Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. RF~MEMS switches are characterized by their high isolation, low insertion loss, large bandwidth and by their unparalleled signal linearity. They are relatively simple to control, are very small and have almost zero power consumption. Despite these benefits, RF~MEMS switches are not yet seen in commercial products because of reliability issues, limits in signal power handling and questions in packaging and integration. Also, the actuation voltages are typically too high for electronics applications and require additional drive circuitry. This thesis presents a novel MEMS switch concept based on an S-shaped film actuator, which consists of a thin and flexible membrane rolling between a top and a bottom electrode. The special design makes it possible to have high RF isolation due to the large contact distance in the off-state, while maintaining low operation voltages due to the zipper-like movement of the electrostatic dual-actuator. The switch comprises two separately fabricated parts which allows simple integration even with RF circuits incompatible with certain MEMS fabrication processes. The two parts are assembled by chip or wafer bonding which results in an encapsulated, ready-to-dice package. The thesis discusses the concept of the switch and reports on the successful fabrication and evaluation of prototype devices. Furthermore, this thesis presents research results in wafer-level packaging of (RF) MEMS devices by full-wafer bonding with an adhesive intermediate layer, which is structured before bonding to create defined cavities for housing MEMS devices. This technique has the advantage of simple, robust and low temperature fabrication, and is highly tolerant to surface non-uniformities and particles in the bonding interface. It allows cavities with a height of up to many tens of micrometers to be created directly in the bonding interface. In contrast to conventional wafer-level packaging methods with individual chip-capping, the encapsulation is done using a single wafer-bonding step. The thesis investigates the process parameters for patterned adhesive wafer bonding with benzocyclobutene, describes the fabrication of glass lid packages based on this technique, and introduces a method to create through-wafer electrical interconnections in glass substrates by a two-step etch technique, involving powder-blasting and chemical etching. Also, it discusses a technique of improving the hermetic properties of adhesive bonded structures by additional passivation layers. Finally, it presents a method to substantially improve the bond strength of patterned adhesive bonding by using the solid/liquid phase combination of a patterned polymer layer with a contact-printed thin adhesive film. / QC 20100617

Made available in DSpace on 2014-07-29T15:08:14Z (GMT). No. of bitstreams: 1 Eric Nery Chaves.pdf: 1402393 bytes, checksum: eb28c97ecabfcf07a31c7bf35ab01e85 (MD5) Previous issue date: 2010-06-17 / This work presents the application of control techniques to drive single-phase induction motors with the aim of improving the performance of cooling systems. The control system is based on Fuzzy Logic and is applied to a three-phase PWM inverter adapted to drive singlephase motors with volts per hertz technique. The main feature of the work is to control the temperature of the cooling system driven by a hermetic compressor using variable speed. A commercial milk cooling system is used to obtain the results. / O presente trabalho demonstra os efeitos da aplicação de técnicas de controle em acionamento de motores de indução monofásicos, visando à melhoria do desempenho e eficiência energética, no local onde esses motores são aplicados. O trabalho em questão trata de um sistema que engloba um controlador de temperatura baseado em Lógica Fuzzy ou Nebulosa e um conversor de frequência trifásico, chaveado no modo PWM (modulação por largura de pulsos na sigla em inglês) senoidal, com controle escalar do tipo V/f (tensão proporcional à frequência) e adaptado para utilização em motores de indução monofásicos. O objetivo geral deste trabalho é o projeto e implementação de um sistema de controle de temperatura Fuzzy, com acionamento do compressor hermético em regime de velocidade variável. Também chamado de VCC (compressor de capacidade variável na sigla em inglês) - pois a capacidade é diretamente proporcional à velocidade - a estratégia de controle, a partir do acionamento do motor monofásico em regime de velocidade variável, será aplicada a um sistema de refrigeração que simula um tanque de resfriamento de leite e atenderá às Instruções Normativas nº 51 e nº 53, do Ministério da Agricultura, Pecuária e Abastecimento.

