The scaling down of Complementary Metal Oxide Semiconductor (CMOS) transistors to sub-100nm requires replacement of conventional Silicon dioxide layer with high dielectric constant (K) material for gate dielectric. Among the various high-K dielectrics that have been studied, HfO2 is found to be a promising candidate because of its high dielectric constant (~25), large band gap (5.68 eV), thermodynamic stability and good interface with Si. The HfO2 films have already been deposited using different growth techniques such as Atomic layer Deposition (ALD), Metalorgonic Chemical Vapor Deposition (MOCVD) and Pulsed Laser Deposition (PLD). Ion Assisted Deposition (IAD) is a novel technique that has been successfully employed to produce optical coatings of required quality. This growth technique presents many advantages over the other techniques such as formation from solid oxide sources, low growth temperatures (25-3000C) and film densification by ion bombardment. Hence this technique has been used to prepare HfO2 films in the present investigations. This thesis presents the structural, optical and electrical properties of HfO2 thin films prepared by Ion assisted deposition (IAD). The suitability of Ion assisted deposition process and the importance of investigations on the influence of process parameters on the film characteristics have been brought out in the process parameters-structure-composition and properties correlation presented in this thesis. The aim of this work is to process and characterize HfO2 films and investigate the influence of process parameters on the structure, composition and properties of the films to identify their suitability for CMOS gate applications. HfO2 films were deposited on p-type Si (100) wafers by Ion assisted deposition in an electron beam evaporation (Leybold,L-560) system. Pre-bombardment of the substrates with Argon ions has been done to remove any native oxide layer formation on Silicon by using a hallow cathode ion source (DENTON VACUUM CC103). During the film deposition a collimated oxygen ion beam, generated from the ion source is directed towards the substrate. The oxygen ion current is controlled by adjusting the voltage applied to the ion source and the oxygen flow through the ion source. The oxygen ions bombard the film as it grows and in that process improves its packing density as well as its stoichiometry. Keeping the deposition rate and thickness constant, HfO2 films have been deposited by varying Ion Current, Ion energy and substrate temperature. MOS capacitors were fabricated with Aluminum as gate electrode deposited by thermal evaporation. Ellipsometry techniques have been used to measure the optical thickness of the films. The interfacial layer (IL) formed at the HfO2/ Si interface was investigated by using Fourier transform Infrared spectroscopy (FT-IR). The structural characterization was carried out by X-ray diffraction technique. The high frequency capacitance-voltage and DC leakage current characteristics were measured to analyze the electrical characteristics of MOS capacitors. The effect of post deposition annealing (PDA) of the films at 600°C and 700ºC in Forming Gas (15%H2+85%N2) ambient and Post metallization annealing (PMA) at 400ºC in the same ambient was also investigated to observe the changes in electrical characteristics. The initial step of this work was to compare the characteristics of the films deposited by reactive evaporation and Ion assisted deposition which confirmed the superiority of the quality of IAD coatings and justified the need to proceed further with a more detailed study on the influence of various parameters on the properties of IAD coatings. HfO2 films deposited on substrates maintained at 1000C exhibited better structural, Optical and Electrical properties. The leakage current in these films were lower which has been attributed to silicate free interface as confirmed by XRD studies. Investigations on films deposited with oxygen ion beams of different currents in the range 20 to 40mA indicated that the films deposited at 20mA ion current showed better electrical properties. Better stoichiometry of these films as indicated by FT IR studies was one of the reasons for their improved performance. Annealing of these films at 6000C and 7000C in FGA medium resulted in creation of silicates and silicides at the interface thereby increasing the leakage currents and degraded the film properties. The films deposited with oxygen ion beams generated with a driving voltage 265V showed better structural and optical properties with silicate free interface compared with low and high driving voltages. Among all the films, the maximum dielectric constant of about 21.9 with a minimum EOT of 5.5 nm corresponding to a film deposited at ion current 20mA with PMA 400°C in FG ambient for 20minites is achieved. The lowest value of interface charge density achieved is 2.7 x1012 per cm-2 eV-1 corresponding to the sample deposited at substrate temperature 100°C with deposition rate of 0.5Å/sec followed by post metallization annealing at 400°C in forming gas for 20minutes. The range of Dit values that were obtained are varying from 2.7x 1012 – 16.7x1012 cm-2eV-1.It was also found that, the samples deposited at higher ion currents show lower Dit values than the samples deposited at lower ion currents. From the I−V analysis, the leakage current density is found to be comparatively less in IAD than in reactive evaporation. Leakage current increases with increase in substrate temperature and the same trend is observed with annealed films also. The lowest leakage current density of 1.05x10–8 A/cm2 at a gate bias of 1V was observed in the films deposited at substrate temperature 1000C. The present thesis focused on the suitability of the Ion Assisted deposition process for the preparation of HfO2 films for high-K gate dielectric application and the importance of investigations on the influence of process parameters on the film characteristics.

