Ce travail propose deux flots de conception complémentaires permettant le broadcast d’un bitstream partiel vers un ensemble de Régions Partiellement Reconfigurables (RPRs) identiques. Ces deux flots de conception sont applicables avec les FPGAs – Xilinx. Le premier appelé ADForMe (Automatic DPPR Flow For Multi-RPRs Architecture) permet l’automatisation du flot traditionnel de la RDP de Xilinx grâce à l’automatisation de la phase de floorplanning. Ce floorplanning est assuré par l’algorithme AFLORA (Automatic Floorplanning For Multi-RPRs Architectures) que nous avons conçu qui permet l'allocation identique de ces RPRs en termes de forme géométrique en tenant compte des paramètres technologiques du FPGA et des paramètres architecturaux de la conception dans le but de permettre la relocalisation de bitstream. Le deuxième flot proposé vise à favoriser la technique de relocalisation 1D et 2D afin de permettre le broadcast d’un bitstream partiel (fonctionnalité) vers un ensemble de RPRs pour une configuration du système. Ce flot permet donc l’optimisation de la taille de la mémoire de bitstream. Nous avons également proposé une architecture matérielle adéquate capable d’effectuer ce broadcast. Les résultats expérimentaux ont été effectués sur les FPGAs-Xilinx récents et ont prouvé la rapidité d’exécution de notre algorithme AFLORA ainsi que l’efficacité des résultats obtenus suite à l’application du flot d’automatisation de la relocalisation de bitstream. Ces deux flots permettent d’assurer la flexibilité et la réutilisabilité des composants IPs intégrés dans les architectures à Multi-RPRs afin de réduire la complexité en termes de temps de conception et d’améliorer productivité des concepteurs. / This work proposes two complementary design flows allowing the broadcast of a partial bitstream to a set of identical Partially Reconfigurable Regions (PRRs). These two design flows are applicable with FPGAs - Xilinx. The first one called ADForMe (Automatic DPPR Flow For Multi-RPRs Architecture) allows the automation of the traditional flow of Xilinx RDP through the automation of the floorplanning phase. This floorplanning is carried out by the AFLORA (Automatic Floorplanning For Multi-RPRs Architectures) algorithm which we have designed that allows the same allocation of these RPRs in terms of geometric shape taking into account the technological parameters of the FPGA and the architectural parameters of the design in order to allow the relocation of bitstream. The second proposed flow aims to promote the 1D and 2D relocation technique in order to allow the broadcast of a partial bitstream (functionality) to a set of RPRs for a system configuration. Therefore, this flow allows optimizing the size of the bitstream memory. We have also proposed suitable hardware architecture capable of performing this broadcast. The experimental results have been performed on the recent Xilinx FPGAs and have proved the speed of execution of our AFLORA algorithm as well as the efficiency of the results obtained by the application of the automation of the bitstream relocation technique flow. These two flows allow flexibility and reusability of IP components embedded in Multi-RPRs architectures to reduce complexity in design time and improve design productivity.

<p>With increasing demands in terms of timing, area and power, today’s ASIC (Application Specific Integrated Circuit) designers are faced with new problems as technology emerges. Ericsson has started to work in 65 nm and realized that the methods used in previous, larger technologies, does not offer good enough correlation between synthesis and the results after physical placement. This leads to several expensive and time consuming iterations back and forth between Ericsson and the ASIC vendor.</p><p>In order to narrow the gap between Ericsson and the ASIC vendor, and hence increase correlation, physical planning has been identified as a possible solution. Cadence First Encounter, part of the Cadence Encounter digital IC design platform, is an advanced tool for silicon virtual prototyping. The tool basically brings back-end placement knowledge to front-end ASIC designers.</p><p>This master’s thesis main goal is to evaluate Cadence First Encounter and investigate how it could be integrated with Ericsson’s design flow. The tool has been tested on previous designs with known issues and the results are positive. By using the prototype work flow in First Encounter that is described in this report, it is possible to identify and correct issues with the netlists in time, which will help shortening the lead time in projects and hence also the time to market.</p>

With increasing demands in terms of timing, area and power, today’s ASIC (Application Specific Integrated Circuit) designers are faced with new problems as technology emerges. Ericsson has started to work in 65 nm and realized that the methods used in previous, larger technologies, does not offer good enough correlation between synthesis and the results after physical placement. This leads to several expensive and time consuming iterations back and forth between Ericsson and the ASIC vendor. In order to narrow the gap between Ericsson and the ASIC vendor, and hence increase correlation, physical planning has been identified as a possible solution. Cadence First Encounter, part of the Cadence Encounter digital IC design platform, is an advanced tool for silicon virtual prototyping. The tool basically brings back-end placement knowledge to front-end ASIC designers. This master’s thesis main goal is to evaluate Cadence First Encounter and investigate how it could be integrated with Ericsson’s design flow. The tool has been tested on previous designs with known issues and the results are positive. By using the prototype work flow in First Encounter that is described in this report, it is possible to identify and correct issues with the netlists in time, which will help shortening the lead time in projects and hence also the time to market.