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Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. 3D integration of NEMS and ICs also contributes to more compact device footprints, improves device performance, and lowers the power consumption. Therefore, 3D integration of NEMS and ICs has been proposed as a promising solution to the end of Moore’s law, i.e. the slowing advancement of complementary metal-oxide-semiconductor (CMOS) technology.In this Ph.D. thesis, I propose a comprehensive fabrication methodology for heterogeneous 3D integration of NEM devices directly on top of CMOS circuits. In heterogeneous integration, the NEMS and CMOS components are fully or partially fabricated on separate substrates and subsequently merged into one. This enables process flexibility for the NEMS components while maintaining full compatibility with standard CMOS fabrication. The first part of this thesis presents an adhesive wafer bonding method using ultra-thin intermediate bonding layers which is utilized for merging the NEMS components with the CMOS substrate. In the second part, a novel NEM switch concept is introduced and the performance of CMOS-integrated NEM switch circuits for logic and computation applications is discussed. The third part examines two different packaging approaches for integrated MEMS and NEMS devices with either hermetic vacuum cavities or low-cost glass lids for optical applications. Finally, a novel fabrication approach for through silicon vias (TSVs) by magnetic assembly is presented, which is used to establish an electrical connection from the packaged devices to the outside world. / Tredimensionell (3D) integration av mikro- och nano-elektromekaniska system (MEMS/NEMS) med integrerade kretsar (ICs) är en ny teknik som erbjuder stora fördelar jämfört med konventionell mikroelektronik. MEMS och NEMS används oftast som sensorer och aktuatorer då de möjliggör många funktioner som inte kan uppnås med vanliga ICs.3D-integration av NEMS och ICs bidrar även till mindre dimensioner, ökade prestanda och mindre energiförbrukning av elektriska komponenter. Den nuvarande tekniken för complementary metal-oxide-semicondictor (CMOS) närmar sig de fundamentala gränserna vilket drastiskt begränsar utvecklingsmöjligheten för mikroelektronik och medför slutet på Moores lag. Därför har 3D-integration identifierats som en lovande teknik för att kunna driva vidare utvecklingen för framtidens elektriska komponenter.I denna avhandling framläggs en omfattande fabrikationsmetodik för heterogen 3D-integration av NEMS ovanpå CMOS-kretsar. Heterogen integration betyder att både NEMS- och CMOS-komponenter byggs på separata substrat för att sedan förenas på ett enda substrat. Denna teknik tillåter full processfrihet för tillverkning av NEMS-komponenter och garanterar kompatibilitet med standardiserade CMOS-fabrikationsprocesser.I den första delen av avhandlingen beskrivs en metod för att sammanfoga två halvledarskivor med en extremt tunn adhesiv polymer. Denna metod demonstreras för 3D-integration av NEMS- och CMOS-komponenter. Den andra delen introducerar ett nytt koncept för NEM-switchar och dess användning i NEM-switch-baserade mikrodatorchip. Den tredje delen presenterar två olika inkapslingsmetoder för MEMS och NEMS. Den ena metoden fokuserar på hermetisk vakuuminkapsling medan den andra metoden beskriver en lågkostnadsstrategi för inkapsling av optiska komponenter. Slutligen i den fjärde delen presenteras en ny fabrikationsteknik för så kallade ”through silicon vias” (TSVs) baserad på magnetisk självmontering av nickeltråd på mikrometerskala. / <p>20170519</p>

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L'élaboration de composites à matrice céramique denses et à fibres continues multidirectionnelles par de nouveaux procédés hybrides a été étudiée. Les procédés développés reposent sur le dépôt d'interphases autour des fibres par Infiltration Chimique en phase Vapeur (CVI) puis sur l'introduction de poudres céramiques au sein de préformes fibreuses par infusion de suspensions aqueuses colloïdales concentrées et stables, et enfin sur la consolidation des préformes soit par frittage flash, soit par imprégnation réactive de métaux liquides.La consolidation des composites par frittage flash est très rapide (palier de maintien en température inférieure à 5 minutes) et permet d'obtenir des composites denses. Durant le frittage, la dégradation des fibres de carbone a pu être évitée en adaptant le cycle de pression afin de limiter l'évolution des gaz au sein du système.La densification totale des composites par imprégnation de métaux liquides a été obtenue en contrôlant attentivement les paramètres d'imprégnation afin d'éviter de piéger des espèces gazeuses au sein des préformes fibreuses.Les composites à fibres de carbone consolidés par frittage flash ou par imprégnation réactive de métaux liquide possèdent un comportement mécanique de type élastique endommageable ainsi qu'une contrainte à rupture en flexion voisine de 300 MPa. Ces composites ont montré leur capacité à s'autocicatriser dans des conditions oxydantes. Comparés aux composites à matrice céramiques élaborés par CVI, les composites densifiés par imprégnation de métaux liquide sont eux parfaitement denses et ont un comportement mécanique en traction à température ambiante similaire avec notamment une contrainte à rupture en traction de 220 MPa. / The fabrication of multidirectional continuous carbon fibers reinforced dense self healing Ceramic Matrix Composites by new short time hybrid processes was studied. The processes developed are based, first, on the deposition of fiber interphase and coating by chemical vapor infiltration, next, on the introduction of ceramic powders into the fibrous preform by Slurry Impregnation and, finally, on the densification of the composite by liquid-phase Spark Plasma Sintering (SPS) or by Reactive Melt Infiltration of silicon (RMI).The homogeneous introduction of the ceramic particles into the multidirectional fiber preforms was realized by slurry impregnation from highly concentrated (> 32 %vol.) and well dispersed aqueous colloid suspensions. The densification of the composites by spark plasma sintering was possible with a short (< 5 minutes) dwelling period in temperature. The chemical degradation of the carbon fibers during the fabrication was prevented by adapting the sintering pressure cycle to inhibit gas evolution inside the system. The composites elaborated are dense. The fully densification of the composites by RMI was realised by carefully controlling the impregnation parameters to avoid to entrap some gaseous species inside the fiber preforms. Our carbon fiber reinforced ceramic matrix composites processed by Spark Plasma Sintering or Reactive Melt Infiltration have a damageable mechanical behaviour with a room temperature bending stress at failure around 300 MPa and have shown their ability to self-healing in oxidizing conditions. Compared to the CMC processed by CVI, the composites processed with a final consolidation step by RMI are fully dense and have a similar room temperature tensile test behaviour with an ultimate tensile stress around 220 MPa.