The work deals with flash technology, the history of its development, current application of this technology and discusses the advantages and disadvantages of flash memories. It describes the integration of flash technology into mass storage devices and commonly used mechanisms that suppress the flash shortcomings for such application. The next part of the work focuses on analysis of commonly used buses for flash storage devices. Based on these theoretical foundations, text presents way to develop own flash based disk. The work focuses mainly on finding the most accessible platform for connecting the disk to personal computers - USB, on PCB design for storage module in Eagle CAD and implementation of necessary firmware for MCU and VHDL design for FPGA, that provide the disk functionality. At the end the work summarizes the results and outlines the way of further development.

Familiarization with the problems of PCB assembly and commissioning means for interim and final control of DPS on semi-automatic and manual assembly. Analysis tools for visualizing programs during PCB assembly. Defining the pluses and minuses of each program. Introducing the functioning of the program selected for visualization. Implementation of the program into production. Problems with introducing the program and compared with the previous situation. Evaluation of its contribution to manufacturing (time, quality, financial costs, human resources, ...). Solving problems encountered with the implementation of the program. Recommendations for the type of production the program is suitable.

Many organic compounds are released to the environment and can be harmful to living organisms. These compounds are often persistent and toxic. Some are mutagens, carcinogens, endocrine disruptors or they can cause an increase in bacterial resistance. They tend to accumulate in nature and their transformation is a long-term process. Therefore, various remediation techniques are needed for decontamination. Remediation and bioremediation processes depend on many factors which should be critically evaluated. This dissertation thesis studies the relationship between bioavailability, biodegradation and toxicity of polychlorinated biphenyls, polycyclic aromatic hydrocarbons and fluoroquinolone antibiotics. These compounds of different origin, character and properties were degradated by ligninolytic fungi. Desorption behaviour of pollutants from historically contaminated sites, degradation potential of ligninolytic fungi, ongoing degradation mechanisms, transformation products and their toxicity were studied as important factors for evaluation of mycoremediation and its environmental impact. The results show that determination of bioaccessible fraction by sequential supercritical fluid extraction is very useful for precise prediction of biodegradability of pollutants. The evidence that ecotoxicity and...

This thesis relates to the design and implementation of a Gysel power combiner consisting of two input ports. The design is implemented using discrete (lumped) components over the conventional transmission line architecture and operates at 100 MHz. Because of the high power requirements for the power combiner, special attention is given to the power handling capabilities of the lumped elements and the other components involved. Simulations of an S-parameter of Gysel power combiner are performed using the Advanced Design System (ADS) from Keysight Technologies. The final design of two-way Gysel power combiner using PCB toroidal inductor was implemented, simulated and optimized at centre frequency of 100 MHz. Satisfactory results were obtained in terms of Insertion loss, Return loss and Port Isolation.

This report presents a project that has been made to present the design of a planar transformer as a part of a series loaded resonant DC/DC converter in a power unit. The design is based on an existing transformer that is not planar and so the characteristics of the transformer is translated into a planar version. A multilayer printed circuit board (PCB) design was made to fit a chosen magnetic ferrite core that was chosen based on the magnetic characteristics of the old core. Calculations were made for the loss of both core and windings and the final results show that it is possible to design a planar transformer from a traditional transformer.

Arbetet har fokuserat på att minimera arbetsbelastningen för personalen hos företaget Arcoma. Detta har uppnåtts genom att bygga ett automatiserat mätsystem för läckstrålning med material som fanns hos Arcoma. Det användes bland annat tekniker som CAN, reglerteknik och matematiska omvandlingar för att styra motorerna så att röntgengivaren placeras vid rätt position i förhållande till en punkt i planet. Systemet styrs med hjälp av ett användargränssnitt genom webben för att minska besvärligheter. Tester av detta system bestod av noggrannheten, test av exponering och ett sluttest på en röntgenapparat. Slutsatsen för arbetet ledde till att noggrannheten i det automatiserade mätsystemet var inom acceptabelt område. Systemet blev delvis automatiserat eftersom ställningen behövdes sättas upp av en person, men var relativt enkelt att kontrollera genom användargränssnitt. Dock är uppsättningen av systemet inte helt praktisk.

