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This is (Not) a Textile is a surface pattern design project made with tools from motion design. The aim is to bring textile design into a new digital context, and explore how crossing these two fields can help to develop a new method of designing dynamically changing print. The process begins with hand sketching using automatic drawing methods inspired by surrealism. Then, the pattern elements are animated and constructed in the Adobe After Effects program using multiple layers of compositions. The result is a collection of animated patterns that each express a unique quality of digital changeability: building pattern layers, shifting light and color, and moving tessellation. In the future, designs like these may be applied to the real world with the help of augmented reality technology. In addition to influencing how design in the textile field can be reformulated with digital processes, this project pushes the boundaries of what textiles are and how they can be communicated and transformed through digital technology.

This research focused on the characterization of organosilicone surfactants and their effects on sulfonylurea herbicide activity. The project included efficacy tests, rainfastness studies in the greenhouse, radiotracer studies on herbicide uptake, fluorescent dye studies on surface deposition, and various measurements of physico-chemical properties. In measuring physico-chemical properties, a logistic dose response relationship was found between adjuvant concentration and contact angle on parafilm. An AsymSigR relationship existed between adjuvant concentration and surface tension for all the adjuvants. The organosilicones, Silwet L-77, Silwet 408, and Sylgard 309, and Kinetic (a blend of an organosilicone with a nonionic surfactant) gave equilibrium surface tension values around 20 dyne/cm and showed great spreading ability on the foliage of velvetleaf. With the conventional adjuvants, Agri-Dex, methylated soybean oil, Rigo oil concentration, and X-77, and Dyne-Amic (a blend of an organosilicone with a crop oil concentrate), surface tension was rarely below 28 dyne/cm and spreading ability was limited on velvetleaf. In addition, the organosilicone surfactant and Kinetic also lowered dynamic surface tension, which may improve droplet retention on leaf surfaces. The differences in physico-chemical properties between Kinetic and Dyne-Amic confirmed that carefully electing a co-adjuvant for an organosilicone blend is critical to avoid antagonism with trisiloxane molecules and retain the unique physico-chemical properties of organosilicone in the blends. Studies involving structurally-related organosilicones showed that the end structure in the trisiloxane hydrophilic group has little or no effect on surface tension, contact angle, spread pattern, herbicide uptake and translocation, and efficacy of primisulfuron on velvetleaf. It may be suggested that there is not a strict requirement to purify the end structure during the synthesis process, which is time consuming and expensive. When 14C-primisulfuron was combined with organosilicones or the blends, the uptake of 14C at 1 or 2 h after herbicide application was significantly higher than when combined with conventional adjuvants in velvetleaf. In the greenhouse, organosilicone surfactants greatly increased the rainfastness of primisulfuron in velvetleaf. The effect was immediate and dramatic, even when simulated rainfall was applied 0.25 h after treatment. In addition, herbicide efficacy on marginally susceptible weed species, velvetleaf and barnyardgrass, was significantly increased. A very complicated relationship exists between herbicides and adjuvants. The enhancement effects of adjuvants are often herbicide specific, weed species specific, and even environment specific. No one type of adjuvant functions well in all circumstances. Therefore, there is a need to understand the properties and functions of each class of adjuvants and locate the 'right' niche for each individual adjuvant. / Ph. D.

