This dissertation presents the development of electrically-powered, lamination-based microactuators for the realization of large arrays of high impulse and short duration micro-jets with potential applications in the field of micro-electro-mechanical systems (MEMS). Microactuators offer unique control opportunities by converting the input electrical or chemical energy stored in a propellant into useful mechanical energy. This small and precise control obtained can potentially be applied towards aerodynamic control and transdermal drug delivery applications. This thesis discusses the development of both chemical and physical microactuators and characterizes their performance with focus towards the feasibility of using them for a specific application. The development of electrically powered microactuators starts by fabricating an array of radially firing microactuators using lamination-based micro fabrication techniques that potentially enable batch fabrication at low cost. The microactuators developed in this thesis consist of three main parts: a micro chamber in which the propellant is stored; two electrode structures through which electrical energy is supplied to the propellant; and a micro nozzle through which the propellant or released gases from the propellant are expanded as a jet. The fabricated actuators are then integrated with MEMS-process-compatible propellants and optimized to produce rapid ignition of the propellant and generate a fluidic jet. This rapid ignition is achieved either by making the propellant itself conductive, thus, passing an electric current directly through the propellant; or by discharging an arc across the propellant by placing it between two closely spaced electrodes. The first concept is demonstrated with chemical microactuators for the application of projectile maneuvering and the second concept is demonstrated with physical microactuators for transdermal drug delivery application. For both the actuators, the propellant integrated microactuators are characterized for performance in terms of impulse delivered, thrust generated and duration of the jet. The experimentally achieved results are validated by comparing with results from theoretical modeling. Finally, the feasibility of using chemical microactuators for maneuvering the path of a 25 mm projectile spinning at 500 Hz is discussed and the feasibility of applying the physical microactuators for increasing skin's permeability to drug analog molecules is studied.

This dissertation reports, for the first time, on the design and implementation of tunable micromachined bandpass filters in the ultra high frequency (UHF) range that are fully integrated on CMOS-grade (resistivity=10-20 ohm.cm) silicon. Filters, which are designed in the Elliptic and coupled-resonator configuration, are electrostatically tuned using tunable microelectromechanical (MEM) capacitors with laterally movable interdigitated fingers. Tunable filters and high-quality factor (Q) integrated passives are made in silver (Ag), which has the highest conductivity of all materials in nature, to reduce the ohmic loss. The loss of the silicon substrate is eliminated by using micromachining techniques. The combination of the highest-conductivity metal and a low-loss substrate significantly improves the performance of lumped components at radio frequencies (RF), resulting in an insertion loss of 6 dB for a tunable lumped bandpass filter at 1075 MHz with a 3 dB-bandwidth of 63 MHz and tuning range of 123 MHz. The bandpass filters are encapsulated at the wafer level using a low-temperature, thermally released, polymer packaging process. This thesis details the design, fabrication, and measurement results of the filters and provides strategies to improve their performance. The performance of filter components, including the tunable capacitors and inductors, is characterized and compared to the state-of-the-art micromachined passive components. The silver inductors reported in this thesis exhibit the record high Q, and the silver bandpass filters show the minimum insertion loss that has been achieved on a CMOS-grade silicon substrate, to the best of our knowledge. Alternatively, tunable capacitors can be made in the bulk of silicon using a modified version of the high-aspect-ratio polysilicon and single crystal silicon (HARPSS) fabrication technique to obtain a larger capacitance density at the expense of a higher conductive loss. Using this process, a 15 pF two-port tunable capacitor is fabricated and tuned by 240% with the application of 3.5 V to the isolated actuator. Silver inductors can be post integrated with HARPSS tunable capacitors to obtain tunable filters in the very high frequency (VHF) range. The reported bandpass filters can be monolithically integrated with CMOS and have the potential to replace several transmit and receive acoustic filters currently used in cellular phones.

Thesis (M.S.)--Mississippi State University. Department of Agricultural and Biological Engineering. / Title from title screen. Includes bibliographical references.

Thesis (Ph. D.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2006. / John Papapolymerou, Committee Chair ; Joy Laskar, Committee Member ; John Cressler, Committee Member ; Alan Doolittle, Committee Member ; Clifford Henderson, Committee Member.

