Thesis (MScEng (Mechanical and Mechatronic Engineering))--University of Stellenbosch, 2011. / Please refer to full text to view abstract. / Imported from http://etd.sun.ac.za. / np2011

The purpose of this thesis was based on visual rhetoric theory to examine how design agencies experience the design of over-the-counter drug packaging, what challenges they face, and with which rhetorical appeals they convince consumers, while they relate to the non-art-related conditions, the Swedish Medical Products Agency’s regulations (SMPA). The objective was based on previous research that has begun a discourse on the phenomenon and that designers previously has expressed a lack of dialogue in the graphic expression of over-the-counter drug packaging with the SMPA. To investigate the phenomenon semi-structured interviews was conducted with six professions of five different design agencies whose area of expertise was health and pharmaceutical communication. The results showed that the designers' biggest challenges was to find the balance between the visually attractive as well as the patient safe and reliable graphic expression. The results also showed a challenge in the absence of direct communication with the SMPA in the design process. Such communications had facilitated the process as a dialogue for the graphic expression and its effect on a patient safe packaging, had been possible. The elements in the design process that the respondents considered most essential to persuade the consumers were colors and illustrations. These elements could be widely applied without violating the rules.

Thesis (MComm)--Stellenbosch University, 2003. / ENGLISH ABSTRACT: The usage of product packaging and generation specific marketing in order to influence and persuade consumers to buy specific products are being used more often resulting packaging in being more consumer-orientated and playing an increasingly important role in enterprises' marketing communication strategies than before. In this study the dimensions of packaging are identified and the importance that the various dimensions of cosmetic packaging hold for Generation X and Yare investigated. Form, colour, graphics, brand name, words, material and size have been identified as dimensions of packaging. The Engel-Blackwell-Miniard Model for Decision-making Behaviour and the Generation Model were used as theoretical starting points for a discussion about packaging and the characteristics of Generation X and Y consumers. For the purposes of this explorative study, information has been gathered by use of a mall intercept survey. Trained fieldworkers questioned approximately five hundred respondents. The statistical processing of the data included frequency-analyses, cross tabulation as well as significance statistics. It was found that Generation X and Y consumers see the packaging, with all its different dimensions, as a single entity and that the importance of the graphic, material, brand name (as indication of quality and price), size and word dimensions of packaging are reasonably similar for men and women. Men and women, however, attach different perceptions concerning colour/s, form and brand names. There also exist statistically significant differences between the different genders, concerning the usage of most of the range of cosmetic products. Women make up the majority of users. Although the results indicate that the Generation Model can be applied to all races originating from the middle and high income and literacy groups, the usage of cosmetics products tend to differ between the races. Recommendations for further research are made. / AFRIKAANSE OPSOMMING: Bemarkers gebruik toenemend die verpakking van produkte en generasiespesifieke bemarking om verbruikers te beïnvloed en te oorreed en om hul produkte te koop. Verpakkings is gevolglik meer verbruikersgeoriënteerd en speel 'n belangriker rol in die bemarkingskommunikasie-strategie van 'n onderneming as in die verlede. In hierdie studie word die dimensies van verpakking geïdentifiseer en die belangrikheid van die onderskeie dimensies van kosmetiese verpakking vir Generasie X en Y ondersoek. Vorm, kleur, grafika, handelsnaam, woorde, materiaal en grootte is geïdentifiseer as dimensies van verpakking. Die Engel-Blackwell-Miniard model van verbruikers besluitnemingsprosesgedrag en die Generasie-model is gebruik as teoretiese vertrekpunte vir 'n bespreking oor verpakking en die eienskappe van Generasie X en Y verbruikers. Vir die doeleindes van die eksploratiewe studie is inligting ingesamel deur middel van 'n inkoopsentrumopname ("mall intercept"). Ongeveer vyfhonderd respondente is deur opgeleide veldwerkers ondervra. Die statistiese verwerking van die data sluit frekwensie-ontleding en kruistabulering in, asook beduidenheid statistiek. Daar is gevind dat Generasie X en Y verbruikers die verpakking met sy onderskeie dimensies as 'n enkele identiteit beskou en dat die belangrikheid van die grafika-, materiaal-, handelsnaam- (as indikator van kwaliteit en prys), grootte- en woorddimensie van verpakking redelik ooreenstem vir beide mans en dames. Mans en dames heg egter verskillende betekenisse aan die kleur/e en vorm van 'n verpakking en het verskillende persepsies oor handelsname. Daar bestaan ook statisties beduidende verskille tussen geslagte in die verbruik van die meeste kosmetiese produkte. Dames is die grootste verbruikers van die meeste kosmetiese produkte. Alhoewel die resultate daarop dui dat die Generasie-model op alle bevolkingsgroepe wat afkomstig is uit middel en hoër inkomste- en geletterdheidsgroepe van toepassing is, verskil die verbruik van kosmetiek tussen die verskillende bevolkingsgroepe. Aanbevelings in verdere navorsing word gemaak.

