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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
731

Highly Mismatched GaAs(1-x)N(x) and Ge(1-x)Sn(x) Alloys Prepared by Ion Implantation and Ultrashort Annealing

Gao, Kun 19 December 2014 (has links)
Doping allows us to modify semiconductor materials for desired properties such as conductivity, bandgap, and / or lattice parameter. A small portion replacement of the highly mismatched isoelectronic dopants with the host atoms of a semiconductor can result in drastic variation of its structural, optical, and / or electronic properties. Here, the term "mismatch" describes the properties of atom size, ionicity, and / or electronegativity. This thesis presents the fabrication of two kinds of highly mismatched semiconductor alloys, i.e., Ge(1-x)Sn(x) and GaAs(1-x)N(x). The structural and optical properties of the prepared Ge(1-x)Sn(x) and GaAs(1-x)N(x) have been investigated. The results suggest an efficient above-solubility doping induced by non-equilibrium methods of ion implantation and ultrashort annealing. Pulsed laser melting promotes the regrowth of monocrystalline Ge(1-x)Sn(x), whereas flash lamp annealing brings about the formation of high quality GaAs(1-x)N(x) with room temperature photoluminescence. The bandgap modification of Ge(1-x)Sn(x) and GaAs(1-x)N(x) has been verified by optical measurements of spectroscopic ellipsometry and photoluminescence, respectively. In addition, effective defect engineering in GaAs has been achieved by flash lamp annealing, by which a quasi-temperature-stable photoluminescence at 1.3 µm has been obtained. / Dotierung ermöglicht es, die Eigenschaften von Halbleitermaterialien, wie Leitfähigkeit, aber auch Bandabstand und / oder Gitterkonstanten gezielt zu verändern. Wenn ein Halbleiter mit einer kleinen Menge unterschiedliche Fremdatome dotiert wird, kann dies in einer drastischen Modifikation der strukturellen, optischen und / oder elektronischen Eigenschaften resultieren. Der Begriff "unterschiedlich" bedeutet hier die Eigenschaften von Atomgröße, Ioniztät und / oder Elektronegativität. Diese Doktorarbeit beschreibt die Herstellung von zwei Arten von stark fehlangepassten Halbleiterlegierungen: Ge(1-x)Sn(x) und GaAs(1-x)N(x). Die strukturellen und optischen Eigenschaften von Ge(1-x)Sn(x) und GaAs(1-x)N(x) wurden untersucht. Die Ergebnisse deuten auf eine effiziente Dotierung oberhalb der Löslichkeit, induziert durch die Nicht-Gleichgewichtsverfahren Ionenimplantation und Ultrakurzzeit-Ausheilung. Gepulstes Laserschmelzen ermöglicht das Nachwachsen von monokristallinem Ge(1-x)Sn(x), während die Blitzlampenausheilung in der Bildung von GaAs(1-x)N(x) hoher Qualität mit Photolumineszenz bei Raumtemperatur resultiert. Die Änderung der Bandlücke von Ge(1-x)Sn(x) und GaAs(1-x)N(x) wurde durch die optischen Methoden der spektroskopischen Ellipsometrie und Photolumineszenz verifiziert. Darüber hinaus konnte in ausgeheiltem GaAs eine quasi-temperaturstabile Photolumineszenz bei 1,3 µm beobachtet werden.
732

Integration of III-V compound nanocrystals in silicon via ion beam implantation and flash lamp annealing

