Non-volatile memory can keep the data without supplying power, and it is suitable for portable electronic products due to the advantage of low power consumption. In current industrial production, high-temperature and long-time process are necessary for the fabrication of non-volatile memory, which are heavy loadings on production capacity and lots cost. Therefore, decreasing the temperature of the process is a trend. Recently using the oxidation treatment of supercritical carbon dioxide fluid can efficiently decrease the temperature of the process. In this thesis, the mixture layer of Zn, Sn, and SiO2 is applied to reduce the temperature of process, and to employ the defects of ZnO and SnO2 as floating gate for electron storage to fabricate the nonvolatile memory device. Zn and Sn are applied due to the low temperature melting points. To ensure the layer of cosputtering with Zn and Sn to be able to successfully fabricate as nano material device, the process of traditional rapid temperature annealing treatment was applied for first step. The co-sputtered Zn-Sn-SiO2 thin film was deposited on the tunneling oxide layer, and then the thin film was treated with varied annealing temperature to precipitate ZnO and SnO2 nanocrystals. After that, the C-V measurement is applied to analyze the change of the electrical and material properties. Using a positive bias, the electrons are injected into the oxide layer, by the threshold voltage the offset is occurred, which is defined as the memory window of the memory effect, and the property of nonvolatile memory will be applied. In addition, no matter the charge is injected from the gate oxide or tunnel oxide, the defects position of DLTS¡¦s peak is with the same property. The supercritical carbon dioxide fluid technology has been performed to study the memory effect. The capability of electron injection, storages and the defect, in the storage layer were studied by the C-V measurement and DLTS. The experiment confirmed that the Zn-Sn alloy has the memory property after it been treated by the supercritical carbon dioxide fluid technology. It has shown that Zn can promote to the storage capability ability due to the formation of deep level defects of SnO2 from the DLTS spectra. A new species is found at 0.93 eV with low activation energy and high capability of electron storage. The defect formation mechanism of Zn, ZnO, Zn-O-Si, Sn, and SnO are analyzed by found by the XPS and DLTS. The device fabrication using Zn-Si alloy and supercritical carbon dioxide fluid technology has the potential to reduce the process temperature and to improve the memory property of nonvolatile memory device.

Das Halbleitermaterial Zinkselenid (ZnSe) wurde mit Deep Level Transient Spectroscopy (DLTS) untersucht. Fuer planar N-dotierte, MO-CVD-gewachsene ZnSe-Schichten auf p-GaAs wurden vorwiegend breite Zustandsverteilungen, aber auch tiefe Niveaus gefunden. In kristallin gezuechtetem, undotiertem ZnSe wurden tiefe Stoerstellen nachgewiesen.