Thesis (MScEng)--Stellenbosch University, 2013. / ENGLISH ABSTRACT: There is a need for a coarse-to-fine positioning system as per a case study presented by the project collaboration partner, the Technical University of Chemnitz. The case study involves the picking and placing of piezo-ceramic micro parts into milled micro cavities. The focus of the project is the creation and development of a systematic approach for the design and the implementation of a coarse-to-fine positioning system for micro material handling. A second focus is to determine the applicability of the system for highly accurate and repeatable micro drilling and micro-milling. A systematic approach entails combining innovation management (assists in overall project structure), systems engineering (assists in specific design steps and tools) and research questions. Micro-milling was achieved, however the system proved unsuitable for highly accurate and repeatable micro drilling. The coarse-to-fine positioning system was successfully designed, built, and tested for accurate micro material handling. / AFRIKAANSE OPSOMMING: Daar bestaan ’n behoefte aan ’n grof-tot-fyn-posisioneringstelsel - soos blyk uit die gevallestudie uiteengesit deur die samewerkende projekvennoot, die Tegniese Universiteit van Chemnitz. Die gevallestudie behels die uitsoek en plasing van piezo-keramiek partikels in gefreesde mikroholtes. Hierdie projek het gefokus op die skepping en ontwikkeling van ’n stelselmatige benadering tot die ontwerp en implementering van ’n grof-tot-fyn-posisioneringstelsel vir mikromateriaalhantering en mikromasjienering. ’n Stelselmatige benadering behels dat innovasiebestuur (hulp met die algehele projekstruktuur), stelselingenieurswese (hulp met spesifieke ontwerpstappe en -hulpmiddels) en navorsingsdoelwitte gekombineer word. Die geïmplementeerde stelsel is eksperimenteel getoets en daar is bevind dat dit aan die spesifikasies en vereistes voldoen.

Um micromecanismo é, essencialmente, um dispositivo de dimensões milimétricas ou até micrométricas que executa uma tarefa específica como atuar como garra, pinça, grampo, etc. Quando acoplados a um sistema eletrônico, são chamados de sistemas microeletromecânicos ou \"Micro-Electro-Mechanical Systems\" (MEMS). Esses dispositivos são quase todos constituídos por mecanismos flexíveis, onde o movimento é dado pela flexibilidade de sua estrutura, sem juntas e pinos. Uma das formas de atuação de micromecanismos é a eletrotermomecânica, onde uma atuação elétrica sobre o próprio mecanismo é convertida em calor, por efeito Joule, que gera tensões térmicas responsáveis pela deformação estrutural desejada. Recentemente, vários grupos de pesquisa no mundo estão desenvolvendo micromecanismos fabricados com dois (ou até mais) materiais, o que permite obter maiores deformações sem que seja excedido o limite de resistência do material e mais flexibilidade no projeto de micromecanismos que realizem diferentes tarefas quando sujeito a diversas atuações (multiflexíveis). As técnicas de processo de fabricação de micromecanismos atingiram um alto nível de maturidade. No entanto, a modelagem e, em particular, o desenvolvimento de métodos computacionais sistemáticos para o projeto estão ainda no seu estágio inicial. Atualmente, o projeto de micromecanismos com vários materiais vem sendo realizado por métodos de tentativa e erro, dependendo da intuição e experiência do projetista. Além disso, o projeto genérico de um MEMS eletrotermomecânico é uma tarefa complexa, que leva em conta conhecimentos multidisciplinares. Dessa forma, o objetivo desse trabalho de mestrado foi desenvolver um software para o projeto de MEMS multifásicos, atuados eletrotermicamente, usando um método de projeto genérico e sistemático, como o Método de Otimização Topológica (MOT). Utilizando um modelo de interpolação de material de função de pico, qualquer número de materiais pode ser considerado sem que haja aumento na quantidade de variáveis de projeto se comparado à otimização com apenas um material e vazio. Visando maximizar o deslocamento de saída contra uma peça de rigidez conhecida, foram projetados mecanismos atuados por tensão elétrica, alguns considerando multiflexibilidade. Um estudo da influência dos parâmetros da otimização foi realizado. Como uma alternativa à atuação eletrotermomecânica, foram projetados mecanismos atuados por fluxo de calor. / A micromechanism is essentially a device of milimetric, or even micrometric, dimensions that can actuate as a gripper, tweezers, clamp, etc. When coupled to an electronic system, they are called \"Micro-Electro-Mechanical Systems\" (MEMS). Almost all of these devices are constituted by compliant mechanisms, where the motion is allowed by the compliance of its own structure, rather than the presence of joint and pins. One of the forms of micromechanisms actuation is the electrothermomechanical, where an electric actuation applied to the mechanism is converted in heat, by Joule effect, that generates the thermal stress responsible for the desired structural deformation. Recently, many research groups around the world are developing micromechanisms manufactured with two (or even more) materials, what allows larger displacements without exceeding the materials ultimate tensile strength, and gives more flexibility in the design of micromechanisms that accomplish different tasks when under different actuations (multiflexible mechanisms). The manufacturing process techniques of micromechanisms reached a high level of maturity, however, the modelling and, particularly, the development of systematic computational methods for design are still in early stages. Nowadays, micromechanism design with many materials is being carried on by \"try and error\" methods, depending on designer intuition and experience. Also, a generic design of an electrothermomechanical MEMS is a complex task that needs multidisciplinary knowledge. Thus, the objective of this work is to develop a software for the design of multi-phase MEMS, electrothermomechanically actuated, using a method for systematic and generic design, such as Topology Optimization Method (TOM). Using a peak function material interpolation model, any number of materials can be considered without increasing the amount of design variables if compared to an optimization with only one material and void. Mechanisms actuated by electric tension were designed considering the maximization of output displacement against a work piece with known stiffness. The design of microactuators considering multiflexibility was also performed. A study of optimization parameters influence is presented. As an alternative to electrothermomechanical actuation, some mechanisms actuated by heat flow were designed.