Wutzler, René 26 September 2017 (has links)
The progress in device performance of modern microelectronic technology is mainly driven by down-scaling. In the near future, this road will probably reach a point where physical limits make even more down-scaling impossible. The substitution of single components materialwise over the last decades, like high-k dielectrics or metal gates, has been a suitable approach to foster performance improvements. In this scheme, the integration of high-mobility III-V compound semiconductors as channel materials into Si technology is a promising route to follow for the next one or two device generations. III-V integration, today, is conventionally performed by using techniques like molecular beam epitaxy or wafer bonding which utilize solid phase crystallization but suffer to strain due to the lattice mismatch between III-V compounds and Si. An alternative approach using sequential ion beam implantation in combination with a subsequent flash lamp annealing is presented in this work. Using this technique, nanocrystals from various III-V compounds have been successfully integrated into bulk Si and Ge as well as into thin Si layers which used either SOI substrates or were grown by plasma-enhanced chemical vapour deposition. The III-V compounds which have been fabricated are GaP, GaAs, GaSb, InP, InAs, GaSb and InxGa1-xAs with variable composition. The structural properties of these nanocrystals have been investigated by Rutherford backscattering, scanning electron microscopy and transmission electron microscopy, including bright-field, dark-field, high-resolution, high-angle annular dark-field and scanning mode imaging, electron-dispersive x-ray spectroscopy and energy-filtered element mapping. Furthermore, Raman spectroscopy and X-ray diffraction have been performed to characterise the nanocrystals optically. In Raman spectroscopy, the characteristic transversal and longitudinal optical phonon modes of the different III-V compounds have been observed. These signals proof that the nanocrystals have formed by the combination of ion implantation and flash lamp annealing. Additionally, the appearance of the typical phonon modes of the respective substrate materials verifies recrystallization of the substrate by the flash lamp after amorphisation during implantation. In the bulk Si samples, the nanocrystals have a circular or rectangular lateral shape and they are randomly distributed at the surface. Their cross-section has either a hemispherical or triangular shape. In bulk Ge, there are two types of precipitates: one at the surface with arbitrary shape and another one buried with circular shape. For the thin film samples, the lateral shape of the nanocrystals is more or less arbitrary and they feature a block-like cross-section which is limited in height by the Si layer thickness. Regarding crystalline quality, the nanocrystals in all samples are mainly single-crystalline with only a few number of stacking faults. However, the crystalline quality in the bulk samples is slightly better than in the thin films. The X-ray diffraction measurements display the (111), (220) and (311) Bragg peaks for InAs and GaAs as well as for the InxGa1-xAs where the peaks shift with increasing In content from GaAs towards InAs. The underlying formation mechanism is identified as liquid phase epitaxy. Hereby, the ion implantation leads to an amorphisation of the substrate material which is then molten by the subsequent flash lamp annealing. This yields a homogeneous distribution of the implanted elements within the melt due to their strongly increased diffusivity in the liquid phase. Afterwards, the substrate material starts to