Orientador: Carlos Gilberto Raetano / Banca: Ulisses Rocha Antuniassi / Banca: Cristina Gonçalves de Mendonça / Resumo: Este trabalho teve como objetivo avaliar o efeito de adjuvantes sobre algumas propriedades de soluções aquosas, como tamanho de gotas, tensão superficial dinâmica e ângulo de contato das gotas em diferentes superfícies, natural e artificial, bem como avaliar o efeito desses produtos sobre a deposição e a deriva utilizando como alvo três espécies de plantas daninhas (Euphorbia heterophylla, Ipomoea grandifolia e Brachiaria plantaginea). Seis formulações de adjuvantes (Antideriva®, Uno®, Pronto 3®, Li-700®, Supersil® e Silwet L-77®) foram avaliadas em soluções aquosas contendo a dose recomendada do produto comercial e o dobro dela. As avaliações de tamanho de gotas foram feitas com três diferentes pontas de pulverização (AXI 110 015, 110 02 e 110 03) por um equipamento a laser (Mastersizer, Malvern) na pressão de trabalho de 414 kPa. Os ângulos de contato formados pelas gotas em duas superfícies, uma hidrofílica (vidro) e outra hidrofóbica (óxido de alumínio), foram obtidos por análise de imagens capturadas por uma câmera digital. As avaliações de deposição e deriva das soluções aquosas associadas ou não aos adjuvantes e contendo o traçador azul brilhante (0,15% v/v), foram feitas sobre diferentes espécies vegetais, e com o auxílio de coletores laterais (placas de Petri). A quantificação do traçador foi por feita espectrofotometria. A tensão superficial dinâmica e o ângulo de contato formado sobre as superfícies adaxiais das folhas foram medidos por um tensiômetro. Em relação ao tamanho de gotas, o adjuvante Antideriva, com dobro da dose recomendada, foi o que apresentou os menores valores percentuais de volume de gotas com diâmetro menor que 100 µm e os maiores DMV, para todas as pontas em teste. As soluções que proporcionaram as maiores ...(Resumo completo, clicar acesso eletrônico abaixo) / Abstract: The aim of this work is to evaluate the effect of adjuvants on droplet size, dynamic surface tension and contact angle formed by the water drops in different surfaces, as well as evaluating the adjuvants effect on the deposit and the spray drift using three species of plants (Euphorbia heterophylla, Ipomoea grandifolia e Brachiaria plantaginea). We studied six adjuvants formulations (Antideriva™, Uno™, Pronto 3™, Li- 700™, Supersil™ and Silwet L-77™) in water solution using the dosage recommended by the manufacturer and twice that dose. The droplet size of three different nozzles (AXI 110 015, 110 02 and 110 03), for a constant pressure of 414 kPa, were evaluated by a laser system. The contact angles of the drops in two surfaces (hydrophilic and hydrophobic) were obtained by the analysis of images captured by a digital camera. The evaluation of deposition and spray drift deposition of the solutions containing brilliant-blue dye (0.15 % v/v) were carried out in different plant species. The solutions were collected laterally using Petri dishes, and the brilliant-blue dye content quantified by absorption spectroscopy. The dynamic surface tension and the angle formed on the surfaces of the leaves were measured by a tensiometer. Regarding the droplet size, for all the nozzles tested the adjuvant Antideriva with twice the recommended dose presented the lowest percentage of spray volume in droplets with diameters smaller than 100µm, and highest VMD. The solutions that provided the highest reductions in the dynamic surface tension and the smallest contact angle were the ones with the adjuvants Silwet L-77 and Supersil for both appraised doses. The largest deposit average for I. grandifolia was obtained by using Uno with double of the dose; for B. ...(Complete abstract click electronic access below) / Mestre

No description available.

