Gallium nitride (GaN) based high electron mobility transistors (HEMTs) offer numerous benefits for both direct current (DC) and radio frequency (RF) power technology due to their combination of large band gap, high electrical breakdown field, high peak and saturation carrier velocity, and good stability at high temperatures. In particular, AlGaN/GaN heterostructures are of great interest because of the unique conduction channel that develops as a result of the spontaneous and piezoelectric polarization that occurs in these layers. This channel is a vertically confined plane of free carriers that is often called a 2 dimensional electron gas (or 2DEG). Although these devices have shown an improvement in performance over previous heterostructures, reliability issues are a concern because of the high temperatures and electric fields that develop during operation. Therefore, characterizing electrical and thermal profiles within AlGaN/GaN HEMTs is critical for understanding the various factors that contribute to device failures. Little research has been performed to model and characterize these devices under RF bias conditions, and is therefore of great interest. Under pulsed conditions, a single cycle consists of an “on-state” period where power is supplied to the device and self-heating occurs, followed by an “off-state” period where no power is supplied to the device and the device cools. The percentage of a single cycle in which the device is powered is called the duty cycle. In this work, we present a coupled electro-thermo-mechanical finite-element model for describing the development of temperature, stress, and strain profiles within AlGaN/GaN HEMTs under DC and AC power conditions for various duty cycles. It is found that bias conditions including source-to-drain voltage, source-to-gate voltage, and pulsing frequency directly contribute to the electro-thermo-mechanical response of the device, which is known to effect device performance and reliability. The model is validated by comparing numerical simulations to experimental electrical curves (Ids-Vds) and experimental strain measurements performed using scanning joule expansion microscopy (SJEM). In addition, we show how the operating conditions (bias applied and AC duty cycle) impact the thermal profiles of the device and outline how the stress in the device changes through a pulsed cycle due to the changing thermal and electrical profiles. Qualitatively, the numerical model has good agreement across a broad range of bias conditions, further validating the model as a tool to better understand device performance and reliability.

Visible-blind and solar-blind ultraviolet photodetectors based on GaN/AlGaN were designed, fabricated, and characterized for commercial and military applications. High performance back-illuminated solar-blind MSM achieved external quantum efficiency of ~48%. The dark current of 40x40μm MSM was less than the instrument measurement limitation of 20fA for a bias <100V. No photoconductive gain was observed. With an n-type doped high-Al ratio "window" Al₀.₆Ga₀.₄N layer, back-illuminated solar-blind p-i-n photodiode achieved a quantum efficiency of ~55% at zero-bias. Absorption edge study of both MSM and p-i-n photodetectors, based on device spectral responses, resulted in a performance comparison of MSMs and p-i-ns, as the solar-blind photodetection requires a sharp solar-blind rejection. Photoconductive detectors and avalanche photodetectors, with the internal gain advantage, have been discussed as well. A 30μm diameter GaN avalanche photodiode achieved a gain >23, with a dark current less than 100pA. The breakdown showed a positive temperature coefficient of 0.03 V/K that is characteristic of avalanche breakdown. SiC APDs, as candidates for visible-blind applications, have been designed, fabricated and characterized. An avalanche gain higher than 10⁵, with a dark current less than 1nA, showed the potential of SiC APD replacing PMTs for high sensitivity visible-blind UV detection. A silicon-based optical receiver has been presented in the Appendix. With the photodiode internal avalanche gain ~4, a sensitivity ~-6.9dBm at 10Gbps has been achieved. / text

