The thesis deals with study of high-temperature alloying process of power semiconductor devices. Mechanical durability and loss heat extraction is achieved via contacting silicon devices on molybdenum electrode in vacuum alloying furnace. Properties of alloy contact determine electrical, geometrical and mechanical parameters of device and are related with durability of device under heavy load during operation in various industrial machines or transport vehicles. Process parameters are evaluated in terms of input materials and their preparation along with temperature ramp profile and conditions in vacuum furnace. Test samples are analyzed to assess their electrical and geometrical parameters and selected samples underwent element analysis of alloy contact. Optimal process parameters are estimated according to analysis of experiments.

L’assemblage et le conditionnement en électronique représentent un enjeu de création de nouveaux systèmes électroniques hybrides rassemblant sur un même substrat des éléments électroniques, optiques, mécaniques… La technologie Flip-chip , introduite par IBM et baptisée C4 (Control Collapse Chip Connection), garantit une plus grande densité d’intégration tout en gardant les mêmes dimensions de puce. Au coeur de cette technologie, le « Bumping » est un procédé qui consiste en l’introduction d’une microbille conductrice entre deux plots de connexion des puces afin de réaliser une liaison électrique et mécanique avec le niveau de packaging suivant. La technique de dépôt par sérigraphie de pâte à braser est récemment devenue pratique en raison de son adaptation aux alliages sans plomb. Cette méthode présente l'avantage d'un faible coût et d'une possible production à grande échelle. Nous avons donc choisi de développer cette technique afin d’obtenir des matrices de connexions électriques de dimensions comprises entre 50 μm et 100 μm, pour une pâte à braser de type Sn3.0Ag0.5Cu. Nous avons déterminé les paramètres de sérigraphie afin d’obtenir un minimum d’étalement de pâte pour un remplissage maximum des ouvertures du masque choisi en Ni-électroformé d’épaisseur 50μm : une vitesse de racle de 20mm/s et une vitesse de démoulage de 4mm/s sont par exemple à retenir pour une pâte de type 5. L’étude du masque de sérigraphie a conduit au choix d’ouvertures circulaires. Des formes de billes circulaires ont été obtenues pour des UBM (Under Bump Metallurgy) également circulaires, de diamètre ¼ et ½ le diamètre de l’ouverture du masque. L’optimisation du profil de refusion a permis de déterminer qu’un palier à 180°C, un TAL de 90s ou plus et une température maximale à 250°C favorisaient l’obtention de billes circulaires avec absence de vides. Pour une pâte de type 6, des billes de 60à 70μm de diamètre ont été obtenues pour des ouvertures de masque de 100μm. Une étude de fiabilité de ces billes à partir de tests de cisaillement et de l’analyse des IMC (composés intermétalliques) formés après refusion a permis de montrer que des UBM en Cr-Cu-Au, de diamètre égal à la moitié de l’ouverture du masque, permettaient d’assurer un meilleur maintien mécanique des billes / The semiconductor industry has continuously improved its products by increasing the density of integration resulting in an increasing of the I/Os, always with a low cost requirement. To obtain high-density and high-speed packaging, the Flip-Chip interconnection technology was introduced by IBM also called C4 (Control Collapse Chip Connection). Solder bumps have been widely used in electronic industry and were generally based on the Sn-Pb alloy, for its low melting point and good wetting property. Containing highly toxic element (Pb), Pb-Sn solder alloy has been banned. The ternary alloy Sn-Ag-Cu seems to be the best compromise, in fact it as physical and chemical characteristics equivalent to that of Sn-Pb.In this study we are interested to optimize stencil printing process and adjust it with the flip-chip technology, in order to obtain solder bumps which height is between 50µm and 100µm associated to pitches less than or equal to 200µm, using Sn-3.0Ag-0.5Cu solder paste. We have optimized the stencil printing parameters machine, the stencil apertures shape and size (circular shape and 50µm height, for a Ni-electroformed stencil). Spherical solder balls have been achieved with circular UBM (Under Bump Metallurgy), which