The first part of this thesis is concerned with thestructure-property relationships in nonionic surfactantsystems. The main aim was to investigate how the surfactantstructure influences the adsorption at interfaces andinteractions between surfactant coated interfaces.Particularly, the effect of the structure of the surfactantheadgroups was investigated. These were sugar-based headgroupwith varying size and flexibility and poly(ethylene oxide)based headgroups with or without an additional amide or estergroup. The hydrophobic part of the surfactant consisted mostlyof straight alkyl chains, except for one type of poly(ethyleneoxide) based surfactant with a dehydroabietic hydrophobe. The main technique that was used is the surface forcetechnique, with which the forces acting between two adsorbedsurfactant layers on hydrophilic or hydrophobic surfaces can bemeasured. These forces are important for e.g. the stability ofdispersions. The hydrophilic surfaces employed were glass andmica, whereas the hydrophobic surfaces were silanized glass andhydrophobized mica. The adsorption behavior on hydrophilicsurfaces is highly dependent on the type of headgroup andsurface, whereas similar results were obtained on the two typesof hydrophobic surfaces. To better understand how the surfaceforces are affected by the surfactant structure, measurementsof adsorbed amount and theoretical mean-field latticecalculations were carried out. The results show that the sugarsurfactant layers and poly(ethylene oxide) surfactant layersgive rise to very different surface forces, but that the forcesare more similar within each group. The structure-propertyrelationships for many other physical properties have beenstudied as well. These include equilibrium and dynamicadsorption at the liquid-vapor interface, micelle size, micelledynamics, and wetting. The second part in this thesis is about the aggregationbetween cationic polyelectrolytes and an anionic surfactant.The surface force technique was used to study the adsorption ofa low charged cationic polyelectrolyte on mica, and theaggregation between the adsorbed polyelectrolyte with theanionic surfactant. The aggregation in bulk was studied withturbidimetry, small angle neutron scattering (SANS), and smallangle x-ray scattering (SAXS). An internal hexagonal aggregatestructure was found for some of the bulk aggregates. <b>Keywords:</b>nonionic surfactant, sugar surfactant,poly(ethylene oxide), amide, ester, polyelectrolyte, SDS,hydrophobic surface, glass surface, mica, adsorption,aggregation, micelle size, surface forces, wetting, dynamicsurface tension, NMR, TRFQ, SANS, SAXS, mean-field latticecalculations.

<p>The first part of this thesis is concerned with thestructure-property relationships in nonionic surfactantsystems. The main aim was to investigate how the surfactantstructure influences the adsorption at interfaces andinteractions between surfactant coated interfaces.Particularly, the effect of the structure of the surfactantheadgroups was investigated. These were sugar-based headgroupwith varying size and flexibility and poly(ethylene oxide)based headgroups with or without an additional amide or estergroup. The hydrophobic part of the surfactant consisted mostlyof straight alkyl chains, except for one type of poly(ethyleneoxide) based surfactant with a dehydroabietic hydrophobe.</p><p>The main technique that was used is the surface forcetechnique, with which the forces acting between two adsorbedsurfactant layers on hydrophilic or hydrophobic surfaces can bemeasured. These forces are important for e.g. the stability ofdispersions. The hydrophilic surfaces employed were glass andmica, whereas the hydrophobic surfaces were silanized glass andhydrophobized mica. The adsorption behavior on hydrophilicsurfaces is highly dependent on the type of headgroup andsurface, whereas similar results were obtained on the two typesof hydrophobic surfaces. To better understand how the surfaceforces are affected by the surfactant structure, measurementsof adsorbed amount and theoretical mean-field latticecalculations were carried out. The results show that the sugarsurfactant layers and poly(ethylene oxide) surfactant layersgive rise to very different surface forces, but that the forcesare more similar within each group. The structure-propertyrelationships for many other physical properties have beenstudied as well. These include equilibrium and dynamicadsorption at the liquid-vapor interface, micelle size, micelledynamics, and wetting.</p><p>The second part in this thesis is about the aggregationbetween cationic polyelectrolytes and an anionic surfactant.The surface force technique was used to study the adsorption ofa low charged cationic polyelectrolyte on mica, and theaggregation between the adsorbed polyelectrolyte with theanionic surfactant. The aggregation in bulk was studied withturbidimetry, small angle neutron scattering (SANS), and smallangle x-ray scattering (SAXS). An internal hexagonal aggregatestructure was found for some of the bulk aggregates.</p><p><b>Keywords:</b>nonionic surfactant, sugar surfactant,poly(ethylene oxide), amide, ester, polyelectrolyte, SDS,hydrophobic surface, glass surface, mica, adsorption,aggregation, micelle size, surface forces, wetting, dynamicsurface tension, NMR, TRFQ, SANS, SAXS, mean-field latticecalculations.</p>

