Abstract The demands toward the development of simple and cost-effective fabrication methods of metallic structures with high lateral resolution on different substrates - applied in many fields of technology, such as in microelectronics, optoelectronics, micromechanics as well as in sensor and actuator applications - gave the idea to perform this research. Due to its simplicity, laser-assisted chemical liquid-phase deposition (LCLD) has been investigated and applied for the metallization of surfaces having practical importance (Si, GaAs, SiO2, Si3N4, etc.) since the beginning of the 80s. By the invention of novel substrates (polyimide, porous silicon), it was adequate to work out new precursors or just adopt old ones and optimise LCLD in order to fabricate metallic micro-patterns upon these materials for various purposes. According to the motivations mentioned above, LCLD was utilized for the fabrication of palladium (Pd) micro-patterns on polyimide (PI), polyimide/copper flexible printed circuit boards (PCBs), fused silica (SiO2) and silicon (Si). The selective metallization of porous silicon (PS) has been carried out with nickel (Ni). Depending on the types of lasers, either the focusing (Ar+ laser beam) or diaphragm projection (KrF and XeCl excimer laser pulses) method was employed. In the course of the work, various precursors of the corresponding metals have been investigated and utilized. In the beginning, the pyrolytic decomposition of palladium-amine complex ions ([Pd(NH3)4]2+) on PI by a scanned and focused Ar+ laser beam was optimised and discussed. Thick (up to several micrometers) and narrow (~ 10 μm) Pd conductor lines with electrical conductivity close to that of the bulk were obtained. In the continuation of these investigations, the precursor was developed further. [Pd(NH3)4]2+ was mixed with the solution of formaldehyde (HCOH) in order to induce the reduction of the metal complex ions. To our knowledge, we were the first - so far - who applied this solution and described the reaction. With the proper choice of the laser parameters, thin Pd films as catalyst layers for electroless copper plating were deposited utilizing Ar+ and excimer lasers as well. The chemically plated copper deposits - upon the obtained Pd film - have excellent electrical and good mechanical properties. In the second part of the thesis, three practical applications (metallization of via holes drilled in PI/Cu flexible PCBs, end-mirror fabrication on single-mode optical fibers, and carbon nanotube growth on Pd activated Si and Si/SiO2 substrates) of Pd LCLD were realized. The previously presented [Pd(NH3)4]2+ and [Pd(NH3)4]2+/HCOH precursors were employed for creating the catalyst Pd layers for the carbon nanotube chemical vapor-phase deposition and for the autocatalytic electroless chemical copper plating, respectively. Finally, a simple novel method was introduced for the area-selective metallization of PS. Since the surface of PS reduces spontaneously most metals from their aqueous solutions, it is difficult to realize localized metal deposition from liquid-phase precursors on it. We proposed the application of a stable Ni plating bath from which the metal deposits only when the PS is irradiated with photons having wavelength shorter than 689 nm, thus making possible an area-selective laser-assisted metal deposition. The deposited metal structures and patterns were analysed by field emission scanning electron microscopy (FESEM) equipped with energy dispersive spectrometer (EDS), by the milling and imaging modes of a focused ion beam system (FIB), optical microscopy, profilometry, resistance, and by reflectance measurements.

This research focuses on developing a model to predict the yield of a printed circuit board manufactured on a given assembly line. Based on an extensive literature review as well as discussion with industrial partners, it was determined that there is no tool available for assisting engineers in determining reliable estimates of their production capabilities as they introduce new board designs onto their current production lines. Motivated by this need, a more in-depth study of manufacturing yield as well as the electronic assembly process was undertaken. The relevant literature research was divided into three main fields: process modeling, board design, and PCB testing. The model presented in this research combines elements from process modeling and board design into a single yield model. An optimization model was formulated to determine the fault probabilities that minimize the difference between actual yield values and predicted yield values. This model determines fault probabilities (per component type) based on past production yields for the different board designs assembled. These probabilities are then used to estimate the yields of future board designs. Two different yield models were tested and their assumptions regarding the nature of the faults were validated. The model that assumes independence between faults provided better yield predictions. A preliminary case study was performed to compare the performance of the presented model with that of previous models using data available from the literature. The proposed yield model predicts yield within 3% of the actual yield value, outperforming previous regression models that predicted yield within 10%, and artificial neural network models that predicted yield within 5%. A second case study was performed using data gathered from actual production lines. The proposed yield model continued to provide very good yield predictions. The average difference with respect to the actual yields from this case study ranged between 1.25% and 2.27% for the lines studied. Through sensitivity analysis, it was determined that certain component types have a considerably higher effect on yield than others. Once the proposed yield model is implemented, design suggestions can be made to account for manufacturability issues during the design process. / Master of Science