Thesis (MBA (Business Management))--Stellenbosch University, 2008. / ENGLISH ABSTRACT: Over the last few years consumers have become more environmentally focused and have transferred this pressure upwards through the supply chain to retailers and manufacturers in turn. One of the areas under scrutiny is food packaging, as this does not form part of the product being consumed or used. Packaging's primary function is to protect the contents from the time of manufacture until it is used and the environmental footprint of packaging is only a small portion of the overall food chains'. In a study conducted by Oki and Sasaki (2000) they concluded that, a shortage of packaging materials in nations with inadequate social infrastructures causes extremely heavy losses of foodstuffs. In developed countries foodstuff waste is close to 1 %, whereas in less developed countries the waste can be as high as 50% to 75%. Functional packaging contributes to minimising this waste. Packaging media are often chosen for their ability to satisfy the product's requirements, but different materials are perceived by the public to be more or Jess environmentally friendly, independent of the functional requirements. The products with the better environmental reputation are generally those that are recycled and where companies have promoted the recycling efforts. However the perception does not necessarily reflect the actual environmental impact of the product type. In many instances, when one considers all of the energy costs and pollution effects associated with a particular product's manufacture and recycling, it can have a harsher impact than a single-use product that is disposed of after use. The long term business success of companies in the packaging industry will be linked to consumer preferences for functionally suitable, environmentally friendly packaging. To determine a product's environmental effect, a Life Cycle Analysis (LCA) is often used. LCA is a quantitative procedure to assess the environmental burdens associated with the life cycle of a product, process or service. The complete life cycle of a product includes the extraction of raw materials (including water), processing, transportation, manufacturing, distribution, the use and reuse of materials, maintenance, recycling and waste disposal. (Brent, A.C.: 2003, 115). In this report LCI's were compiled for three South African product categories, selected on the basis of volume used in the consumer market and suitable comparison products being available. Having completed the LCI based on realistic packaging products and production methods, the results per category can be presented. For a functional unit comparison of two cup types, a volume of 1000 litres was used. The results show that per functional unit, expanded polystyrene cups use 27% less energy, but produce 32% more C02 emissions than paper cups. The paper cups however use 51% more water. Neither product shows a significant overall environmental benefit over the other. For a functional unit comparison of two burger boxes, a functional number of 10 000 boxes was used. The results show that per functional unit the carton board boxes use 89% more energy, produce 268% more CO2 emissions and use 239% more water. Overall, the polystyrene burger box has a lower environmental impact. For a functional unit comparison of two protein packaging trays, a functional number of 10 000 trays was used. The results show that per unit, polypropylene trays use 94% more energy, produce 197% more C02 emissions, but only use 76% of the water compared to a foamed polystyrene tray. The LCI study has produced suitable data to provide a summary where aspects of the environmental impacts of the products can be compared. This information can be used to understand and improve the environmental footprint of the products or to educate the stakeholders who are involved in the packaging decisions. The LCI results differ from similar international studies due to the importation of most raw materials and high air emissions from local electricity production. / AFRIKAANSE OPSOMMING: Verbruikers het die afgelope paar jaar baie meer omgewingsbewus geword en plaas