diameter is ¼ and ½ the diameter of the stencil aperture. The reflow thermal profile is the key to the formation of a reliable solder bump. It must allow a homogeneous reflow for all particles of the metallic solder paste. We define a thermal profile with a Time above liquidus (TAL) of 90s, a temperature in soaking zone (Ts) of 180°C and a maximum temperature (Tmax) of 250°C. For type 6 solder pastes, balls of 60-70µm diameter have been obtained for 100µm stencil apertures.The quality of a solder joint is directly related to the adhesion of the solder ball to the substrate. Among the various methods of mechanical testing, shear testing is the most widely used to assess the strength of the attachment of beads to the substrate and determine the fragility of the ball at the interface caused by the intermetallic layer compounds (IMC) formed after the reflow step. We have shown that Cr-Cu-Au UBM, with a diameter equal to the half of the stencil aperture, ensure the mechanical adhesion of the balls

abstract: This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal test and vibration test are discussed. The main cause of failure of lead- free solder is fatigue crack, and the speed of propagation of the initial crack could differ from different test conditions and different solder materials. A quantitative analysis about the fatigue behavior of SAC lead-free solder under thermal preconditioning process is conducted. This thesis presents a method of making prediction of failure life of solder alloy by building a Weibull regression model. The failure life of solder on circuit board is assumed Weibull distributed. Different materials and test conditions could affect the distribution by changing the shape and scale parameters of Weibull distribution. The method is to model the regression of parameters with different test conditions as predictors based on Bayesian inference concepts. In the process of building regression models, prior distributions are generated according to the previous studies, and Markov Chain Monte Carlo (MCMC) is used under WinBUGS environment. / Dissertation/Thesis / Masters Thesis Industrial Engineering 2014

To meet the requirements of miniaturization and multifunction in microelectronics, understanding of their reliability and performance has become an important research subject in order to characterise electronics served under various loadings. Along with the demands of the increasing miniaturization of electronic devices, various properties and the relevant thermo-mechanical-electrical response of the lead-free solder joints to thermal cycling and electro-migration become the critical factors, which affect the service life of microelectronics in different applications. However, due to the size and structure of solder interconnects in microelectronics, traditional methods based on experiments are not applicable in the evaluation of their reliability under complex joint loadings. This thesis presents an investigation, which is based on finite-element method, into the performance of lead-free solder interconnects under thermal fatigue and electro-migration, specifically in the areas as follows: (1) the investigation of thermal-mechanical performance and fatigue-life prediction of flip-chip package under different sizes to achieve a further understanding of IMC layer and size effects of a flip chip package under thermal cycling; (2) the establishment of a numerical method, simulating void-formation/crack-propagation based on the results of finite-element analysis, to allow the prediction of crack evolution and failure time for electro-migration reliability of solder bumps; (3) the establishment of a flow-based algorithm for combination effects of thermal-mechanical and electro-migration that was subsequent implemented in to an FE model to evaluate the reliability assessment of service lives associated with a flip chip package.