La compréhension des mécanismes qui pilotent la transmission des contraintes aux interfaces déformables est au centre de nombreuses problématiques touchant des applications actuelles utilisant un film mince de polymère souple comme couche interfaciale. Arriver à caractériser de tels films fins est encore un défi aujourd’hui car l’analyse des mesures expérimentales destinées à extraire les contributions dues aux films est complexe et délicate et les techniques usuelles de caractérisation sont peu adaptées aux systèmes. Ce travail étudie la réponse mécanique de deux types de systèmes modèles au moyen de deux techniques de caractérisation différentes. Le premier système que nous avons élaboré et caractérisé mécaniquement par le test JKR, est constitué de films d’élastomère réticulé d’épaisseurs micrométriques (de 5 à 100µm) et déposés sur des wafers de silicium. Les mesures expérimentales ont été analysées par comparaison à un modèle semi-analytique récent proposé par E. Barthel dans le but d’extraire le module élastique de chaque film et de répondre à la question de savoir si l’épaisseur du film influe sur la valeur de ce module. Nous avons montré que ce modèle permet de rendre compte quantitativement du raidissement lié à la présence d’un solide supportant le film mais que la précision sur les mesures de modules de Young reste limitée (de l’ordre de 35 %).Le deuxième système modèle est constitué de brosses de polymères greffées (PDMS) par une extrémité à la surface de wafers de silicium et gonflées dans un bon solvant (47V20). Nous avons analysé la réponse mécanique dans plusieurs régimes de distance et de fréquence en utilisant un appareil à forces de surface (SFA) dans lequel on contrôle l’approche d’une sphère millimétrique d’un plan sur lequel sont greffées les polymères. En statique, nous avons vérifié que la réponse en compression était celle d’une brosse de type Alexander-de Gennes. En mode dynamique, quand la sphère est loin de la couche gonflée, nous avons vérifié que la réponse dissipative était celle d’un écoulement de Reynolds qui décrit normalement l’écoulement d’un fluide simple newtonien entre une sphère et un plan solide. Ceci nous a permis de montrer que l’écoulement du solvant pénètre partiellement à l’intérieur de la couche greffée sur une profondeur de l’ordre du tiers de l’épaisseur gonflée de la couche. Dans le régime ou les brosses sont comprimées, il n’y a pas d’accord entre les mesures réalisées et le modèle classique de Fredrickson et Pincus. Ceci s’explique par les expériences que nous avons réalisées sur un substrat nu (sans polymère) montrant pour la première fois la déformation des substrats solides qui sont indentés par l’écoulement de liquide et qu’il faut prendre en compte cette déformation dans les analyses de nanorhéologie. Finalement, une annexe est consacrée à la fabrication de surfaces hydrophobes silanisées optimisées en vue d’étudier le glissement d’un liquide simple et d’électrolytes à la paroi. / Understanding how stresses are transmitted to deformable interfaces is a key-point in numerous issues having everyday life applications which use a thin polymer film as an interfacial layer. Still, characterizing the mechanical properties of such elastic films remains a challenge because the usual employed techniques are destructive of the surface and because of the complexity of the associated analysis. In this work, we study the mechanical response of two types of home-made model systems using two different characterization techniques. The first system – studied with a JKR test- is composed of reticulated elastomeric films of micrometric thickness (5 to 100 µm) and stuck to a silicon wafer. We analyse the experimental data with E.Barthel’s recently published semi-analytical model in order to determine the elastic modulus of each indented film and see if the thickness of the film had any influence on its value. We show that this model is in a quantitatively good agreement with our data but that we only have a 35% accuracy on the elastic modulus values thanks to the set-up. The second system we studied consists in polymer brushes end-grafted onto the surface of silicon wafers and of nanometric thickness. To characterize the mechanical response of those brushes and the effect of both their molecular organization and ingredients on their ability to transmit stresses at the interface, we use a surface force apparatus in the dynamic mode as a soft fluid indenter. We use a millimetric sphere to create a liquid flow of the solvent in which the brushes are immerged and swollen. This flow induces hydrodynamic forces whose range we can control by varying the excitation frequency and the distance of approach. We obtain the following results : first with the static response we checked that the response of the polymer layers are well-described by the Alexander-de Gennes approximation. In the dynamical mode, when the sphere is far from the solid surface, we showed that the dissipative response was well-described by the Reynolds force. Thanks to those results, we succeeded in localizing the limit of penetration of the liquid flow inside the brushes at one third of the thickness of the swollen brush; second, when the brushes are compressed, we showed that the existing models (Fredrickson & Pincus) are insufficient to explain the dynamic responses of the brushes. This disagreement is explained by experiments we performed on the bare solid substrate, which show for the first time, the deformation of the substrate due to the liquid. Thus, the mechanical response of the underlying substrate has to be taken into account in the analysis of the nanorheological results on the brushes even though the substrate is much stiffer than the polymer layers. Finally, we present how we fabricated hydrophobic (silanized) surfaces in order to study the sliding of simple liquids at the wall with the same surface force apparatus.