dus al hoe meer opwaardse druk via die verskaffingsketting op kleinhandelaars en vervaardigers. Een van die areas onder verdenking is voedselverpakking, want dit vorm nie deel van die produk wat verbruik word nie. Verpakking se primere funksie is die beskerming van die inhoud daarvan vanaf vervaardiging tot dit verbruik word. Die omgewingsimpak van verpakking is slegs 'n klein gedeelte van die algehele voedselketting. Navorsing deur Oki en Sasaki (2000) toon dat 'n tekort aan verpakkingsmateriaal in nasies met skaars sosiale infrastrukture veroorsaak geweldige verliese in voedsel. In ontwikkelde lande is voedselvermorsing ongeveer 1% terwyl minder ontwikkelde lande se voedselvermorsing so hoog as 50% tot 75% is. Funksionele verpakking help om die vermorsing te verminder. Verpakkingsmedia word dikwels gekies vir hul vermoee om aan die produk se vereistes te voldoen, maar verskillende materiale word onafhanklik van hul funksionele vereistes deur die publiek as meer of minder omgewingsvriendelik beskou. Die produkte met die beter omgewingsvriendelike reputasie is gewoonlik die wat herwin word en ook waar die herwinningspogins deur die maatskappye bemark word. Die persepsie weerspieel egter nie noodwendig die eintlike omgewingsimpak van die produktipe nie. Dit gebeur dikwels dat wanneer al die energiekostes en besoedelingsgevolge wat met die vervaardiging en herwinning van 'n spesifieke produk in ag geneem word, dit 'n erger impak as 'n produk wat slegs eenmalig gebruik en dan weggegooi word, het. Die langtermyn sukses van maatskappye in die verpakkingsindustrie sal gekoppel word aan verbruikersvoorkeure vir funksionele gepaste, omgewingsvriendelike verpakking. 'n Lewensiklus Analise word dikwels gebruik om 'n produk se omgewingsimpak te bepaal. Dit is 'n kwantitatiewe prosedure wat die omgewingslaste wat met die lewensiklus van ' n produk, proses of diens verband hou assesseer. Die volledige lewensiklus van 'n produk sluit die ekstraksie van rou materiaal (water ingesluit), prossesering, vervoer, vervaardiging, verspreiding, die gebruik en hergebruik van materiaal, instandhouding, herwinning en afval verwydering in (Brent. A.C.: 2003. 115). In hierdie verslag word die Lewensiklus Analise van drie Suid-Afrikaanse produkkategoriee saamgestel. Die kategoriee is geselekteer op grond van die volume gebruik in die verbruikersmark en ook die gepaste vergelykbare produkte wat beskikbaar is. Nadat die Lewensiklus Analise afgehandel is, gebaseer op realistiese verpakkingsprodukte en produksiemetodes, is dit moontlik om die resultate per kategorie voor te stel. 'n Volume van 1000 liter was gebruik vir die funksionele eenheidsvergelyking van twee houertipes. Die resultate toon dat, per funksionele eendheid, die polistireen houers 27% minder energie verbruik, maar dit produseer 32% meer C02 uitlatings as papierhouers. Die papierhouers gebruik egter 51 % meer water. Nie een van die produkte toon egter 'n beduidende algehele omgewingsvoordeel oor die ander nie. 'n Funksionele nommer van 10000 houers was gebruik vir 'n funksionele eenheidssvergelyking van burgerhouers. Die resultate wys dat die kartonhouers, per funksionele eeheid, 89% meer energie verbruik, 268% meer C02 uitlatings produseer en 239% meer water gebruik. Die polistireen bugerhouer het oor die algemeen 'n laer omgewingsimpak. 'n Funksionele nommer van 10 000 houers is gebruik vir die funksionele eenheidsvergelyking van twee protiene verpakkinghouers. Die resultate toon dat, per eenheid, polypropylene houers 94% meer energie verbruik, 197% meer C02 uitlatings produseer, maar net 76% water gebruik in vergelyking met die polistireen houer. Die Lewensiklus eenheidsvergelyking het gepaste data voorsien wat 'n opsomming verskaf waar die aspekte van die omgewingsimpak van die produkte vergelyk kan word. Hierdie inligting kan gebruik word om die omgewingsinvloed van die produkte te verstaan en te verbeter en ook om die deelnemers betrokke by die verpakkingsbesluite op te voed. Die Lewensiklus Analise resultate verskil van soortgelyke internasionale studies as gevolg van die invoer van die meeste rou materiale en groter lug besoedeling van plaaslike elektrisiteitsproduksie.

