L’actualité des travaux de recherche dans le domaine des moteurs électriques repose en partie sur des machines utilisant des matériaux supraconducteurs. En effet, ces matériaux des caractéristiques intéressantes pour des applications à champ magnétique et courant élevés, en étant refroidis à très basse température, en général de 4 à 77K. Ce qui est un paramètre important pour développer des machines de fortes puissances avec un encombrement minimal. Nous proposons d’utiliser les caractéristiques de fort courant et fort champ magnétique des fils supraconducteurs ainsi que les capacités de blindage magnétique des supraconducteurs massifs pour le développement de moteurs supraconducteurs. Nous avons développé et réalisé les essais d’une machine synchrone supraconductrice de 250kW, à inducteur supraconducteur tournant. Nous continuons les travaux sur les machines supraconductrices à topologies originales, avec la modélisation 3D d’un nouvel inducteur, à pans coupés. Mais également par de nouveaux essais et développements de la machine à concentration de flux magnétique réalisée dans des travaux précédents / An important part of electrical machines research activities focus on superconducting motors. In fact, an important magnetic field and high current are possible with these materials, used at low temperature, generally 4 to 77K. These two parameters allow an interesting motor development, with higher electrical power and a minimal overcrowding. In front of high magnetic flux and high current superconducting caracteristics and bulk screening effect, we suggest several superconducting motors development. We developed and realized a 250kW synchronous superconducting motor, with a rotating superconducting inductor. Then, using 3D finite element software, we introduce an original superconducting inductor topology, nammed "pan coupé". Besides, we show new test and development of the magnetic flux concentration motor constructed 4 years ago

This thesis examines converter topologies suitable for Module Integrated Converters (MICs) in grid interactive photovoltaic (PV) systems, and makes a contribution to the development of the MIC topologies based on the two-inductor boost converter, which has received less research interest than other well known converters. The thesis provides a detailed analysis of the resonant two-inductor boost converter in the MIC implementations with intermediate constant DC links. Under variable frequency control, this converter is able to operate with a variable DC gain while maintaining the resonant condition. A similar study is also provided for the resonant two-inductor boost converter with the voltage clamp, which aims to increase the output voltage range while reducing the switch voltage stress. An operating point with minimized power loss can be also established under the fixed load condition. Both the hard-switched and the soft-switched current fed two-inductor boost converters are developed for the MIC implementations with unfolding stages. Nondissipative snubbers and a resonant transition gate drive circuit are respectively employed in the two converters to minimize the power loss. The simulation study of a frequency-changer-based two-inductor boost converter is also provided. This converter features a small non-polarised capacitor in a second phase output to provide the power balance in single phase inverter applications. Four magnetic integration solutions for the two-inductor boost converter have also been presented and they are promising in reducing the converter size and power loss.

Inductors are extensively used in the design of radio-frequency circuits. In the last decade, the integration of passive components, especially inductors on silicon chips, has led to the widespread development and implementation of Radio Frequency Integrated Circuits (RFICs) in CMOS technologies. However, on-chip passive inductors occupy a large silicon chip area and hardly scale down with technology scaling. Therefore, on-chip passive inductors become formidable obstacles to the realization of highly dense RFICs to be integrated with other highly dense digital circuits on a single chip using a common fabrication process. In recent years, researchers have focused on replacing passive inductors with transistor-only active circuits, namely active inductors. Active inductors can be realized with only a few transistors, which scale down with technology scaling. Therefore, they occupy a fraction of the chip area of their passive counterparts, and can be implemented densely in CMOS processes. Unlike passive inductors, bias dependent operations of active inductors allow for the tuning of their inductance and quality factor Q, and in turn, tuning the performance parameters of RFICs. This thesis focuses on the design and development of passive inductorless CMOS RFICs for ultra-wideband (UWB) receiver front-ends using active inductors. A new Q-enhanced and a new bandwidth-extended tunable active inductors are designed. Using the Q-enhanced active inductor, two tunable UWB low-noise amplifiers (LNAs) (two-stage and three-stage UWB LNAs), a UWB mixer and a wideband local-oscillator (LO) driver are designed. Active inductors are utilized to develop a novel wideband active shunt-peaking technique that decreases high-frequency losses to yield a flat gain over a wide bandwidth. A tunable multiband-UWB front-end integrating a two-stage UWB LNA, and a pair of UWB mixers driven by a pair of wideband LO drivers, is fabricated in a 90nm digital CMOS process. The passive inductorless two-stage UWB LNA, three-stage UWB LNA and UWB front-end occupy chip areas of only 0.0114mm2, 0.0227mm2, and 0.1485mm2, respectively. The active CMOS UWB front-end exhibits a measured flat gain of 22.5dB over 2.5-8.8 GHz bandwidth, and its tunability allows for varying the gain and bandwidth. / Integrated Circuits and Systems

