Environmental health awareness has elevated in recent years alongside the evidence that supports the need to mitigate harmful greenhouse gas (GHG) emissions from non-renewable energy resources. The transportation sector alone significantly contributes to the pollutants on a global scale. Although it is commonly used for its superior energy-density and fuel efficiency, diesel engines are a significant portion of the transportation sector that contributes to these pollutants. As a result, this motivates novel research to simultaneously drive fuel efficiency improvements and emissions reductions. <div><br></div><div>The aftertreatment system for a diesel engine is critical in reducing the amount of harmful tailpipe emissions. Efficient operation of these aftertreatment systems generally requires elevated temperatures of 250◦C or above. In this effort, a flexible valvetrain will be utilized to demonstrate fuel-efficient strategies via intake valve closure (IVC) modulation at elevated speeds and loads. In addition, thermal management strategies will be demonstrated at low-to-moderate loads via cylinder deactivation (CDA), cylinder cutout, exhaust valve opening (EVO) modulation, and high-speed idle operation.</div><div><br></div><div>At elevated engine speeds, late intake valve closure (LIVC) enables improved cylinder filling via a dynamic charging effect. It is experimentally and analytically demonstrated that LIVC at 2200 RPM and 7.6 bar to 12.7 bar BMEP can be used to increase the volumetric efficiency and enable higher exhaust gas recirculation fractions without penalizing the air-to-fuel ratio. As a result, efficiency improving injection advances are implemented to achieve 1.2% and 1.9% fuel savings without sacrificing NOx penalties. In order to implement the LIVC benefits on a cammed engine, production-viable valve profile solutions were investigated. It is demonstrated that lost-motion-enabled and/or added-motion-enabled boot shape profiles are capable of improving volumetric efficiency at elevated engine speeds and loads. These profiles were also considered for one (of two) -valve modulation and two-valve modulation. Nearly 95% of the volumetric efficiency benefits are possible using production-viable boot or phase profiles, while 80% of the benefits are possible for single-valve modulation. </div><div><br></div><div>At curb idle, CDA and cylinder cutout operation realize stay-warm aftertreatment thermal management improvements by leveraging their impact on the gas exchange process. Specifically, cylinder cutout demonstrates 17% fuel savings, while CDA demonstrates 40% fuel savings, over the conventional six-cylinder thermal calibration. Additionally, the performance of cylinder cutout is subject to the geometry of the exhaust manifold, location of the EGR loop, and ability to control the exhaust manifold pressure. </div><div><br></div><div>Elevating the idle speed, while maintaining the same idle load, enables improved aftertreatment warm-up performance with engine-out NOx and PM levels no higher than a state-of-the-art thermal calibration at conventional idle operation. Elevated idle speeds of 1000RPM and 1200 RPM, compared to conventional idle at 800 RPM, realized 31% to 51% increase in exhaust flow and 25◦C to 40◦C increase in engine-out temperature, respectively. Additional engine-out temperature benefits are experimentally demonstrated at all three idle speeds considered (800, 1000, and 1200 RPM), without compromising the exhaust flow rates or emissions, by modulating the EVO timing. </div><div><br></div><div>At low-to-moderate loads modern diesel engines manipulate exhaust manifold pressures to drive EGR and thermally manage the aftertreatment. In these engines exhaust manifold pressure control is typically achieved via either a valve after the turbine, a variable geometry turbine, or wastegating. It is experimentally demonstrated that valvetrain flexibility enables efficient engine and aftertreatment operation without requiring exhaust manifold pressure control. Specifically, IVC modulation and CDA at elevated engine speeds, along with EVO modulation, CDA, and internal EGR at low engine speeds can match, or improve, efficiency and thermal management performance compared to a stock thermal calibration that requires exhaust manifold pressure control.<br></div>