As the microelectronic industry moves toward stacking of dies to achieve greater performance and smaller footprint, there are several reliability concerns when assembling the stacked dies on current organic substrates. These concerns include excessive warpage, interconnect cracking, die cracking, and others. Silicon interposers are being developed to assemble the stacked dies, and then the silicon interposers are assembled on organic substrates. Although such an approach could address stacked-die to interposer reliability concerns, there are still reliability concerns between the silicon interposer and the organic substrate. This work examines the use of diced glass panel as an interposer, as glass provides intermediate coefficient of thermal expansion between silicon and organics, good mechanical rigidity, large-area panel processing for low cost, planarity, and better electrical properties. However, glass is brittle and low in thermal conductivity, and there is very little work in existing literature to examine glass as a potential interposer material. Starting with a 150 x 150 mm glass panel with a thickness of 100 µm, this work has built alternating layers of dielectric and copper on both sides of the panel. The panels have gone through typical cleanroom processes such as lithography, electroplating, etc. Upon fabrication, the panels are diced into individual substrates of 25 x 25 mm and a 10 x 10 mm flip chip with a solder bump pitch of 75 um is then reflow attached to the glass substrate followed by underfill dispensing and curing. The warpage of the flip-chip assembly is measured. In parallel to the experiments, numerical models have been developed. These models account for viscoplastic behavior of the solder. The models also mimic material addition and etching through element “birth-and-death” approach. The warpage from the models has been compared against experimental measurements for glass substrates with flip chip assembly. It is seen that the glass substrates provide significantly lower warpage compared to organic substrates, and thus could be a potential candidate for future 3D systems.

One of the main challenges in the electronics manufacturing and packaging development is how to integrate more functions inside the same or even smaller size. To meet the demand for higher integration, the interest toward passive and active component embedding has been increasing during the past few years. One of the main reasons for the growing interest toward embedded active components, in addition to demand for higher packaging density, is the need for better electrical performance of the component assemblies. However, it is little known how embedded IC and passives affect the reliability of IC packaging. Solder joints have been used in the electronic industry as both structural and electrical interconnections between electronic packages and printed circuit boards (PCB). When solder joints are under thermal cyclic loading, mismatch in coefficients of thermal expansion (CTE) between the printed circuit boards and the solder balls creates thermal strains and stresses on the joints, which may finally result in cracking. Consequently, the mechanical interconnection is lost, leading to electrical failures (such as hard/intermittent open, parametric failure), which in turn causes malfunction of the circuit or whole system. When a die is embedded into a substrate, Young's modulus of the die is larger than one of the core of the substrate and the CTEs of the die is smaller than those of the substrate. As a result, mismatch in coefficients of thermal expansions (CTE) between the substrate with the embedded device and the solder balls may increase. In the present study, the stress of chip scale packages (CSP) with an embedded die under thermal cycling conditions is evaluated using the finite element method. The viscoplastic model for solders including matrix dislocation mechanism and grain boundary sliding model developed by Yi et al. (2002) is employed.

To explore the potential of packaging design structures in menswear. While packaging design and fashion design are two distinctively different fields,their methodologies are distinctively similar.To compare packaging and garment design is therefore to compare their development process and purpose in terms of structure, material, color and print, as well as aspects concerning production and marketing. Both fields aim to create designs that are functional as well as aesthetically pleasing within their particular context; the fundamental contextual difference being that packaging is conceived for a product and garments conceived for a body. Focusing on structure, both packaging and fashion design may use product templates to facilitate mass production. In fashion design these templates are called construction patterns; in packaging design templates are called packaging nets or development nets. Both construction patterns and packaging nets are 2-d structures that gain a three dimensional form according to a construction system, e.g. constructing a box from a flat element using folding techniques. For this bachelor degree work the aim is to explore the potential of packaging design structures in menswear. The result is a lineup of outfits generated by the adoption of packaging nets as construction patterns for garments. Since the outfits are created using packaging design principles and methods, they challenge the contextual distinction both between garment and packaging, and between body and product. By considering garments as packaging for the body, the collection blurs the line between fashion design and packaging design. I believe that the intersection of these two branches of design allows us not only to discover new forms of expression and construction, but also to gain a new perspective on fashion design practice. In addition to structural properties, by also considering the graphic aspect of packaging design, this collection highlights the importance of product differentiation and thus serves as a starting point for future fashion experiments with product branding. / Program: Fashion Design