In the thesis CuPc thin films were investigated by (in situ) SE and RAS, which are employed to determine the out-of-plane and in-plane optical anisotropy and molecular orientation, respectively. CuPc is a promising candidate of organic semiconductors used in organic field effect transistors, organic light emitting diodes and organic solar cells. Vicinal Si(111) substrates are interesting due to the in-plane anisotropy caused by the steps and terraces on the surface. The strength of in-plane anisotropy of vicinal Si(111) is dependent on the offcut angle. The influence of offcut angle on out-of-plane and in-plane molecular orientation in CuPc thin films is explored. The in situ investigation of CuPc films suggests that structural changes occur during film growth. In addition, two different surface modification layers were utilized to examine the effect on CuPc molecular orientation: OTS monolayer with upright standing molecules and PTCDA layers with flat lying molecules. Metal-organic interface plays an important role in organic electronic devices. In-CuPc is chosen to be an example system investigated employing in situ SE and RAS. When In was thermally evaporated onto CuPc film, In atoms firstly diffuse into the CuPc film underneath and then aggregate to form clusters on top. Hafnium dioxide (HfO2) is currently a hot topic to replace the conventionally used SiO2 as gate dielectrics in order to minimize leakage current when further scaling down microelectronic devices. Since HfO2 films are often crystalline, in order to obtain amorphous films which are beneficial to minimize leakage current, aluminum oxide (Al2O3) (k value: 9) which stays amorphous at much higher temperatures are combined to overcome this difficulty. Two series of ultra-thin samples were deposited by atomic layer deposition: mixed layers HfxAl1-xOz and bilayers HfO2 on Al2O3. Optical constants and bandgap are determined using SE in the energy range of 0.7-10 eV. It is found that the (effective) optical bandgap of both mixed layer and bilayer structures can be tuned by the film composition. Aging effect of high-k films was observed after storage of samples in air for two months, which is attributed to further oxidation of the dielectric films caused by the oxygen diffusion from ambient air to high-k films. / In dieser Arbeit werden dünne Schichten aus Kupferphthalozyanin (CuPc) mittels spektroskopischer (in-situ) Ellipsometrie (SE) und (in-situ) Reflektions-Anisotropie-Spektroskopie (RAS) untersucht, um die optische Anisotropie in einer Ebene parallel und senkrecht zur Schichtoberfläche und die molekulare Orientierung zu bestimmen. CuPc ist ein aussichtsreicher Kandidat als organischer Halbleiter in organischen Feldeffekt-Transistoren, organischen Leuchtdioden und organischen Solarzellen. Vizinale Si(111)-Substrate sind wegen der Anisotropie in der Substratebene interessant, die durch die Treppen und Terrassen auf der Oberfläche verursacht wird. Die Stärke der Anisotropie der vizinalen Si(111)-Oberfläche ist vom Schnittwinkel (Offcut) abhängig. Es wird der Einfluss des Offcut-Winkels auf die molekulare Orientierung in dünnen CuPc-Schichten parallel und senkrecht zur Substratoberfläche untersucht. Die in-situ Untersuchungen von CuPc-Schichten weisen darauf hin, dass strukturelle Veränderungen beim Wachstum auftreten. Darüber hinaus wurden zwei unterschiedliche