Submitted by Irene Nascimento (irene.kessia@ufpe.br) on 2016-09-28T17:50:15Z No. of bitstreams: 2 license_rdf: 1232 bytes, checksum: 66e71c371cc565284e70f40736c94386 (MD5) Tese Edivânia.pdf: 9678189 bytes, checksum: bc6e8c52a38eb49d616a9e268bd0a048 (MD5) / Made available in DSpace on 2016-09-28T17:50:15Z (GMT). No. of bitstreams: 2 license_rdf: 1232 bytes, checksum: 66e71c371cc565284e70f40736c94386 (MD5) Tese Edivânia.pdf: 9678189 bytes, checksum: bc6e8c52a38eb49d616a9e268bd0a048 (MD5) Previous issue date: 2016-02-26 / PRH / A exploração da energia de petróleo e gás é um campo de importância atual no desenvolvimento da economia mundial a qual tem tomado gradualmente o centro das atenções nos ambientes econômico e científico, elevando a demanda por tecnologias no desenvolvimento de materiais mais resistentes como os aços da classe API. As plataformas de prospecção e produção de petróleo no mar, oleodutos e gasodutos em operação, são fabricados a partir de chapas com diferentes processos de soldagem. Estes equipamentos, quando submersos em água do mar, estão susceptíveis a corrosão por fatores diversos como zona termicamente afetada e salinidade. Esse conjunto de fatores pode enfraquecer o material, principalmente na região da junta de solda podendo ocasionar a nucleação e propagação de trincas em regiões preferenciais. A degradação de materiais metálicos pode tornar-se ainda mais severa quando houver associação do meio corrosivo com micro-organismos os quais se aderem às superfícies e, através do seu metabolismo modificam as condições do meio podendo comprometer alterar a durabilidade e desempenho dos materiais. Neste trabalho foi obtida uma melhor compreensão sobre a ação das bactérias redutoras de sulfato e do Vibrio alginolyticus isoladamente e em consórcio, na corrosão de corpos de prova com juntas de solda do aço API 5L X80 em presença de água do mar. Para tanto, foram expostos corpos de prova do aço X 80 em sistemas contendo água do mar estéril, acrescida dos respectivos micro-organismos, além de um sistema abiótico. Foram feitas quantificações de bactérias sésseis e planctônicas, determinação das taxas de corrosão, ensaio de impacto Charpy e tração, observação das superfícies por microscópio eletrônico de varredura (MEV). Os resultados mostraram que a adesão microbiana e as taxas de corrosão não foram afetadas pela presença da solda e que os micro-organismos provocaram um efeito passivante, na corrosão por perda de massa, porem a observação das superfícies por MEV mostrou ataque por corrosão localizada. Quanto às propriedades mecânicas, os corpos de prova com solda, expostos ao sistema contendo Vibrio alginolyticus apresentara uma queda na absorção de energia, mostrando um enfraquecimento do material nessas condições. / The exploitation of oil and gas energy is a current important field in the development of the world economy which has gradually taken center stage in the economic and scientific environments, increasing the demand for technologies in the development of more resistant materials such as grade steels API. The platforms of oil exploration and production offshore, oil and gas pipelines in operation are made from sheets with different welding processes. These devices, when submerged in seawater, are susceptible to corrosion by several factors such as heat affected zone and salinity. This set of factors can weaken the material, especially in the solder joint in the region may cause the nucleation and propagation of cracks in preferred regions. Deterioration of metallic materials may become even more severe when the corrosive environment associated with micro-organisms which adhere to surfaces and through metabolism modifying the conditions of the environment can compromise alter the durability and performance of the materials. In this work we obtained a better understanding of the action of sulfate-reducing bacteria and Vibrio alginolyticus alone and in consortium, the corrosion test specimens with steel solder joints API 5L X80 in the presence of seawater. For both, it was exposed X 80 steel specimens in water the barren sea, plus the respective micro-organisms, as well as an abiotic system. measurements were made of sessile and planktonic bacteria, determination of corrosion rates, Charpy impact test and pull, observation of surfaces by scanning electron microscope (SEM). The results showed that the microbial adhesion and corrosion rates were not affected by the presence of solder, and that micro-organisms caused a passivating effect on the corrosion weight loss, but the observation of the surface by SEM showed attack by pitting. As for the mechanical properties, the samples with solder, exposed to the system containing Vibrio alginolyticus presented a drop in energy absorption, showing a weakening of the material in these conditions.