Les travaux présentés dans cette thèse sont une contribution à l'étude d'antennes reconfigurables à base de MEMS en intégration hétérogène 3D pour les systèmes de communication millimétriques. Ces travaux de thèse s'inscrivent dans le cadre d'un projet ANR nommé SIPCOM (Intégration hétérogène 3D (System-In-Package) pour objets communicants en gamme millimétrique), qui concerne l'intégration hétérogène d'un microsystème intelligent communicant à 60GHz. Au cours de ce manuscrit, nous proposons la réalisation d'antennes sur membrane selon 3 technologies. Dans un premier temps, une nouvelle technologie simple et bas coût basée sur un empilement de FR4 et de Pyralux ainsi qu'un nouveau concept d'antenne patch sur membrane alimentée par un guide d'onde intégré via une fente de couplage sont présentés. Dans un second temps, ce nouveau concept d'antenne a été adapté afin de pouvoir l'intégrer au module SiP réalisé en technologie Silicium / BCB. Enfin, la troisième technologie basée sur des substrats de quartz permet de démontrer la faisabilité d'une antenne à balayage électronique pour laquelle chaque excitateur est intégré dans le design d'un déphaseur à base de MEMS permettant de s'affranchir des interconnexions par bonding entre le déphaseur et la partie antennaire. / The work presented in this PhD thesis is a contribution for the study of reconfigurable antennas based on MEMS integration for 3D heterogeneous millimeter communication systems. This study falls within the framework of a ANR project named SIPCOM, for heterogeneous integration of smart millimeter communicating systems. During this manuscript, we propose the implementation of membrane antennas with three technological processes. Firstly, a new simple and low cost technology based on FR4 and Pyralux substrates and a new concept of patch antenna fed by integrated waveguide are investigated. In a second time, this new antenna design has been matched in order to be integrated in the SIP module using Silicon/BCB technology. The third technology based on quartz substrates is used to demonstrate the feasibility of an electronic beamscanning antenna for which one each slot feeder is integrated into the design of the MEMS phase shifter to overcome the bonding interconnections between the phase shifter and the antenna.

Afin de répondre aux exigences industrielles, aux besoins environnementaux ainsi qu’aux contraintes de fonctionnement, les composants électroniques doivent être protégés et interconnectés avec les autres éléments du système. Cette étape est appelée « Packaging ». Cependant, les technologies de packaging classiques, telles que le scellement de boitier, le brasage ou le moulage, sont généralement limitées au niveau de la géométrie du boitier, des interactions matières et ont un impact significatif sur le coût et la complexité de l’encapsulation. De plus, ces techniques sont peu évolutives au cours du développement de produit. En effet, la technique de packaging doit être définie dès le début de la conception du produit, en fonction du composant à encapsuler et des performances attendues. Le choix du mode d’encapsulation conditionne ainsi le processus de réalisation et d’assemblage du système.Dans cette thèse, une nouvelle approche du packaging, plus simple, plus flexible et moins coûteuse, est présentée. La fabrication additive, plus connue sous le nom d’impression 3D, permet de construire un packaging personnalisé, parfaitement adapté aux dimensions et spécifications des composants. Cette approche, simplifie le procédé d’encapsulation en fusionnant les différentes étapes de fabrication du boitier, de mise en place et d’étanchéité. De plus, elle permet également d’encapsuler facilement des composants déjà existants (composant sur étagère, du commerce).Afin de valider la faisabilité d’un packaging directe par fabrication additive, cette étude s’est tenue à un objectif principal : comprendre les mécanismes d’adhésion physico-chimiques (mécanique, chimie, …) mis en jeu entre un polymère ABS imprimé par fabrication additive et un substrat. Pour cela, plusieurs axes de recherches ont été développés, tels que :- Le choix du procédé de fabrication additive, basé sur l’adhésion du polymère imprimé sur substrat et la résolution du procédé. Cet axe, nous a permis de sélectionner la stéréolithographie (technique de fabrication reposant sur la polymérisation localisée de résine spécifique, réactive aux UV).- Les mécanismes d’adhésion entre un polymère ABS et un substrat. Cet axe, basé sur la connaissance des matériaux, leurs caractérisations chimiques ainsi que la caractérisation physique de l’adhérence, a permis de comprendre les mécanismes d’adhésion mis en jeux lors d’une impression directe sur substrat.- Des études pour améliorer l’adhérence, basées sur différentes chimies (organique, métalliques, inorganique) et topographies de surfaces (rugosité de surfaces, texturations de surfaces réalisées par découpe partielle ou gravure).