The growth of thin-film metal nitride materials from elemental metal targets by plasma-assisted pulsed laser deposition (PLD) has been explored and analysed. A new UHV PLD growth system has been installed and assembled and its system elements were calibrated. A series of GaN thin films have been grown to calibrate the system. In-situ RHEED indicated that the films were single crystal and that growth proceeded in a three-dimensional fashion. SEM images showed heavy particulation of film surfaces that was not in evidence for later refractory metal nitride films. This may be connected to the fact that Ga targets were liquid while refractory metals were solid. Most GaN films were not continuous due to insufficient laser fluence. Continuous films did not exhibit photoluminescence. HfN films have been grown by PLD for the first time. Films grown have been shown to have high reflectivity in the visible region and low resistivity. These factors, along with their crystal structure, make them suitable candidates to be used as back-contacts in GaN LEDs and could also serve as buffer layers to enable the integration of GaN and Si technologies. Growth factors affecting the films’ final properties have been investigated. Nitrogen pressure, within the operating range of the plasma source, has been shown to have little effect on HfN films. Substrate temperature has been demonstrated to have more influence on the films’ properties, with 500 °C being established as optimum. ZrN films have also been grown by PLD. Early results indicated that they exhibit reflectivities 50 % ± 5 % lower than those of HfN. However, further growth and characterisation would be required in order to establish this as a fundamental property of ZrN as nitride targets were mostly used in ZrN production. Single-crystal epitaxial GdN and SmN films have been produced by PLD. This represents an improvement in the existing quality of GdN films reported in the literature, which are mostly polycrystalline. In the case of SmN, these are the first epitaxial films of this material to be grown. Film quality has been monitored in-situ by RHEED which has allowed growth to be tailored to produce ever-higher crystal quality. Post-growth analyses by collaborators was also of assistance in improving film growth. Substrate temperatures and nitrogen plasma parameters have been adjusted to find optimum values for each. In addition, laser fluence has been altered to minimise the presence of metal particulates in the films, which interfere with magnetic measurements carried out in analyses. Capping layers of Cr, YSZ or AlN have been deposited on the GdN and SmN prior to removal from vacuum to prevent their degradation upon exposure to atmospheric water vapour. The caps have been steadily improved over the course of this work, extending the lifetime of the nitride films in ambient. However, they remain volatile and this may persist since water vapour can enter the film at the edge regardless of capping quality. Optical transmission has shown an onset of absorption at 1.3 eV for GdN and 1.0 eV for SmN.

Certains domaines d'applications tels que l'aérospatial, l'automobile ou le forage de haute profondeur peuvent nécessiter la visualisation de certains paramètres physiques dans des environnements hostiles. Les capteurs microélectroniques basés sur le silicium y atteignent souvent leurs limites, qui sont qualifiées de conditions " sévères ". Ce travail se base principalement sur l'étude de solutions de capteurs mécaniques fonctionnant en conditions sévères. Le principe de ces capteurs repose sur l'exploitation de transistors de mesures HEMT à base de nitrures III-V (III-N), à la fois piézoélectriques et semiconducteurs, qui reste stable en conditions sévères. La compréhension des interactions entre physique des semiconducteurs et physique des matériaux ainsi que la caractérisation de structures possibles pour la détection mécanique représentent les principaux enjeux de ce sujet de thèse. La modélisation mécanique analytique et numérique des structures étudiées a permis d'appréhender le comportement de structures piézoélectriques multicouches. Le couplage de ce modèle électromécanique avec un modèle électronique du capteur a permis d'établir la faisabilité du principe de détection ainsi que la linéarité de la réponse du capteur. La caractérisation des prototypes réalisés en cours de thèse ont corroboré la linéarité du capteur tout en faisant apparaître l'influence de nombreux effets parasites réduisant sa sensibilité à savoir les effets de résistance parasites et de piézorésistances variables.