Sabemos que em placas de circuito impresso montadas com tecnologia SMD Surface Mount Device podem ocorrer problemas com a migração eletroquímica. O fenômeno aparece principalmente porque os novos encapsulamentos possuem terminais com espaçamentos muito próximos. A migração eletroquímica pode tornar-se um potencial problema no processo de soldagem eletrônica quando é utilizado a tecnologia Lead Free na montagem das placas. O processo de migração eletroquímica ocorre quando temos metal, isolante e metal, em ambiente de alta umidade e sobre polarização elétrica, o metal deixa a posição inicial em forma de íon e se redeposita sobre o isolante. Em uma placa de circuito impresso, dois terminais adjacentes podem tornar-se eletrodos, dessa forma as dendritas crescem do cátodo para o ânodo. Podem aparecer diferentes morfologias com diferentes elementos envolvidos no processo de migração, dependendo da composição da pasta de solda ou acabamento da placa de circuito impresso. Uma estrutura do tipo pente comb feita sobre laminado FR4 foi utilizada nos experimentos. A distância entre as trilhas foram de 102 e 254 mícrons para simular uma distancia real dos terminais dos dispositivos. Os fatores considerados durante os experimentos foram: A distancia entre os terminais na estrutura (102 ou 254 mícrons), tensão aplicada (2 ou 3 V). Foi observado que a pasta de solda e o acabamento final não influenciam no processo de migração eletroquímica. O Estanho foi o principal metal que migrou. Todos os resultados obtidos nesse estudo concordam com a literatura. / It is well known that in printed circuits boards assembled by SMT technology may occur Electrochemical migration (ECM). This phenomenon appears mainly because the new packaging has the terminals very close. Also the Electrochemical migration may become a potential reliability problem in electronic soldering when lead free technology is used in soldering electronic devices. Electrochemical migration is an electrochemical process where metal on an insulating material, in a humid environment and under an applied electric field, leaves its initial location in ionic form and redeposit. In a PCB two adjacents terminal may behave as electrodes so the dendrites grow from cathode to anode. It can show different morphologies with the different migration elements involved depending on the solder paste composition or PCB surface finishing. A structure with a comb shape printed on FR4 substrate was used in the experiments. The distance between the fingers in the structure was 102 or 254 microns, in order to simulate a real distance between dispositive terminals. The factors considered during the experiments were surface finishing (ENIG or HASL), solder paste composition, distance between terminals (102 or 254 microns) and applied voltage (2 or 3 V). It was observed that the solder paste and the surface finishing dont influence the ECM process. Tin was the main metal that migrates. All the results obtained in these study agrees with the literature.

Orientadores: Amauri Garcia, Wislei Riuper Ramos Osório / Tese (doutorado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecânica / Made available in DSpace on 2018-08-21T02:28:07Z (GMT). No. of bitstreams: 1 Garcia_LeonardoRicheli_D.pdf: 14084477 bytes, checksum: f9b96fac198700cfcafeecf1edca6f9b (MD5) Previous issue date: 2012 / Resumo: A preocupação ambiental sobre a toxicidade do Pb combinada com normas rígidas, estão gradualmente proibindo a aplicação de Pb em ligas de soldas. As ligas alternativas Sn-Ag e Sn-Bi podem estar entre as mais promissoras candidatas à substituição das ligas de solda sem chumbo em função de apresentarem propriedades compatíveis com as da liga Sn-Pb. A fim de adequar os produtos aos novos requisitos, produtores de componentes microeletrônicos necessitam desenvolver novas ligas de solda. Estudos sobre a influência da taxa de resfriamento sobre a microestrutura e as propriedades mecânicas resultantes e as características de recobrimento dessas ligas necessitam ser realizados. Esse trabalho tem exatamente esse objetivo, e no qual é realizado um estudo experimental comparativo das principais características da tradicional liga Sn-Pb e das ligas Sn-Ag e Sn-Bi visando a aplicação dessas ligas como ligas alternativas de solda. As seguintes atividades foram desenvolvidas para atingir tais propósitos: i) solidificação unidirecional das ligas Sn-Ag (hipoeutética Sn-2%Ag e eutética Sn-3,5%Ag) e Sn-Bi (Sn-10, 20 e 40%Bi); ii) ensaios de mergulho de lâminas de cobre nas ligas Sn-Ag e Sn-Bi fundidas e; iii) ensaios de tração de acordo com as especificações da norma ASTM E 8M/04. Foi utilizado um dispositivo de solidificação vertical ascendente para obter os lingotes das ligas e os correspondentes perfis térmicos. Variáveis térmicas de solidificação como: taxa de resfriamento, velocidade de solidificação e tempo local de solidificação foram determinadas para as ligas Sn-Ag e Sn-Bi. Essas variáveis experimentais foram correlacionadas com os espaçamentos dendríticos secundários (l2) e foram propostas equações experimentais de crescimento dendrítico. A espessura da camada solidificada, a área recoberta e as microestruturas resultantes das ligas no substrato de cobre foram avaliadas após o ensaio de mergulho em diferentes temperaturas. Verificou-se que, considerando-se as ligas Sn-Ag e Sn-Bi examinadas, a liga Sn- 40%Bi apresenta maior resistência mecânica e a liga Sn-3,5%Ag apresenta molhabilidade similar quando comparada com a tradicional liga de solda Sn-40%Pb / Abstract: The