Le développement du laser a ouvert la voix à l'exploration de nouveaux domaines scientifiques et industriels. Les impulsions laser à haute intensité sont un outil unique pour les études d'interaction lumière/matière et leurs applications. Mais elles sont générées par des systèmes laser reposant sur l'utilisation de milieux à gain en verre pompés par des lampes flashes et sont donc intrinsèquement limitées en termes de cadence et d'efficacité. Le développement, au cours de ces dernières années, des lasers semi-conducteurs a attiré l'attention sur une nouvelle classe de lasers, les « laser solides pompés par diodes » (DPSSL). Ils possèdent une grande efficacité et sont des candidats de choix pour les systèmes compacts à haute puissance moyenne requis pour des applications industrielles, mais aussi en tant que sources de pompe à haute puissance pour des lasers ultra-intenses. Les travaux décrits dans cette thèse s'inscrivent dans le cadre du système laser Lucia (1 kilowatt de puissance moyenne), actuellement en construction au «Laboratoire d'Utilisation des Intenses lasers» (LULI) à l'Ecole Polytechnique, France. La génération d'impulsions laser de durée sub-10 nanosecondes avec des énergies allant jusqu'à 100 joules et des taux de répétition de 10 hertz est principalement limitée par l'émission spontanée amplifiée (ASE) et les effets thermiques. L'étude de ces limitations est le thème central de ce travail. Leur impact est discuté dans le cadre d'un premier jalon énergétique fixé vers 10 joules. Le système laser mis au point est présenté en détails depuis l'oscillateur jusqu'à la fin de la chaine d'amplification. Une discussion complète de l'impact de l'ASE et des effets thermiques est complétée par des vérifications expérimentales. Les modèles de simulation informatique développés sont validés puis utilisés pour prédire les performances du système laser qui, lors d'une première activation, à atteint un niveau d'énergie de 7 joules en régime mono-coup et de 6,6 joules pour un taux de répétition de 2 hertz. Les limitations actuelles sont discutées ainsi que les approches envisagées pour des développements futurs.

Hydrogen has been shown to be a promising replacement for fossil fuels for use in light duty vehicles because it is a clean, renewable and plentiful resource with a high gravimetric energy density. However, in order to obtain an acceptable volumetric energy density, densification of the hydrogen is required. Adsorptive materials have been shown in the literature to increase volumetric and gravimetric storage densities. A major issue with adsorptive storage is that the adsorption process generates heat and optimal storage conditions are at temperatures below 100 K at pressures up to 50 atm. There is a need to develop heat exchanging architecture that enables adsorbents to be a viable method for hydrogen storage by managing the thermal environment of the storage tank. Based on previous modeling efforts to determine an acceptable bed module height for removal of heat via microchannel cooling plates, a thermal management system has been designed and tested capable of removing the heat of adsorption within adsorbent-filled hydrogen storage tanks. The system uses liquid nitrogen cooling to maintain tank temperatures of below 80 K at 50 atm. System studies show that the microchannel architecture offers a high cooling capacity with about a 6% displacement volume. Simulations and experiments have been conducted to evaluate the design for the cooling capacity, pressure drop, and flow distribution between and across the cooling plates, stress due to the pressurized environment, and thermal stress. Cost models have been developed to demonstrate that the system can be manufactured for a reasonable cost at high production volumes. Experimental results show that the modular system offers an acceptable cooling capacity and pressure drop with good flow distribution while adequately managing thermal stresses during operation. / Graduation date: 2013

<p>The aim of my work is to model a segment of a unit cell of a fuel cell stack using numerical methods which is classified as computational fluid dynamics and implementing the work in a commercial computational fluid dynamics package, FLUENT. The focus of my work is to study the thermal distribution within this segment. The results of the work aid in a better understanding of the fuel cell operation in this temperature range. At the time of my investigation experimental results were unavailable for validation and therefore my results are compared to previously published results published. The outcome of the results corresponds to this, where the current flux density increases with the increasing of operating temperature and fixed operating voltage and the temperature variation across the fuel cell at varying operating voltages. It is in the anticipation of determining actual and or unique material input parameters that this work is done and at which point this studies results would contribute to the understanding high temperature PEM fuel cell thermal behaviour, significantly.</p>

