This thesis is composed of two parts: a 3¡ÑVDD mixed-voltage-tolerant I/O buffer with 1¡ÑVDD CMOS standard device, and a PVT detector for 2¡ÑVDD output buffer with slew-rate compensation. In the first topic, a 3¡ÑVDD bidirectional mixed-voltage-tolerant I/O buffer, which has been implemented using a typical TSMC 0.18 £gm CMOS process, is proposed with a Dynamic gate bias voltage generator to provide appropriate gate drives for the stacked output stage. Besides, a Gate-tracking circuit and a Floating N-well technique are adopted to prevent 1¡ÑVDD device from gate-oxide overstress problems and leakage currents. The maximum data rate is simulated to be 166/166/166/100/80 MHz when VDDIO is 5.0/3.3/1.8/1.2/0.9 V, respectively, given an equivalent probe capacitive load of 10pF. The second topic is a process, voltage, and temperature¡]PVT¡^detector for 2¡ÑVDD output buffer with slew-rate compensation. The threshold voltage¡]Vth¡^ of PMOSs and NMOSs varying with process variation could be detected, respectively. In addition, the voltage and temperature variations could be monitored, respectively, by detecting different charging and discharging times of delay buffers at each PVT corner. By adjusting output currents, the slew rate of output signals could be compensated over 24¢H. Moreover, the maximum data rate with compensation is 133 MHz in contrast with 100 MHz without compensation when VDDIO ¡× 1.8 V, in transmitting mode.

The aim of the thesis is weigh measurement using strain gauges from cheap digital scales. Work describes problems connected with using strain gauges as temperature compensation and requirements for accurate voltage reference and summarize function and wiring of chaep digital scales using four strain gauges. Result of work is design of an electrical circuit for weigh measurement using four strain gauges from analyzed scale.

CMOS RF circuit design has been an ever-lasting research field. It gained so much attention since RF circuits have high mobility and wide band efficiency, while CMOS technology has the advantage of low cost and better capability of integration. At the same time, IC circuits never stopped scaling down for the recent many decades. Reliability issues with RF circuits have become more and more severe with device scaling down: reliability effects such as gate oxide break down, hot carrier injection, negative bias temperature instability, have been amplified as the device size shrinks. Process variability issues also become more predominant as the feature size decreases. With these insights provided, reliability and variability evaluations on typical RF circuits and possible compensation techniques are highly desirable. In this work, a class E power amplifier is designed and laid out using TSMC 0.18 µm RF technology and the chip was fabricated. Oxide stress and hot electron tests were carried out at elevated supply voltage, fresh measurement results were compared with different stress conditions after 10 hours. Test results matched very well with mixed mode circuit simulations, proved that hot carrier effects degrades PA performances like output power, power efficiency, etc. Self- heating effects were examined on a class AB power amplifier since PA has high power operations. Device temperature simulation was done both in DC and mixed mode level. Different gate biasing techniques were analyzed and their abilities to compensate output power were compared. A simple gate biasing circuit turned out to be efficient to compensate selfheating effects under different localized heating situations. iv Process variation was studied on a classic Colpitts oscillator using Monte-Carlo simulation. Phase noise was examined since it is a key parameter in oscillator. Phase noise was modeled using analytical equations and supported by good match between MATLAB results and ADS simulation. An adaptive body biasing circuit was proposed to eliminate process variation. Results from probability density function simulation demonstrated its capability to relieve process variation on phase noise. Standard deviation of phase noise with adaptive body bias is much less than the one without compensation. Finally, a robust, adaptive design technique using PLL as on-chip sensor to reduce Process, Voltage, Temperature (P.V.T.) variations and other aging effects on RF PA was evaluated. The frequency and phase of ring oscillator need to be adjusted to follow the frequency and phase of input in PLL no matter how the working condition varies. As a result, the control signal of ring oscillator has to fluctuate according to the working condition, reflecting the P.V.T changes. RF circuits suffer from similar P.V.T. variations. The control signal of PLL is introduced to RF circuits and converted to the adaptive tuning voltage for substrate bias. Simulation results illustrate that the PA output power under different variations is more flat than the one with no compensation. Analytical equations show good support to what has been observed.