Oberflächenmodifizierungsschichten, um deren Wirkung auf die molekulare Orientierung von CuPc zu untersuchen, verwendet: eine OTS-Monoschicht mit aufrecht stehenden Molekülen und PTCDA-Schichten mit flach liegenden Molekülen. Metall-organische Grenzflächen spielen eine wichtige Rolle in organischen elektronischen Bauelementen. In-CuPc wird als Beispiel für ein Metall-organisches System durch in-situ SE und RAS untersucht. Wenn In thermisch auf eine CuPc-Schicht aufgedampft wird, diffundieren In-Atome zunächst in die darunterliegende CuPc-Schicht und bilden dann Cluster auf der Schicht. Hafniumdioxid (HfO2) ist ein heißer Kandidat für das Ersetzen des herkömmlich als Gate-Dielektrikum verwendeten SiO2 mit dem Ziel, die Leckströme bei der weiteren Verkleinerung mikroelektronischer Bauelemente zu minimieren. Um amorphe Schichten, die vorteilhaft zur Minimierung der Leckströme sind, zu erhalten, werden die HfO2-Schichten, die oft kristallin sind, mit Aluminiumoxid (Al2O3) (k-Wert: 9) kombiniert, das bei wesentlich höheren Temperaturen amorph bleibt. Zwei Serien von ultra-dünnen Proben wurden durch Atomlagenabscheidung hergestellt: Mischschichten HfxAl1-xOz und Doppelschichten HfO2 auf Al2O3. Die optischen Konstanten und Bandlücken wurden mittels SE im Energiebereich von 0,7 bis 10 eV bestimmt. Es hat sich gezeigt, dass die (effektive) Bandlücke der Misch- und Doppelschichten durch die Komposition abgestimmt werden kann. Nach Lagerung der High-k-Schichten für zwei Monate an Luft konnte ein Alterungseffekt beobachtet werden. Dieser wird auf die weitere Oxidation der dielektrischen Schichten, die durch Sauerstoffdiffusion aus der Umgebungsluft in die High-k-Schichten ermöglicht wird, zurückgeführt.

In the thesis CuPc thin films were investigated by (in situ) SE and RAS, which are employed to determine the out-of-plane and in-plane optical anisotropy and molecular orientation, respectively. CuPc is a promising candidate of organic semiconductors used in organic field effect transistors, organic light emitting diodes and organic solar cells. Vicinal Si(111) substrates are interesting due to the in-plane anisotropy caused by the steps and terraces on the surface. The strength of in-plane anisotropy of vicinal Si(111) is dependent on the offcut angle. The influence of offcut angle on out-of-plane and in-plane molecular orientation in CuPc thin films is explored. The in situ investigation of CuPc films suggests that structural changes occur during film growth. In addition, two different surface modification layers were utilized to examine the effect on CuPc molecular orientation: OTS monolayer with upright standing molecules and PTCDA layers with flat lying molecules. Metal-organic interface plays an important role in organic electronic devices. In-CuPc is chosen to be an example system investigated employing in situ SE and RAS. When In was thermally evaporated onto CuPc film, In atoms firstly diffuse into the CuPc film underneath and then aggregate to form clusters on top. Hafnium dioxide (HfO2) is currently a hot topic to replace the conventionally used SiO2 as gate dielectrics in order to minimize leakage current when further scaling down microelectronic devices. Since HfO2 films are often crystalline, in order to obtain amorphous films which are beneficial to minimize leakage current, aluminum oxide (Al2O3) (k value: 9) which stays amorphous at much higher temperatures