Det här projektet har utförts i samarbete med företaget Eskilstuna Elektronikpartner AB (EEPAB). Företaget arbetar med tillverkning av kretskort där de använder sig av ytmontering och hålmontering. Vissa mönsterkort kan vara böjda och kan därmed orsaka problem i Surface Mount Device (SMD)-linan. Syftet med projektet var att ta fram en fixtur som gör mönsterkorten planare vilket innebär att minska höjdskillnaden mellan högsta och lägsta punkten på korten. Detta för att effektivisera och förhindra stopp i produktionen. Två forskningsfrågor togs fram som fungerade som ett stöd under projektets gång: F1:Hur förbättras produktionen i en SMD-lina när mönsterkorten hålls plana? F2:Vilka faktorer bör beaktas när en fixtur tas fram för en SMD-lina? Projektet har följt en produktutvecklingsprocess där fokuset har legat på konceptstadiet. Data har samlats in genomen litteraturstudie, intervjuer samt ett formulär. Projektet resulterade i ett slutgiltigt koncept i form av en fixtur. Resultatet i projektet visar att genom att spänna fast mönsterkortets kortsidor så minskas nedböjningen. Genom planare mönsterkort minskas risken för fel mängdapplicering av lödpasta som i sin tur kan orsaka kortslutning eller en öppen slutning. Att problemen med fel mängd lödpasta minskas leder även till att manuellt arbete som tvättning och applicering av lödpasta kan reduceras. När lödpasta appliceras för hand är det även svårt att veta om rätt mängd har applicerats, detta kan även leda till problem under lödningen. Sedan kan det konstateras att designen av fixturen måste samspela med alla maskiner i SMD-linan för att inte orsaka problem eller hindra maskinerna från att utföra dess arbete. Utifrån ett koncepttest visade det sig att det framtagna konceptet gör mönsterkorten cirka 42% planare. Detta bör kunna minska problemen i SMD-linan och spara in tiden det tar att åtgärda dessa problem. Koncepttestet utfördes inte i den rätta maskinen och måste därmed undersökas ordentligt. Det var endast ett sorts mönsterkort som testades, dessa faktorer är exempel på felkällor. I framtiden bör ett flertal olika mönsterkort testas för att få en högre reliabilitet. Det behövs även tas fram en exakt tolerans för när mönsterkorten är för böjda och problem uppstår. I dagsläget finns endast maskinens egentolerans som inte stämmer särskilt bra och en generell tolerans för SMD-linor.

Denna rapport utreder möjligheten till en mönsterkortslösning för en kabelbaserad kraftenhet. Denna kraftenhet är en låda som består av flera komponenter som exempelvis kraftenheter för 24V, 100V, filter och motorstyrkort för två axlar samt kraftfördelning. Kablarna i enheten är tidskrävande och dessutom kostsamma. Därför har enheten idag både hög produktionskostnad och produktionstid. Kablarna tillför, utöver höga kostnader, risk för störningar och p.g.a. mängden kablar ökar svårigheten att felsöka enheten. Simuleringar har genomförts med LT-Spice för olika RC-filter för styrsignalerna i kraftenheten. Vidare har ett kretsschema konstruerats baserat på ritningen av lådan och alla kablar som ska reduceras och hanteras av mönsterkortet. Med kretsschemat skapades en layout för mönsterkortet. Denna layout representerar alla komponenter och hur kopparledningarna ska placeras. Det ledde till att mönsterkortet utvecklades som en möjlig lösning till kraftenheten. / This report investigates the possibility for a PCB (Printed circuit board) solution for a cable-based power unit. This power unit is a box which contains multiple components as for example power units for 24v, 100v, filter and motor control boards fort wo shafts and power supply. The cables in the unit are complicated and hard to construct and also expensive. Therefore, the unit has a high production cost and high production time. Besides high costs the cables also add risks for interference and because of the amount of cables it also raises the difficulty to debug the unit. Simulations have been done with LT-Spice for constructions of different RC-filters for the steering signals in the power unit. Furthermore, a circuit diagram has been drawn based on the drawing of the power unit and all the cables that are to be reduced and handled by the circuit board. The circuit board layout was designed based on the circuit diagram. Which led to a circuit board being developed as a possible solution for the power unit.

