This thesis presents the design, implementation and fabrication for a 0.13μm interface to a capacitive MEMS accelerometer. By varying the number of amplifier slices used in concurrence based on different full scale input ranges, the analog circuitry power scales as the input range scales. Due to the oversampling nature of typical accelerometer front ends, for a full-scale input increase of N times, the analog circuitry power reduces by N2 times. The front end has two signal amplification stages, with the first stage power scaled. The chip is 1.15mmx1.15mm and implemented in a 0.13μm CMOS process. The design was packaged with the MEMS accelerometer chip inside a 44 pin CQFP. Measured results show an output rms noise of 63μVrms in a 100Hz bandwidth. The total analog circuitry power scales very linearly with different full scale ranges. A novel simple offset removal network is also shown and confirmed via measurement results.

The in-vivo observation of the neural activities generated by a large number of closely located neurons is believed to be crucial for understanding the nervous system. Moreover, the functional electrical stimulation of the central nervous system is an effective method to restore physiological functions such as limb control, sound sensation, and light perception. The Deep Brain Stimulation (DBS) is being successfully used in the treatment of tremor and rigidity associated with advanced Parkinson's disease. Cochlear implants have also been employed as an effective treatment for sensorineural deafness by means of delivering the electrical stimulation directly to the auditory nerve. The most significant contribution of this PhD study is the development of next-generation microprobes for the simultaneous stimulation and recording of the cortex and deep brain structures. For intracortical applications, millimetre length multisite microprobes that are rigid enough to penetrate into the cortex while integrated with flexible interconnection cables are demanded. In chronic applications, the flexibility of the cable minimizes the tissue damage caused by the relative micro-motion between the brain and the microprobe. Although hybrid approaches have been reported to construct such neural microprobes, these devices are brittle and may impose severe complications if they break inside the tissue. In this project, MEMS fabrication processes were employed to produce non-breakable intracortical microprobes with an improved structural design. These 32 channel devices are integrated with flexible interconnection cables and provide enough mechanical strength for penetration into the tissue. Polyimide-based flexible implants were successfully fabricated and locally reinforced at the tip with embedded 15 µm-thick gold micro-needles. In DBS applications, centimetre long microprobes capable of stimulating and recording the neural activity are required. The currently available DBS probes, manufactured by Medtronic, provide only four cylindrical shaped electrode sites, each 1.5 mm in height and 1.27 mm in diameter. Although suitable for the stimulation of a large brain volume, to measure the activity of a single neuron but to avoid measuring the average response of adjacent cells, recording sites with dimensions in the range of 10 - 20 µm are required. In this work, novel Three Dimensional (3D) multi channel microprobes were fabricated offering 32 independent stimulation and recording electrodes around the shaft of the implant. These microprobes can control the spatial distribution of the charge injected into the tissue to enhance the efficacy and minimize the adverse effects of the DBS treatment. Furthermore, the device volume has been reduced to one third the volume of a conventional Medtronic DBS lead to significantly decrease the tissue damage induced by implantation of the microprobe. For both DBS and intracortical microprobes, the impedance characteristics of the electrodes were studied in acidic and saline solutions. To reduce the channel impedance and enhance the signal to noise ratio, iridium (Ir) was electroplated on gold electrode sites. Stable electrical characteristics were demonstrated for the Ir and gold electrodes over the course of a prolonged pulse stress test for 100 million cycles. The functionality and application potential of the fabricated microprobes were confirmed by the in-vitro measurements of the neural activity in the mouse hippocampus. In order to reduce the number of channels and simplify the signal processing circuitry, multiport electrostatic-actuated switch matrices were successfully developed, fabricated, and characterized for possible integration with neural microprobes to construct a site selection matrix. Magnetic-actuated switches have been also investigated to improve the operation reliability of the MEMS switching devices.

The development and fabrication of silicon-based phononic band gap crystals has been gaining interest since phononic band gap crystals have implications in fundamental science and display the potential for application in engineering by providing a relatively new platform for the realization of sensors and signal processing elements. The seminal study of phononic band gap phenomenon for classical elastic wave localization in structures with periodicity in two- or three-physical dimensions occurred in the early 1990’s. Micro-integration of silicon devices that leverage this phenomenon followed from the mid-2000’s until the present. The reported micro-integration relies on exotic piezoelectric transduction, phononic band gap crystals that are etched into semi-infinite or finite-thickness slabs which support surface or slab waves, phononic band gap crystals of numerous lattice constants in dimension and phononic band gap crystal truncation by homogeneous mediums or piezoelectric transducers. The thesis reports, to the best of the author's knowledge, for the first time, the theory, design methodology and experiment of an electrostatically actuated silicon-plate phononic band gap quasi-crystal architecture, which may serve as a platform for the development of a new generation of silicon-integrated sensors, signal processing elements and improved mechanical systems. Electrostatic actuation mitigates the utilization of piezoelectric transducers and provides action at a distance type forces so that the phononic band gap quasi-crystal edges may be free standing for potentially reduced anchor and substrate mode loss and improved energy confinement compared with traditional surface and slab wave phononic band gap crystals. The proposed phononic band gap quasi-crystal architecture is physically scaled for fabrication as MEMS in a silicon-on-insulator process. Reasonable experimental verification of the model of the electrostatically actuated phononic band gap quasi-crystal architecture is obtained through extensive dynamic harmonic analysis and mode shape topography measurements utilizing optical non-destructive laser-Doppler velocimetry. We have utilized our devices to obtain fundamental information regarding novel transduction mechanisms and behavioral characteristics of the phononic band gap quasi-crystal architecture. Applicability of the phononic band gap quasi-crystal architecture to physical temperature sensors is demonstrated experimentally. Vibration stabilized resonators are demonstrated numerically.