are combined to overcome this difficulty. Two series of ultra-thin samples were deposited by atomic layer deposition: mixed layers HfxAl1-xOz and bilayers HfO2 on Al2O3. Optical constants and bandgap are determined using SE in the energy range of 0.7-10 eV. It is found that the (effective) optical bandgap of both mixed layer and bilayer structures can be tuned by the film composition. Aging effect of high-k films was observed after storage of samples in air for two months, which is attributed to further oxidation of the dielectric films caused by the oxygen diffusion from ambient air to high-k films. / In dieser Arbeit werden dünne Schichten aus Kupferphthalozyanin (CuPc) mittels spektroskopischer (in-situ) Ellipsometrie (SE) und (in-situ) Reflektions-Anisotropie-Spektroskopie (RAS) untersucht, um die optische Anisotropie in einer Ebene parallel und senkrecht zur Schichtoberfläche und die molekulare Orientierung zu bestimmen. CuPc ist ein aussichtsreicher Kandidat als organischer Halbleiter in organischen Feldeffekt-Transistoren, organischen Leuchtdioden und organischen Solarzellen. Vizinale Si(111)-Substrate sind wegen der Anisotropie in der Substratebene interessant, die durch die Treppen und Terrassen auf der Oberfläche verursacht wird. Die Stärke der Anisotropie der vizinalen Si(111)-Oberfläche ist vom Schnittwinkel (Offcut) abhängig. Es wird der Einfluss des Offcut-Winkels auf die molekulare Orientierung in dünnen CuPc-Schichten parallel und senkrecht zur Substratoberfläche untersucht. Die in-situ Untersuchungen von CuPc-Schichten weisen darauf hin, dass strukturelle Veränderungen beim Wachstum auftreten. Darüber hinaus wurden zwei unterschiedliche Oberflächenmodifizierungsschichten, um deren Wirkung auf die molekulare Orientierung von CuPc zu untersuchen, verwendet: eine OTS-Monoschicht mit aufrecht stehenden Molekülen und PTCDA-Schichten mit flach liegenden Molekülen. Metall-organische Grenzflächen spielen eine wichtige Rolle in organischen elektronischen Bauelementen. In-CuPc wird als Beispiel für ein Metall-organisches System durch in-situ SE und RAS untersucht. Wenn In thermisch auf eine CuPc-Schicht aufgedampft wird, diffundieren In-Atome zunächst in die darunterliegende CuPc-Schicht und bilden dann Cluster auf der Schicht. Hafniumdioxid (HfO2) ist ein heißer Kandidat für das Ersetzen des herkömmlich als Gate-Dielektrikum verwendeten SiO2 mit dem Ziel, die Leckströme bei der weiteren Verkleinerung mikroelektronischer Bauelemente zu minimieren. Um amorphe Schichten, die vorteilhaft zur Minimierung der Leckströme sind, zu erhalten, werden die HfO2-Schichten, die oft kristallin sind, mit Aluminiumoxid (Al2O3) (k-Wert: 9) kombiniert, das bei wesentlich höheren Temperaturen amorph bleibt. Zwei Serien von ultra-dünnen Proben wurden durch Atomlagenabscheidung hergestellt: Mischschichten HfxAl1-xOz und Doppelschichten HfO2 auf Al2O3. Die optischen Konstanten und Bandlücken wurden mittels SE im Energiebereich von 0,7 bis 10 eV bestimmt. Es hat sich gezeigt, dass die (effektive) Bandlücke der Misch- und Doppelschichten durch die Komposition abgestimmt werden kann. Nach Lagerung der High-k-Schichten für zwei Monate an Luft konnte ein Alterungseffekt beobachtet werden. Dieser wird auf die weitere Oxidation der dielektrischen Schichten, die durch Sauerstoffdiffusion aus der Umgebungsluft in die High-k-Schichten ermöglicht wird, zurückgeführt.