recrystallize at first and an enrichment of the melt with group-III and group-V elements takes place due to segregation. When the temperature is low enough, the III-V compound semiconductor starts to crystallize using the recrystallized substrate material as a template for epitaxial growth. In order to gain control over the lateral nanocrystal distribution, an implantation mask of either aluminium or nickel is introduced. Using this mask, only small areas of the samples are implanted. After flash lamp treatment, nanocrystals form only in these small areas, which allows precise positioning of them. An optimal implantation window size with an edge length of around 300nm has been determined to obtain one nanocrystal per implanted area. During an additional experiment, the preparation of Si nanowires using electron beam lithography and reactive ion etching has been conducted. Hereby, two different processes have been investigated; one using a ZEP resist, a lift-off step and a Ni hard mask and another one using a hydrogen silsesquioxane resist which is used directly as a mask for etching. The HSQ-based process turned out to yield Si nanowires of better quality. Combining both, the masked implantation and the Si nanowire fabrication, it might be possible to integrate a single III-V nanocrystal into a Si nanowire to produce a III-V-in-Si-nanowire structure for electrical testing. / Der Fortschritt in der Leistungsfähigkeit der Bauelemente moderner Mikroelektroniktechnologie wird hauptsächlich durch das Skalieren vorangetrieben. In naher Zukunft wird dieser Weg wahrscheinlich einen Punkt erreichen, an dem physikalische Grenzen weiteres Herunterskalieren unmöglich machen. Der Austausch einzelner Teile auf Materialebene, wie Hoch-Epsilon-Dielektrika oder Metall-Gate-Elektroden, war während der letzten Jahrzehnte ein geeigneter Ansatz, um die Leistungsverbesserung voranzubringen. Nach diesem Schema ist die Integration von III-V-Verbindungshalbleiter mit hoher Mobilität ein vielversprechender Weg, dem man für die nächsten ein oder zwei Bauelementgenerationen folgen kann. Heutzutage erfolgt die III-V-Integration konventionell mit Verfahren wie der Molekularstrahlepitaxie oder dem Waferbonden, welche die Festphasenkristallisation nutzen, die aber aufgrund der Gitterfehlanpassung zwischen III-V-Verbindungen und Silizium an Verspannungen leiden. In dieser Arbeit wird ein alternativer Ansatz präsentiert, welcher die sequenzielle Ionenstrahlimplantation in Verbindung mit einer darauffolgenden Blitzlampentemperung ausnutzt. Mit Hilfe dieses Verfahrens wurden Nanokristalle verschiedener III-V-Verbindungshalbleiter erfolgreich in Bulksilizium- und -germaniumsubstrate sowie in dünne Siliziumschichten integriert. Für die dünnen Schichten wurden hierbei entweder SOI-Substrate verwendet oder sie wurden mittels plasmagestützer chemischer Gasphasenabscheidung gewachsen. Die hergestellten III-V-Verbindungen umfassen GaP, GaAs, GaSb, InP, InAs, InSb und InxGa1-xAs mit veränderbarer Zusammensetzung. Die strukturellen Eigenschaften dieser Nanokristalle wurden mit Rutherford-Rückstreu-Spektroskopie, Rasterelektronenmikroskopie und Transmissionselektronenmikroskopie untersucht. Bei der Transmissionelektronenmikroskopie wurden die Hellfeld-, Dunkelfeld-, hochauflösenden, “high-angle annular dark-field” und Rasteraufnahmemodi sowie die energiedispersive Röntgenspektroskopie und die energiegefilterte Elementabbildung eingesetzt. Darüber hinaus wurden Ramanspektroskopie- und Röntgenbeugungsmessungen durchgeführt, um die Nanokristalle optisch zu charakterisieren. Mittels Ramanspektroskopie wurden die charakteristischen transversal- und longitudinal-optischen Phononenmoden