Orientador: Luiz Otávio Saraiva Ferreira. / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecânica / Made available in DSpace on 2018-08-21T04:03:41Z (GMT). No. of bitstreams: 1 Silva_MarioEduardodeBarrosGomeseNunesda_M.pdf: 3848213 bytes, checksum: ebb7fc7d814e03c6ae81ee577ddb158f (MD5) Previous issue date: 2012 / Resumo: A caracterização das propriedades mecânicas de filmes finos faz-se necessária para o projeto e fabricação de Microsistemas Eletromecânicos (MEMS - Micro-Electro-Mechanical Systems), que demanda dados precisos dos materiais. Esta pesquisa descreve um novo método de caracterização das propriedades mecânicas de filmes finos, barato e aplicávela uma ampla gama de materiais. Além do mais, este método também pode ser utilizado para avaliar a resistência das microestruturas durante cada etapa do processo de fabricação, e mesmo do sistema completo. Para realizar os experimentos de caracterização é utilizado um perfilômetro de superfície. Perfilômetros de superfície são dispositivos utilizados para medir a espessura e rugosidade de filmes, sendo essenciais em laboratórios de microfabricação. Tal fato permite que seja possivel repetir os experimentos deste trabalho em qualquer laboratório que possua um perfilômetro de superfície, sem a necessidade de investimento em novos equipamentos. O método de caracterização baseia-se na flexão de microestruturas suspensas. Os corpos de prova são fabricados no material em teste, e um perfilômetro de superfície é usado para defleti-los, e a partir dos dados desse experimento, pode-se calcular o módulo de Young. Caso os corpos de prova venham a se fraturar é possivel calcular a tensão de ruptura. Em uma primeira etapa do trabalho, foram caracterizados filmes de óxido de silício, fabricados por óxidação térmica de um substrado de silício monocristalino. Na segunda etapa, o método de caracterização foi expandido para filmes sobrepostos de materiais diversos e, foram caraterizados filmes de nitreto de silício, fazendo uso de microestruturas compostas de nitreto de silicio, depositado pelo método de vapor químico de baixa pressão (LPCVD), sobre o óxido de silício fabricado por óxidação térmica. O presente trabalho também sugere uma forma de utilizar o mesmo método de caracterização para determinar o coeficiente de Poisson, fazendo uso de várias amostras com expessuras diversas. Os corpos de prova foram fabricados no Centro de Componentes Semicondutores (CCS) da Universidade Estadual de Campinas (UNICAMP), e os experimentos de deflexão realizados no Laboratório de Microfabricação (LMF) do Laboratório Nacional de Nanotecnologia (LNNano) / Abstract: The mechanical properties characterization of thin films is necessary for MEMS (Micro-Electro-Mechanical Systems) design and manufacture, which requires accurate materials data. This research describes a new method for mechanical properties characterization of thin films, inexpensive and applicable to a wide range of materials. Also, this method can be used to evaluate the resistance of the microstructures during each step of the manufacturing process, and even the complete system. To perform the experiments of characterization is used a surface profilometer. Surface profilometers are devices generally used to measure the films thickness and roughness, and they are essential in microfabrication laboratories. This fact allows the possibility of repetitive the experiments of this work in any laboratory that has a surface profilometer, without the necessity to invest in new equipment. The characterization method is based on bending of suspended microstructures. The specimens are fabricated in the material under test, and a surface profilometer is used to deflect then, and from this experiment data, it's possible to calculate the Young's modulus. If the specimens fracture, it is possible to calculate the tensile strength. In a first step, were characterized films of silicon oxide, manufactured by thermal oxidation of a monocrystalline silicon substrate. In the second step, the characterization method has been expanded to superimposed films of various materials and films of silicon nitride were characterized, by making use of microstructures consisting of silicon nitride, deposited by the method of low-pressure chemical vapor (LPCVD), over the silicon oxide produced by thermal oxidation. The present work also suggests a way to use the same characterization method for determining the Poisson's ratio, using various samples with different thickness. The specimens were fabricated in the Center for Semiconductor Components (CCS) of University of Campinas (UNICAMP), and the deflection experiments performed in the Microfabrication Laboratory (LMF) of Brazilian Nanotechnology National Laboratory (LNNano) / Mestrado / Mecanica dos Sólidos e Projeto Mecanico / Mestre em Engenharia Mecânica

