Heat removal technologies are among the most critical needs for three-dimensional (3D) stacking of high-performance microprocessors. This research reports a 3D integration platform that can support the heat removal requirements for 3D integrated circuits that contain high-performance microprocessors in the 3D stack. This work shows the use of wafer-level batch fabrication to develop advanced electrical and fluidic three-dimensional interconnect networks in a 3D stack. Fabrication results are shown for the integration of microchannels and electrical through-silicon vias (TSVs). A compact physical model is developed to determine the design trade-offs for microchannel heat sink and electrical TSV integration. An experimental thermal measurement test-bed for evaluating a 3D inter-layer liquid cooling platform is developed. Experimental thermal testing results for an air-cooled chip and a liquid-cooled chip are compared. Microchannel heat sink cooling shows a significant junction temperature and heat sink thermal resistance reduction compared to air-cooling. The on-chip integrated microchannel heat sink, which has a thermal resistance of 0.229 °C/W, enables cooling of >100W/cm² of each high-power density chip, while maintaining an average junction temperature of less than 50°C. Cooling liquid is circulated through the 3D stack (two layers) at flow rates of up to 100 ml/min. The ability to assemble chips with integrated electrical and fluidic I/Os and seal fluidic interconnections at each strata interface is demonstrated using three assembly and fluidic sealing techniques. Assembly results show the stacking of up to four chips that contain integrated electrical and fluidic I/O interconnects, with an electrical I/O density of ~1600/cm².

To reduce electronics packaging lead time and potentially to reduce manufacturing cost, an innovative packaging process targeting rapid package prototyping (RPP) has been developed. The developed RPP process, which is based on a data-driven chip-first approach, provides electrical functionality as well as form factors for micro-systems packages. The key component of the RPP process is the nano-particle silver (NPS) interconnect. However, NPS has not yet been adequately proven for use in electronics packaging applications. Moreover, its adhesion to electronics packaging materials such as polyimide, benzocyclobutene (BCB), copper, and aluminum is found to be weak. Thus, improving the adhesion strength of NPS will be a key issue for reliable package prototypes with NPS interconnects. In this research, the adhesion of NPS to substrate materials is found to be attributed to particle adhesion and more specifically, van der Waals forces. An adhesion model based on the van der Waals force is suggested in order to predict NPS adhesion strength to packaging materials. A new adhesion test method that is based on a die shear test and a button shear test is developed to validate the NPS adhesion prediction model. The newly developed adhesion test method is generic in nature and can be extended to other thin films' adhesion tests. The NPS adhesion model provides a general and explicit relation between NPS tensile bond strength and adhesion factors such as substrate hardness, adhesion distance, van der Waals constant, and particle diameter. The NPS adhesion model is verified as a first order adhesion model using experimental data from seventeen packaging materials. Substrate hardness is identified as a primary factor in NPS adhesion. Adhesion distance and van der Waals constant are also significant in organic and inorganic materials. Diffusion or other interfacial reaction between NPS and metal substrates such as copper and silver seems to exist. Finally, guidelines to improve the adhesion strength of NPS are suggested based on the adhesion model and on external adhesion factors such as Silane coupling agents and plasma treatment.

With continued push toward 3D integrated packaging, Through-Silicon Vias (TSVs) play an increasingly important role in interconnecting stacked silicon dies. Although progress is being made in the fabrication of TSVs, experimental and theoretical assessment of their thermomechanical reliability is still in infancy. This work explores the thermomechanical reliability of TSVs through numerical models and innovative experimental characterization techniques. Starting with free-standing wafers, this work examines failure mechanisms such as Si and SiO₂ cohesive cracking as well as SiO₂/Cu interfacial cracking. Such cohesive crack propagation and interfacial crack propagation are studied using fracture mechanics finite-element modeling, and the energy available for crack propagation is determined through crack extension using the proposed centered finite-difference approach (CFDA). In parallel to the simulations, silicon wafers with TSVs are designed and fabricated and subjected to thermal shock test. Cross-sectional SEM failure analysis is carried out to study cohesive and interfacial crack initiation and propagation under thermal excursions. In addition, local micro-strain fields under thermal excursions are mapped through synchrotron X-ray diffraction. To understand the 3D to 2D strain measurement data projection process, a new data interpretation method based on beam intensity averaging is proposed and validated with measurements. Building upon the work on free-standing wafers, this research studies the package assembly issues and failure mechanisms in multi-die stacks. Comprehensive design-of-simulations study is carried out to assess the effect of various material and geometry parameters on the reliability of 3D microelectronic packages. Through experimentally-measured strain fields, thermal cycling tests, and simulations, design guidelines are developed to enhance the thermomechanical reliability of TSVs used in future 3D microelectronic packages.