In recent years, with only small fractions of modern processors now accessible in a single cycle, computer architects constantly fight against propagation issues across the die. Unfortunately this trend continues to shift inward, and now the even most internal features of the pipeline are designed around communication, not computation. To address the inward creep of this constraint, this work focuses on the characterization of communication within the pipeline itself, architectural techniques to avoid it when possible, and layout co-design for early detection of problems. I present work in creating a novel detection tool for common case operand movement which can rapidly characterize an applications dataflow patterns. The results produced are suitable for exploitation as a small number of patterns can describe a significant portion of modern applications. Work on dynamic dependence collapsing takes the observations from the pattern results and shows how certain groups of operations can be dynamically grouped, avoiding unnecessary communication between individual instructions. This technique also amplifies the efficiency of pipeline data structures such as the reorder buffer, increasing both IPC and frequency. I also identify the same sets of collapsible instructions at compile time, producing the same benefits with minimal hardware complexity. This technique is also done in a backward compatible manner as the groups are exposed by simple reordering of the binarys instructions. I present aggressive pipelining approaches for these resources which avoids the critical timing often presumed necessary in aggressive superscalar processors. As these structures are designed for the worst case, pipelining them can produce greater frequency benefit than IPC loss. I also use the observation that the dynamic issue order for instructions in aggressive superscalar processors is predictable. Thus, a hardware mechanism is introduced for caching the wakeup order for groups of instructions efficiently. These wakeup vectors are then used to speculatively schedule instructions, avoiding the dynamic scheduling when it is not necessary. Finally, I present a novel approach to fast and high-quality chip layout. By allowing architects to quickly evaluate what if scenarios during early high-level design, chip designs are less likely to encounter implementation problems later in the process.

Les systèmes adaptatifs basés sur les architectures FPGA (Field-Programmable Gate Arrays) peuvent bénéficier grandement de la grande flexibilité offerte par la reconfiguration partielle dynamique (DPR). Grâce au DPR, les tâches matérielles composant un système adaptatif peuvent être allouées et re-allouées à la demande ou en fonction de l'environnement dynamique. Les flots de conceptions disponibles et les outils commerciaux ont évolué pour répondre aux exigences des architectures reconfigurables qui sont toutefois limitées dans leurs fonctionnalités. Ces outils ne permettent pas un placement et une relocation efficaces de tâches matérielles de tailles variables. L'objectif principal de ces travaux de thèse consiste à proposer des nouvelles méthodologies et de nouvelles approches pour faciliter au concepteur la phase de conception d'un système adaptatif reconfigurable opérationnelle, valide, optimisé et adapté aux changements dynamiques de l'environnement. La première contribution de cette thèse porte sur la problématique de la relocation des tâches matérielles de tailles différentes. Une méthodologie de conception est proposée pour répondre à un problème majeur des mécanismes de relogement : le stockage d'une unique bitstream de configuration pour réduire les besoins de la mémoire et pour accroître la réutilisable des modules matériels générés. Une technique de partitionnement de la région reconfigurable est appliquée dans la méthodologie de relogement proposée pour augmenter l'efficacité d'utilisation des ressources matérielles dans le cas des tâches reconfigurables de tailles variables. Cette méthodologie prend en compte aussi la communication entre différentes régions reconfigurables et la région statique. Pour valider la méthode, plusieurs études de cas sont implémentées. Cette validation montre une utilisation efficace des ressources matérielles ainsi une réduction importante du temps de reconfiguration. La deuxième partie de cette thèse présente et détaille une formulation mathématique afin d'automatiser le floorplanning des zones reconfigurables dans les FPGAs. Les algorithmes de recherche présentés dans cette thèse sont basés sur la technique d'optimisation PLMNE (programmation linéaire mixte en nombres entiers). Ces algorithmes permettent de définir automatiquement l'emplacement, la taille et la forme de la zone reconfigurable dynamique. Nous nous intéressons principalement dans cette recherche à la satisfaction des contraintes de placement des zones reconfigurables et celles liées à la relocation. De plus, nous considérons l’optimisation des ressources matérielles dans le FPGA en tenant compte des tâches de tailles variables. Finalement, une évaluation de l'approche proposée est présentée / Adaptive systems based on Field-Programmable Gate Arrays (FPGA) architectures can benefit greatly from the high degree of flexibility offered by dynamic partial reconfiguration (DPR). Thanks to DPR, hardware tasks composing an adaptive system can be allocated and relocated on demand or depending on the dynamically changing environment. Existing design flows and commercial tools have evolved to meet the requirements of reconfigurables architectures, but that are limited in functionality. These tools do not allow an efficient placement and relocation of variable-sized hardware tasks. The main objective of this thesis is to propose a new methodology and a new approaches to facilitate to the designers the design phase of an adaptive and reconfigurable system and to make it operational, valid, optimized and adapted to dynamic changes in the environment. The first contribution of this thesis deals with the issues of relocation of variable-sized hardware tasks. A design methodology is proposed to address a major problem of relocation mechanisms: storing a single configuration bitstream to reduce memory requirements and increasing the reusability of generating hardware modules. A reconfigurable region partitioning technique is applied in this proposed relocation methodology to increase the efficiency of use of hardware resources in the case of reconfigurable tasks of variable sizes. This methodology also takes into account communication between different reconfigurable regions and the static region. To validate the design method, several cases studies are implemented. This validation shows an efficient use of hardware resources and a significant reduction in reconfiguration time. The second part of this thesis presents and details a mathematical formulations in order to automate the floorplanning of the reconfigurable regions in the FPGAs. The algorithms presented in this thesis are based on the optimization technique MILP (mixed integer linear programming). These algorithms allow to define automatically the location, the size and the shape of the dynamic reconfigurable region. We are mainly interested in this research to satisfy the constraints of placement of the reconfigurable zones and those related to the relocation. In addition, we consider the optimization of the hardware resources in the FPGA taking into account the tasks of variable sizes. Finally, an evaluation of the proposed approach is presented