While 3D stacked multi-processor technology offers the potential for significant computing advantages, these architectures also face the significant challenge of small, localized hotspots with very large heat fluxes due to the placement of asymmetric cores, heterogeneous devices and performance driven layouts. In this thesis, a new thermal management solution is introduced that seeks to maximize the performance of microprocessors with dynamically managed power profiles. To mitigate the non-uniformities in chip temperature profiles resulting from the dynamic power maps, solid-liquid phase change materials (PCMs) with an embedded heat spreader network are strategically positioned near localized hotspots, resulting in a large increase in the local thermal capacitance in these problematic areas. Theoretical analysis shows that the increase in local thermal capacitance results in an almost twenty-fold increase in the time that a thermally constrained core can operate before a power gating or core migration event is required. Coupled to the PCMs are solid state coolers (SSCs) that serve as a means for fast regeneration of the PCMs during the cool down periods associated with throttling events. Using this combined PCM/SSC approach allows for devices that operate with the desirable combination of low throttling frequency and large overall core duty cycles, thus maximizing computational throughput. The impact of the thermophysical properties of the PCM on the device operating characteristics has been investigated from first principles in order to better inform the PCM selection or design process. Complementary to the theoretical characterization of the proposed thermal solution, a prototype device called a "Composite Thermal Capacitor (CTC)" that monolithically integrates micro heaters, PCMs and a spreader matrix into a Si test chip was fabricated and tested to validate the efficacy of the concept. A prototype CTC was shown to increase allowable device operating times by over 7X and address heat fluxes of up to ~395 W/cm2. Various methods for regenerating the CTC have been investigated, including air, liquid, and solid state cooling, and operational duty cycles of over 60% have been demonstrated.

A stacked microchannel heat sink was developed to provide efficient cooling for microelectronics devices at a relatively low pressure drop while maintaining chip temperature uniformity. Microfabrication techniques were employed to fabricate the stacked microchannel structure, and experiments were conducted to study its thermal performance. A total thermal resistance of less than 0.1 K/W was demonstrated for both counter flow and parallel flow configurations. The effects of flow direction and interlayer flow rate ratio were investigated. It was found that for the low flow rate range the parallel flow arrangement results in a better overall thermal performance than the counter flow arrangement; whereas, for the large flow rate range, the total thermal resistances for both the counter flow and parallel flow configurations are indistinguishable. On the other hand, the counter flow arrangement provides better temperature uniformity for the entire flow rate range tested. The effects of localized heating on the overall thermal performance were examined by selectively applying electrical power to the heaters. Numerical simulations were conducted to study the conjugate heat transfer inside the stacked microchannels. Negative heat flux conditions were found near the outlets of the microchannels for the counter flow arrangement. This is particularly evident for small flow rates. The numerical results clearly explain why the total thermal resistance for counter flow arrangement is larger than that for the parallel flow at low flow rates. In addition, laminar flow inside the microchannels were characterized using Micro-PIV techniques. Microchannels of different width were fabricated in silicon, the smallest channel measuring 34 mm in width. Measurements were conducted at various channel depths. Measured velocity profiles at these depths were found to be in reasonable agreement with laminar flow theory. Micro-PIV measurement found that the maximum velocity is shifted significantly towards the top of the microchannels due to the sidewall slope, a common issue faced with DRIE etching. Numerical simulations were conducted to investigate the effects of the sidewall slope on the flow and heat transfer. The results show that the effects of large sidewall slope on heat transfer are significant; whereas, the effects on pressure drop are not as pronounced.