The use of electrostatic transduction has enabled high-Q miniaturized mechanical resonators made of non-piezoelectric material that vibrate at high and ultra high frequencies. However, this transduction technique suffers from large values of motional resistance associated with the technique, limiting its use for interfacing to standard 50 RF circuits. Piezoelectric transduction has advantages over the electrostatic method because of its comparable to 50 motional resistance. However, the technique requires use of thin film piezoelectric materials with the demonstrated Qs that are much lower than their corresponding non-piezoelectric resonators. This research proposes use of electrodynamic transduction, reports analytic and experimental studies on electrodynamic transduction for RF application, highlights the method’s advantages, and lists the contributions. The use of Lorentz-force transduction for RF micromechanical filters proposed in this work is pursued by experimentally evaluating the transduction technique implemented for microfabricated designs. By fabricating single and coupled microresonators in a few different fabrication technologies, including CMOS35, the performance of the Lorentz-force driven microresonators is studied. Using a laser vibrometer, the actual performance, including the displacement and velocity of the moving points of the microstructures’ surfaces, are measured. The mode shapes and resonance specifications of the microstructures in air and vacuum derived by laser vibrometer provide data for characterizing the employed Lorentz-force transduction technique. Furthermore, the results from the electrical measurements are compared to the micromechanical resonators’ frequency response obtained from the mechanical measurements by laser vibrometer. The significantly low values of motional resistance computed for the differently fabricated designs demonstrate the advantage of Lorentz-force transduction for RF filter applications. Should a device similar in size be driven electrostatically, the motional resistance would be multiple orders of magnitude higher. This research reports the experimental results obtained by examining a Lorentz- force transduction application for developing RF micromechanical filters. The results demonstrate the Lorentz-force transduction’s advantages over other transduction methods used for RF μ-mechanical filters. Compared to electrostatic transduction, the Lorentz-force method provides greater electromechanical coupling, multiple orders of magnitude lower motional resistance, the independence of the filter center frequency from the bias voltage, higher power handling, and no requirement for bias lines, which decreases the work in microfabrication. Unlike piezoelectric transduction, the electrodynamic technique requires no piezoelectric material. Use of non-piezoelectric materials provides more flexibility for resonator material in the IC-compatible fabrications. Power handling in electrodynamic transduction has fewer limitations than other transduction techniques because the higher power needed in electrostatic or piezoelectric methods requires a higher voltage, which is limited by the breakdown voltage. The higher power in Lorentz-force-based transduction demands a larger current. The larger current produces heat that is removable by applying an appropriate cooling technique.

