<p>Computational Fluid Dynamics is the analysis of a system involving fluid flow, heat transfer and associated phenomena such as chemical reactions by means of a computer-based simulation. The simulations in this study are performed using (CFD) software package FLUENT. The mixture of two gases (Silane gas (SiH4) and Hydrogen gas (H2)) are delivered into the hot-wire chemical vapor deposition system (HWCVD) with the two deposited substrates (glass and Silicon). This process is performed by the solar cells group of the Physics department at the University of the Western Cape. In this thesis, the simulation is done using a CFD software package FLUENT, to model the gas-flow patterns inside the HWCVD system. This will show how the gas-flow patterns are affected by the varying temperature of the heater in each simulation performed in this study under a constant pressure of 60&mu / Bar of the system.</p>

<p>Computational Fluid Dynamics is the analysis of a system involving fluid flow, heat transfer and associated phenomena such as chemical reactions by means of a computer-based simulation. The simulations in this study are performed using (CFD) software package FLUENT. The mixture of two gases (Silane gas (SiH4) and Hydrogen gas (H2)) are delivered into the hot-wire chemical vapor deposition system (HWCVD) with the two deposited substrates (glass and Silicon). This process is performed by the solar cells group of the Physics department at the University of the Western Cape. In this thesis, the simulation is done using a CFD software package FLUENT, to model the gas-flow patterns inside the HWCVD system. This will show how the gas-flow patterns are affected by the varying temperature of the heater in each simulation performed in this study under a constant pressure of 60&mu / Bar of the system.</p>

Magister Scientiae - MSc / Computational Fluid Dynamics is the analysis of a system involving fluid flow, heat transfer and associated phenomena such as chemical reactions by means of a computer-based simulation. The simulations in this study are performed using (CFD) software package FLUENT. The mixture of two gases (Silane gas (SiH4) and Hydrogen gas (H2)) are delivered into the hot-wire chemical vapor deposition system (HWCVD) with the two deposited substrates (glass and Silicon). This process is performed by the solar cells group of the Physics department at the University of the Western Cape. In this thesis, the simulation is done using a CFD software package FLUENT, to model the gas-flow patterns inside the HWCVD system. This will show how the gas-flow patterns are affected by the varying temperature of the heater in each simulation performed in this study under a constant pressure of 60μBar of the system. / South Africa

>Magister Scientiae - MSc / In this thesis, I explore the subjects of fluid dynamics and the Hot-Wire Chemical Vapour Deposition (HWCVD) process. HWCVD, in its simplicity, is one of the more powerful and elegant deposition techniques available in thin film research which allows for both the growth and post deposition treatments of functional thin films. In the HWCVD process, the quality of the final films is determined by a fixed set of deposition parameters namely: temperature, pressure and the gas flow rate. Finding the optimal combination of these parameters is key to obtaining the desired film specifications during every deposition. Conducting multiple trial experiments to determine said parameters can be expensive and time consuming, this is where simulation methods come into play. One such simulation method is Computational Fluid Dynamics (CFD) modelling