In multi-level Co/low-k based interconnect systems of ultralarge-scale integrated electronic devices the removal of plasma etch residues by common plasma cleaning processes has been shown to alter material properties like k-value and leakage current of the low-k dielectric. Besides the development of less damaging plasma processes their substitution by wet cleaning steps is in the focus of research and development. With further decreasing feature dimensions the development of wet cleaning processes has to include wetting issues like the non-wetting of small features due to the surface energy of the liquid or pattern collapse effects of low-k dielectric trenches due to high capillary forces This work at first focuses on the determination of the surface energetic character of common cleaning solutions for PERR and differently etched or ashed low-k dielectric surfaces by contact angle analysis, to outline which combinations of solid and liquid will be critical regarding their wetting behavior. Besides the determination of the wetting behavior the contact angle analysis turned out to be a fast and sensible analytic tool to understand the surface modifications introduced by different plasma processes and can help to understand the mechanisms of plasma damage of low-k dielectric surfaces. The analysis showed that especially polymerizing plasma etch processes produce a low-energetic low-k dielectric surface with a negligible polar energy contributions, which inhibits their wetting by high energetic water based cleaning solutions, which actually are favored by semiconductor manufacturers. The strategy to overcome these wetting issues followed in the present work is the reduction of the surface energy of the cleaning liquids by the application of surfactants. Several types of surfactants have been applied to the cleaning liquids and the compatibility of the surfactant solutions to BEOL materials like low-k dielectrics, copper and diffusion barriers as well as their dynamic behavior has been studied. The analysis showed that choosing the appropriate rinsing solution after the cleaning process is essential to ensure its compatibility to porous low-k dielectrics. Optical, electrical and structural data indicated that DIW rinse in most of the cases was not able to remove residual surfactant species within the material, while for an IPA rinse most of the residual surfactants have been removed. Considering the data received for compatibility to low-k materials, copper and barriers, the dynamic behavior of the surfactant solutions as well as influences of increased bath temperature and long term stability a general advice about surfactant selection and processing of surfactant aided solutions within BEOL is given. / In mehrlagigen Kupfer/low-k basierten Metallisierungssystemen hochintegrierter elektronischer Bauelemente kann die Entfernung von Residuen nach der Plasmastrukturierung des Dielektrikums mittels herkömmlicher Plasmareinigungsprozesse zur Schädigung der Isolatorschicht und damit zum Ansteigen der relativen Dielektrizitätszahl sowie der Leckströme führen. Neben der Entwicklung schädigungsarmer Plasmaprozesse stellt der Ersatz dieser Prozesse durch Nassreinigungsschritte zur Ätzresiduenentfernung eine vielversprechende Alternative dar. Mit stetig abnehmenden Strukturabmaßen ist bei der Entwicklung dieser Nassreinigungsprozesse neben der Materialkompatibilität auch das Benetzungsverhalten der Reinigungsflüssigkeit von entscheidender Bedeutung, da die Oberflächenenergie der Reinigungslösung das Eindringen dieser in kleinste Strukturen verhindern und es durch hohe Kapillarkräfte zum Kollaps von Grabenstrukturen im Dielektrikum kommen kann. In der vorliegenden Arbeit wurde zunächst mittels Kontaktwinkelanalyse die Oberflächenenergie verschieden prozessierter