Magistro darbe vertinamas antrinių žaliavų tvarkymo situacijos Vilniaus mieste valdymas ir valdymo efektyvumas. Pirmajame skyriuje yra apžvelgiami svarbiausi komunalinių atliekų tvarkymą reglamentuojantys Europos sąjungos ir Lietuvos Respublikos teisės aktai, klasifikuojamos antrinių žaliavų ir aptariami jų tvarkymo budai, vertinama institucinė atsakomybė atliekų tvarkymo srityje. Antrajame skyriuje, remiantis Vilniaus miesto savivaldybės administracijos medžiaga, nagrinėjama antrinių žaliavų tvarkymo situacija Vilniaus mieste, komunalinių atliekų tvarkymo sistemos kontekste, apžvelgiama Vilniaus miesto antrinių žaliavų sistema. Analizuojama antrinių žaliavų surinkimo ir tvarkymo situacija Lietuvoje ir Vilniuje, vertinami antrinių žaliavų sutvarkymo kaštai. Trečiajame skyriuje, remiantis gyventojų apklausos rezultatu bei interviu su Savivaldybės ir atliekas tvarkančių įmonių ekspertais duomenimis, analizuojama antrinių žaliavų tvarkymo sistema, šios sistemos valdymas ir efektyvumas. Analizė parodė, kad Vilniaus miesto antrinių žaliavų tvarkymo sistema nėra pakankamai efektyvi. Pagrindinė grandis, kuri organizuoja savo teritorijoje susidarančių komunalinių atliekų ir antrinių žaliavų tvarkymą, yra Savivaldybė. Savivaldybė atsakinga už šių atliekų tvarkymo sistemos sukūrimą ir valdymą – reglamentavimą, plėtojimą ir administravimą. Tačiau atlikta analizė parodė, kad antrinių žaliavų tvarkymo sistemos valdymas yra nepakankamai efektyvus... [toliau žr. visą tekstą] / Master's work evaluated the processing of secondary raw material situation in Vilnius city management and management efficiency. The first chapter provides an overview of the most important municipal waste management regulations of the European Union and the Lithuanian legal acts of secondary materials are classified and discussed their management techniques; assess the institutional responsibility for waste management. The second chapter, on the basis of the Vilnius City Municipality Administration material issue in the processing of secondary raw material situation in the city of Vilnius, municipal waste management systems in the context of an overview of the city of Vilnius secondary materials system. Analyzing the collection of secondary raw materials and processing situation in Lithuania and Vilnius, evaluates the recycled material clean-up costs. The third chapter, on the basis of the survey results and interviews with municipal waste-management companies and experts in data analysis of secondary raw materials handling system, the system management and efficiency. The analysis showed that the city of Vilnius secondary raw materials handling system is not sufficiently effective. The main chains, which organizes its own territory due to municipal waste and secondary raw materials processing is the municipality. Municipality responsible for the waste management system development and management - regulation, development and... [to full text]

Bakalauro baigiamajame darbe analizuojama naujo produkto pakuotės koncepcijos tema. Bet kuri organizacija siekianti sukurti sėkmingą produktą, sprendžia ir jos pakuotės koncepcijos klausimą. Šio darbo tiriamą problemą galima apibūdinti klausimais: kokia turi būti naujo produkto pakuotės koncepcija, kuri būtų pagrindas sėkmingam prekės konkurencingumui laiduoti? Kitaip sakant, ieškoma atsakymo į klausimą, kokia turi būti priešuždegiminio preparato pakuotė, kuri geriausiai atitiktų jos potencialių vartotojų poreikius? Išanalizavus literatūrą apibrėžta pakuotės koncepcijos savoka, identifikuoti pakuotės verbaliniai, neverbaliniai elementai bei su jais susijusios pakuotės funkcijos. / Bachelor’s thesis examines what should be the concept of a new product packing. All companies which are trying to establish a successful product deals with package concept question. The analyzed issue can be characterized by the following question: what should the concept of a new product packing be to guarantee a basis for a successful competitiveness? In other words, what should be the packing of anti – inflammatory drugs that would satisfy the needs of a potential consumer? After analyzing scientific and practical literature a definition of the concept of the product was defined – to identify verbal and non – verbal elements of a product, and some of the particular functions.

This research reports for the first time conductive anodic filament reliability of copper plated-through-vias with spacing of 75 – 200 µm in thin glass fiber reinforced organic packaging substrates with advanced epoxy-based and cyclo-olefin polymer resin systems. Reliability studies were conducted in halogenated and halogen-free substrates with improved test structure designs including different conductor spacing and geometry. Accelerated test condition (temperature, humidity and DC bias voltage) was used to investigate the effect of conductor spacing and substrate material influence on insulation reliability behavior. Characterization studies included gravimetric measurement of moisture sorption, extractable ion content analysis, electrical resistance measurement, impedance spectroscopy measurement, optical microscopy and scanning electron microscopy analysis and elemental characterization using energy dispersive x-ray spectroscopy. The accelerated test results and characterization studies indicated a strong dependence of insulation failures on substrate material system, conductor spacing and geometry. This study presents advancements in the understanding of failure processes and chemical nature of failures in fine-pitch copper plated-through-vias in newly developed organic substrates and demonstrates potential methods to mitigate failures for high density organic packages.

Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008. / Includes bibliographical references.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department or Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2009. / Includes bibliographical references.

Der beschleunigte Wandel der Industriegesellschaft wird auch in den nächsten Jahrzehnten entscheidend durch technologische Innovationsprozesse beeinflusst. In diesem Bereich sind die deutschen Werkzeugmaschinenhersteller führend, was anhand der vorgestellten Innovationen zu erkennen ist. Die deutschen Hersteller haben sich als Technologieführer mit geringeren Stückzahlen positioniert während die asiatischen Hersteller vorrangig im Segment der Universalmaschinen als Massenhersteller vertreten sind. Langfristig wird es darauf ankommen, ob die einzelnen Unternehmen zu strategischen Phasensprüngen fähig sind, die angesichts der Globalisierung der Wirtschaftsstruktur zu einer wettbewerbsfähigen Technologiekultur führen. Im Hinblick auf diese Anforderungen ist insbesondere die Beschleunigung der Entwicklungsprozesse eine wesentliche Voraussetzung für die Beibehaltung und den Ausbau der Marktposition der global agierenden Unternehmen. [... aus der Einleitung]