Hot-wire chemical vapour deposition (HWCVD) is a promising technique that permits polycrystalline silicon films with grain size of nanometers to be obtained at high deposition rates and low substrate temperatures. This material is expected to have better electronic properties than the commonly used amorphous hydrogenated silicon (a-Si:H).In this work, thin-film transistors (TFTs) were fabricated using nanocrystalline hydrogenated silicon film (nc-Si:H), deposited by HWCVD over thermally oxidized silicon wafer. The employed substrate temperature during the deposition process permits inexpensive materials as glasses or plastics to be used for various applications in large-area electronics. The deposition rate was about one order of magnitude higher than in other conventionally employed techniques. The deposited nc-Si:H films show good uniformity and reproducibility. The films consist of vertically grown columnar grains surrounded by amorphous phase. The columnar grains are thinner at the bottom (near the oxide interface) and thicker at the top of the film. Chromium layer was evaporated over the nc-Si:H in order to form drain and source contacts. Using photolithography techniques, two types of samples were fabricated. The first type (simplified) was with the chromium contacts directly deposited over the intrinsic nc-Si:H layer. No dry etching was involved in the fabrication process of this sample. The transistors on the wafer were not electrically separated from each other. Doped n+ layer was incorporated at the drain and source contacts in the second type of samples (complete samples). Dry etching was employed to eliminate the nc-Si:H between the TFTs and to isolate them electrically from each other.The electrical characteristics of both types of nc-Si:H TFTs were similar to a-Si:H based TFTs. Nevertheless, some significant differences were observed in the characteristics of the two types of samples. The increasing of the off-current in the simplified structure was eliminated by the n+ layer in the second type of samples. This led to the improving of the on/off ratio. The n+ layer also eliminated current crowding of the output characteristics. On the other hand, the subthreshold slope, the threshold voltage and the density of states were slightly deteriorated in the samples with incorporated n+ layer. Surface states created by the dry etching could be a possible reason. Other cause could be a bad quality of the nc-Si:H/SiO2 interface. The TFTs with incorporated n+ contact layer and electrically separated on the wafer were used in the further studies of stability and device modelling.The nc-Si:H TFTs were submitted under prolonged positive and negative gate bias stress in order to study their stability. We studied the influence of the stressing time and voltage on the transfer characteristics, threshold voltage, activation energy and density of states. The threshold voltage increased under positive gate bias stress and decreased under negative gate bias stress. After both positive and negative stresses, the threshold voltage recovered its initial values without annealing. This behaviour indicated that temporary charge trapping in the channel/gate insulator interface is the responsible process for the device performance under stress. Measurements of space-charge limited current confirmed that bulk states were not affected by the positive nor by negative stress.Analysis of the activation energy and the density of states gave more detailed information about the physical processes taking place during the stress. Typical drawback of the nc-Si:H films grown by HWCVD with tungsten (W) filament is the bad quality of the bottom, initially grown, interfacial layer. It is normally amorphous and porous. We assume that this property of the nc-Si:H film is determining for charge trapping and the consecutive temporary changes of the TFT's characteristics. On the other hand, the absence of defect-state creation during the gate bias stress demonstrates that the nc-Si:H films did not suffer degradation under the applied stress conditions. The electrical characteristics and the operational regimes of the nc-Si:H TFTs were studied in details in order to obtain the best possible fit using the Spice models for a-Si:H and poly-Si TFTs existing until now. The analysis of the transconductance gm showed behaviour typical for a-Si:H TFTs at low gate voltages. In contrast, at high gate voltages unexpected increasing of gm was observed, as in poly-Si TFTs. Therefore, it was impossible to fit the transfer and output characteristics with the a-Si:H TFT model neither with poly-Si TFT model.We performed numerical simulations using the Silvaco's Atlas simulator of semiconductor devices in order to understand the physical parameters, responsible for the device behaviour. The simulations showed that the reason for this behaviour is the density of acceptor-like states, which situates the properties of nc-Si:H TFTs between the amorphous and the polycrystalline transistors. Taking into account this result, we performed analysis of the concentrations of the free and the trapped carriers in nc-Si:H layer. It was found that nc-Si:H operates in transitional regime between above-threshold and crystalline-like regimes. This transitional regime was predicted earlier, but not experimentally observed until now. Finally, we introduced new equations and three new parameters into the existing a-Si TFTs model in order to account for the transitional regime. The new proposed model permits the shapes of the transconductance, the transfer and the output characteristics to be modelled accurately.