Rapid advances in integration technology have tremendously increased the design complexity of very large scale integrated (VLSI) circuits, necessitating robust optimization techniques in many stages of VLSI design. A genetic algorithm (GA) is a stochastic optimization technique that uses principles derived from the evolutionary process in nature. In this work, genetic algorithms are used to alleviate the hardware design process of VLSI application specific integrated circuits (ASICs) and reconfigurable hardware. VLSI ASIC design suffers from high design complexity and a large number of optimization objectives requiring hierarchical design approaches and multi-objective optimization techniques. The floorplanning stage of the design cycle becomes highly important in hierarchical design methods. In this work, a multi-objective genetic algorithm based floorplanner has been developed with novel crossover operators to address the multi-objective floorplanning problem for VLSI ASICs. The genetic floorplanner achieves significant wirelength savings (>19% on average) with little or no increase in area ( < 3% penalty) over previous floorplanners that perform simultaneous area and wirelength minimization. Hardware implementation of genetic algorithms is gaining importance because of their proven effectiveness as optimization engines for real-time applications. Earlier hardware implementations suffer from major drawbacks such as absence of GA parameter programmability, rigid pre-defined system architecture, and lack of support for multiple fitness functions. A compact IP core that implements a general purpose GA engine has been designed to realize evolvable hardware in field programmable gate array devices. The designed GA core achieved a speedup of around 5.16x over an analogous software implementation. Novel reconfigurable analog architectures have been proposed to realize extreme environment analog electronics. In this work, a digital framework has been developed to realize self reconfigurable analog arrays (SRAA) where genetic algorithms are used to evolve the required analog functionality and compensate performance degradation in extreme environments. The framework supports two methods of compensation, namely, model based lookup and genetic algorithm based compensation and is scalable in terms of the number of fitness evaluation modules. The entire framework has been implemented as a digital ASIC in a leading industrystrength silicon-on-insulator (SOI) technology to obtain high performance and a small form factor.