Structural Health Monitoring is a useful tool for reducing maintenance costs and improving the life and performance of engineering structures. Impedance-Based SHM utilizes the coupled electromechanical behavior of piezoelectric materials to detect adverse changes and material and mechanical failures of structures. Environmental variables such as temperature present a challenge to assessing the veracity of damage detected through statistical modeling of impedance signals. An effective frequency shift method was developed to compensate impedance measurements for changes resulting from environmental temperature fluctuations. This thesis investigates how the accuracy of this method can be improved and be applied to a 100oF range of temperatures. Building up the idea of eliminating temperature effects from impedance measurements, this thesis investigates the possibility of using statistical moments to create a temperature independent impedance baseline. / Master of Science

Das menschliche Gehirn funktioniert weitgehend zuverlässig – egal ob man im Schneegestöber nach einer schützenden Unterkunft sucht oder im Hochsommer einen Marathon läuft. Der Grund hierfür liegt im Erhalt einer nahezu konstanten Körpertemperatur, der für den menschlichen Organismus einen hohen Energieaufwand darstellt. Dadurch verliert die Temperaturabhängigkeit chemischer Prozesse auf mikroskopischer Ebene für den Menschen an Bedeutung – im Gegensatz zu allen wechselwarmen Lebewesen, deren Körpertemperatur sich der Umgebungstemperatur umgehend anpasst. Dass lebenswichtige Körper- und Gehirnfunktionen vieler Wechselwarmer dennoch über einen breiten Temperaturbereich funktionieren, legt nahe, dass sich diese Tiere Mechanismen zu Nutze machen, die die Temperaturabhängigkeit auf mikroskopischer Ebene ausgleichen. Die vorliegende Arbeit beschreibt Möglichkeiten der so genannten Temperaturkompensation am Beispiel des Hörsystems der Heuschrecke. Für einige Heuschreckenarten ermöglicht das Hörsystem die Lokalisierung und Identifizierung möglicher Partner anhand von Werbegesang, auch bei schlechten Sichtverhältnissen in hoher Vegetation. Insbesondere funktioniert die akustische Kommunikation über eine Temperaturspanne von bis zu 15°C. Diese Doktorarbeit erklärt zum einen, wie einzelne Nervenzellen mit temperaturabhängigen Ionenkanälen eine temperaturkompensierte Stimulusrepräsentation erzeugen können. Weiterhin wird gezeigt, dass der zugrundeliegende zell-intrinsische Kompensationsmechanismus nicht den neuronalen Energieverbrauch beeinträchtigen muss. Zum anderen wird belegt, dass die Schallverarbeitung auf höheren Verarbeitungsstufen selbst nicht temperaturkompensiert ist. Anhand mathematischer und computergestützter Modelle wird erläutert wie dennoch mit der gemessenen Temperaturabhängigkeit der neuronalen Verarbeitung temperaturkompensierte Gesangserkennung ermöglicht wird. Die vorgeschlagenen Mechanismen können auf alle wechselwarmen Organismen verallgemeinert werden. / The human brain largely remains functional regardless of whether one is searching for the shortest path to a warming shelter in a snowstorm or running a marathon on a summer’s day. This robustness of brain functionality can be attributed to the maintenance of a constant body temperature, which requires a large investment of energy. Due to homeothermy, the temperature dependence of all chemical reactions, including those inside the body, loses relevance as a constraint for humans. For poikilotherms, in contrast, a rise in ambient temperature translates to an increase in body temperature, which speeds up all chemical processes. Yet, many poikilotherms exhibit robustness of vital behaviors across a broad range of temperatures, which suggests the existence of mechanisms that compensate for temperature dependencies at the microscopic level. The present thesis proposes mechanisms for such temperature compensation, using the auditory system of the grasshopper as a model system. For various grasshopper species, the auditory system facilitates localization and recognition of conspecifics under conditions of low visibility. In particular, communication and recognition remain functional across a temperature range of up to 15 C. Here, we show on the one hand how single nerve cells with temperature-dependent ion channels can generate a temperature-compensated stimulus representation. Importantly, we reveal that the underlying cell-intrinsic compensation mechanism need not impair neuronal energy efficiency. On the other hand, we show that sound processing in higher-order neurons does not exhibit the degree of compensation that is found at the input level. Using a combination of mathematical modeling and simulations we show how temperature compensation of song recognition can be achieved at the network level, with temperature-dependent neural filters. In principle the proposed mechanisms are applicable to all poikilothermic species.