der verschiedenen III-V-Verbindungen beobachtet. Diese Signale beweisen, dass sich unter Verwendung der Kombination von Ionenstrahlimplantation und Blitzlampentemperung Nanokristalle bilden. Weiterhin zeigt das Vorhandensein der typischen Phononenmoden der jeweiligen Substratmaterialien, dass die Substrate aufgrund der Blitzlampentemperung rekristallisiert sind, nachdem sie durch Ionenimplantation amorphisiert wurden. In den Bulksiliziumproben besitzen die Nanokristalle eine kreisförmige oder rechteckige Kontur und sind in zufälliger Anordnung an der Oberfläche verteilt. Ihr Querschnitt zeigt entweder eine Halbkugel- oder dreieckige Form. Im Bulkgermanium gibt es zwei Arten von Ausscheidungen: eine mit willkürlicher Form an der Oberfläche und eine andere, vergrabene mit sphärischer Form. Betrachtet man die Proben mit den dünnen Schichten, ist die laterale Form der Nanokristalle mehr oder weniger willkürlich und sie zeigen einen blockähnlichen Querschnitt, welcher in der Höhe durch die Siliziumschichtdicke begrenzt ist. Bezüglich der Kristallqualität sind die Nanokristalle in allen Proben mehrheitlich einkristallin und weisen nur eine geringe Anzahl an Stapelfehlern auf. Jedoch ist die Kristallqualität in den Bulkmaterialien ein wenig besser als in den dünnen Schichten. Die Röntgenbeugungsmessungen zeigen die (111), (220) und (311) Bragg-Reflexe des InAs und GaAs sowie des InxGa1-xAs, wobei sich hier die Signalpositionen mit steigendem Gehalt an Indium von GaAs zu InAs verschieben. Als zugrundeliegender Bildungsmechanismus wurde die Flüssigphasenepitaxie identifiziert. Hierbei führt die Ionenstrahlimplantation zu einer Amorphisierung des Substratmaterials, welches dann durch die anschließende Blitzlampentemperung aufgeschmolzen wird. Daraus resultiert eine homogene Verteilung der implantierten Elemente in der Schmelze, da diese eine stark erhöhte Diffusivität in der flüssigen Phase aufweisen. Danach beginnt zuerst das Substratmaterial zu rekristallisieren und es kommt aufgrund von Segregationseffekten zu einer Anreicherung der Schmelze mit den Gruppe-III- und Gruppe-V-Elementen. Wenn die Temperatur niedrig genug ist, beginnt auch der III-V-Verbindungshalbleiter zu kristallisieren, wobei er das rekristallisierte Substratmaterial als Grundlage für ein epitaktisches Wachstum nutzt. In der Absicht Kontrolle über die laterale Verteilung der Nanokristalle zu erhalten, wurde eine Implantationsmaske aus Aluminium beziehungsweise Nickel eingeführt. Durch die Benutzung einer solchen Maske wurden nur kleine Bereiche der Proben implantiert. Nach der Blitzlampentemperung werden nur in diesen kleinen Bereichen Nanokristalle gebildet, was eine genaue Positionierung dieser erlaubt. Es wurde eine optimale Implantationsfenstergröße mit einer Kantenlänge von ungefähr 300 nm ermittelt, damit sich nur ein Nanokristall pro implantierten Bereich bildet. Während eines zusätzlichen Experiments wurde die Präparation von Siliziumnanodrähten mit Hilfe von Elektronenstrahllithografie und reaktivem Ionenätzen durchgeführt. Hierbei wurden zwei verschiedene Prozesse getestet: einer, welcher einen ZEP-Lack, einen Lift-off-Schritt und eine Nickelhartmaske nutzt, und ein anderer, welcher einen HSQ-Lack verwendet, der wiederum direkt als Maske für die Ätzung dient. Es stellte sich heraus, dass der HSQ-basierte Prozess Siliziumnanodrähte von höherer Qualität liefert. Kombiniert man beides, die maskierte Implantation und die Siliziumnanodrahtherstellung, miteinander, sollte es möglich sein, einzelne III-V-Nanokristalle in einen Siliziumnanodraht zu integrieren, um eine III-V-in-Siliziumnanodrahtstruktur zu fertigen, welche für elektrische Messungen geeignet ist.
733