Magister Scientiae - MSc / Amorphous silicon nitride (a-SiN:H) thin films has a multitude of applications, stemming from the tunability of the material properties. Plasma enhanced chemical vapour deposition (PECVD) is the industrial workhorse for production of device quality a-SiN:H. However, this technique has drawbacks in terms of film quality, rooting from ion bombardment, which then results in undesirable oxidation. Hot wire chemical vapour deposition (HWCVD) has shown to be a viable competitor to its more costly counterpart, PECVD. A thin film produced by HWCVD lacks ion bombardment due to the deposition taking place in the absence of plasma. This study will focus on optimising the MVsystems ® HWCVD chamber at The University of the Western Cape, for production of device quality a-SiN:H thin films at low processing parameters. The effect of these parameters on the structural, optical and morphological properties was investigated, for reduction of production costs. The films were probed by heavy ion elastic recoil detection, energy dispersive spectroscopy, Fourier transform infrared spectroscopy, atomic force microscopy, Xray diffraction, and ultraviolet visible spectroscopy. It was shown that silicon rich, device quality a-SiN:H thin films could be produced by HWCVD at wire temperatures as low as 1400 °C and the films showed considerable resistance to oxidation in the bulk.

Magister Scientiae - MSc / Technological advancement has created a market for large area electronics such as solar cells and thin film transistors (TFT’s). Such devices now play an important role in modern society. Various types of conducting, semiconducting and insulating thin films of the order of hundreds, or even tens of nanometres are combined in strata to form stacks to create interactions and phenomena that can be exploited and employed in these devices for the benefit of mankind. One such is for the generation of energy via photovoltaic devices that use thin film technology; these are known as second and third generation solar cells. Silicon and its alloys such as silicon germanium (SiGex), silicon oxide (SiOx), silicon carbide (SiCx) and silicon nitride (SiNx) play an important role in these devices due to the fact that each material in its different structures, whether amorphous, micro or nano-crystalline or completely crystalline, has its own range of unique optical, mechanical and electrical properties. These structures and their material properties can thus exert a huge influence over the overall device performance. viii Chemical vapour deposition (CVD) techniques are most widely used in industry to obtain thin films of silicon and silicon alloys. Source gases are decomposed by the external provision of energy thereby allowing for the growth of a thin solid film on a substrate. In this study a variant of CVD, namely Hot Wire Chemical Vapour Deposition (HWCVD) will be used to deposit thin films of silicon nitride by the decomposition of silane (SiH4), hydrogen (H2) and ammonia (NH3) on a hot tantalum filament (~1600 C). Hydrogenated amorphous silicon nitride (a-SiNx:H) has great potential for application in optoelectronic devices. In commercial solar cell production its potential for use as anti-reflection coatings are due to its intermediate refractive index combined with low light absorption. An additional benefit is the passivation of interface and crystal defects due to the bonded hydrogen. This can lead to better photon conversion efficiency. Its optical properties including optical band gap, Urbach tail, and wavelength-dependent optical constants such as absorption coefficient and refractive index are crucial for the design and application in the relevant optoelectronic device. The final firing step in the production of micro-crystalline silicon solar cells, allows hydrogen to effuse into the solar cell from the a-SiNx:H, and drives bulk passivation of the grain boundaries. We therefore propose the exploration of annealing effects on the thin film structure. The study undertakes a comparison of optical and bonding structure of the as deposited thin film compared to that of the annealed thin film which would have undergone changes due to high temperature annealing under vacuum. However, it is difficult to simultaneously obtain all of these important ix optical parameters for a-SiNx:H thin films. Ultraviolet visible (UV-vis) spectroscopy will be the method of choice to investigate the optical properties. Infrared (IR) spectroscopy is a source of useful information on the microstructure of the material. In particular, the local atomic bonding configurations involving Si, N, and H atoms in a-SiNx:H films can be obtained by Fourier Transform Infrared Spectroscopy (FTIR). Therefore, this study will attempt to establish a relationship between film microstructure of a-SiNx:H thin films and their macroscopic optical properties.

Magister Scientiae - MSc (Physics) / An increasing energy demand and growing environmental concerns regarding the use of fossil fuels in South Africa has led to the challenge to explore cheap, alternative sources of energy. The generation of electricity from Photovoltaic (PV) devices such as solar cells is currently seen as a viable alternative source of clean energy. As such, crystalline, amorphous and nanocrystalline silicon thin films are expected to play increasingly important roles as economically viable materials for PV development. Despite the growing interest shown in these materials, challenges such as the partial understanding of standardized measurement protocols, and the relationship between the structure and optoelectronic properties still need to be overcome.