ITC/USA 2005 Conference Proceedings / The Forty-First Annual International Telemetering Conference and Technical Exhibition / October 24-27, 2005 / Riviera Hotel & Convention Center, Las Vegas, Nevada / This paper discusses using the CAN (Control Area Network) Bus protocol for control and status of flight test data acquisition systems. The application of the CAN (Control Area Network) on an F/A-18 aircraft will be discussed in detail.

The main purpose of this thesis was to develop a printed circuit board for Autoliv Electronics AB. This circuit board should be placed in their test equipment to support some of their camera vision systems used in cars. The main task was to combine the existing hardware into one module. To be able to achieve this, the most important factors in designing a printed circuit board was considered. A satisfying power distribution network is the most crucial one. This was accomplished by using decoupling capacitors to achieve low enough impedance for all circuits. Calculations and simulations were executed for all integrated circuits to find the correct size and numbers of capacitors. The impedance of the circuit board was tested with a network analyzer to confirm that the impedance were low enough, which was the case. System functionality was never tested completely, due to delivery problems with some external equipment.

A geração global de resíduo eletrônico (REEE) cresce a uma taxa de cerca de 40 milhões de toneladas por ano. Este constante incremento na geração dos REEEs somado às recentes legislações tem impulsionado pesquisas focadas no desenvolvimento de processos para recuperação de materiais e sustentabilidade da indústria eletroeletrônica. Dentro destes resíduos encontram-se as placas de circuito impresso (PCIs) que estão presentes na maioria dos EEEs, têm composição heterogênea que varia conforme a fonte, país de proveniência e época, e tecnologia de fabricação. Assim, este trabalho teve por objetivo a realização de rota hidrometalúrgica (extração sólido/líquido) e biohidrometalúrgica para reciclagem de placas de circuito impresso provenientes de impressoras visando a recuperação de cobre. Para tanto fez-se inicialmente a caracterização da PCI e o desenvolvimento de uma rota combinada de processamento físico seguida por processo hidrometalúrgico ou biohidrometalúrgico. O processamento físico e de caracterização foi composto por etapas de cominuição, separação magnética, classificação granulométrica, visualização em lupa binocular, microscópio eletrônico de varredura acoplado com detector de energia dispersiva de raios X (MEV/EDS), digestão ácida, perda ao fogo e análise química por AAS e ICP. Já, o processamento hidrometalúrgico foi composto por duas etapas de extração sólido/líquido: a primeira em meio sulfúrico e a segunda em meio sulfúrico oxidante. Para os ensaios de biolixiviação utilizou-se uma cepa bacteriana composta por 3 espécies microbianas: Acidithiobacillus ferrooxidans, Acidithiobacillus thiooxidans e Leptospirillum ferrooxidans. Verificou-se que a placa possui 4 camadas de Cu intercaladas por fibra de vidro, é lead free e seus componentes representam 53,3 % do seu peso. A porcentagem em massa correspondente ao material não magnético é de 74,6 % e do magnético 25,4 %. Os materiais moído e não magnético apresentaram tendência em se acumular nas frações mais grossas. Já na fração magnética, o acúmulo do material ocorreu na fração mais fina (0,053 mm). A separação dos metais através de classificação granulométrica não foi possível. A PCI estudada é composta por: 44% de metais, 28,5 % de polímeros e 27,5 % de cerâmicas. Sendo: Ag-0,31 %; Al3,73 %; Au0,004 %; Cu 32,5 %; Fe1,42 %; Ni0,34 %; Sn0,96 % e Zn0,64 %. A extração de Cu no processamento