Several fabrication techniques for surface micromachined 3-D structures have been developed for RF components. The fabrication techniques all have in common the use of epoxy patterning and subsequent metallization. Techniques and structures such as embedded conductors, epoxy-core conductors, a reverse-side exposure technique, a multi-exposure scheme, and inclined patterning are presented. The epoxy-core conductor technique makes it easy to fabricate high-aspect-ratio (10-20:1), tall (~1mm) RF subelements as well as potentially very complex structures by taking advantage of advanced epoxy processes. To demonstrate feasibility and usefulness of the developed fabrication techniques for RF applications, two test vehicles are employed. One is a solenoid type RF inductor, and the other is a millimeter wave radiating structure such as a W-band quarter-wavelength monopole antenna. The embedded inductor approach provides mechanical robustness and package compatibility as well as good electrical performance. An inductor with a peak Q-factor of 21 and an inductance of 2.6nH at 4.5GHz has been fabricated on a silicon substrate. In addition, successful integration with a CMOS power amplifier has been demonstrated. A high-aspect-ratio inductor fabricated using epoxy core conductors shows a maximum Q-factor of 84 and an inductance of 1.17nH at 2.6GHz on a glass substrate with a height of 900um and a single turn. Successful W-band monopole antenna fabrication is demonstrated. A monopole with a height of 800um shows its radiating resonance at 85GHz with a return loss of 16dB. In addition to the epoxy-based devices, an advanced tunable ferroelectric device architecture is introduced. This architecture enables a low-loss conductor device; a reduced intermodulation distortion (IMD) device; and a compact tunable LC module. A single-finger capacitor having a low-loss conductor with an electrode gap of 1.2um and an electrode thickness of 2.2um has been fabricated using a reverse-side exposure technique, showing a tunability of 33% at 10V. It shows an improved Q-factor of 21.5. Reduced IMD capacitors consist of wide RF gaps and narrowly spaced high resistivity electrodes with a gap of 2um and a width of 2um within the wide gap. A 14um gap and a 20um gap capacitor show improved IMD performance compared to a 4um gap capacitor by 6dB and 15dB, respectively, while the tunability is approximately 21% at 30V for all three devices due to the narrowly spaced multi-pair high resistivity DC electrodes within the gap. Finally, a compact tunable LC module is implemented by forming the narrow gap capacitor in an inductor shape. The resonance frequency of this device is variable as a function of DC bias and a frequency tunability of 1.1%/V is achieved. The RF components developed in this thesis illustrate the usefulness of the application of micromachining technology to this application area, especially as frequencies of operation of RF systems continue to increase (and therefore wavelengths continue to shrink).

Novel polymer-enhanced photodefined through-silicon via (TSV) and passive technologies have been demonstrated for silicon interposers to obtain compact heterogeneous computing and mixed-signal systems. These technologies include: (1) Polymer-clad TSVs with thick (~20 µm) liners to help reduce TSV losses and stress, and obtain optical TSVs in parallel for interposer-to-interposer long-distance communication; (2) Polymer-embedded vias with copper vias embedded in polymer wells to significantly reduce the TSV losses; (3) Coaxial vias in polymer wells to reduce the TSV losses with controlled impedance; (4) Antennas over polymer wells to attain a high radiation efficiency; and (5) High-Q inductors over polymer wells. Cleanroom fabrication and characterization of the technologies have been demonstrated. For the fabricated polymer-clad TSVs, resistance and synchrotron x-ray diffraction (XRD) measurements have been demonstrated. High-frequency measurements up to 170 GHz and time-domain measurements up to 10 Gbps have been demonstrated for the fabricated polymer-embedded vias. For the fabricated coaxial vias and inductors, high-frequency measurements up to 50 GHz have been demonstrated. Lastly, for the fabricated antennas, measurements in the W-band have been demonstrated.