Emerging wireless standards are designed to be spectrally efficient to address the high cost of licensing wireless spectra. Unfortunately, the resulting signals have a high peak-to-average ratio that reduces the base station power amplifier efficiency at the back-off power level. The wasted energy is converted to heat that degrades the device reliability and increases the base-station’s carbon footprint and cooling requirements. In addition, these new standards place stringent re- quirements on the amplifier output power, linearity, efficiency, and bandwidth. To improve the back-off efficiency, a Doherty amplifier, which uses two device in parallel for back-off efficiency enhancement, is deployed in a typical base station. Unfortunately, the conventional Doherty amplifier is narrowband and thus cannot satisfy the bandwidth requirement of the modern base station that needs to support multiple standards and backward compatibility. In this thesis, we begin by studying the class F/F−1 high efficiency mode of operation. To this end, we designed a narrowband, harmonically-tuned 3.3 GHz, 10 W GaN high efficiency amplifier. Next, we investigate how to simultaneously achieve high efficiency and broad bandwidth by harnessing the simplified real frequency technique for the broadband matching network design. A 2 to 3 GHz, 45 W GaN amplifier and a 650 to 1050 MHz, 45 W LDMOS amplifier were designed. Finally, we analyze the conventional Doherty amplifier to determine the cause of its narrow bandwidth. We find that the narrow bandwidth can be attributed to the band-limited quarter-wave transformer as well as the widely adopted traditional design technique. As an original contribution to knowledge, we propose a novel Doherty amplifier configuration with intrinsically broadband characteristics by analyzing the load modulation concept and the conventional Doherty amplifier. The proposed amplifier uses asymmetrical drain voltage biases and symmetrical devices and it does not require a complex mixed-signal setup. To demonstrate the proposed concept in practice, we designed a 700 to 1000 MHz, 90 W GaN broadband Doherty amplifier. Moreover, to show that the proposed concept is applicable to high power designs, we designed a 200 W GaN broadband Doherty amplifier in the same band. In addition, to show that the technique is independent of the device technology, we designed a 700 to 900 MHz, 60 W LDMOS broadband Doherty amplifier. Using digital pre-distortion, the three prototypes were shown to be highly linearizable when driven with wideband 20 MHz LTE and WCDMA modulated signals and achieved excellent back-off efficiency. Lastly, using the insights from the previous analyses, we propose a novel mixed-technology Doherty amplifier with an extended and reconfigurable back-off level as well as an improved power utilization factor. The reconfigurability of the proposed amplifier makes it possible to customize the back-off level to achieve the highest average efficiency for a given modulated signal without redesigning the matching networks. A 790 to 960 MHz, 180 W LDMOS/GaN Doherty amplifier demonstrated the extended bandwidth and reconfigurability of the back-off level. The proposed amplifier addresses the shortcomings of the conventional Doherty amplifier and satisfies the many requirements of a modern base station power amplifier.

Emerging wireless standards are designed to be spectrally efficient to address the high cost of licensing wireless spectra. Unfortunately, the resulting signals have a high peak-to-average ratio that reduces the base station power amplifier efficiency at the back-off power level. The wasted energy is converted to heat that degrades the device reliability and increases the base-station’s carbon footprint and cooling requirements. In addition, these new standards place stringent re- quirements on the amplifier output power, linearity, efficiency, and bandwidth. To improve the back-off efficiency, a Doherty amplifier, which uses two device in parallel for back-off efficiency enhancement, is deployed in a typical base station. Unfortunately, the conventional Doherty amplifier is narrowband and thus cannot satisfy the bandwidth requirement of the modern base station that needs to support multiple standards and backward compatibility. In this thesis, we begin by studying the class F/F−1 high efficiency mode of operation. To this end, we designed a narrowband, harmonically-tuned 3.3 GHz, 10 W GaN high efficiency amplifier. Next, we investigate how to simultaneously achieve high efficiency and broad bandwidth by harnessing the simplified real frequency technique for the broadband matching network design. A 2 to 3 GHz, 45 W GaN amplifier and a 650 to 1050 MHz, 45 W LDMOS amplifier were designed. Finally, we analyze the conventional Doherty amplifier to determine the cause of its narrow bandwidth. We find that the narrow bandwidth can be attributed to the band-limited quarter-wave transformer as well as the widely adopted traditional design technique. As an original contribution to knowledge, we propose a novel Doherty amplifier configuration with intrinsically broadband characteristics by analyzing the load modulation concept and the conventional Doherty amplifier. The proposed amplifier uses asymmetrical drain voltage biases and symmetrical devices and it does not require a complex mixed-signal setup. To demonstrate the proposed concept in practice, we designed a 700 to 1000 MHz, 90 W GaN broadband Doherty amplifier. Moreover, to show that the proposed concept is applicable to high power designs, we designed a 200 W GaN broadband Doherty amplifier in the same band. In addition, to show that the technique is independent of the device technology, we designed a 700 to 900 MHz, 60 W LDMOS broadband Doherty amplifier. Using digital pre-distortion, the three prototypes were shown to be highly linearizable when driven with wideband 20 MHz LTE and WCDMA modulated signals and achieved excellent back-off efficiency. Lastly, using the insights from the previous analyses, we propose a novel mixed-technology Doherty amplifier with an extended and reconfigurable back-off level as well as an improved power utilization factor. The reconfigurability of the proposed amplifier makes it possible to customize the back-off level to achieve the highest average efficiency for a given modulated signal without redesigning the matching networks. A 790 to 960 MHz, 180 W LDMOS/GaN Doherty amplifier demonstrated the extended bandwidth and reconfigurability of the back-off level. The proposed amplifier addresses the shortcomings of the conventional Doherty amplifier and satisfies the many requirements of a modern base station power amplifier.