Esta tese teve por objetivo desenvolver um algoritmo preciso e robusto capaz de compensar os erros térmicos volumétricos de um centro de usinagem 5 eixos em diferentes condições operacionais. O comportamento térmico da máquina foi modelado usando técnicas do método dos elementos finitos (MEF) com base na teoria do calor de atrito e calor de convecção, e validadas através dos vários campos de temperatura obtidos experimentalmente usando termopares e imagens térmicas. Os principais subsistemas da máquina foram inicialmente modelados, como o conjunto de fusos de esferas, guias lineares e motofuso, o que permitiu posteriormente a validação do comportamento termoelástico da máquina completa para onze ciclos de trabalho em vazio, seis ciclos de usinagem, nove ciclos de posicionamento e dois ciclos com temperatura ambiente variando, obtendo erros máximos inferiores a 9%, ao comparar os resultados numéricos com os resultados experimentais. A validação do modelo em elementos finitos permitiu usar os resultados obtidos para treinar e validar uma rede neural artificial (RNA) para prever os erros térmicos do centro de usinagem. Os desvios entre os erros térmicos previstos pela RNA e os calculados pelo MEF foram inferiores a 5%. Baseado nos resultados obtidos pelas medições das peças de trabalho usinadas foi possível formular e implementar um modelo de compensação dos erros térmicos no CNC do centro de usinagem, que obteve uma redução dos erros entre 62% e 100% nas peças usinadas com compensação. Foi também proposto um algoritmo de previsão e compensação dos erros térmicos para o centro de usinagem, baseado em todos os ciclos e simulações realizadas, e que se comparando com os resultados experimentais mostrou-se capaz de reduzir os erros térmicos entre 50% e 95%. Após sua validação, foi possível concluir que o algoritmo desenvolvido é uma ferramenta precisa e robusta para compensar os erros térmicos da máquina para várias condições de trabalho, podendo compensá-los mesmo com esta movendo-se a diferentes velocidades, em usinagem ou mesmo operando em temperatura ambiente variável. / This thesis aims to develop an accurate and robust algorithm capable of compensating the volumetric thermal errors of a 5-axis machining center under different operating conditions. The thermal behavior of the machine was first modeled using finite element method (FEM) techniques based on theory of friction heat and convection heat, and validated with the various experimentally raised temperature fields using thermocouples and thermal imaging. The main machine subsystems were initially modeled, such as the ball screw system, linear guides and spindle, which allowed for validating of the thermoelastic behavior of the entire machine for eleven no load duty cycles, six cycles of machining, nine cycles of positioning and two cycles with varying ambient temperature, obtaining errors lower than 9%, when comparing the numerical results with the experimental results. The validation of the finite element model allowed for the use of the results obtained to train and validate an artificial neural network (ANN) for predicting the thermal errors of the machining center. The deviations between the thermal errors predicted by ANN and the FEM simulation results were less than 5%. Based on the results obtained by the measurements of the machined workpieces, it was possible to formulate and implement a model of compensation of the thermal errors in the CNC of the machining center, which obtained a reduction of errors of 62% and 100% of the machined parts with compensation. It was also proposed a thermal error prediction and compensation algorithm for the machining center, based on all cycles and simulations performed, and that, comparing with the experimental results, it was able to reduce the thermal errors between 50% and 95%. After its validation, it was possible to conclude that the developed algorithm is an accurate and robust tool to compensate the thermal errors of the machine for various duty conditions, being able to compensate the errors even when it is moving at different speeds, in machining process or even operating in variable ambient temperature.

Silicon alternatives to quartz crystal based oscillators to electronic system clocking are explored. A study of clocking requirements reveals widely different specifications for different applications. Traditional CMOS oscillator-based solutions are optimized for low-cost fully integrated micro-controller clock applications. The frequency variability of these clock generators is studied and techniques to compensate for this variability are proposed. The efficacy of these techniques in reducing variability is proven theoretically and experimentally. MEMS-resonator based oscillators, due to their exceptional quality factors, are identified as suitable integrated replacements to quartz based oscillators for higher accuracy applications such as data converter clocks. The frequency variation in these oscillators is identified and techniques to minimize the same are proposed and demonstrated. The sources of short-term variation (phase noise) in these oscillators are discussed and an inclusive theory of phase noise is developed. Techniques to improve phase noise are proposed. Findings from this research indicate that MEMS resonator based oscillators, may in future, outperform quartz based solutions in certain applications such as voltage controlled oscillators. The implications of these findings and potential directions for future research are identified.

This thesis purposes and develops inductively coupled LC (inductive-capacitive) pH sensors based on pH-sensitive electrode pair. The LC resonator circuit is based on a varactor and measures the low frequency potential difference. For wireless pH monitoring, the resonator circuit is integrated with a pH-sensitive electrode pair. This sensor demonstrates a linear response over 2 to 12 pH dynamic range, 0.1 pH accuracy and long-term stability. Accurate measurement of pH using electrode-based sensors is affected by temperature variation. A technique of simultaneously measuring two parameters, pH and temperature, with a single RLC resonator based sensor is presented. An algorithm is developed, which applies both pH and temperature measurement to incorporate temperature compensation in pH measurement. For in-fluid applications, an encapsulation method is applied to the LC resonator based sensor to reduce the influence of medium permittivity and conductivity on the sensor measurement. Non-invasive way to obtain reliable pH information from bacterial culture bioprocesses is demonstrated with the fluid embeddable sensor. The pH sensor is remodeled to an acidic and basic volatile sensor by embedding the electrodes in a hydrogel host electrolyte. Tests demonstrate that the volatile sensor has a detection limit of 1.5 ppm and 2 ppm for ammonia and acetic acid vapor, respectively. Application of the volatile sensor to fish spoilage monitoring shows that the sensor is capable of detecting the product rejection level with good sensitivity in real-time. It is important to develop low cost wireless passive pH sensor technologies for embedded applications such as bioprocess and food spoilage monitoring. The electrode-based passive LC sensor approach employed in this thesis overcomes drawbacks of some of the early developed passive pH sensors and can lead to an inexpensive implementation using printed electronics technology.