Στη παρούσα Διατριβή διερευνήθηκε η χρήση υλικών υψηλής διηλεκτρικής σταθεράς (high-k) ως οξειδίων ελέγχου σε διατάξεις παγίδευσης φορτίου τύπου MONOS (Μetal-Οxide-Νitride-Οxide-Silicon). Τα οξείδια που εξετάστηκαν ήταν το HfO2, τo ZrO2 και το Al2O3. Η ανάπτυξή τους πραγματοποιήθηκε με χρήση της μεθόδου εναπόθεσης ατομικού στρώματος (ALD). Οι ιδιότητες των δομών μνήμης μελετήθηκαν συναρτήσει: (α) των πρόδρομων μορίων της εναπόθεσης για τα HfO2 και ZrO2, (β) του οξειδωτικού μέσου της εναπόθεσης για την περίπτωση του Al2O3 και (γ) της επακόλουθης ανόπτησης. Η ηλεκτρική συμπεριφορά των δομών εξετάστηκε με την κατασκευή πυκνωτών τύπου MOS. Τα υμένια του HfO2 αναπτύχθηκαν επί διστρωματικής στοίβας SiO2/Si3N4 με (α) αλκυλαμίδιο του χαφνίου (ΤΕΜΑΗ) και Ο3 στους 275 oC, και (β) κυκλοπενταδιενύλιο του χαφνίου (HfD-04) και Ο3 στους 350 οC. Ομοίως, τα υμένια του ZrO2 αναπτύχθηκαν επί διστρωματικής στοίβας SiO2/Si3N4 με: (α) αλκυλαμίδιο του ζιρκονίου (ΤΕΜΑΖ) και Ο3 στους 275 oC και (β) κυκλοπενταδιενύλιο του ζιρκονίου (ZrD-04) με Ο3 στους 350 oC. Ο δομικός χαρακτηρισμός, για το HfO2, φανέρωσε πως η ύπαρξη ή όχι κρυσταλλικού χαρακτήρα και η σύσταση του οξειδίου εξαρτάται τόσο από το πρόδρομο μόριο αλλά και από την ανόπτηση (600 οC, 2 min). Αντίθετα, το ZrO2 έχει σε κάθε περίπτωση κρυσταλλικότητα. Τα ηλεκτρικά χαρακτηριστικά των πυκνωτών Si/SiO2/Si3N4/high-k/Pt, δείχνουν ότι οι δομές έχουν ικανοποιητική συμπεριφορά ως στοιχεία μνήμης αφού όλες οι ιδιότητες πληρούν τις βασικές προϋποθέσεις ως στοιχεία μνήμης, παρά την ανυπαρξία ενεργειακού φραγμού μεταξύ στρώματος παγίδευσης και οξειδίου ελέγχου. Η ικανότητα παγίδευσης και η επίδοση των δομών με HfO2 και ZrO2 δεν διαφοροποιούνται σημαντικά με χρήση διαφορετικού πρόδρομου μορίου ή με την ανόπτηση. Ο έλεγχος όμως της αντοχής των δομών σε επαναλαμβανόμενους παλμούς εγγραφής/διαγραφής αναδεικνύει ότι αμφότερες οι δομές που ανεπτύχθησαν με βάση το κυκλοπενταδιενύλιο έχουν μειωμένη αντοχή ηλεκτρικής καταπόνησης. Τo Al2O3 αναπτύχθηκε χρησιμοποιώντας το μόριο ΤΜΑ και ως οξειδωτικό μέσο: (α) H2O, (β) O3 και (γ) Plasma Ο2 (μέθοδος PE-ALD) σε συνδυασμό με ΤΜΑ. Οι δομές στην αρχική κατάσταση, χωρίς ανόπτηση, χαρακτηρίζονται από ισχυρό ρεύμα έγχυσης ηλεκτρονίων από την πύλη (υπό αρνητικές τάσεις) περιορίζοντας την ικανότητα φόρτισης και την επίδοση διαγραφής. Η ανόπτηση σε φούρνο και αδρανές περιβάλλον (850 ή 1050 oC, 15 min) προκάλεσε σημαντική βελτίωση των ηλεκτρικών χαρακτηριστικών των δομών λόγω του σημαντικού περιορισμού του παραπάνω φαινομένου. Μετά το στάδιο της ανόπτησης οι συνδυασμοί ΤΜΑ/Η2Ο και ΤΜΑ/Plasma Ο2 έχουν καλύτερες χαρακτηριστικές σε σχέση με αυτές του συνδυασμού ΤΜΑ/Ο3. Το φαινόμενο της διαρροής ηλεκτρονίων από την πύλη αποδίδεται στη μεγάλη συγκέντρωση και χωρική κατανομή του υδρογόνου στο υμένιο υψηλής διηλεκτρικής σταθεράς. Τέλος, διερευνήθηκε η τροποποίηση των ιδιοτήτων μνήμης των δομών με εμφύτευση ιόντων αζώτου χαμηλής ενέργειας και υψηλής δόσης στο Al2O3 και επακόλουθη ανόπτηση υψηλής θερμοκρασίας. Η παρουσία αζώτου στο υμένιο καθώς και ο χημικός δεσμός του εμφυτευμένου αζώτου είναι συνάρτηση της θερμοκρασίας ανόπτησης. Επομένως, οι ιδιότητες μνήμης εξαρτώνται από τη μορφή σύνδεσης και την συγκέντρωση του εμφυτευμένου αζώτου στο τροποποιημένο Al2O3. Η υψηλή θερμοκρασία ανόπτησης (1050 οC, 15 min) φαίνεται να αποφέρει δομές με τις καλύτερες ιδιότητες μνήμης. / This thesis studies the