increasingly environmental concern over the toxicity of Pb combined with strict regulations, are gradually banning the application of Pb-based solders. Sn-Ag and Sn-Bi solder alloys are among the most promising candidates for Pb-free alternatives due to their compatible properties with the Sn-Pb solder alloy. In order to adequate products to such restriction requirements, electronic components manufacturers have to meet such requirements by developing new lead-free solder alloys. Studies focusing on the influence of the cooling rate on the resulting microstructures and on both the mechanical properties and recovery of these alloys need to be carried out. This work has precisely such objective, in which a comparative experimental study of the main features of the traditional Sn-Pb alloy and Sn-Ag and Sn-Bi alloys is carried out with a view to application of the latter alloys as alternative solder materials. The following activities were developed to attain such purpose: i) unidirectional solidification of Sn-Ag alloys (hypoeutectic Sn-2 wt.% Ag, eutectic Sn-3.5 wt.% Ag), and Sn-Bi alloys (Sn-10, 20 and 40 wt.% Bi); ii) copper blades dipped in both molten Sn-Ag and Sn-Bi alloys (hot dipping) and iii) tensile testing according to specifications of ASTM standard E 8M/04. An upward vertical solidification system has been used to obtain the alloys ingots and their correspondent thermal profiles. Solidification thermal variables such as: the cooling rate, tip growth rate and local solidification time have been determined for Sn-Ag and Sn-Bi alloys. Such experimental variables have been correlated with secondary dendrite arm spacings (l2) and experimental equations of dendritic growth have been proposed. The thickness of the coating layers, the spreading areas and the resulting microstructures of these alloys on the copper substrates were evaluated after the hot dipping procedures at different temperatures. It was found that, of the examined Sn-Ag and Sn-Bi alloys, the Sn-40 wt.% Bi alloy has offered the highest mechanical strength and the Sn- 3.5 wt.% Ag alloy has shown similar wettability when compared with the traditional Sn-40 wt.% Pb solder alloy / Doutorado / Materiais e Processos de Fabricação / Doutor em Engenharia Mecânica

Le développement de dispositif de puissance haute température est un véritable challenge pour la recherche fondamentale et industrielle. La chaleur, provenant de l'échauffement des composants ou des conditions environnementales, représente l'une des contraintes majeures auquel est confronté un module de puissance. Le sujet de l’étude menée dans le cadre de cette thèse, financée par la société HCM (Groupe SERMA) vise à élaborer un module de puissance complet et fiable à haute température. La première partie de l’étude concerne la réalisation d’attaches de puces par différentes techniques : brasage eutectique, frittage de nanopoudre d’argent et le brasage en phase liquide transitoire. Le report de puce a mis en évidence les différents problèmes engendrés par l’utilisation d’une métallisation standard du substrat céramique pour une application haute température. Suite à ce constat, des solutions alternatives au niveau de la métallisation du substrat céramique ont été proposées. Afin d’obtenir la meilleure solution d’assemblage à envisager pour un fonctionnement à 300°C, l’élaboration d’un plan d’expériences Fisher-Taguchi a permis de hiérarchiser l’influence de chaque niveau d’intégration sur la tenue mécanique du joint. Les résultats ont permis de proposer une solution qui répond aux exigences. Dans la deuxième partie, le comportement mécanique des joints sous différents niveaux de contraintes thermiques a été étudié. Des essais de fluage ont également été réalisés sur les brasures eutectiques afin de modéliser la réponse du module aux sollicitations thermomécaniques. Les paramètres caractéristiques au fluage ont été déterminés expérimentalement. La troisième partie présen / The development of power electronic devices operating under high temperature environments is a great challenge for microelectronic industry. The objective of this thesis, supported by the HCM society (SERMA Group) is to propose a complete assemblage able to operate under high temperature. The first part of this study presents the different die attach techniques: eutectic solder alloys, sintered nanosilver and the TLPB method. The implementation for techniques was optimized via the variation of various experimental parameters by using a Fisher-Taguchi method. The as-proposed protocol corresponds to values of maximal shear stress. Moreover, an alternative solution to the substrate metallization was proposed to suppress any diffusion between the different elements deposited on the ceramic substrate.In the second part the mechanical behavior of joints under various levels of thermal and mechanical stress was studied. Creep experiments were carried out on the eutectic solders to describe the thermo-mechanical behavior of the complete module. The parameters characteristic of creep were experimentally determined. Finally, in the last part of this study the growth of Ti3SiC2 MAX phases were studied onto α-SiC substrates differently oriented by thermal annealing of TiAl layers deposited by magnetron sputtering. The Ti3SiC2 phase of low contact resistivity is proposed as new ohmic contact materials in dual n and p-type SiC-based devices. A step flow mechanism was proposed to explain that Ti3SiC2 grow, preferentially along the SiC basal planes, from a heterogeneous surface nucleation.