Den snabbt växande utvecklingen av AI-baserade applikationer och den stora mängden data dessa applikationer behandlar ställer ökade krav på prestanda och optimering av datorsystemen. För att tillfredsställa de växande datorbehoven används hårdvaruacceleratorer som förbättrar databehandlingshastigheten genom att avlasta den befintliga utrustningen genom att hjälpa till med uppgifter och komplexa beräkningar. De befintliga lösningarna som används i dagsläget är kostsamma och MT-FoU på Umeå Universitetssjukhus efterfrågar därför en alternativ lösning i form av att kombinera mindre integrerande acceleratorer på ett större PCIe-kort. I detta examensarbete designas och implementeras en AI-accelerator bestående av fyra Google Coral Dual Edge TPU M.2 på ett 16x PCIe-kort. Arbetet genomfördes på MT-FoU och målet med examensarbetet var att undersöka om den tilltänkta konstruktionen kan förbättra prestandan hos AI-baserade system och fungera som ett billigare alternativ i verksamheten. Schemaritning och PCB-design utfördes i KiCad och information om gränssnitt och komponenter hämtades främst från tillverkares hemsidor och datablad. Kretsen består i huvudsak av fyra stycken M.2 E key kontaktdon, en 16port/16lane packetswitch och en 16x PCIe-anslutning. Switchen delar upp banorna från PCIe porten så att Edge TPU’erna kan anslutas parallellt i M.2 kontakterna. Edge TPU’erna använder pipelineparallellism för att fördela arbetsuppgifter på varje TPU så att större, mer komplexa program kan exekveras. Vid monteringen av kretskortet uppstod problem med fastlödningen av vissa komponenter. För att undvika att dessa problem uppstår och möjliggöra avlägsnandet av dessa felkällor bör montering istället beställas av fabrik där lödrobot finns tillgängligt. På grund av att tiden för kursen tog slut hann en sådan beställning inte göras och evaluering av den framtagna designen var därför inte möjlig att genomföra. Den design som togs fram var dock betydligt billigare än de existerande lösningarna och med pipelineparallellism förväntas designen kunna utföra komplexa beräkningar och därmed förbättra prestandan i befintliga system. / The rapidly growing development of AI-based applications and the large amount of data these applications process place increased demands on the performance and optimization of conventional computer systems. To satisfy these growing computing requirements, hardware accelerators are used to improve the data processing speed by offloading the existing equipment by executing models and complex calculations. The existing solutions currently used are costly and MT-R&D at Umeå University Hospital is therefore requesting an alternative solution by combining smaller integrating accelerators on a larger PCIe card. In this thesis, an AI accelerator using four Google Coral Dual Edge TPU M.2 on a 16x PCIe card is designed and implemented. The work was carried out at MT-R&D and the goal of the thesis was to investigate whether the intended design can improve the performance of AI-based systems and serve as a cheaper alternative in the institution. Schematic and PCB were designed in KiCad and information on interfaces and components was obtained from manufacturers' websites and data sheets. The circuit’s main components are four M.2 E key connectors, a 16port/16lane packet switch and a 16x PCIe connection. The switch divides the lanes from the PCIe port so that the Edge TPUs can be connected in parallel in the M.2 connectors. The Edge TPUs use pipeline parallelism to distribute models across each TPU so that larger, more complex programs can be executed. When assembling the circuit board, problems arose with the soldering of certain components. In order to avoid these sources of error, assembly should instead be ordered from a factory where a soldering robot is available. Due to the fact that the time for the course ran out, such an order could not be placed and evaluation of the design was therefore not possible to carry out. However, the design that was produced was significantly cheaper than the existing solutions and by using pipeline parallelism, the design is expected to be able to perform complex calculations and thus improve the performance of existing systems.