functionality of high-k oxides as blocking oxide layers in SONOS type charge-trap memory devices. The oxide materials that were examined were the HfO2, the ZrO2 and the Al2O3. All these blocking oxide layers were deposited by atomic layer deposition technique (ALD). The electrical performance of the trilayer stacks was examined using Pt-gate MOS-type capacitors. The properties of the memory structures were examined as a function of: (a) precursor chemistry of HfO2 and ZrO2 deposition, (b) the deposition oxidizing agent in the case of Al2O3 and (c) subsequent high temperature annealing steps. The HfO2 films were deposited on SiO2/Si3N4 bilayer stacks using: (a) hafnium alkylamide (TEMAH) and O3 at 275 oC, and (b) hafnium cyclopentadienyl (HfD-04) and O3 at 350 oC. Similarly the ZrO2 films were deposited by (a) zirconium alkylamide (TEMAZ) and O3 at 275 oC, and (b) zirconium cyclopentadienyl (ZrD-04) and O3 at 350 oC The structural characterization of the HfO2 showed that the crystallinity of the deposited high-k material depends on the precursor choice and the post deposition annealing step (600 °C, 2 min). On the contrary ZrO2 is deposited in a crystalline phase independent of the deposition conditions and the choice of the precursors. The electrical characterization of Si/SiO2/Si3N4/high-k/Pt capacitors showed that all fabricated structures operate well as memory elements, despite the absence of an energy barrier between the trapping layer and control oxide. The trapping efficiency and the performance of structures with HfO2 or ZrO2 blocking layers do not revealed a dependence upon the precursor chemistry. However, endurance testing using continuous write/erase pulses showed that both structures deposited by cyclopentadienyl precursors cannot sustain the resulting electrical stress. The Al2O3 layers were deposited using the TMA molecule while three different oxidizing agents were used: (a) H2O, (b) O3 and (c) oxygen plasma. Electrical testing of the resulting Pt-gate trilayer capacitors showed that in the deposited condition all three samples were characterized by gate electrode induced electron leakage currents in the negative bias regime, which completely masked the substrate hole injection effects. This effect limits the performance and the functionality of the memory stacks. After a high temperature annealing step (850 or 1050 oC, 15 min) this leakage current is reduced significantly and the stacks can function as memory elements. The results point to suggest that after annealing the best performance is exhibited by the TMA/H2O and TMA/Plasma O2 samples. The effect of gate induced electron leakage current is attributed to hydrogen related contamination, which has been verified by ToF-ERDA in depth profile measurements, at least for the case of TMA/H2O samples. The modification of the memory properties of the SiO2/Si3N4/Al2O3 stacks was also investigated using low energy and high fluence nitrogen implantation into Al2O3 layer. The concentration and the chemical bonding of the implanted nitrogen is a function of annealing temperature. The memory properties of the stack depend therefore on the chemical bonding and the concentration of the remaining nitrogen in the modified Al2O3. The high temperature annealing (1050 oC, 15 min) appears to provide the structures with improved memory properties in terms of retention and fast erase performance.