The growing demand for wireless communication systems is driving the integration of radio frequency (RF) front-ends on the same chip with multi-band functionality and higher spectral efficiency. Microelectromechanical systems (MEMS) have an overarching applicability to RF communications and are critical components in facilitating this integration process. Among a variety of RF MEMS devices, piezoelectric MEMS resonators have sparked significant research and commercial interest for use in oscillators, filters, and duplexers. Compared to their bulky quartz crystal and surface acoustic wave (SAW) counterparts, MEMS resonators exhibit impressive advantages of compact size, lower production cost, lower power consumption, and higher level of integration with CMOS fabrication processes. One of the promising piezoelectric MEMS resonator technologies is the aluminum nitride (AlN) contour mode resonator (CMR). On one hand, AlN is chemically stable and offers superior acoustic properties such as large stiffness and low loss. Furthermore, CMRs offer low motional resistance over a broad range of frequencies (few MHZ to GHz), which are lithographically-definable on the same silicon substrates. To date, RF MEMS resonators (include CMRs) have been extensively studied; however, one aspect that was not thoroughly investigated is how to modulate/tune their equivalent parameters to enhance their performance in oscillators and duplexers. The goal of this thesis is to investigate various modulation methods to improve the thermal stability of the resonator, its “effective” quality factor when used in an oscillator, and build completely novel non-reciprocal components. Broadly defined, modulation refers to the exertion of a modifying or controlling influence on something, herein specifically, the resonator admittance. In this thesis, three categories of modulation methods are investigated: thermal modulation, force modulation, and external electronic modulation. Firstly, the AlN CMR’s center frequency can be tunned by the applied thermal power to the resonator body. The resonator temperature is kept constant (for example, 90 °C) via a temperature sensor and feedback control such that the center frequency is stable over the whole operation temperature range of interest (e.g. –35 to 85 °C). The maximum power consumption to sustain the maximum temperature difference (120 ºC in this thesis) between resonator and ambient is reduced to a value as low as 353 μW – the lowest ever reported for any MEMS device. These results were attained while simultaneously maintaining a high quality factor (up to 4450 at 220 MHz device). The feedback control was implemented by either analog circuits or via a microprocessor. The analog feedback control, which innovatively utilized a dummy resistor to compensate for temperature gradients, resulted in a total power consumption of 3.8 mW and a frequency stability of 100 ppm over 120 ºC. As for the digital compensation, artificial neural network algorithm was employed to facilitate faster calibration of look-up tables for multiple frequencies. This method attained a frequency stability of 14 ppm over 120 ºC. The second modulation method explored in this thesis is based on the use of an effective external force to enhance the 3-dB quality factor of AlN CMRs and improve the phase noise performance of resonator-based oscillators. The force modulation method was embodied in a two-port device, where one of the two ports is used as a one-port resonator and the other is driven by an external signal to effectively apply an external force to the first port. Through this technique, the quality factor of the resonator was boosted by 140 times (up to 150,000) and the phase noise of the corresponding oscillator realized using the resonator was reduced by 10 dBc/Hz. Lastly, a novel magnetic-free electrical circulator topology that facilitates the development of in-band full duplexers (IBFD) for simultaneous transmit and receive (STAR) is proposed and modeled. Fundamentally, a linear time-invariant (LTI) filter network parametrically modulated via a switching matrix is used to break the reciprocity of the filter. The developed model accurately predicts the circulator behavior and shows very good agreement with the experimental results for a 21.4 MHz circulators built with MiniCircuit filter and switch components. Furthermore, a high frequency (1.1 GHz) circulator was synthesized based on AlN MEMS bandpass filters and CMOS RF switches, hence showing a compact approach that can be used in handheld devices. The modulation frequency and duty cycle are optimized so that the circulator can provide up to 15 dB of isolation over the filter bandwidth while good power transfer between the other two ports is maintained. The demonstrated device is expected to intrinsically offer low noise and high linearity. The combination of the first two modulation methods facilitates the implementation of monolithic, temperature-stable, ultra-low noise, multi-frequency oscillator banks. The third modulation technique that was investigated sets the path for the development of CMOS-compatible in-band full duplexers for simultaneous transmit and receive and thus facilitates the efficient utilization of the electromagnetic spectrum. With the aid of all these three modulation approaches, the author believes that a fully integrated, multi-frequency, spectrum-efficient transceiver is enabled for next-generation wireless communications.