This thesis reports the development of high-performance symmetric and decoupled micromachined gyroscopes for tactical-grade inertial measurement applications. The symmetric structure allows easy matching of the resonance frequencies of the drive and sense modes of the gyroscopes for achieving high angular rate sensitivity / while the decoupled drive and sense modes minimizes mechanical cross-coupling for low-noise and stable operation. Three different and new symmetric and decoupled gyroscope structures with unique features are presented. These structures are fabricated in four different micromachining processes: nickel electroforming (NE), dissolved-wafer silicon micromachining (DWSM), silicon-on-insulator (SOI) micromachining, and silicon-on-glass (SOG) micromachining. The fabricated gyroscopes have capacitive gaps from 1.5&micro / m to 5.5&micro / m and structural layer thicknesses from 12&micro / m to 100&micro / m, yielding aspect ratios up to 20 depending on the fabrication process. The size of fabricated gyroscope chips varies from 1x1mm2 up to 4.2x4.6mm2. Fabricated gyroscopes are hybrid-connected to a designed capacitive interface circuit, fabricated in a standard 0.6&micro / m CMOS process. They have resonance frequencies as small as 2kHz and as large as 40kHz / sense-mode resonance frequencies can be electrostatically tuned to the drive-mode frequency by DC voltages less than 16V. The quality factors reach to 500 at atmospheric pressure and exceed 10,000 for the silicon gyroscopes at vacuum. The parasitic capacitance of the gyroscopes on glass substrates is measured to be as small as 120fF. The gyroscope and interface assemblies are then combined with electronic control and feedback circuits constructed with off-the-shelf IC components to perform angular rate measurements. Measured angular rate sensitivities are in the range from 12&micro / V/(deg/sec) to 180&micro / V/(deg/sec), at atmospheric pressure. The SOI gyroscope demonstrates the best performance at atmospheric pressure, with noise equivalent rate (NER) of 0.025(deg/sec)/Hz1/2, whereas the remaining gyroscopes has an NER better than 0.1(deg/sec)/Hz1/2, limited by either the small sensor size or by small quality factors. Gyroscopes have scale-factor nonlinearities better than 1.1% with the best value of 0.06%, and their bias drifts are dominated by the phase errors in the demodulation electronics and are over 1deg/sec. The characterization of the SOI and SOG gyroscopes at below 50mTorr vacuum ambient yield angular rate sensitivities as high as 1.6mV/(deg/sec) and 0.9mV/(deg/sec), respectively. The NER values of these gyroscopes at vacuum are smaller than 50(deg/hr)/Hz1/2 and 36(deg/hr)/Hz1/2, respectively, being close to the tactical-grade application limits. Gyroscope structures are expected to provide a performance better than 10 deg/hr in a practical measurement bandwidth such as 50Hz, provided that capacitive gaps are minimized while preserving the aspect ratio, and the demodulation electronics are improved.

As the world faces an energy crisis with depleting fossil fuel reserves, alternate energy sources are being researched ever more seriously. In addition to renewable energy sources, energy recycling and energy scavenging technologies are also gaining importance. Technologies are being developed to scavenge energy from ambient sources such as vibration, radio frequency and low grade waste heat, etc. Waste heat is the most common form of wasted energy and is the greatest potential source of energy scavenging. Pyroelectricity is the property of some materials to change the surface charge distribution with the change in temperature. These materials produce current as temperature varies in them and can be utilized to convert thermal energy to electrical energy. In this work a novel approach to vary temperature in pyroelectric material to convert energy has been investigated. Microelectromechanical Systems or MEMS is the new technology trend that takes advantage of unique physical properties at micro scale to create mechanical systems with electrical interface using available microelectronic fabrication techniques. MEMS can accomplish functionalities that are otherwise impossible or inefficient with macroscale technologies. The energy harvesting device modeled and developed for this work takes full benefit of MEMS technology to cycle temperature in an embedded pyroelectric material to convert thermal energy from low grade waste heat to electrical energy. Use of MEMS enables improved performance and efficiency and overcomes problems plaguing previous attempts at pyroelectric energy conversion. A Numerical model provides accurate prediction of MEMS performance and sets design criteria, while physics based analytical model simplifies design steps. A SPICE model of the MEMS device incorporates electrical conversion and enables electrical interfacing for current extraction and energy storage. Experimental results provide practical implementation steps towards of the modeled device. Under ideal condition the proposed device promises to generate energy density of 400 W/L.

This dissertation reports a metal-transfer-molding (MTM) technique for simultaneous implementation of air-lifted RF passive components, as well as coplanar waveguide (CPW) structures, in a high performance and potentially cost-effective fashion. A metal transfer mechanism is introduced into the conventional micro-molding process to realize polymer-core RF passive components and integration. A system-on-package (SOP) integration scheme of front-end RF components can be realized by this process. Several air-lifted RF components based on MTM technology have been presented with excellent performance. As an integration application of the MTM technology, a novel wireless passive airflow sensor based on the RF evanescent-mode cavity resonators has been also presented. The sensor makes use of RF technology to measure wind velocity through changes in the resonant frequency with applied airflow. Compared with reported wireless sensors based on conventional RF cavity resonator, this design has advantages such as compact size and greatly improved sensitivity. Wireless interrogating has also been demonstrated for the passive sensor. Overall, the RF components developed in this thesis illustrate the great potential of MTM technology in both wireless communication and sensor areas.

The need for miniaturized frequency-selective components in electronic systems is clear. The questions are whether and how micro-electro-mechanical systems (MEMS) can satisfy the need. This dissertation aims to address these questions from a scientific perspective. Silicon is the focus of this work, as it can benefit from scaling of the semiconductor industry. Silicon also offers many technical advantages. The characteristics of silicon resonators from 32 kHz to 1 GHz are described. The temperature stability and phase noise of a 6-MHz temperature-compensated oscillator and a 100-MHz temperature-controlled oscillator are reported. Silicon resonator design and characterization, with a focus on quality factor, linearity, and the electrical equivalent circuit, are included. Electrical tuning, electromechanical coupling, finite element modeling, and unexpected findings of these resonators are also described. A manufacturability technique employing batch process compensation is demonstrated. Results indicate that silicon is an excellent material for micromechanical resonators. The aim of this research is to explore the fundamental limitations, provide a foundation for future work, and also paint a clearer picture on how micromechanical resonators can complement alternative technologies.