No description available.

After nearly a decade of development, human-implantable sensors for detection of muscle activity have recently been demonstrated in the literature. The implantable sensors are powered and communicate wirelessly through the skin using coupled inductor coils. The focus of the present work has been the development of a new approach to modeling the inductively coupled link by using the finite element method (FEM) to simulate a three-dimensional representation of the coils and surrounding magnetic field. The validity of the simulation is tested by comparison to analytically-developed formulas for self-inductance, ac resistance and mutual inductance of the coils. Determination of these parameters is necessary for calculation of the coupling coefficient between the coils, and to fully define the lumped circuit model of the link. This 3D FEM approach is novel and attractive because it is able to encompass physical geometric parameters and material properties that have been traditionally been a challenge to determine. In particular the contribution of a ferrite-core, and the case of non-symmetrical relative coil positioning can be evaluated. / Graduate

With the advancement of biomedical instrumentation technologies sensor based remote healthcare monitoring system is gaining more attention day by day. In this system wearable and implantable sensors are placed outside or inside of the human body. Certain sensors are needed to be placed inside the human body to acquire the information on the vital physiological phenomena such as glucose, lactate, pH, oxygen, etc. These implantable sensors have associated circuits for sensor signal processing and data transmission. Powering the circuit is always a crucial design issue. Batteries cannot be used in implantable sensors which can come in contact with the blood resulting in serious health risks. An alternate approach is to supply power wirelessly for tether-less and battery- less operation of the circuits.Inductive power transfer is the most common method of wireless power transfer to the implantable sensors. For good inductive coupling, the inductors should have high inductance and high quality factor. But the physical dimensions of the implanted inductors cannot be large due to a number of biomedical constraints. Therefore, there is a need for small sized and high inductance, high quality factor inductors for implantable sensor applications. In this work, design of a multi-spiral solenoidal printed circuit board (PCB) inductor for biomedical application is presented. The targeted frequency for power transfer is 13.56 MHz which is within the license-free industrial, scientific and medical (ISM) band. A figure of merit based optimization technique has been utilized to optimize the PCB inductors. Similar principal is applied to design on-chip inductor which could be a potential solution for further miniaturization of the implantable system. For layered human tissue the optimum frequency of power transfer is 1 GHz for smaller coil size. For this reason, design and optimization of multi-spiral solenoidal integrated inductors for 1 GHz frequency is proposed. Finally, it is demonstrated that the proposed inductors exhibit a better overall performance in comparison with the conventional inductors for biomedical applications.