Metal-insulator-metal (MIM) capacitors are used for analog, RF, and DRAM applications in ICs. The International Technology Roadmap for Semiconductors (ITRS) specifies continuing increase in capacitance density (> 7 fF/ m2), lower leakage current density (< 10 8 A/cm2), very low effective oxide thickness (EOT < 1 nm, for DRAM applications), and better capacitance density-voltage (C-V) linearity ( < 100 ppm/V2, for analog/RF applications). In addition, the maximum fabrication/processing temper-ature should not be greater than 400 0C, in order to be compatible with the thermal budget of back-end fabrication steps. Low dielectric constants of conventional SiO2 and Si3N4 capacitors limit the capacitance densities of these devices. Although scaling down of dielectric thickness increases the capacitance density, it results in large leakage current density and poor C-V linearity. In this work, the effects of high-k materials (Eu2O3, Gd2O3, TiO2) on the device performance of MIM capacitors are studied. The performance of multi-dielectric stack, and doped-dielectric stack devices are also investigated. The effects of anneal temperature, anneal ambient, anneal mode, and dielectric thickness on device performance are evaluated. C-V, current density-voltage (J-V), and reliability measurements are performed to benchmark the electrical performance, and this is correlated to the structural and material properties of the films through ellipsometry, scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS) measurements. High-performance MIM capacitors are fabricated by using (RF sputtered) Eu2O3 dielectric. The fabricated devices are subjected to different anneal conditions, to study their device performance. Forming gas (FG) and argon (Ar) annealed devices are shown to have higher capacitance densities (7 fF/ m2jF G), lower leakage current densities (3.2 10 8 A/cm2jAr at -1 V), and higher , compared to oxygen (O2) annealed de-vices ( 100kHz = 193 ppm/V2jO2). The electrical characterization results are correlated with the surface chemical states of the films through XPS measurements. The annealing ambient is shown to alter the surface chemical states, which, in turn, modulate the electrical characteristics. High-density MIM capacitors are fabricated by using (RF sputtered) Gd2O3, and Gd2O3-Eu2O3 stacked dielectrics. The fabricated Gd2O3 capacitors are also subjected to different anneal conditions, to study their device performance. Although Gd2O3 capacitors provide high capacitance density (15 fF/ m2), they suffer from high leakage current density, high , and poor reliability. Therefore, stacked dielectrics of Gd2O3 and Eu2O3 (Gd2O3/Eu2O3 and Eu2O3/Gd2O3) are fabricated to reduce leakage current density, improve , and improve reliability, with only a marginal reduction in capacitance density, compared to Gd2O3 capacitors. Density of defects and barrier/trap heights are extracted for the fabricated capacitors, and correlated with the device characteristics. High-performance MIM capacitors with bilayer dielectric stacks of (ALD-deposited) TiO2-ZrO2, and Si-doped ZrO2 are characterized. Devices with (ALD-deposited) TiO2/ ZrO2/TiO2 (TZT) and AlO-doped TZT stacks are also characterized. The influence of doping on the device performance is studied. The surface chemical states of the deposited films are analyzed by high-resolution XPS. The structural analysis of the samples is performed by XRD measurements, and this is correlated to the electrical characteristics of the devices. Reliability measurements are performed to study the effects of constant voltage and current stress on device performance. High capacitance density (> 45 fF/ m2), low leakage current density (< 5 10 8 A/cm2 at -1 V, for most devices), and sub-nm EOT are achieved. These parameters exceed the ITRS specifications for DRAM storage capacitors.