Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Ocean Engineering, 1981. / MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERING. / Includes bibliographical references. / by Vassilios John Papazoglou. / Ph.D.

Embedded active and passive devices has been increasingly used by in order to integrate more functions inside the same or smaller size device and to meet the need for better electrical performance of the component assemblies. Solder joints have been used in the electronic industry as both structural and electrical interconnections between electronic packages and printed circuit boards (PCB). When solder joints are under thermal cyclic loading, mismatch in coefficients of thermal expansion (CTE) between the printed circuit boards and the solder balls creates thermal strains and stresses on the joints, which may finally result in cracking. Consequently, the mechanical interconnection is lost, leading to electrical failures which in turn causes malfunction of the circuit or whole system. When a die is embedded into a substrate, Young's modulus of the die is larger than one of the core of the substrate and the CTEs of the die is smaller than those of the substrate. As a result, mismatch in coefficients of thermal expansions (CTE) between the substrate with the embedded device and the solder balls may increase. In the present study, finite element method (FEM) is employed to find out the stress and strain distribution of ball grid array(BGA) solders under thermal cycling. The ANAND model for viscoplasticity is employed for this purpose.

Hundreds of thousands of dollars could be lost due to failures during the fabrication of Trunnion-Hub-Girder (THG) assemblies of bascule bridges. Two different procedures are currently utilized for the THG assembly. Crack formations in the hubs of various bridges during assembly led the Florida Department of Transportation (FDOT) to commission a project to investigate why the assemblies failed. Consequently, a research contract was granted to the Mechanical Engineering department at USF in 1998 to conduct theoretical, numerical and experimental studies. It was found that the steady state stresses were well below the yield strength of the material and could not have caused failure. A parametric finite element model was designed in ANSYS to analyze the transient stresses, temperatures and critical crack lengths in the THG assembly during the two assembly procedures. The critical points and the critical stages in the assembly were identified based on the critical crack length. Furthermore, experiments with cryogenic strain gauges and thermocouples were developed to determine the stresses and temperatures at critical points of the THG assembly during the two assembly procedures. One result revealed by the studies was that large tensile hoop stresses develop in the hub at the trunnion-hub interface in AP1 when the trunnion-hub assembly is cooled for insertion into the girder. These stresses occurred at low temperatures, and resulted in low values of critical crack length. A suggestion to solve this was to study the effect of thickness of the hub and to understand its influence on critical stresses and crack lengths. In addition, American Association of State Highway and Transportation Officials (AASHTO) standards call for a hub radial thickness of 0.4 times the inner diameter while currently a thickness of 0.1 to 0.2 times the inner diameter is used. In this thesis, the geometrical dimensions are changed according to the design of experiments standards to find the sensitivity of these parameters on critical stresses and critical crack lengths during the assembly. Parameters changed are hub radial thickness to trunnion outer diameter ratio, trunnion outer diameter to trunnion bore diameter ratio and variations of the interference. The radial thickness of the hub was found to be the most influential parameter on critical stresses and critical crack lengths.

This work focuses on the chemical substitution of cations and anions in the frameworks of materials that have been known to exhibit negative thermal expansion (NTE). Zr2(PO4)2(SO4) is a member of the A(2)M(3)O(12) family which has been known to exhibit NTE. We have shown that Zr2(PO4)2(SO4) exhibits anisotropic positive thermal expansion. We have also shown that this material has been characterized in the wrong space group. Hf2(PO4)2(SO4) behaves similarly to Zr2(PO4)2(SO4) and follows this trend. Under pressure, Hf2(PO4)2(SO4) appears to undergo a phase transition. We have still yet to determine what space group the materials transitions to. While many members of the AX(2)O(7) family of frameworks have been fully characterized, the thermal expansion of PbP2O7 has yet to be reported. We were unable to obtain a reproducible procedure for synthesis of PbP2O7 from its precursor. Finally, variable temperature and variable pressure studies were performed on ZrMo2O8 in an attempt to learn more about the local structure. We found that space groups P213 and Pa-3 gave poor fits of the local structure at low r. Behavior of the nearest neighbor Zr-Mo distance was very similar to the bulk CTE. On compression, pressure induced amorphization is observed in ZrMo2O8. All interatomic correlations above 4 angstroms are washed out. Zr-O-Mo linkages remain well defined and do not massively deform as the pressure is increased. Finally, we we observed that Zr-O-Mo linkages change geometry reversibly as the pressure is increased.

Originally presented as the author's Thesis--Universität Hamburg, 2007. / Includes bibliographical references.

