• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 891
  • 167
  • 165
  • 133
  • 61
  • 59
  • 46
  • 39
  • 18
  • 14
  • 10
  • 7
  • 7
  • 7
  • 7
  • Tagged with
  • 1870
  • 356
  • 303
  • 257
  • 234
  • 219
  • 219
  • 159
  • 144
  • 143
  • 114
  • 112
  • 104
  • 96
  • 96
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
191

The Fabrication of Laser Array Module by Flip Chip Technique

Hsieh, Cheng-Han 12 January 2001 (has links)
We have fabricated a laser array module using a passive self-aligned flip-chip bonding technique. Silicon optical bench was used as a submount with PbSn (Tm=183¢J) solder bump and V-grooves. A 4-channel laser array was flip-chip mounted with coupling efficiency of 56% to cleaved 62.5/125£gm multimode fiber ribbons. The optimum fabrication parameters were bonding time of 20 seconds and bonding load of 10g. The average misalignments were measured to be 1£gm and 5£gm for X and Y directions , respectively.
192

Implementation of Hierarchical Architecture of Basic Memory Modules

Yang, Shang-da 11 September 2008 (has links)
In system-on-chip designs, memory designs store data to be accessed by processing modules. Memory access time can affect overall system performance significantly. In this research, we implemented a configurable architecture of a basic memory module and its design composition, including memory interface, memory controller, memory array, row buffer, row decoder and column decoder. We explore various memory module designs. Utilizing the configurable architecture, we can effectively reduce design time and improve access time of memory module designs. We also realized these functionalities in SystemC language and performed configurability experiments.
193

CoNoC: Fast Full Chip Topology Generation for Application-Specific Network on Chip

Chen, Shu-yu 08 January 2010 (has links)
We propose a synthesis methodology for Network-on-Chips (NoC) or NoC-based multiprocessor systems-on-chip (MPSoCs) for application-specific or irregular topology generation.We first propose simultaneously synthesize both for processor and communication architectures in order to estimate area and routing more accurately during floorplanning stage, which is different with traditional router and link insertion after floorplanning. Our NoC topology generation is simultaneously optimized for fast, low power and wirelength. Compared with the state of art, our results outperforms averagely 445.45 X in CPU time, 33.20 % in power consumption, and 96.86 % in wirelength at cost of NoC Size of more 2.26 % because our method considering router shape; the number of routers of more 20.63 % because our method only allows router port limit of 5; the number of links of more 3.93 % because our method allows different link lengths. Also our method is scalable and experiments of 2 X, 4 X, 8 X and 16 X outperform averagely 355,089.11 X in CPU time, 1.21 X in the number hops, 78.33 % in power consumption. Our experimental results show our synthesis method is effective, efficiently and scalable.
194

Fluidic microsystems for biochemical analysis

Hairer, Gabriel January 2009 (has links)
Zugl.: Wien, Techn. Univ., Diss., 2009
195

Evaluation, optimization, and reliability of no-flow underfill process

Colella, Michael. January 2004 (has links) (PDF)
Thesis (M.S.)--Mechanical Engineering, Georgia Institute of Technology, 2004. / Daniel Baldwin, Committee Chair; Suresh Sitaraman, Committee Member; Steven Danyluk, Committee Member. Includes bibliographical references (leaves 238-241).
196

Study on the curing process of no-flow and wafer level underfill for flip-chip applications

Zhang, Zhuqing, January 2003 (has links) (PDF)
Thesis (Ph. D.)--School of Materials Science and Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Includes bibliographical references (leaves 275-289).
197

Fundamental study of underfill void formation in flip chip assembly

Lee, Sangil. January 2009 (has links)
Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2010. / Committee Chair: Baldwin, Daniel; Committee Member: Colton, Jonathan; Committee Member: Ghiaasiaan, Mostafa; Committee Member: Moon, Jack; Committee Member: Tummala, Rao. Part of the SMARTech Electronic Thesis and Dissertation Collection.
198

Software for chip companies : an analysis and strategies to build software IP / Analysis and strategies to build software IP

Jayatheerthan, Venkatramana 08 February 2012 (has links)
Software plays an important role in making products usable. We couldn’t imagine a laptop without software that run it making the things it does possible with the laptop hardware. Software has penetrated into several industries making significant contribution in how the products are designed and to make them more usable. This thesis focuses on semiconductor industry and analyzes the role played by software to enhance their products and differentiate them from competition. In this context, the thesis looks at acquisition of software companies by chip companies and analyzes them to determine the benefits and how it changed the market space. In a semiconductor company, the focus is predominantly on hardware. Although software is equally crucial to the success of the product, not much focus is placed on it in terms of innovation and building sustained software IP portfolio. One of the questions that this thesis tries to answer is how to build a robust software IP portfolio in a chip company. Case studies of different products were conducted to analyze their IP building strategies in general and focusing specifically on software patenting in terms number of patents filed and procedures adopted to encourage it. It looks closely at the best and not-so-best practices adopted by the teams and analyzing them to determine why certain initiatives succeeded while others failed. A crucial aspect of building software IP pipeline is to involve junior level engineers in this process. The thesis looks at some of the strategies companies could use to bring the culture of patents to the lowest levels of engineers. Typically the senior engineers are well tuned in to the process and regularly file patents while the junior engineers don’t. This is crucial to the company since today’s junior engineer is tomorrow’s senior engineer leading technology initiatives. The thesis concludes by putting forward recommendations to encourage software patenting. / text
199

Identification of MYCN and SOX9 target genes and a study of drug treatment effects in medulloblastoma

Östergren, Tiolina January 2015 (has links)
Medulloblastoma (MB) is the most common malignant brain tumor affecting children. The transcription factors MYCN and SOX9 are associated with initiation, maintenance and recurrence of MB and are also connected to more aggressive tumors. In this study, a ChIP was performed to isolate DNA from genes that are transcriptionally regulated by these proteins. Identification of these target genes will reveal new potential drug targets and help us better understand the functions of MYCN and SOX9. The ChIP was not fully optimized during this project and the target genes were not sent for sequencing and identified. To study the connection between SOX9 and recurrence, cells with different levels of SOX9 were treated with drugs, after which cell viability was measured. No significant difference in resistance could be measured. Change in expression level of MYCN, SOX9 and other relevant genes after drug treatment was also studied. The results show an increase in SOX9 and HES1, suggesting that these genes are involved in tumor recurrence.
200

Systems-on-a-chip testing using an embedded microprocessor

Hwang, Sungbae 28 August 2008 (has links)
Not available / text

Page generated in 0.0222 seconds