Silicon carbide (SiC) is currently under development for high power bipolar devices such as insulated gate bipolar transistors (IGBTs). A major issue for these devices is the charge carrier lifetime, which, in the absence of structural defects such as dislocations, is influenced by point defects and their associated deep levels. These defects provide energy levels within the bandgap and may act as either recombination or trapping centers, depending on whether they interact with both conduction and valence band or only one of the two bands. Of all deep levels know in 4H-SiC, the intrinsic carbon vacancy related Z1/2 is the most problematic since it is a very effective recombination center which is unavoidably formed during growth. Its concentration in the epilayer can be decreased for the production of high voltage devices by injecting interstitial carbon, for example by oxidation, which, however, results in the formation of other new deep levels. Apart from intrinsic crystal flaws, extrinsic defects such as transition metals may also produce deep levels within the bandgap, which in literature have so far only been shown to produce trapping effects. The focus of the thesis is the transient electrical and optical characterization of deep levels in SiC and their influence on the carrier lifetime. For this purpose, deep level transient spectroscopy (DLTS) and minority carrier transient spectroscopy (MCTS) variations were used in combination with time-resolved photoluminescence (TRPL). Paper 1 deals with a lifetime limiting deep level related to Fe-incorporation in n-type 4H-SiC during growth and papers 2 and 3 focus on identifying the main intrinsic recombination center in p-type 4H-SiC. In paper 4, the details of the charge carrier capture behavior of the deeper donor levels of the carbon vacancy, EH6/7, are investigated. Paper 5 deals with trapping effects created by unwanted incorporation of high amounts of boron during growth of n-type 4H-SiC which hinders the measurement of the carrier lifetime by room temperature TRPL. Finally, paper 6 is concerned with the characterization of oxidation-induced deep levels created in n- and p-type 4H- and 6H-SiC as a side-product of lifetime improvement by oxidation. In paper 1, the appearance of a new recombination center in n-type 4H-SiC, the RB1 level is discussed and the material is analyzed using room temperature TRPL, DLTS and pnjunction DLTS. The level appears to originate from a reactor contamination with Fe, a transition metal that generally leads to the formation of several trapping centers in the bandgap. Here it is found that under specific circumstances beneficial to the growth of high-quality material with a low Z1/2 concentration, the Fe incorporation also creates an additional recombination center capable of limiting the carrier lifetime. In paper 2, all deep levels found in p-type 4H-SiC grown at Linköping University which are accessible by DLTS and MCTS are investigated with regard to their efficiency as recombination centers. We find that none of the detectable levels is able to reduce carrier lifetime in p-type significantly, which points to the lifetime killer being located in the top half of the bandgap and having a large hole to electron capture cross section ratio (such as Z1/2, which is found in n-type material), making it undetectable by DLTS and MCTS. Paper 3 compares carrier lifetimes measured by temperature-dependent TRPL measurements in n- and p-type 4H-SiC and it is shown that the lifetime development over a large temperature range (77 - 1000 K) is similar in both types. This is interpreted as a further indication that the carbon vacancy related Z1/2 level is the main lifetime killer in p-type. In paper 4, the hole and electron capture cross sections of the near midgap deep levels EH6/7 are characterized. Both levels are capable of rapid electron capture but have only small hole capture rates, making them insignificant as recombination centers, despite their advantageous position near midgap. Minority carrier trapping by boron, which is both a p-type dopant and an unavoidable contaminant in 4H-SiC grown by CVD, is investigated in paper 5. Since even the shallow boron acceptor levels are relatively deep in the bandgap, minority trap and-release effects are detectable in room-temperature TRPL measurements. In case a high density of boron exists in n-type 4H-SiC, for example leached out from damaged graphite reactor parts during growth, we demonstrate that these trapping effects may be misinterpreted in room temperature TRPL measurements as a long free carrier lifetime. Paper 6 uses MCTS, DLTS, and room temperature TRPL to characterize the oxidation induced deep levels ON1 and ON2 in n- and p-type 4H- and their counterparts OS1-OS3 in 6H-SiC. The levels are found to all be positive-U, coupled two-levels defects which trap electrons efficiently but exhibit very inefficient hole capture once the defect is fully occupied by electrons. It is shown that these levels are incapable of significantly influencing carrier lifetime in epilayers which underwent high temperature lifetime enhancement oxidations. Due to their high density after oxidation and their high thermal stability they may, however, act to compensate n-type doping in low-doped material.

ZnO material based hetero-junctions are a potential candidate for the design andrealization of intrinsic white light emitting devices (WLEDs) due to several advantages overthe nitride based material system. During the last few years the lack of a reliable andreproducible p-type doping in ZnO material with sufficiently high conductivity and carrierconcentration has initiated an alternative approach to grow n-ZnO nanorods (NRs) on other ptypeinorganic and organic substrates. This thesis deals with ZnO NRs-hetero-junctions basedintrinsic WLEDs grown on p-SiC, n-SiC and p-type polymers. The NRs were grown by thelow temperature aqueous chemical growth (ACG) and the high temperature vapor liquid solid(VLS) method. The structural, electrical and optical properties of these WLEDs wereinvestigated and analyzed by means of scanning electron microscope (SEM), current voltage(I-V), photoluminescence (PL), cathodoluminescence (CL), electroluminescence (EL) anddeep level transient spectroscopy (DLTS). Room temperature (RT) PL spectra of ZnOtypically exhibit one sharp UV peak and possibly one or two broad deep level emissions(DLE) due to deep level defects in the bandgap. For obtaining detailed information about thephysical origin, growth dependence of optically active defects and their spatial distribution,especially to study the re-absorption of the UV in hetero-junction WLEDs structure depthresolved CL spectroscopy, is performed. At room temperature the CL intensity of the DLEband is increased with the increase of the electron beam penetration depth due to the increaseof the defect concentration at the ZnO NRs/substrate interface. The intensity ratio of the DLEto the UV emission, which is very useful in exploring the origin of the deep level emissionand the distribution of the recombination centers, is monitored. It was found that the deepcenters are distributed exponentially along the ZnO NRs and that there are more deep defectsat the root of ZnO NRs compared to the upper part. The RT-EL spectra of WLEDs illustrateemission band covering the whole visible range from 420 nm and up to 800 nm. The whitelightcomponents are distinguished using a Gaussian function and the components were foundto be violet, blue, green, orange and red emission lines. The origin of these emission lines wasfurther identified. Color coordinates measurement of the WLEDs reveals that the emitted lighthas a white impression. The color rendering index (CRI) and the correlated color temperature(CCT) of the fabricated WLEDs were calculated to be 80-92 and 3300-4200 K, respectively.