hidrometalúrgico foi de 100 % e o fator de recuperação 98,46 %, o que corresponde a uma recuperação de 32 kg de Cu em 100 kg de PCI. Já no processamento biohidrometalúrgico, a extração de Cu alcança 100 % quando utilizados 2 % de densidade de polpa e 100 % de inóculo. O fator de recuperação é de 100 % e a recuperação de Cu em 100 kg de PCI é de 32,5 kg. O processamento hidrometalúrgico apresenta como vantagens quando comparado ao biohidrometalúrgico: menor tempo de extração (8 h versus 4 dias); seletividade de Cu; maior densidade de polpa (10 % versus 2 %). Já a biolixiviação utiliza menor temperatura de trabalho (36 ºC versus 75 ºC) e dispensa a etapa de separação magnética. / The increase in the generation of waste electrical and electronic equipment (WEEE), 40 tons per year, allied with the enactment of new laws encouraged researches focused on the developing of processes to reclaim materials and on the sustainability of the electrical and electronics industry. Whithin the WEEEs, printed circuit boards (PCB) composition is heterogeneous and varies according to several factors, including: kind of EEE, when and where it was produced and fabrication technology. The goal of this work is to perfom a hydrometallurgical route (solid/liquid extraction) and a biohydrometallurgical route to recycle PCB from discarded printers aiming the recovery of copper. To do so, the first step is to characterize the PCB and the development of a combined fisical processing followed by hydrometallurgical and biohydrometallurgical routes. The fisical and the characterization processes, in that order, consisted on griding, magnetic separation, granulometric screening, visual assessement by binocular magnifier, scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM/EDS), acid digestion, loss on fire, and chemical analyzes by AAS and ACP-OES. The hydrometallurgical stage consisted on two steps: solid/liquid extraction by sulfuric acid leaching and solid/liquid extraction by sulfuric acid leaching with an oxidizing agent. The bioleaching tests used a mixed bacterial strain: Acidithiobacillus ferrooxidans, Acidithiobacillus thiooxidans and Leptospirillum ferrooxidans. The results showed that PCB consisted on 4 layers of copper and fiber glass, not possesing lead (leadfree) on its composition and its components constitute 53.3 % weight percentage. The non-magnetic fraction (NMA) weight percentage represents 74.6 %, the magnetc fraction (MA) represents 25.4 %. The grinded material and the non-magnetic fraction presented an inclination to build up on thickest fractions. On the magnetic fraction this behavior occurred on the thinnest fraction (0.053 mm). The metal separation using granulometric screening was not possible and the visual assessement by binocular magnifier was conclusive for this research. The composition of the studied PCB is: 44 % metal, 28.5 % polymer and 27.5 % ceramics. Beeing: Ag-0.31 %, Al-3.73 %, Au-0.004 %, Cu-32.5 %, Fe-1.42 %, Ni-0.34 %, Sn-0.96 %, Zn-0.64 % and other metals-4.10 %. Copper extraction in the hydrometallurgical process achieved 100 % and the recuperation factor 98.46 %, which means a recovery of 32 kg of copper in 100 kg of PCB. However in biohydrometallurgical process, the copper extraction reached 100 % on the forth day using a 2 % pulp density and 100 % inoculum. The recuperation factor achieved 100 % and, therefore, copper recovery in 100 kg of PCB is equivalent to 32.5 kg. The hydrometallurgical processing has many advantages compared to the biohydrometallurgical processing: a smaller extraction time (8 h versus 4 days); Cu selectivity; higher pulp density (10 % versus 2 %). However, bioleaching uses an inferior working temperature (36 ºC versus 75 ºC) and dont require magnetic separation.