Thesis (MScEng)-- Stellenbosch University, 2013. / ENGLISH ABSTRACT: The objective of this project is to develop an electromagnetic model that can be used to accurately calculate the voltage distribution in a transformer winding structure when excited with standard impulse excitation waves. This voltage distribution is required during the design stage of a power transformer to ensure that the insulation is capable of withstanding the occurring electric field stresses during these tests. This study focuses on the modelling of a single disk-type power transformer winding without the presence of an iron-core. Methods of calculating self- and mutual-inductances of transformer windings are presented and validated by means of finite element method software simulations. The same is done for the calculation methods used for calculating the capacitances in and around the winding structure. The calculated and FEM-simulated results are compared to measured values as a final stage of validation. The methods used to calculate the various model parameters seem to produce results that agrees well with measured values. The non-linear frequency dependant dissipative nature of transformer windings is also investigated and a methodology to take this into account is proposed and implemented. The complete modelling methodology proposed in this thesis, which includes the calculation of the model parameters, model synthesis and solver algorithm, are applied to an actual case study. The case study is performed on an air-core reactor manufactured using a disk-type power transformer winding. The reactor is excited with standard lightning impulse waves and the voltages along the winding are measured. The calculated and measured voltage wave forms are compared in both the frequency and time-domain. From the comparison it is found that the model accurately represents the actual transient voltage response of the testunit for the frequency range of interest during standard factory acceptance tests. / AFRIKAANSE OPSOMMING: Die doel van hierdie projek is om 'n elektromagnetiese model te ontwikkel wat gebruik kan word om die spanningsverspreiding in 'n transformatorwindingstruktuur te bereken as standaard weerligimpulstoetse toegedien word. Hierdie spanningsverspreiding word vereis tydens die ontwerpstadium van ‘n kragtransformator om te verseker dat die isolasie in staat is om die elektriese veldsterkte tydens hierdie toetse te weerstaan. Hierdie studie fokus op die modelering van 'n enkele skyftipe-kragtransformatorwinding sonder die teenwoordigheid van 'n ysterkern. Metodes van berekening van self- n wedersydse-induktansie van transformatorwindings word aangebied en getoets deur middel van Eindige-Element-Metode (EEM) simulasies. Dieselfde word gedoen vir die metodes wat gebruik word vir die berekening van die kapasitansies in en rondom die windingstruktuur. Die berekende en EEM-gesimuleerde resultate word vergelyk met die gemeete waardes as 'n finale vlak van bekragtiging. Die metodes wat gebruik word om die verskillende modelparameters te bereken vergelyk goed met gemete waardes. Die nie-lineêre frekwensie-afhanklike verliese van transformatorwindings word ook ondersoek en 'n metode om hierdie in ag te neem is voorgestel en geïmplementeer. Die volledige voorgestelde modeleringsmetodiek in hierdie tesis, wat die berekening van die modelparameters, modelsintese en oplosingsalgoritme insluit word toegepas op 'n werklike gevallestudie. Die gevallestudie is uitgevoer op 'n lugkern-reaktor wat 'n skyftipe-kragtransformatorwinding. Die reaktor word onderwerp aan die standaard weerligimpuls golwe en die spanning al langs die winding word gemeet. Die berekende en gemete spanning golf vorms word met mekaar vergelyk in beide die frekwensie- en tyd-vlak. Uit die vergelyking blyk dit dat die model die werklike oorgangspanningsweergawe van die toetseenheid akkuraat verteenwoordig vir die frekwensie reeks van belang tydens standaard fabriekaanvaardingstoetse.

Les inductances et interconnexions des composants passifs intégrés pour la téléphonie mobile, sont sujettes à des défaillances dues à l’électromigration et l’auto-échauffement. L’électromigration n’est pas un risque majeur, au regard des grandes dimensions de cuivre de la technologie étudiée et de l’application. L’auto-échauffement est, en revanche, le principal phénomène qui limite le choix des dimensions des inductances et interconnexions lors de leurs conceptions.L’effet Joule pour les interconnexions et les inductances, a été étudié par le biais de caractérisations et de simulations électrothermiques. La méthodologie des plans d’expériences a été utilisée afin de modéliser le comportement électrothermique des inductances et des interconnexions. Un modèle prédictif de l’auto-échauffement en fonction des dimensions et de l’intensité, a été déterminé permettant d’étudier et de déterminer l’influence de chaque facteur dimensionnel, en régime continu. En radiofréquence, une méthodologie de mesure de l’auto-échauffement a été déterminée permettant sa caractérisation sur des composants sur plaquette. Une corrélation entre les régimes continus et alternatifs ne donnant pas de résultat concluant, une méthodologie de couplage faible, entre un simulateur électromagnétique et électrothermique a été effectuée, permettant la simulation du phénomène d’auto-échauffement sous contrainte radiofréquentielle. / Electrothermal and electromigration failure are likely to occur on copper inductor and interconnection in integrated passive devices for wireless telephony application. Electromigration is not a concern considering the high thickness of the copper and the application but the Joule heating is the main restriction on the dimensions during the component design. Joule heating on interconnections and inductors has been studied by electrothermal characterization and simulation. We have shown that Joule heating depends of several parameters such as material layers parameters and component dimensions. Design of experiments methodology has been used in order to model the inductor and interconnection electrothermal behavior. A self-heating predictive model has been determined allowing the study and the determination of dimensions impact in direct current.In radiofrequency, a self-heating measurement methodology has been determined allowing its characterization at wafer level. A correlation between direct current and radiofrequency is not satisfactory and a weak coupling between an electromagnetic and electrothermal simulator has been performed, providing the self-heating simulation under radiofrequency stress.