Thesis (Ph. D.)--University of Missouri-Columbia, 1998. / Typescript. Vita. Includes bibliographical references (leaves 107-111). Also available on the Internet.

Thesis (Ph. D.)--University of Missouri-Columbia, 1998. / Typescript. Vita. Includes bibliographical references (leaves 107-111). Also available on the Internet.

Thesis (Ph. D.)--West Virginia University, 2005. / Title from document title page. Document formatted into pages; contains ix, 72 p. : ill. Includes abstract. Includes bibliographical references (p. 68-72).

The study of defects in semiconductors has been on-going for over 50 years. During this time, researchers have been studying the origins and identity of process induced defects, a task which has proved to be very demanding. While defects in silicon, the most widely used semiconductor, have been widely studied, there is more literature on n-type silicon than on p-type silicon. Compared to n-type silicon, p-type silicon is challenging to work with when it comes to making good Schottky diodes. A good rectifying device is essential for the performing of electrical characterisation techniques such as deep-level transient spectroscopy. In spite of this challenge p-silicon cannot be ignored. Many of the electronic devices are a combination of both n- and p-silicon therefore the need to understand the electronic properties of both materials. In this thesis, defects introduced in p-Si by electron beam deposition (EBD) were investigated. In order to understand these defects better, defects introduced by conditions of electron beam deposition (EBD) without metal deposition, were investigated. This process will be referred to as electron beam exposure (EBE). Finally, the defects were compared to defects induced by alpha-particle irradiation. EBD defects, introduced during electron beam deposition (EBD) of titanium (Ti) contacts on p-Si were investigated. The Schottky contacts were annealed within a temperature range of 200–400 oC. Current-voltage (I-V) measurements were conducted to monitor the change in electrical characteristics with every annealing step. Deep-level transient spectroscopy (DLTS) and Laplace-DLTS techniques were employed to identify the defects introduced after EBD and isochronal annealing of the Ti Schottky contacts. DLTS revealed that the main defects introduced during metallisation were hole traps with activation energy of 0.05 eV, 0.23 eV and 0.38 eV. Depth profiles of these defects showed that the formed close to the interface within a depth of 0.4 μm. Defects induced by EBE were studied by exposing samples for 50 minutes after which nickel (Ni) Schottky contacts were fabricated using resistive deposition. Only one defect with an activation energy of 0.55 eV was observed. This activation energy is similar to that of the I-defect. DLTS depth profiling revealed that the defect could be detected up to a depth of 0.8μm below the junction, which is significantly deeper than EBD defects. Defects induced when p-Si was irradiated by alpha particles from a 5.4 MeV americium (Am) 241 foil radioactive source with a fluence rate of 7×106 cm−2 s−1 at room temperature were investigated. After exposure at a fluence of 5.1×1010 cm−2, hole traps with the following activation energies were observed: 0.10 eV, identified as a tri-vacancy related defect, 0.33 eV, the interstitial carbon (Ci), 0.52 eV, a B-related defect and 0.16 eV. Low temperature irradiation experiments were also carried out using alpha- particles with the same fluence rate. Measurements were taken between 35 K and 120 K. The defect levels were at 0.10 eV, 0.14 eV and 0.18 eV. These levels were attributed to the boron-substitutional vacancy complex, the mono-vacancy and a vacancy-related defect, respectively. We conclude that EBD and EBE induced more complex defects than those induced by alpha-particle irradiation. / Thesis (PhD)--University of Pretoria, 2019. / Physics / PhD / Unrestricted

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