Electromagnetic compatibility remains an important topic in the design and manufacturing of printed circuit boards (PCBs). Compatibility of these devices with their surroundings is becoming increasingly difficult as a modern PCB can have hundreds or thousands of parts, operating on many layers, and all at high speed. One such part is a via and its clearance, or via hole, commonly required in multilayer circuits where vertical connections between layers are used. The via hole may be exposed to large electromagnetic fields within the PCB. Although electrically small, the via hole provides a pathway for the fields to excite the exterior, either directly or through coupling to adjacent structures. To quantify this process, the near fields and radiation of an excited via hole are analysed, and are the focus of this thesis. The near fields of the via hole are first decoupled into electric and magnetic fields of the 'static' type. In both cases a series solution for two regions, one outside, and one inside the layers is constructed. The coefficients of the terms of the series are chosen to best satisfy the boundary behaviour of the fields on the conducting surfaces and across the hole. The criteria for assessing quality of the solution is based on the least squares method (LSM). Linear equation systems for both models are derived, and as no numerical integration or discretisation is required, an efficient and robust implementation to find the near fields is developed. Transformation into the far field is then achieved through surface integration of relevant field quantities close to the via hole. The far fields are best viewed as that due to two dipoles, of the magnetic and electric type, with strength and orientation depending on how the via hole is excited. It is shown that the two dipole model is sufficient to find the radiation from a 1mm diameter via hole at a frequency up to 8 GHz. Of further interest is how the choice of via hole dimensions affects the dipole moments and the near fields solved earlier are a key to this understanding.

The purpose of this study is to analyze the current situation and trend over Taiwan's Specialty Chemicals of Printed Circuit Board industry. In addition, this study explores the optimal management strategy through competitive strategy theory and case study, and proposes suggestions on management stratedy to Specialty Chemicals of Printed Circuit Board industry. The key success factors were summarized from literature review and analysis of current industry status. By using these factors as variables to design the questionnaire and conducting the survey with in-depth interview, following concousions were made from the study. 1.The business advangate of Taiwan Specialty Chemicals of Printed Circuit Board industry includes the well-developed finance and stable capital support, great R&D ability, stable quality sandard, outstanding customer and after-sale service, plenty talent person for management and technology, and excellent enterprise culture. 2.Key factors affecting the competiveness among the Taiwan Specialty Chemicals of Printed Circuit Board industry are as follows. (1)Suppliers: product quality and the ability of problems solving and readily answering form suppliers. (2)Customers: identification with the brand quality and the bargaining power and purchasing amount of customers. (3)New entrants: distinctive product and technology, product differentiation and cost advantage. (4)Substitute products: function, quality, price, switching cost and R&D ability of substitute products. (5)Competitive rivalry: switching cost of customers, the integral industry growth rate and the integral actual strength of competitors. 3.The study suggests the Taiwan Specialty Chemicals of Printed Circuit Board industry to adopt the following competitive strategy. (1)Cost leadership strategy: to seek for suppliers with lower supplying cost, stable suppling and lower manpower cost. (2)Differentiation strategy: product innovation and quality. (3)Growth strategy: vertical intergration of upstream to downstream manufacturering partners and discriminiate market development.

ABSTRACT In recent years China's rapid rise and low-cost advantages, has brought the greatest impact on the printed circuit board industry, low-cost competition for the majority of Taiwanese companies are not strengths, combined with the financial crisis began in 2008, followed by 2009, the world consumer electronics market tightening, are tested in Taiwan for the production of printed circuit board industry base in the viability of manufacturers. In this study, through the study of Taiwan as a production base in case the printed circuit board companies, in the face of financial crisis in 2008, and follow-up to internal and external changes in the industry and the growth and decline of national competitiveness, the restructuring strategy is adopted to overcome the external environmental challenges of rapid change, which concludes with Taiwan as a production base of the printed circuit board industry, in the face of financial turmoil and economic environment changes and the overall production of cross-strait ECFA signed, to the advantage of strengths and talents of Taiwan culture resources, so printed circuit board manufacturing industry can continue to Taiwan as a production base, more competitive challenges towards internationalization. In this study, the research method is qualitative research in the case study method, the scope of the production base of a Taiwanese printed circuit board industry, the use of literature survey and data compilation, and the case company interviews, and data collation, the first stage first motive of enterprise transformation, analysis and use of five forces analysis and diamond model to understand the background and conditions of business transformation, the second stage, the case company interviews, SWOT analysis summarized the case company and the feasibility assessment and develop transformation strategies, and understanding of the transformation strategy of the key success factors. The study concludes on the hope that the production base in Taiwan for the printed circuit board industry in the face of changing external environment when assessing the feasibility of transformation strategy and development, and further development of Taiwan companies for the future a reference transformation strategy. Keywords¡GPrinted Circuit Board (PCB), Five Forces Analysis, Diamond Model, SWOT Analysis, Transformation Strategies