聚醯亞胺薄膜用於軟性電路板市場從2006年起，由於競爭者眾多，整個產業環境變得十分嚴苛，事業屬性從獨佔性變成競爭十分激烈的寡佔性市場。此篇論文通過產業的總體環境分析及產業分析來對軟板市場進行區隔，並針對不同目標市場擬定行銷策略，將產品重新定位來滿足不同目標市場的需求，以期達到杜邦公司聚醯亞胺薄膜產品在軟性電路板市場的永續成長。
從含有產品價格因素在內的問卷調查中找到產業鏈中最有議價能力廠商的最重要需求及預估用量，進而做為公司開發下一世代聚醯亞胺薄膜產品的依據。 / Start from 2006, Polyimide films industry has become very competitive in flexible printed circuits applications. The polyimide film industry has transformed from monopoly to oligopoly, major players in flexible printed circuits market are DuPont, Kaneka, SKC-Kolon and Taimide companies.
After analyzing the political, economics, social, technical and industrial trends, The FPC industry has been re-segmented into two segments – Basic market and Niche market. With different strategies been developed for different markets, we re-position our different type of Kapton® polyimide films for different markets and developed an executable marketing plan which will be test in selected customers.
Through price included questionarries, we also found the key industrial decision makers’ unmet needs, price expectation and potential volume. Base on the findings, we are able to develop the next generation polyimide films to satisfy customers.
| Identifer | oai:union.ndltd.org:CHENGCHI/G0093932114 |
| Creators | 張春來, Chang, Michael |
| Publisher | 國立政治大學 |
| Source Sets | National Chengchi University Libraries |
| Language | 中文 |
| Detected Language | English |
| Type | text |
| Rights | Copyright © nccu library on behalf of the copyright holders |
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