Variability has become one of the vital challenges that the designers of integrated circuits encounter. variability becomes increasingly important. Imperfect manufacturing process manifest itself as variations in the design parameters. These variations and those in the operating environment of VLSI circuits result in unexpected changes in the timing, power, and reliability of the circuits. With scaling transistor dimensions, process and environmental variations become significantly important in the modern VLSI design. A smaller feature size means that the physical characteristics of a device are more prone to these unaccounted-for changes. To achieve a robust design, the random and systematic fluctuations in the manufacturing process and the variations in the environmental parameters should be analyzed and the impact on the parametric yield should be addressed. This thesis studies the challenges and comprises solutions for designing robust VLSI systems in the presence of variations. Initially, to get some insight into the system design under variability, the parametric yield is examined for a small circuit. Understanding the impact of variations on the yield at the circuit level is vital to accurately estimate and optimize the yield at the system granularity. Motivated by the observations and results, found at the circuit level, statistical analyses are performed, and solutions are proposed, at the system level of abstraction, to reduce the impact of the variations and increase the parametric yield. At the circuit level, the impact of the supply and threshold voltage variations on the parametric yield is discussed. Here, a design centering methodology is proposed to maximize the parametric yield and optimize the power-performance trade-off under variations. In addition, the scaling trend in the yield loss is studied. Also, some considerations for design centering in the current and future CMOS technologies are explored. The investigation, at the circuit level, suggests that the operating temperature significantly affects the parametric yield. In addition, the yield is very sensitive to the magnitude of the variations in supply and threshold voltage. Therefore, the spatial variations in process and environmental variations make it necessary to analyze the yield at a higher granularity. Here, temperature and voltage variations are mapped across the chip to accurately estimate the yield loss at the system level. At the system level, initially the impact of process-induced temperature variations on the power grid design is analyzed. Also, an efficient verification method is provided that ensures the robustness of the power grid in the presence of variations. Then, a statistical analysis of the timing yield is conducted, by taking into account both the process and environmental variations. By considering the statistical profile of the temperature and supply voltage, the process variations are mapped to the delay variations across a die. This ensures an accurate estimation of the timing yield. In addition, a method is proposed to accurately estimate the power yield considering process-induced temperature and supply voltage variations. This helps check the robustness of the circuits early in the design process. Lastly, design solutions are presented to reduce the power consumption and increase the timing yield under the variations. In the first solution, a guideline for floorplaning optimization in the presence of temperature variations is offered. Non-uniformity in the thermal profiles of integrated circuits is an issue that impacts the parametric yield and threatens chip reliability. Therefore, the correlation between the total power consumption and the temperature variations across a chip is examined. As a result, floorplanning guidelines are proposed that uses the correlation to efficiently optimize the chip's total power and takes into account the thermal uniformity. The second design solution provides an optimization methodology for assigning the power supply pads across the chip for maximizing the timing yield. A mixed-integer nonlinear programming (MINLP) optimization problem, subject to voltage drop and current constraint, is efficiently solved to find the optimum number and location of the pads.

Variability has become one of the vital challenges that the designers of integrated circuits encounter. variability becomes increasingly important. Imperfect manufacturing process manifest itself as variations in the design parameters. These variations and those in the operating environment of VLSI circuits result in unexpected changes in the timing, power, and reliability of the circuits. With scaling transistor dimensions, process and environmental variations become significantly important in the modern VLSI design. A smaller feature size means that the physical characteristics of a device are more prone to these unaccounted-for changes. To achieve a robust design, the random and systematic fluctuations in the manufacturing process and the variations in the environmental parameters should be analyzed and the impact on the parametric yield should be addressed. This thesis studies the challenges and comprises solutions for designing robust VLSI systems in the presence of variations. Initially, to get some insight into the system design under variability, the parametric yield is examined for a small circuit. Understanding the impact of variations on the yield at the circuit level is vital to accurately estimate and optimize the yield at the system granularity. Motivated by the observations and results, found at the circuit level, statistical analyses are performed, and solutions are proposed, at the system level of abstraction, to reduce the impact of the variations and increase the parametric yield. At the circuit level, the impact of the supply and threshold voltage variations on the parametric yield is discussed. Here, a design centering methodology is proposed to maximize the parametric yield and optimize the power-performance trade-off under variations. In addition, the scaling trend in the yield loss is studied. Also, some considerations for design centering in the current and future CMOS technologies are explored. The investigation, at the circuit level, suggests that the operating temperature significantly affects the parametric yield. In addition, the yield is very sensitive to the magnitude of the variations in supply and threshold voltage. Therefore, the spatial variations in process and environmental variations make it necessary to analyze the yield at a higher granularity. Here, temperature and voltage variations are mapped across the chip to accurately estimate the yield loss at the system level. At the system level, initially the impact of process-induced temperature variations on the power grid design is analyzed. Also, an efficient verification method is provided that ensures the robustness of the power grid in the presence of variations. Then, a statistical analysis of the timing yield is conducted, by taking into account both the process and environmental variations. By considering the statistical profile of the temperature and supply voltage, the process variations are mapped to the delay variations across a die. This ensures an accurate estimation of the timing yield. In addition, a method is proposed to accurately estimate the power yield considering process-induced temperature and supply voltage variations. This helps check the robustness of the circuits early in the design process. Lastly, design solutions are presented to reduce the power consumption and increase the timing yield under the variations. In the first solution, a guideline for floorplaning optimization in the presence of temperature variations is offered. Non-uniformity in the thermal profiles of integrated circuits is an issue that impacts the parametric yield and threatens chip reliability. Therefore, the correlation between the total power consumption and the temperature variations across a chip is examined. As a result, floorplanning guidelines are proposed that uses the correlation to efficiently optimize the chip's total power and takes into account the thermal uniformity. The second design solution provides an optimization methodology for assigning the power supply pads across the chip for maximizing the timing yield. A mixed-integer nonlinear programming (MINLP) optimization problem, subject to voltage drop and current constraint, is efficiently solved to find the optimum number and location of the pads.

Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation. / Dreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.

Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary Bibliography / Dreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary Bibliography