distancia real dos terminais dos dispositivos. Os fatores considerados durante os experimentos foram: A distancia entre os terminais na estrutura (102 ou 254 mícrons), tensão aplicada (2 ou 3 V). Foi observado que a pasta de solda e o acabamento final não influenciam no processo de migração eletroquímica. O Estanho foi o principal metal que migrou. Todos os resultados obtidos nesse estudo concordam com a literatura. / It is well known that in printed circuits boards assembled by SMT technology may occur Electrochemical migration (ECM). This phenomenon appears mainly because the new packaging has the terminals very close. Also the Electrochemical migration may become a potential reliability problem in electronic soldering when lead free technology is used in soldering electronic devices. Electrochemical migration is an electrochemical process where metal on an insulating material, in a humid environment and under an applied electric field, leaves its initial location in ionic form and redeposit. In a PCB two adjacents terminal may behave as electrodes so the dendrites grow from cathode to anode. It can show different morphologies with the different migration elements involved depending on the solder paste composition or PCB surface finishing. A structure with a comb shape printed on FR4 substrate was used in the experiments. The distance between the fingers in the structure was 102 or 254 microns, in order to simulate a real distance between dispositive terminals. The factors considered during the experiments were surface finishing (ENIG or HASL), solder paste composition, distance between terminals (102 or 254 microns) and applied voltage (2 or 3 V). It was observed that the solder paste and the surface finishing dont influence the ECM process. Tin was the main metal that migrates. All the results obtained in these study agrees with the literature.

<p>Saab Microwave Systems, SMW is a supplier of radar systems. The circuit boards that are operating in their radars have components which solder joints contains lead. However, the EU directive RoHs and WEEE are causing SMW to prepare for a transition to lead free solder joints. The objective of this thesis is to gain deeper knowledge of lead free solder joints.</p><p>Brittle fractures in solder joints is a type of failure that might increase in a transition to lead free solder joints. The brittle fractures are induced by the creation of the intermetallic phases which are formed during soldering. The amount and composition of the intermetallics affects the mechanical strength of the joint. An intermetallic layer is thickened during heat exposure as during soldering, thermal aging and rework.</p><p>The focus of this thesis was to investigate how rework affect the brittleness of the lead free solder joint and thereby how the intermetallic layers change depending on chemical composition, design and reflow cycles. Two types of components and two types of solder materials (SnPb and SAC305) were studied.</p><p>To study the mechanical properties of the joint a shear testing device was used. This is a way of measuring the reliability of the joint when subjected to mechanical shock. The intermetallic layers were examined in a Scanning Electron Microscope and the fracture surfaces were studied in a optical microscope, a scanning electron microscope and a stereomicroscope. The heat spread over the board where examined by soldering thermocouples to the board and plotting the values of time and temperature.</p><p>The results showed that the rework process did not have any significant impact of the intermetallic growth. The adjecent and distant components were not damaged during rework. A lead free rework process can therefor be preformed successfully at SMW. The intermetallic layers formed at the interface between the a lead free solder and a nickel finish grew faster than an intermetallic layer formed between a leaded solder and a nickel finish. The presence of nickel could therefore have a more negative effect on the intermetallic growth rate for the lead free material compared to the leaded.</p>

Over the past 50 years, electronics manufacturing industry has undergone revolutionary changes, which have provided consumers with a plethora of electronic products. The increase in functionality of electronic products and decrease in cost due to continuous miniaturization and lower manufacturing costs have evolved over time. As electronics manufacturing technology becomes more advanced, reliability of electronic products and devices have become more of a concern. Thermomechanical reliability in electronics is studied in this research. Thermomechanical failures are failures due to temperature loading conditions electronic products and devices experience during manufacturing and service. The thermomechanical issue studied in this research is the effect of convective solder reflow on the warpage of packaged electronic devices, bare boards and chip packages. A convective reflow-projection moir warpage measurement system is designed and implemented in this research. The system is the first available system capable of measuring warpage of printed wiring boards (PWBs) with and without electronic components during simulated convective reflow process. A finite element prediction tool is also developed to predict the warpage of PWBs populated with plastic ball grid array (PBGA) packages. The developed warpage measurement system as well as the developed finite element model is used to study various PWB assembly (PWBA) configurations during simulated convective reflow processes.