This report presents the design and manufacturing process of a bionic signal messagebroker (BSMB), intended to allow communication between implanted electrodes andprosthetic legs designed by Ossur. The BSMB processes and analyses the data intorelevant information to control the bionic device. The intention is to carry out eventdetection in the BSMB, where events in the muscle signal are matched to the events ofthe gait cycle (toe-o, stance, swing).The whole system is designed to detect muscle contraction via sensors implantedin residual muscles and transmit the signals wireless to a control unit that activatesassociated functions of a prosthetic leg. Two users, one transtibial and one transfemoral,underwent surgery in order to get electrodes implantable into their residual leg muscles.They are among the rst users in the world to get this kind of implanted sensors.A prototype of the BSMB was manufactured. The process took more time thanexpected, mainly due to the fact that it was decided to use a ball grid array (BGA)microprocessor in order to save space. That meant more complicated routing and higherstandards for the manufacturing of the board. The results of the event detection indicatethat the data from the implanted electrodes can be used in order to get sucient controlover prosthetic legs. These are positive ndings for users of prosthetic legs and shouldincrease their security and quality of life.It is important to keep in mind when the results of this report are evaluated that allthe testing carried out were only done on one user each.

In the current development work conducted at BAE Systems Hägglunds AB's electronics department, there are often long lead times from started projects to finished electronic units. This means that it is necessary to take a new approach to development in order to meet changing specifications and new interfaces. To mitigate the risks in design and interfaces, testing of the system needs to start as early as possible. Against the given background, the aim of the project is to develop and evaluate a modular concept for different Input/output (I/O) interfaces between a carrier board and modules. The modular concept where developed using Altium Designer and through schematic design and PCB design the designs was developed for the intended concept regarding modularization. To test the connections between the carrier board and modules and to get a visual picture over how it could look, Altium designers Multi-board Assembly function where used. By analyzing the boundaries between the carrier board and I/O-modules, new limitations were discovered in the contact surfaces between them. The focus turned to improve the existing carrier board by replacing the existing connectors with more modular alternative connectors that better fits the intended concept of the modularity in the I/O-modules. Three different alternatives for the current carrier board were evaluated and the alternative that is the best for modularization is to change the connectors on the current carrier board. The design of the I/O-modules are based on the already existing I/O designs and the I/O-modules designed were Digital Input (DIP) and Digital Output (DOP). The results that emerged during the project are as follows: The designed I/O-modules follow a relationship-based design to produce a combination of the different circuit solution already available at BAE Systems. The circuits DIP and DOP are the most common I/O-interfaces in use and the focus was to develop modules for these. In order to achieve the optimal modularity with respect for the intended concept, the current design of the carrier boards need to change to meet the intended concept regarding modularization. / I det nuvarande utvecklingsarbetet som bedrivs på BAE Systems Hägglunds ABs elektronikavdelning finns det ofta långa ledtider från påbörjade projekt till färdiga elektronikenheter. Detta leder till att omtag i utvecklingen blir nödvändigt för att kunna möta ändrade specifikationer och nya gränsytor. För att mitigera risker i design och gränsytor behöver testning av systemet påbörjas så tidigt som möjligt. Projektet syftar mot den givna bakgrunden att ta fram och utvärdera ett modulärt koncept för olika Input/Output (I/O) gränssnitt mellan bärarkort och moduler. Det modulära konceptet utvecklades i Altium Designer och genom schemaritning och PCB design utvecklades designerna för det tänkta konceptet gällande modularisering. För att testa anslutningar mellan bärarkort och modul och samtidigt få en visuell bild över hur resultatet kan se ut, användes Altium Multi-board Assembly. Genom att analysera avgränsningar mellan bärarkort och I/O-modul upptäcktes nya begränsningar i kontaktytorna mellan dem. Fokus hamnade på att förbättra det befintliga bärarkortet genom att byta ut de befintliga kontakterna till mer modulära kontakter som passar det tänkta konceptet för I/O-modulernas modularitet. Tre olika alternativ för det nuvarande bärarkortet togs upp och det alternativ som är bäst sett till Modularisering är att ändra de kontakter som finns på det nuvarande bärarkortet. Designen av I/O-modulerna utgick ifrån de redan befintliga kretslösningar som finns framtagen och de I/O-moduler som designades var Digital input (DIP) och Digital Output (DOP). De resultat som kom fram genom projektet är följande: De I/O-moduler som framställts följer en relationsbaserad design för att framställa en kombination av de olika kretslösningar som redan finns framtagen av BAE Systems. Kretsarna DIP och DOP är de vanligaste I/O-gränssnitten som används och fokus blev att ta fram moduler för dessa. För att uppnå optimal modularitet med anseende på det tänkta konceptet behöver den nuvarande designen av bärarkortets kontakter ändras för att kunna möta den optimala modulariteten för det tänkta konceptet.

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