Continual scaling of devices and on-chip wiring has brought significant challenges for materials and processes beyond the 32-nm technology node in microelectronics. Recently, three-dimensional (3-D) integration with through-silicon vias (TSVs) has emerged as an effective solution to meet the future interconnect requirements. Among others, thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. In this dissertation, thermal stresses and interfacial reliability of TSV structures are analyzed by combining analytical and numerical models with experimental measurements. First, three-dimensional near-surface stress distribution is analyzed for a simplified TSV structure consisting of a single via embedded in a silicon (Si) wafer. A semi-analytic solution is developed and compared with finite element analysis (FEA). For further study, the effects of anisotropic elasticity in Si and metal plasticity in the via on the stress distribution and deformation are investigated. Next, by micro-Raman spectroscopy and bending beam technique, experimental measurements of the thermal stresses in TSV structures are conducted. The micro-Raman measurements characterize the local distribution of the near-surface stresses in Si around TSVs. On the other hand, the bending beam technique measures the average stress and viii deformation in the TSV structures. To understand the elastic and plastic behavior of TSVs, the microstructural evolution of the Cu vias is analyzed using focused ion beam (FIB) and electron backscattering diffraction (EBSD) techniques. To study the impacts of the thermal stresses on interfacial reliability of TSV structures, an analytical solution is developed for the steady-state energy release rate as the upper bound of the driving force for interfacial delamination. The effect of crack length and wafer thickness on the energy release rate is studied by FEA. Furthermore, to model interfacial crack nucleation, an analytical approach is developed by combining a shear lag model with a cohesive interface model. Finally, the effects of structural designs and the variation of the constituent materials on TSV reliability are investigated. The steady state solutions for the energy release rate are developed for various TSV designs and via materials (Al, Cu, Ni, and W) to evaluate the interfacial reliability. The parameters for TSV design optimization are discussed from the perspectives of interfacial reliability. / text

A 2-D CFD / FEM model to simulate thermal stresses in a turbine blade has been set up using the software FLUENT and FIDAP. The model was validated against the data of Bohn et. al. (1995) and was used to simulate 5 test cases. The numerical model was set up for a single Mark II nozzle guide vane (NGV) and utilised the appropriate boundary conditions for the surrounding flow field. A commercially available software code, FLUENT, was used to resolve the flow field, and heat transfer to the blade. The resulting surface temperature profile was then plotted and used as the boundary conditions in FIDAP (a commercial FEM code) to resolve the temperature and stress profile in the blade. An additional solver within FLUENT essentially superimposes an additional flow field as a result of the NGV vibration in the flow field. The pressure, temperature and heat transfer coefficient distribution, from FLUENT, were compared to those from Bohn et. al. (1995). The model predicted the distributions trends correctly, with an average over-prediction for temperature, of 10 % on the suction side and 6 % on the pressure side. This was restricted to the region from leading edge to 40 % chord on both sides of the blade. The blade temperature and equivalent stress contour trends were also correctly predicted by FIDAP. The blade temperature was over-predicted by and average of 1.7 %, while the equivalent stress magnitude was under-predicted by a worst case of 43 %, but the locations of maximum stress were correctly predicted. The reason for the differences between the stresses predicted by FLUENT / FIDAP and the data given in Bohn et. al. (1995), is believed to be the results of the temperature dependence of the material properties for the blade (ASTM 310 stainless steel), used in the two studies, not being identical. The reasoning behind this argument is because the distribution trends and contour variation, predicted by the model, compared favourably with the data of Bohn et. aI., and only the equivalent stress magnitude differed significantly. This completed the validation of the FLUENT / FIDAP model. The model was used to simulate test cases where temperature (i.e. turbine inlet temperature or TIT), at the model inlet (Le. the pressure inlet boundary in FLUENT), was set up to be time varying. Four simplified cases, viz single shock, multiple shocks, simplified cycle and multiple cycles, and a complex cycle (a mission profile) were simulated. The mission profile represented typical gas turbine operational data. The simulation results showed that stress was proportional to TIT. Changes in TIT were seen at a later time in the stress curve, due to conduction through the blade. Steep TIT changes, such as the shock loads, affected stress later than gentler TIT changes - the simplified and multiple cycles. These trends were consistently seen in the complex cycle. The maximum equivalent stress was plotted against TIT to try and develop a loose law that gives maximum equivalent stress as a function of TIT. A 4th order polynomial was fitted through the maxima and minima of the maximum equivalent stress plot, which gave the maximum and minimum stress as a function of TIT. This function was used calculate the maximum and minimum and mean equivalent stress using the TIT data for the mission profile. Thus, the FLUENT I FIDAP model was successfully validated, used to simulated the test cases and a law relating the equivalent stress as a function of TIT was developed. / Thesis (M.Sc.Eng.)-University of Natal, Durban, 2002.

Bibliography: leaves 243-256. / xi, 258 leaves : ill. ; 30 cm. / Title page, contents and abstract only. The complete thesis in print form is available from the University Library. / In this thesis, time-independent thermoelastoplastic and time-dependent creep stress and damage analysis of thick-walled cylinders are investigated using incremental theory of plasticity in conjunction with improved material elastoplastic and creep constitutive models. The results are validated experimentally and numerically. / Thesis (Ph.D.)--University of Adelaide, Dept. of Mechanical Engineering, 1996

Thesis (M. App. Sc.)--Carleton University, 2004. / Includes bibliographical references (p. 104-105). Also available in electronic format on the Internet.

Thesis (M. App. Sc.)--Carleton University, 2004. / Includes bibliographical references (p. 97-99). Also available in electronic format on the Internet.