Future generation of all-electric ships will be highly dependent on electric power, since every single system aboard such as the drive propulsion, the weapon system, the communication and navigation systems will be electrically powered. Power conversion modules (PCM) will be used to transform and distribute the power as desired in various zone within the ships. As power densities increase at both components and systems-levels, high-fidelity thermal models of those PCMs are indispensable to reach high performance and energy efficient designs. Efficient systems-level thermal management requires modeling and analysis of complex turbulent fluid flow and heat transfer processes across several decades of length scales. In this thesis, a methodology for thermal modeling of complex PCM cabinets used in naval applications is offered. High fidelity computational fluid dynamics and heat transfer (CFD/HT) models are created in order to analyze the heat dissipation from the chip to the multi-cabinet level and optimize turbulent convection cooling inside the cabinet enclosure. Conventional CFD/HT modeling techniques for such complex and multi-scale systems are severely limited as a design or optimization tool. The large size of such models and the complex physics involved result in extremely slow processing time. A multi-scale approach has been developed to predict accurately the overall airflow conditions at the cabinet level as well as the airflow around components which dictates the chip temperature in details. Various models of different length scales are linked together by matching the boundary conditions. The advantage is that it allows high fidelity models at each length scale and more detailed simulations are obtained than what could have been accomplished with a single model methodology. It was found that the power cabinets under the prescribed design parameters, experience operating point airflow rates that are much lower than the design requirements. The flow is unevenly distributed through the various bays. Approximately 90 % of the cold plenum inlet flow rate goes exclusively through Bay 1 and Bay 2. Re-circulation and reverse flow are observed in regions experiencing a lack of flow motion. As a result high temperature of the air flow and consequently high component temperatures are also experienced in the upper bays of the cabinet. A proper orthogonal decomposition (POD) methodology has been performed to develop reduced-order compact models of the PCM cabinets. The reduced-order modeling approach based on POD reduces the numerical models containing 35 x 109 DOF down to less than 20 DOF, while still retaining a great accuracy. The reduced-order models developed yields prediction of the full-field 3-D cabinet within 30 seconds as opposed to the CFD/HT simulations that take more than 3 hours using a high power computer cluster. The reduced-order modeling methodology developed could be a useful tool to quickly and accurately characterize the thermal behavior of any electronics system and provides a good basis for thermal design and optimization purposes.

LEDs are being developed as the next generation lighting source due to their high efficiency and long life time, with a potential to save $15 billion per year in energy cost by 2020. State of the art LEDs are capable of emitting light at ~115 lm/W and have lifetime over 50,000 hours. It has already surpassed the efficiency of incandescent light sources, and is even comparable to that of fluorescent lamps. Since the total luminous flux generated by a single LED is considerably lower than other light sources, to be competitive the total light output must be increased with higher forward currents and packages of multiple LEDs. However, both of these solutions would increase the junction temperature, which degrades the performance of the LED--as the operating temperature goes up, the light intensity decreases, the lifetime is reduced, and the light color changes. The word "junction" refers to the p-n junction within the LED-chips. Critical to the temperature rise in high powered LED sources is the very large heat flux at the die level (100-500 W/cm2) which must be addressed in order to lower the operating temperature in the die. It is possible to address the spreading requirements of high powered LED die through the use of power electronic substrates for efficient heat dissipation, especially when the die are directly mounted to the power substrate in a chipon- board (COB) architecture. COB is a very attractive technology for packaging power LEDs which can lead improved price competiveness, package integration and thermal performance. In our work high power LED-chips (>1W/die) implementing COB architectures were designed and studied. Substrates for these packaging configurations include two types of power electronic substrates; insulated-metal-substrates (IMS) and direct-bonded-copper (DBC). To lower the operating temperature both the thermal impedance of the dielectric layer and the heat spreading in the copper circuit layers must be studied. In the analysis of our architectures, several lead free solders and thermal interface materials were considered. We start with the analysis of single-chip LED package and extend the result to the multi-chip arrays. The thermal resistance of the system is only a function of geometry and thermal conductivity if temperature-independent properties are used. Thus through finite element analysis (ANSYS) the effect of geometry and thermal conductivity on the thermal resistance was investigated. The drawback of finite element analysis is that many simulations must be conducted whenever the geometry or the thermal conductivity is changed. To bypass same of the computational load, a thermal resistance network was developed. We developed analytical expressions of the thermal resistance, especially focusing on the heat spreading effect at the substrate level. Finally, multi-chip LED arrays were analyzed through finite element analysis and an analytical analysis; where die-spacing is another important factor to determine the junction temperature. With this thermal analysis, critical design considerations were investigated in order to minimize device temperatures and thereby maximizing light output while also maximizing device reliability.