Cette thèse a pour objet l'étude de la fiabilité de modules de puissance triphasés à IGBTs 200 A - 600 V, destinés à la construction d'onduleurs de traction pour des applications automobiles hybrides ou électriques. Ces travaux visent à évaluer la tenue de ces modules de puissance en régime de cyclage thermique actif à hautes température, en mettant l'accent sur leur résistance à la fatigue thermomécanique. Deux approches complémentaires ont été mises en oeuvre dans ce but: tests de vieillissement accéléré et modélisation numérique. Une compagne d'essais de vieillissement par cyclage actif a été menée avec des profils de température variés, définis par la température ambiante et la variation de température de jonction des IGBTs, utilisés comme facteurs d'accélération des contraintes. Au cours de ces tests, les composants ont électriquement fonctionné dans des conditions semblables à une application réelle (commande MLI). L'objectif était d'identifier les modes de défaillance, d'estimer l'influence des facteurs d'accélération du vieillissement, et d'évaluer la pertinence des indicateurs de défaillance classiques dans ces conditions de stress thermiques sévères. Aussi, afin de mieux comprendre les mécanismes de défaillance responsables de la fatigue de l'assemblage des modules considérés, une modélisation thermomécanique visant à déterminer l'impact des modèles de comportement mécanique sur la durée de vie estimée des brasures, a été développée. La réponse de l'assemblage à des contraintes de cyclage actif similaires à celles appliquées durant les essais a été évaluée par analyse numérique. Les différentes lois de comportement ont été comparées en termes de contraintes, déformations plastiques, et densité d'énergie plastique dans les brasures. / This thesis is dedicated to reliability investigations led on three-phase 200~A~--~600~V IGBT power modules, designed for building drive inverters for hybrid or electric automotive traction applications. The objective was to evaluate the durability of the studied modules when they withstand power cycling in high temperature environments, and especially their resistance to thermo-mechanical fatigue. Two complementary approaches were considered: accelerated aging experiments and numerical modeling.A series of power cycling tests was carried out over a large range of temperature profiles, defined by the ambient temperature and IGBT junction temperature excursion. These quantities are used as thermal stress acceleration factors. Those experiments were led in realistic electrical conditions (PWM control scheme). They aimed at identifying the failure modes of the target devices, assessing the impact of the acceleration factors on their aging process, and evaluating the suitability of standard aging indicators as damage precursors in such harsh loading conditions. Besides, to better understand the failure mechanisms governing the fatigue life of the modules assembly, a thermo-mechanical modeling focusing on solder joints was built. Our simulation efforts concentrated on the appraisal of constitutive modeling effects on solder joints lifetime estimation. Numerical analysis of the assembly response to power cycling in similar operating conditions as practiced in experiments were performed. Behavior laws were then compared on stress, plastic strain, and strain energy density developed within the joints.

This work deals with effects of nanoparticles, mainly copper and silver, on properities of lead-free solder pastes. It describes basic tests done on solder pastes according to IPC-TM-650 standards. In practical section this work focuses on the preparation of Sn-Bi solder paste and the measuring of viscosity. After that different concentrations of silver copper alloy nanoparticles are added to the SnBi solder paste. These solder pastes are tested by the IPC standarts and mechanical and resistive tests are done on printed circuit boards where the effects of mixed in nanoparticles are observed.