- La réalisation d’un démonstrateur opérationnel, basé sur l’encapsulation directe d’une puce avec un routage conducteur et des interconnexions électriques. Cet axe nous a permis de valider la compatibilité de l’encapsulation par impression 3D avec un composant électronique.En conclusion, notre étude démontre que l’encapsulation des dispositifs de microélectronique à base de silicium peut être réalisée par de nouvelles techniques, notamment celles de fabrications additives. / In order to answer to industrial requirements and to withstand environment and functioning stresses, electronic components have to be packaged. State of the art of packaging technologies, such as lid sealing, brazing and molding, usually presents shape limitations, material issues and significant cost impact. Moreover, those technics have to be specified at the beginning of the product design in order to fit with the whole package and assembly processes, without decreasing the device performances.A new approach used to build a specific packaging allowing flexibility, simplicity and cost competitiveness is presented. Using the polymer additive manufacturing, more usually known as 3D printing, we propose to build customized structures and packages perfectly fitting with component dimensions and specifications. This approach simplifies the packaging process by merging the steps of package manufacturing, die encapsulation onto its substrate, and sealing. Moreover, it permits to easily package and encapsulate components off-the-shelf.In order to validate the feasibility of direct packaging by additive manufacturing, this study focused on a main objective: to understand the physical and chemical adhesion mechanisms (mechanics, chemistry, ...) involved between an ABS polymer printed by additive manufacturing and a substrate. For this, several research axes have been developed, such as :- The choice of additive manufacturing process, based on the adhesion of the printed polymer on the substrate and the resolution of the process. This axis allowed us to select the stereolithography process (manufacturing technique based on polymerization of specifics UV-reactive resins).- The adhesion mechanisms between an ABS polymer and a substrate. This axis, based on materials knowledge, their chemical characterizations and physical characterization of the adhesion, leads us to understand the adhesion mechanisms that occurred during a direct printing on substrate.- Studies to improve adhesion, based on different chemistries (organic, metallic, inorganic) and surfaces topographies (roughness, surface patterns obtained by partial dicing or chemical etching).- The realization of an operational prototype, based on the direct encapsulation of a chip with a conductive routing and electrical interconnections. This axis allowed us to validate the compatibility of 3D printing encapsulation with an electronic component.In conclusion, our study demonstrates that the encapsulation of silicon-based microelectronic devices can be achieved by new techniques, including additive manufacturing.

Xenos Ltd. is a technology driven food company, that specializes in aseptic processing and packaging beverage products in bottles. Their aseptic filling technology is based on packaging sterilization with combined treatments of oxidizing agents and Ultraviolet radiation. Recent research studies have suggested that there is a synergistic effect of hydrogen peroxide (0.5 – 1 %) plus UV on inactivation of microorganisms including spores. Advantages of the combined treatment include rapid inactivation, minimum hydrogen peroxide residue in products, with the method being applicable to a wide range of packaging types. Based on this principle, a unique aseptic packaging technique has been developed by Xenos Ltd., which utilizes the combination of vaporized Perform (a commercial sterilizing agent manufactured by Orica Chemnet containing 25% hydrogen peroxide and 5% peracetic acid) and UV radiation at 7.5 – 12.5 W/m2. The aim of the project was to improve and validate the effectiveness of the packaging sterilization process through challenge tests. Challenge tests were conducted using Bacillus subtilis spores as the test microorganism to determine the log reductions delivered by the packaging sterilization system. The tests were firstly carried out on a pilot plant scale aseptic filling machine, in order to test the sterility of the small scale system, and investigate processing parameters (operational conditions) which could affect and improve sterility. The established operational conditions for achieving target sterility were used for designing and modifying an upgrade aseptic packaging system. Finally validation of the upgrade packaging sterilization system was conducted through challenge tests to prove sterility. It is highly recommended that in order to ensure sterility, the packaging sterilization system with vaporized Perform plus UV treatment must meet the requirements listed below during the sterilization process:  Hydrogen peroxide concentration of Perform condensate on bottles (after steaming) is best within 0.5 – 1 %;  Perform loading level should be minimum 300 mg/bottle after vaporized Perform treatment;  UV treatment time applied is greater than 2 seconds during UV treatment;  At least 20 seconds of penetration time (time between Perform treatment and UV treatment) should be allowed. The upgrade sterilization system used by Xenos Ltd. has been improved to meet the above operational conditions. With spore loading level of 106 per bottle and 105 per cap, the system is able to deliver at least a 6 log reduction of B. subtilis spores on PET or glass bottles and a 5 log reduction on bottle caps. Moruzzi et al. (2000) stated that at least a 4 log reduction is commercially required for an aseptic packaging process. Therefore, the system’s sterility would meet the commercial acceptable sterility.