Growing need for application of electronics at temperatures beyond their rated limit, (usually > 150 °C) and the non availability of high temperature compatible electronics necessitates thermal management solutions that should be compact, scalable, reliable and be able to work in environments characterized by high temperature (150 -250 °C), mechanical shock and vibrations. In this backdrop the proposed research aims at realization of an adsorption cooling system for evaporator temperatures in the range of 140 °C-150 °C, and condenser temperature in the range of 160 °C-200 °C. Adsorption cooling systems have few moving parts (hence less maintenance issues), and the use of Thermo-Electric (TE) devices to regenerate heat of adsorption in between adsorbent beds enhances the compactness and efficiency of the overall 'ThermoElectric-Adsorption' (TEA) system. The work presented identifies the challenges involved and respective solutions for high temperature application. An experimental set up was fabricated to demonstrate system operation and mathematical models developed to benchmark experimental results. Also, it should be noted that TEA system comprises TE and adsorption chillers. A TE device can be a compact cooler in its own right. Hence a comparison of the performance of TEA and TE cooling systems has also been presented.

The work reported in this thesis is an attempt to enhance heat transfer in electronic devices with the use of impinging air jets on pin-finned heat sinks. The cooling per-formance of electronic devices has attracted increased attention owing to the demand of compact size, higher power densities and demands on system performance and re-liability. Although the technology of cooling has greatly advanced, the main cause of malfunction of the electronic devices remains overheating. The problem arises due to restriction of space and also due to high heat dissipation rates, which have increased from a fraction of a W/cm2to 100s of W /cm2. Although several researchers have at-tempted to address this at the design stage, unfortunately the speed of invention of cooling mechanism has not kept pace with the ever-increasing requirement of heat re- moval from electronic chips. As a result, efficient cooling of electronic chip remains a challenge in thermal engineering. Heat transfer can be enhanced by several ways like air cooling, liquid cooling, phase change cooling etc. However, in certain applications due to limitations on cost and weight, eg. air borne application, air cooling is imperative. The heat transfer can be increased by two ways. First, increasing the heat transfer coefficient (forced convec- tion), and second, increasing the surface area of heat transfer (finned heat sinks). From previous literature it was established that for a given volumetric air flow rate, jet im-pingement is the best option for enhancing heat transfer coefficient and for a given volume of heat sink material pin-finned heat sinks are the best option because of their high surface area to volume ratio. There are certain applications where very high jet velocities cannot be used because of limitations of noise and presence of delicate components. This process can further be improved by pulsating the jet. A steady jet often stabilizes the boundary layer on the surface to be cooled. Enhancement in the convective heat transfer can be achieved if the boundary layer is broken. Disruptions in the boundary layer can be caused by pulsating the impinging jet, i.e., making the jet unsteady. Besides, the pulsations lead to chaotic mixing, i.e., the fluid particles no more follow well defined streamlines but move unpredictably through the stagnation region. Thus the flow mimics turbulence at low Reynolds number. The pulsation should be done in such a way that the boundary layer can be disturbed periodically and yet adequate coolant is made available. So, that there is not much variation in temperature during one pulse cycle. From previous literature it was found that square waveform is most effective in enhancing heat transfer. In the present study the combined effect of pin-finned heat sink and impinging slot jet, both steady and unsteady, has been investigated for both laminar and turbulent flows. The effect of fin height and height of impingement has been studied. The jets have been pulsated in square waveform to study the effect of frequency and duty cycle. This thesis attempts to increase our understanding of the slot jet impingement on pin-finned heat sinks through numerical investigations. A systematic study is carried out using the finite-volume code FLUENT (Version 6.2) to solve the thermal and flow fields. The standard k-ε model for turbulence equations and two layer zonal model in wall function are used in the problem Pressure-velocity coupling is handled using the SIMPLE algorithm with a staggered grid. The parameters that affect the heat transfer coefficient are: height of the fins, total height of impingement, jet exit Reynolds number, frequency of the jet and duty cycle (percentage time the jet is flowing during one complete cycle of the pulse). From the studies carried out it was found that: a) beyond a certain height of the fin the rate of enhancement of heat transfer becomes very low with further increase in height, b) the heat transfer enhancement is much more sensitive to any changes at low Reynolds number than compared to high Reynolds number, c) for a given total height of impingement the use of fins and pulsated jet, increases the effective heat transfer coefficient by almost 200% for the same average Reynolds number, d) for all the cases it was observed that the optimum frequency of impingement is around 50 − 100 Hz and optimum duty cycle around 25-33.33%, e) in the case of turbulent jets the enhancement in heat transfer due to pulsations is very less compared to the enhancement in case of laminar jets.