This dissertation shows the properties of lithium niobate and lithium tantalate as a promising substrate for III-nitrides, addresses several problems of integrating compound semiconductor materials on LN and LT. It also suggests some solutions of the addressed problems, including furnace anneals at high temperature. While this furnace anneal improved surface smoothness and III-nitride film adhesion, it also caused the repolarization on the congruent LN (48.39 mole % of Li2O) samples. However, the repolarization was not developed in the stoichiometric LN (49.9 mole % of Li2O) samples during the identical thermal treatment. Also, the structural quality of GaN epitaxial layers showed slight improvement when grown on LT substrates over LN substrates. Conventional epitaxial growth technologies were adapted and modified to implement a successful AlGaN/GaN heterostructure on LN (LT). The heterostructure were analyzed to verify the electrical and material properties using several characterization techniques. Finally, it demonstrates AlGaN/GaN-based HEMT devices on ferroelectric materials that will allow the future development of the multifunctional electrical and optical applications.

This thesis describes the fabrication and characterization of GaN homojunction visible-blind ultraviolet (UV) p-i-n avalanche photodiodes (APDs) grown by metalorganic chemical vapor deposition (MOCVD) on free-standing bulk GaN substrates. The objective of this research is to develop GaN UV p-i-n APDs with high linear-mode avalanche gains and the Geiger-mode operation for single photon detection. Low noise, high responsivity, and high detectivity are also required for fabricated APDs used as photodiodes in the photovoltaic mode (zero bias) and the photoconductive mode (low reverse bias). High material defect density and immature fabrication technology have hampered the development of III-nitride APDs in the past. In this thesis, sidewall leakage reduction methods have been developed to achieve significant improvement in dark current density, noise performance, and photo detection performance. A record linear-mode avalanche gain > 10⁵ for GaN APDs was demonstrated at λ = 360 nm. The first Geiger-mode deep UV (DUV) APD using front-illuminated homojunction p-i-n diode structure on a free-standing bulk GaN substrate was also measured with single photo detection efficiency (SPDE) of 1.0 % and dark count probability (DCP) of 0.03 at 265 nm. The performance of fabricated homojunction GaN p-i-n photodiodes was also evaluated in the photoconductive mode as well as the photovoltaic mode. For an 80-µm-diameter device biased at - 20 V (in the photoconductive mode) the dark current density is lower than 40 pA/cm² which is the lowest value achieved for any III-nitride photodiode so far. Its responsivity is 0.140 A/W at 360 nm with an ultraviolet-visible rejection ratio of 8×10³. The room-temperature noise equivalent power is 4.27×10 ⁻¹⁷ W-Hz-[superscript 0.5] and the detectivity D* is 1.66×10¹⁴ cm-Hz[superscript 0.5]-W ⁻¹ at - 20 V. The minimum detectable optical power is as low as 100 fW. They are among the best values reported for reverse-biased GaN p-i-n photodiodes to date.