Development and characterization of a low thermal budget process for multi-crystalline silicon solar cells: Development and characterization of a low thermal budget process for multi-crystalline silicon solar cells

Krockert, Katja 18 December 2015 (has links)
Higher conversion efficiencies while reducing costs at the same time is the ultimate goal driving the development of solar cells. Multi-crystalline silicon has attracted considerable attention because of its high stability against light soaking. In case of solar grade multi-crystalline silicon the rigorous control of metal impurities is desirable for solar cell fabrication. It is the aim of this thesis to develop a new manufacturing process optimized for solar-grade multi-crystalline silicon solar cells. In this work the goal is to form solar cell emitters in silicon substrates by plasma immersion ion implantation of phosphine and posterior millisecond-range flash lamp annealing. These techniques were chosen as a new approach in order to decrease the production cost by reducing the amount of energy needed during fabrication. Therefore, this approach is called “Low Thermal Budget” process. After ion implantation the silicon surface is strongly disordered or amorphous up to the depth of the projected ion range. Therefore, subsequent annealing is required to remove the implantation damage and activate the doping element. Flash lamp annealing in the millisecond-range is demonstrated here as a very promising technique for the emitter formation at an overall low thermal budget. During flash lamp annealing, only the wafer surface is heated homogeneously to high temperatures at a time scales of ms. Thereby, implantation damages are annealed and phosphorous is electrically activated. The variation of pulse time allows to modify the degree of annealing of the bulk region to some extent as well. This can have an influence on the gettering behavior of metallic impurities. Ion implantation doping got in distinct consideration for doping of single-crystalline solar cells very recently. The efficient doping of multi-crystalline silicon remains the main challenge to reduce costs. The influence of different annealing techniques on the optical and electrical properties of multi-crystalline silicon solar cells was investigated. The Raman spectroscopy showed that the silicon surface is amorphous after ion implantation. It could be demonstrated that flash lamp annealing at 1000 °C for 3 ms even without preheating is sufficient to recrystallize implanted silicon. The sheet resistance of flash lamp annealed samples is in the range of about 60 Ω/□. Without surface passivation the minority carrier diffusion length in the flash lamp annealed samples is in the range of 85 µm. This is up to one order of magnitude higher than that observed for rapid thermal or furnace annealed samples. The highest carrier concentration and efficiency as well as the lowest resistivity were obtained after annealing at 1200 °C for 20 ms for both, single- and multi-crystalline silicon wafers. Photoluminescence results point towards phosphorous cluster formation at high annealing temperatures which affects metal impurity gettering within the emitter. Additionally, in silicon based solar cells, hydrogen plays a fundamental role due to its excellent passivation properties. The optical and electrical properties of the fabricated emitters were studied with particular interest in their dependence on the hydrogen content present in the samples. The influence of different flash lamp annealing parameters and a comparison with traditional thermal treatments such as rapid thermal and furnace annealing are presented. The samples treated by flash lamp annealing at 1200 °C for 20 ms in forming gas show sheet resistance values in the order of 60 Ω/□, and minority carrier diffusion lengths in the range of ~200 µm without the use of a capping layer for surface passivation. These results are significantly better than those obtained from rapid thermal or furnace annealed samples. The simultaneous implantation of hydrogen during the doping process, combined with optimal flash lamp annealing parameters, gave promising results for the application of this technology in replacing the conventional phosphoroxychlorid deposition and diffusion.:1 Motivation and objectives 1 2 Progress and prospects of silicon solar cells 5 3 Basics of a silicon solar cell 8 3.1 Specific characteristic of a standard silicon solar cell 12 3.2 Fundamental efficiency limits of standard silicon solar cells 14 4 Industrial process featuring low thermal budget process 17 4.1 Cleaning and etching steps 19 4.2 Emitter formation in p-type silicon 20 4.2.1 Thermal diffusion of phosphorous (industrial) 22 4.2.2 Ion beam implantation 24 4.2.3 Plasma immersion ion implantation as potential tool for the LTB process 26 4.2.4 Thermal processing of ion implanted solar cells - FLA as a novel method 28 4.3 Contact formation 30 4.3.1 Screen printing and sintering (industrial) 30 4.3.2 Gettering and BSF formation by aluminum diffusion (industrial) 32 4.3.3 Sputtering (LTB) 33 4.4 Surface passivation 33 5 Fabrication and characterization 35 5.1 Fabrication 35 5.2 Characterization of the p-n junction by ion implantation and FLA 39 5.2.1 Four-Point-Probe measurement (4-PPM) 39 5.2.2 Raman Spectroscopy (RS) 40 5.2.3 Photoluminescence Spectroscopy (PL) 41 5.2.4 Surface Photo-Voltage (SPV) 41 5.3 Analysis of hydrogen and metal impurities 46 5.3.1 Secondary Ion Mass Spectrometry (SIMS) 46 5.3.2 Elastic Recoil Detection Analyses (ERDA) and 47 Rutherford Backscattering Spectrometry (RBS) 47 5.4 Solar cell characterization 49 5.4.1 Transmission Electron Microscopy (TEM) 49 5.4.2 Auger Electron Spectroscopy (AES) 50 5.4.3 Light Beam Induced Current (LBIC) 51 5.4.4 Sun Simulator 52 6 Solar cell performance 53 6.1 Processing of the p-n junction by IBI and FLA 54 6.1.1 Variation FLA parameters 54 6.1.2 Influence of the grain size on the LD 71 6.2 Influence of the hydrogen introduced by PIII 76 6.2.1 Hydrogen profile by SIMS 76 6.2.2 H content as function of the thermal treatments 78 6.2.3 Optical properties of the silicon substrate 80 6.3 Influence of PIII and FLA on implanted iron 82 6.4 Contact formation 88 6.4.1 Antireflection layer 89 6.4.2 Back surface formation 90 6.4.3 Electrical and optical characterization 93 7 Overview of the achieved results 98 I References VIII II Publications XVII III Symbols index XVIII IV Acronyms XXI
734