low-k Dielektrikaschichten sowie herkömmlicher Lösungen zur Entfernung von Ätzresiduen untersucht, um hinsichtlich ihres Benetzungsverhaltens besonders kritische Materialkombinationen aufzuzeigen. Neben der Bestimmung des Benetzungsverhaltens hat sich die Kontaktwinkelanalyse zur Oberflächenenergieberechnung als schnelle und empfindliche Methode zur Analyse der Auswirkung von Plasmaprozessen auf die Oberfläche von low-k Dielektrika erwiesen. Die Untersuchungen haben gezeigt, dass besonders polymerisierende Plasmaprozesse eine niederenergetische Oberfläche erzeugen, welche von den derzeit in der Halbleiterfertigung bevorzugten hochenergetischen wasserbasierten Reinigungslösungen nur schlecht benetzt wird. Um diesem Effekt entgegenzuwirken wurde in der vorliegenden Arbeit die Senkung der Oberflächenenergie der Reinigungslösungen durch Zugabe von Tensiden untersucht. Es wurden mehrere Tenside unterschiedlichen Typs den Reinigungsflüssigkeiten zugemischt und die Kompatibilität dieser Lösungen mit low-k Dielektrika, Kupferschichten und Diffusionsbarrieren untersucht sowie ihr dynamisches Verhalten analysiert. Dabei hat sich gezeigt, dass die Auswahl der geeigneten Spüllösung nach dem eigentlichen Reinigungsprozess von entscheidender Bedeutung ist. Optische, elektrische sowie strukturelle Daten deuten darauf hin, dass bei Verwendung einer Spülung mit deionisiertem Wasser in den meisten Fällen Tensidrückstände im porösen Dielektrikum verbleiben. Eine Spülung mit Isopropanol war hingegen in der Lage, einen Großteil dieser Tensidrückstände zu entfernen. Unter Einbeziehung der Daten zur Materialkompatibilität und dem dynamischen Verhalten der Tensidlösungen bei Raumtemperatur und erhöhter Badtemperatur sowie ihrer Langzeitstabilität konnte schließlich eine Prozessempfehlung für die Verwendung der benetzungsoptimierten Reinigungslösungen in der BEOL-Prozessierung gefunden werden.

In multi-level Co/low-k based interconnect systems of ultralarge-scale integrated electronic devices the removal of plasma etch residues by common plasma cleaning processes has been shown to alter material properties like k-value and leakage current of the low-k dielectric. Besides the development of less damaging plasma processes their substitution by wet cleaning steps is in the focus of research and development. With further decreasing feature dimensions the development of wet cleaning processes has to include wetting issues like the non-wetting of small features due to the surface energy of the liquid or pattern collapse effects of low-k dielectric trenches due to high capillary forces This work at first focuses on the determination of the surface energetic character of common cleaning solutions for PERR and differently etched or ashed low-k dielectric surfaces by contact angle analysis, to outline which combinations of solid and liquid will be critical regarding their wetting behavior. Besides the determination of the wetting behavior the contact angle analysis turned out to be a fast and sensible analytic tool to understand the surface modifications introduced by different plasma processes and can help to understand the mechanisms of plasma damage of low-k dielectric surfaces. The analysis showed that especially polymerizing plasma etch processes produce a low-energetic low-k dielectric surface with a negligible polar energy contributions, which inhibits their wetting by high energetic water based cleaning solutions, which actually are favored by semiconductor manufacturers. The strategy to overcome these wetting issues followed in the present work is the reduction of the surface energy of the cleaning liquids by the application of surfactants. Several types of surfactants have been applied to the cleaning liquids and the compatibility of the surfactant solutions to