An experimental and theoretical approach is taken to determine the effect of a heterojunction on the effective work function in a metal/high-? gate stack, the characteristics of aqueous hydrochloric acid cleaned (aq-HCl) GaN surface and the interface between GaN and Al2O3, HfO2 and GaON. The investigation of the effect of a heterojunction on the effective work function in a metal/high-? gate stack found that when a Ge/Si heterostructure on silicon is lightly doped and sufficiently thin, the work function can be extracted in a manner similar to that for a simple silicon substrate. Modifications to the terraced oxide structure are proposed to remove oxidation effects of the alternate channel materials. The extracted work function of TiN with various thicknesses on HfSiO is found to be in agreement with that of TiN on a silicon substrate. X-ray and ultraviolet photoelectron spectroscopy are used to observe the interface electronic states at the GaN (0001) and Al2O3, HfO2 and GaON dielectric interfaces. The GaN is cleaned using aqueous HCl prior to thermal oxidation to form GaON and atomic layer deposition of Al2O3 and HfO2. This was followed by a post deposition anneal. The GaN/HfO2 and GaN/Al2O3 interfaces exhibited dipoles of 1.6 eV and 0.4 eV +/- 0.2 eV, respectively. It is determined that the formation of an interfacial layer at the GaN/HfO2 interface is the primary cause of the larger dipole. Due to the knowledge of the formation of an interfacial GaOx or GaON layer during atomic layer deposition of HfO2, a better understanding of the GaN/GaON interface is needed. To accomplish this task, the interface electronic states at the GaN(0001) and GaON interface are observed using X-ray and ultraviolet photoelectron spectroscopy (XPS and UPS). XPS and UPS analysis of the GaN/GaON interface resulted in the calculation of a -2.7 eV +/- 0.2 eV dipole assuming that the core level shifts are only representative of the GaN band bending at the interface. If it is assumed that the core level shifts are only due to the oxidation of GaN, then the exhibited dipole at the GaN/GaON interface is -1.8 eV +/- 0.2 eV. Results indicate that the observed dipole is primarily caused by the polarization of the GaN. A theoretical approach is taken to provide a more complete understanding of the underlying formation mechanisms of a GaON interfacial layer during atomic layer deposition of HfO2. First, density functional theory is used to calculate the interactions of oxygen and water with the Ga-face of GaN clusters. The GaN clusters could be used as testbeds for the actual Ga-face on GaN crystals of importance in electronics. The results reveal that the local spin plays an important role in these interactions. It is found that the most stable interactions of O2 and the GaN clusters results in the complete dissociation of the O2 molecule to form two Ga-O-Ga bonds, while the most stable interactions between a H2O molecule and the GaN clusters are the complete dissociation of one of the O-H bonds to form a Ga-O-H bond and a Ga-H bond. Second, density functional theory is used to calculate the interaction of the reactants used to deposit HfO2 and Al2O3 during atomic layer deposition with hydrolyzed Ga-face GaN clusters. The results suggest that while further research is needed in this area to grasp a better understanding of the interactions of Trimethylaluminum (TMA) or Tertrakis(EthylMethylAmino)Hafnium (TEMAH) with hydrolyzed GaN clusters, it is found that a Ga-N(CH3)(CH2CH3) bond can form during the deposition of HfO2 using ALD and TEMAH as the reactant without breaking the Hf-N bond. The formation of a Ga-N(CH3)(CH2CH3) bond is significant because with the introduction of water into the system, the methyl and ethylmethyl groups may react to form a Ga-N-O bond which is believed to be the interfacial oxide found during deposition of HfO2 using ALD on GaN. No Ga-C bond structure formed in any fully optimized stable structure when analyzing the interaction of TMA with hydrolyzed GaN.

The study of carrier dynamics in wide band gap semiconductors is of great importance for UV detectors and emitters which are expected to be the building blocks for optoelectronic applications and high voltage electronics. On the experimental side, the progress made in the past two decades in generating subpicosecond laser pulses, resulted in numerous experiments that gave insight into the carrier dynamics in semiconductors. From the theoretical standpoint, the study of carrier interactions together with robust simulation methods, such as Monte-Carlo, provided great progress toward explaining the experimental results. These studies immensely improve our understanding of time scales of carrier recombination, relaxation and transport in semiconductor materials and devices which lead to optimizing the operation of optoelectronic devices, more specifically, emitters and detectors. Wide band gap materials having high breakdown field, wide band gap energy and high saturation velocity are among the most important semiconductors employed in the active layer of LEDs and lasers. GaN , its alloys, and ZnO are among the most important materials in semiconductor devices. Moreover, the use of lattice matched layers based on InAlN or InAlGaN is an alternative design approach which could mitigate the effect of polarization and enable growing thicker layers due to the higher structural quality. We first perform the study of carrier dynamics generated by ultrafast laser pulses in bulk GaN and ZnO materials to investigate the temperature dependent luminescence rise time. The obtained results are compared to the experimental results which show an excellent agreement. In this work, we use Monte Carlo method to evaluate the distribution of carriers considering the interaction of carriers with other carriers and also with polar optical phonons in the system. Considering the ongoing research about the advantages of lattice matched nitride based material systems, we also studied the properties of GaN layers lattice matched to InAlN and InAlGaN. As an application, we utilized the GaN/InAlGaN material system to study the carrier dynamics in Quantum Cascade Lasers. Furthermore, due to the superior properties of GaN which makes it an excellent candidate in power electronic applications, we also design and simulate an advanced vertical trench power MOSFET using drift diffusion and Monte Carlo models and characterize the performance of the device.