The main purpose of this dissertation was to address key issues in the design and analysis of RF/microwave filters for wireless applications. Since RF/microwave filters are one of the bulkiest parts of communication systems, their miniaturization is one of the most important technological challenges for the development of compact transceivers. In this work, novel miniaturization techniques were investigated for single-band, dual-band, ultra-wideband and tunable bandpass filters. In single-band filters, the use of cross-shaped fractals in half-mode substrate-integrated-waveguide bandpass filters resulted in a 37 percent size reduction. A compact bandpass filter that occupies an area of 0.315 mm2 is implemented in 90-nm CMOS technology for 20 GHz applications. For dual-band filters, using half-mode substrate-integrated-waveguides resulted in a filter that is six times smaller than its full-mode counterpart. For ultra-wideband filters, using slow-wave capacitively-loaded coplanar-waveguides resulted in a filter with improved stopband performance and frequency notch, while being 25 percent smaller in size. A major part of this work also dealt with the concept of 'hybrid' RF MEMS tunable filters where packaged, off-the-shelf RF MEMS switches were used to implement high-performance tunable filters using substrate-integrated-waveguide technology. These 'hybrid' filters are very easily fabricated compared to current state-of-the-art RF MEMS tunable filters because they do not require a clean-room facility. Both the full-mode and half-mode substrate-integrated waveguide tunable filters reported in this work have the best Q-factors (93 - 132 and 75 - 140, respectively) compared to any 'hybrid' RF MEMS tunable filter reported in current literature. Also, the half-mode substrate-integrated waveguide tunable filter is 2.5 times smaller than its full-mode counterpart while having similar performance. This dissertation also presented detailed analytical and simulation-based studies of nonlinear noise phenomena induced by Brownian motion in all-pole RF MEMS tunable filters. Two independent mathematical methods are proposed to calculate phase noise in RF MEMS tunable filters: (1) pole-perturbation approach, and (2) admittance-approach. These methods are compared to each other and to harmonic balance noise simulations using the CAD-model of the RF MEMS switch. To account for the switch nonlinearity in the mathematical methods, a nonlinear nodal analysis technique for tunable filters is also presented. In summary, it is shown that output signal-to-noise ratio degradation due to Brownian motion is maximum for low fractional bandwidth, high order and high quality factor RF MEMS tunable filters. Finally, a self-sustained microwave platform to detect the dielectric constant of organic liquids is presented in this dissertation. The main idea is to use a voltage- controlled negative-resistance oscillator whose frequency of oscillation varies according to the organic liquid under test. To make the system self-sustained, the oscillator is embedded in a frequency synthesizer system, which is then digitally interfaced to a computer for calculation of dielectric constant. Such a system has potential uses in a variety of applications in medicine, agriculture and pharmaceuticals.

Microsystem interfaces to the macroscopic surroundings and within the microsystems themselves are formidable challenges that this thesis makes an effort to overcome, specifically for enabling a spacecraft based entirely on microsystems. The NanoSpace-1 nanospacecraft is a full-fledged satellite design with mass below 10 kg. The high performance with respect to mass is enabled by a massive implementation of microsystem technology – the entire spacecraft structure is built from square silicon panels that allow for efficient microsystem integration. The panels comprise bonded silicon wafers, fitted with silicone rubber gaskets into aluminium frames. Each module of the spacecraft is added in a way that strengthens and stiffens the overall spacecraft structure. The structural integrity of the silicon module as a generic building block has been successfully proven. The basic design (silicon, silicone, aluminium) survived considerable mechanical loads, where the silicon material contributed significantly to the strength of the structural element. Structural modeling of the silicon building blocks enables rapid iterative design of e.g. spacecraft structures by the use of pertinent model simplifications. Other microsystem interfaces treats fluidic, thermal, and mechanical functions. First, solder sealing of microsystem cavities was demonstrated, using screen-printed solder and localized resistive heating in the microsystem interface. Second, a dismountable fluidic microsystem connector, using a ridged silicon membrane, intended for monopropellant thruster systems, was developed. Third, a thermally regulated microvalve for minute flows, made by a silicon ridge imprint in a stainless steel nipple, was investigated. Finally, particle filters for gas interfaces to microsystems, or between parts of fluidic microsystems, were made from sets of crossed v-grooves in the interface of a bonded silicon wafer stack. Filter manufacture, mass flow and pressure drop characterization, together with numeric modeling for filter design, was performed. All in all this reduces the weight and volume when microsystems are interfaced in their applications.