Microelectromechanical resonators have found widespread applications in timing, sensing and spectral processing. One of the important performance metrics of MEMS resonators is the temperature sensitivity of their frequency. The main objective of this dissertation is the compensation and control of the temperature sensitivity of silicon resonators through engineering of device geometry and structural composition. This has been accomplished through formation of composite platforms or novel geometries based on dispersion characteristics of guided acoustic waves in single crystalline silicon (SCS) microstructures. Furthermore, another objective of this dissertation is to develop efficient longitudinal piezoelectric transduction for in-plane resonance modes of SCS resonators that have lithographically-defined frequencies, to reduce their motional resistance (Rm). A uniformly distributed matrix of silicon dioxide pillars is embedded inside the silicon substrate to form a homogenous composite silicon-oxide platform (SilOx) with nearly perfect temperature-compensated stiffness moduli. Temperature-stable micro-resonators implemented in SilOx platform operating in any desired in- and out-of-plane resonance modes show full compensation of linear temperature coefficient of frequency (TCF). Overall frequency drifts as small as 80 ppm has been achieved over the industrial temperature range (-40°C to 80°C) showing a 40x improvement compared to uncompensated native silicon resonators. A 27 MHz temperature-compensated MEMS oscillator implemented using SilOx resonator demonstrated sub-ppm instability over the industrial temperature range. Besides this, a new formulation of different resonance modes of SCS resonators based on their constituent acoustic waves is presented in this dissertation. This enables engineering of the acoustic resonator to provide several resonance modes with mechanical energy trapped in central part of the resonator, thus obviating narrow tethers traditionally used for anchoring the cavity to the substrate. This facilitates simultaneous piezoelectric-transduction of multiple modes with different TCFs through independent electrical ports, which can realize highly accurate self-temperature sensing of the device using a beat frequency (fb) generated from linear combination of different modes. Piezoelectrically-transduced multi-port silicon resonators implemented using this technique provide highly temperature-sensitive fb with a large TCF of ~8500 ppm/°C showing 100x improvement compared to other Quartz/MEMS counterparts, suggesting these devices as highly sensitive temperature sensors for environmental sensing and temperature-compensated/oven-controlled crystal oscillator (TCXO/OCXO) applications. Another part of this dissertation introduces a novel longitudinal piezoelectric transduction technique developed for implementation of low Rm silicon resonators operating in lithographically defined in-plane modes. Aluminum nitride films deposited on the sidewalls of thick silicon microstructures provides efficient electromechanical transduction required to achieve low Rm. 100 MHz SCS bulk acoustic resonators implemented using this transduction technique demonstrates Rm of 33Ω showing a 100x improvement compared to electrostatically transduced counterparts. Low-loss narrow-band filters with tunable bandwidth and frequency have been implemented by electrical coupling of these devices, showing their potential for realization of truly reconfigurable and programmable filter arrays required for software-defined radios.

The objective of the work presented in this thesis is to implement high-Q silicon capacitive micromechanical resonators operating in the HF, VHF and UHF frequency bands. Several variations of a fully silicon-based bulk micromachining fabrication process referred to as HARPSS have been developed, characterized and optimized to overcome most of the challenges facing application of such devices as manufacturable electronic components. Several micromechanical structures for implementation of high performance capacitive silicon resonators covering various frequency ranges have been developed under this work. Design criteria and electromechanical modeling of such devices is presented. Under this work, HF and VHF resonators with quality factors in the tens of thousands and RF-compatible equivalent electrical impedances have been implemented successfully. Resonance frequencies in the GHz range with quality factors of a few thousands and lowest motional impedances reported for capacitive resonators to date have been achieved. Several resonator coupling techniques for implementation of higher order resonant systems with possibility of extension to highly selective bandpass filters have been investigated and practically demonstrated. Finally, a wafer-level vacuum sealing technique applicable to such resonators has been developed and its reliability and hermeticity is characterized.