BEOL materials like low-k dielectrics, copper and diffusion barriers as well as their dynamic behavior has been studied. The analysis showed that choosing the appropriate rinsing solution after the cleaning process is essential to ensure its compatibility to porous low-k dielectrics. Optical, electrical and structural data indicated that DIW rinse in most of the cases was not able to remove residual surfactant species within the material, while for an IPA rinse most of the residual surfactants have been removed. Considering the data received for compatibility to low-k materials, copper and barriers, the dynamic behavior of the surfactant solutions as well as influences of increased bath temperature and long term stability a general advice about surfactant selection and processing of surfactant aided solutions within BEOL is given. / In mehrlagigen Kupfer/low-k basierten Metallisierungssystemen hochintegrierter elektronischer Bauelemente kann die Entfernung von Residuen nach der Plasmastrukturierung des Dielektrikums mittels herkömmlicher Plasmareinigungsprozesse zur Schädigung der Isolatorschicht und damit zum Ansteigen der relativen Dielektrizitätszahl sowie der Leckströme führen. Neben der Entwicklung schädigungsarmer Plasmaprozesse stellt der Ersatz dieser Prozesse durch Nassreinigungsschritte zur Ätzresiduenentfernung eine vielversprechende Alternative dar. Mit stetig abnehmenden Strukturabmaßen ist bei der Entwicklung dieser Nassreinigungsprozesse neben der Materialkompatibilität auch das Benetzungsverhalten der Reinigungsflüssigkeit von entscheidender Bedeutung, da die Oberflächenenergie der Reinigungslösung das Eindringen dieser in kleinste Strukturen verhindern und es durch hohe Kapillarkräfte zum Kollaps von Grabenstrukturen im Dielektrikum kommen kann. In der vorliegenden Arbeit wurde zunächst mittels Kontaktwinkelanalyse die Oberflächenenergie verschieden prozessierter low-k Dielektrikaschichten sowie herkömmlicher Lösungen zur Entfernung von Ätzresiduen untersucht, um hinsichtlich ihres Benetzungsverhaltens besonders kritische Materialkombinationen aufzuzeigen. Neben der Bestimmung des Benetzungsverhaltens hat sich die Kontaktwinkelanalyse zur Oberflächenenergieberechnung als schnelle und empfindliche Methode zur Analyse der Auswirkung von Plasmaprozessen auf die Oberfläche von low-k Dielektrika erwiesen. Die Untersuchungen haben gezeigt, dass besonders polymerisierende Plasmaprozesse eine niederenergetische Oberfläche erzeugen, welche von den derzeit in der Halbleiterfertigung bevorzugten hochenergetischen wasserbasierten Reinigungslösungen nur schlecht benetzt wird. Um diesem Effekt entgegenzuwirken wurde in der vorliegenden Arbeit die Senkung der Oberflächenenergie der Reinigungslösungen durch Zugabe von Tensiden untersucht. Es wurden mehrere Tenside unterschiedlichen Typs den Reinigungsflüssigkeiten zugemischt und die Kompatibilität dieser Lösungen mit low-k Dielektrika, Kupferschichten und Diffusionsbarrieren untersucht sowie ihr dynamisches Verhalten analysiert. Dabei hat sich gezeigt, dass die Auswahl der geeigneten Spüllösung nach dem eigentlichen Reinigungsprozess von entscheidender Bedeutung ist. Optische, elektrische sowie strukturelle Daten deuten darauf hin, dass bei Verwendung einer Spülung mit deionisiertem Wasser in den meisten Fällen Tensidrückstände im porösen Dielektrikum verbleiben. Eine Spülung mit Isopropanol war hingegen in der Lage, einen Großteil dieser Tensidrückstände zu entfernen. Unter Einbeziehung der Daten zur Materialkompatibilität und dem dynamischen Verhalten der Tensidlösungen bei Raumtemperatur und erhöhter Badtemperatur sowie ihrer Langzeitstabilität konnte schließlich eine Prozessempfehlung für die Verwendung der benetzungsoptimierten Reinigungslösungen in der BEOL-Prozessierung gefunden werden.