Microactuators are needed to convert energy into mechanical work at the microscale. Thermal microactuators can be used to produce this needed mechanical work. The purpose of this research was to design, fabricate, and test thermal microactuators for use at the microscale in microelectromechanical systems (MEMS). The microactuators developed were tested to determine the magnitude of their deflection and estimate their force. Five groups of thermal microactuators were designed and tested. All of the groups used the geometrically constrained expansion of various segments to produce their deflection. The first group, Thermal Expansion Devices (TEDs), produced a rotational displacement and had deflections up to 20 µm. The second group, Bi-directional Thermal Expansion Devices (Bi-TEDs) were similar to the TEDs. The difference, as the name implies, was that the Bi-TEDs deflected up to 6 µm in two directions. Thermomechanical In-plane Micromechanisms (TIMs) were the third group tested. They produced a linear motion up to 20 µm. The fourth group was the Rapid Expansion Bi-directional Actuators (REBAs). These microactuators were bi-directional and produced up to 12 µm deflection in each direction. The final group of thermal microactuators was the Joint Actuating Micro-mechanical Expansion Systems (JAMESs). These thermal microactuators rotated pin joints up to 8 degrees. The thermal microactuators studied can be used in a wide variety of applications. They can move ratchets, position valves, move switches, change devices, or make connections. The thermal microactuator groups have their own unique advantages. The TIMS can be tailored for the amount of deflection and output force they produce. This will allow them to replace some microactuator arrays and decrease the space used for actuation. The Bi-TEDs and REBAs are bi-directional and can possibly replace two single direction micro-actuators. The JAMESs can be attached directly to a pin joint of an existing mechanism. These advantages allow these thermal microactuator groups to be used for a wide variety of applications.

This thesis introduces two ortho-planar MEMS devices that can be used to position microcomponents: the XZ Micropositioning Mechanism and the XYZ Micromanipulator. The displacement and force relationships are presented. The devices were fabricated using surface micromachining processes and the resulting mechanisms were tested. A compliant XYZ Micromanipulator was also designed to reduce backlash and binding. In addition, several other MEMS positioners were fabricated and tested: the Micropositioning Platform Mechanism (MPM), the Ortho-planar Twisting Micromechanism (OTM), and the Ortho-planar Spring Micromechanism (OSM).