Automatic Extraction and Assessment of Entities from the Web

Urbansky, David 15 October 2012 (has links)
The search for information about entities, such as people or movies, plays an increasingly important role on the Web. This information is still scattered across many Web pages, making it more time consuming for a user to find all relevant information about an entity. This thesis describes techniques to extract entities and information about these entities from the Web, such as facts, opinions, questions and answers, interactive multimedia objects, and events. The findings of this thesis are that it is possible to create a large knowledge base automatically using a manually-crafted ontology. The precision of the extracted information was found to be between 75–90 % (facts and entities respectively) after using assessment algorithms. The algorithms from this thesis can be used to create such a knowledge base, which can be used in various research fields, such as question answering, named entity recognition, and information retrieval.
735

A new Content Distribution Network architecture - PlentyCast

Cao, Wei Qiu January 2004 (has links)
Content Distribution Networks have existed for some years. They involve the following problem domains and have attracted attention both in academic research and industry: content replica placement, content location and routing, swarm intelligence, and overlay network self-organization for this type of distributed system. In this project, we propose a novel Content Distribution Network architecture – PlentyCast. This study focuses on improving access latency, network scalability, high content availability, low bandwidth consumption, and improving infrastructure performance for Content Distribution Networks. Outstanding problems such as: Flash crowd, DoS, and difficulty of traffic engineering due to Peer-to-Peer are addressed. / Mediadistributionsnätverk har funnits några år. De har fått uppmärksamhet i både akademisk forskning och i industrin och kännetecknas av följande frågor: placering av innehållskopior, lokalisering av innehåll och routing, svärm intelligens, överlagrade nätverks självorganisering för denna typ av fördelade system. I denna rapport studeras en ny nätverksarkitektur för innehållsfördelning - PlentyCast. Denna studie fokuserar på tillgångslatens, nätverksskalbarhet, hög innehållstillgång, låg bandbreddskonsumtion, och förbättrad infrastrukturprestanda för Innehållsfördelningsnätverk.
736

Simulation générique et contribution à l'optimisation de la robustesse des systèmes de données à large échelle / Generic simulation and contribution to the robustness optimization of large-scale data storage systems

Gougeaud, Sebastien 11 May 2017 (has links)
La capacité des systèmes de stockage de données ne cesse de croître pour atteindre actuellement l’échelle de l’exaoctet, ce qui a un réel impact sur la robustesse des systèmes de stockage. En effet, plus le nombre de disques contenus dans un système est grand, plus il est probable d’y avoir une défaillance. De même, le temps de la reconstruction d’un disque est proportionnel à sa capacité. La simulation permet le test de nouveaux mécanismes dans des conditions quasi réelles et de prédire leur comportements. Open and Generic data Storage system Simulation tool (OGSSim), l’outil que nous proposons, supporte l’hétérogénéité et la taille importante des systèmes actuels. Sa décomposition modulaire permet d’entreprendre chaque technologie de stockage, schéma de placement ou modèle de calcul comme des briques pouvant être combinées entre elles pour paramétrer au mieux la simulation. La robustesse étant un paramètre critique dans ces systèmes, nous utilisons le declustered RAID pour assurer la distribution de la reconstruction des données d’un disque en cas de défaillance. Nous proposons l’algorithme Symmetric Difference of Source Sets (SD2S) qui utilise le décalage des blocs de données pour la création du schéma de placement. Le pas du décalage est issu du calcul de la proximité des ensembles de provenance logique des blocs d’un disque physique. Pour évaluer l’efficacité de SD2S, nous l’avons comparé à la méthode Crush, exemptée des réplicas. Il en résulte que la création du schéma de placement, aussi bien en mode normal qu’en mode défaillant, est plus rapide avec SD2S, et que le coût en espace mémoire est également réduit (nul en mode normal). En cas de double défaillance, SD2S assure la sauvegarde d’une partie, voire de la totalité, des données / Capacity of data storage systems does not cease to increase to currently reach the exabyte scale. This observation gets a real impact on storage system robustness. In fact, the more the number of disks in a system is, the greater the probability of a failure happening is. Also, the time used for a disk reconstruction is proportional to its size. Simulation is an appropriate technique to test new mechanisms in almost real conditions and predict their behavior. We propose a new software we callOpen and Generic data Storage system Simulation tool (OGSSim). It handles the heterogeneity andthe large size of these modern systems. Its modularity permits the undertaking of each storage technology, placement scheme or computation model as bricks which can be added and combined to optimally configure the simulation.Robustness is a critical issue for these systems. We use the declustered RAID to distribute the data reconstruction in case of a failure. We propose the Symmetric Difference of Source Sets (SD2S) algorithmwhich uses data block shifhting to achieve the placement scheme. The shifting offset comes from the computation of the distance between logical source sets of physical disk blocks. To evaluate the SD2S efficiency, we compared it to Crush method without replicas. It results in a faster placement scheme creation in normal and failure modes with SD2S and in a significant reduced memory space cost (null without failure). Furthermore, SD2S ensures the partial, if not total, reconstruction of data in case of multiple failures.
737

Eludicating triggers and neurochemical circuits underlying hot flashes in an ovariectomy model of menopause

Federici, Lauren Michele 26 February 2016 (has links)
Indiana University-Purdue University Indianapolis (IUPUI) / Menopausal symptoms, primarily hot flashes, are a pressing clinical problem for both naturally menopausal women and breast and ovarian cancer patients, with a high societal and personal cost. Hot flashes are poorly understood, and animal modeling has been scarce, which has substantially hindered the development of non-hormonal treatments. An emerging factor in the hot flash experience is the role of anxiety and stress-related stimuli, which have repeatedly been shown to influence the bother, frequency, and severity of hot flashes. Causal relationships are difficult to determine in a clinical setting, and the use of animal models offers the ability to elucidate causality and mechanisms. The first part of this work details the development and validation of novel animal models of hot flashes using clinically relevant triggers (i.e., compounds or stimuli that cause hot flashes in clinical settings), which also increase anxiety symptoms. These studies revealed that these triggers elicited strong (7-9 °C) and rapid hot flash-associated increases in tail skin temperature in rats. In a surgical ovariectomy rat model of menopause, which typically exhibit anxiety-like behavior, hot flash provocation revealed an ovariectomy-dependent vulnerability, which was attenuated by estrogen replacement in tested models. An examination of the neural circuitry in response to the most robust flushing compound revealed increased cellular activity in key thermoregulatory and emotionally relevant areas. The orexin neuropeptide system was hyperactive and presented as a novel target; pretreatment with selective and dual orexin receptor antagonists significantly diminished or eliminated, respectively, the response to a hot flash provocation in ovariectomized rats. The insertion/deletion polymorphism of the serotonin transporter has been linked to increased anxiety-associated traits in humans, and subsequent studies prolonged hot flashes in SERT+/- rats, which also caused hot flashes in highly symptomatic women. These studies indicate the orexin system may be a novel non-hormonal treatment target, and future studies will determine the therapeutic importance of orexin receptor antagonists for menopausal symptoms.
738

Využití vybraných metod umělé inteligence pro nalezení malých povodí nejvíce ohrožených povodněmi z přívalových dešťů / Use of selected artificial intelligence methods for finding small watersheds most at risk of flash floods

Ježík, Pavel January 2016 (has links)
In our region, heavy rains may occur virtually everywhere. Nowadays there are instruments to predict these events in sufficient advance, but without precise localisation, which is a problem. Present instruments for searching endangered watersheds are focused on operative evaluation of meteorological situation and actual precipitation forecast processing (nowcasting). The thesis brings quite different approach. Potentially endangered areas are detected with evaluation of long-term statistical variables (N-year discharges and rain characteristics) and properties of specific watershed. The whole issue is handled out of situation of actual danger, this attitude is so called off-line solution. The thesis describes a model based on selected artificial intelligence methods. The model forms the core of final map application. The use of model and final application is supposed to be used in area of preventive flood protection, and related investment decision-making. The model focuses on heavy rains and flash floods.
739

Modeling and Parametric Evaluation of a Solar Multistage Flash With Brine Mixing Desalination Plant Using a Novel Dual Tank System

Kaheal, Mohamed M. 11 August 2022 (has links)
No description available.
740

Highly-doped germanium nanowires: fabrication, characterization, and application

Echresh, Ahmad 25 July 2023 (has links)
Germanium (Ge) is the most compatible semiconductor material with silicon-based complementary metal-oxide semiconductor technology, which has higher electron and hole mobility than Si, leading to enhanced device performance. In addition, semiconductor nanowires (NWs) have attracted significant attention as promising candidates for next-generation nanoscale devices. Due to their unique geometry and physical properties, NWs show excellent optical and electrical properties such as quantum size effects, enhanced light absorption, and high biological and chemical sensitivity. Furthermore, high response to light irradiation is one of the most significant properties of semiconductor NWs, which makes them excellent candidates for photodetectors. Hence, Ge NWs are promising high-mobility nanostructures for optoelectronic devices. Despite constant improvement in the performance of single NW-based devices, determining their electrical properties remains challenging. Here, a symmetric six-contact Hall bar configuration is developed for top-down fabricated highly doped Ge NWs with different widths down to 30 nm, which simultaneously facilitates Hall effect and four-probe resistance measurements. Furthermore, accurate control of doping and fabrication of metal contacts on n-type doped Ge NWs with low resistance and linear characteristics remain significant challenges in Ge-based devices. Therefore, a combined approach is reported to fabricate Ohmic contacts on n-type doped Ge NWs using ion implantation and rear-side flash lamp annealing. This approach allows the fabrication of axial p–n junctions along the single NWs with different widths. The fabricated devices demonstrated rectifying characteristics in dark conditions. The photoresponse of the axial p–n junction photodetectors was investigated under three different illumination wavelengths of 637 nm, 785 nm, and 1550 nm. Moreover, the fabricated axial p–n junction photodetector demonstrated a high-frequency response up to 1 MHz at zero bias.

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