Spelling suggestions: "subject:"void"" "subject:"oid""
21 |
Transitional Design: Connecting Space, People, and ArchitectureAli, Sarosh 03 August 2011 (has links)
No description available.
|
22 |
Void formation and vacancy injection in Silicon and Silicon GermaniumSu, Han 02 1900 (has links)
<p> Substantial development of silicon-based technology is required to continue to improve product reliability and production yield of silicon-based IC devices. Defects play a key role in process technology and research is required into their properties and interactions with host and impurity atoms. Cavities formed by ion implantation of helium into a silicon substrate are known to be efficient gettering sites for mobile interstitials and metallic impurities. In addition, the existence of a buried void layer drastically reduces the unintentional parasitic transistor gain in power devices by introducing mid-gap energy levels in the substrate. Utilizing slow positron annihilation spectroscopy (PAS), void formation by implanted He+ at a dose of lxl016/cm2 and energy of 60 keV subsequently subjected to various annealing conditions, i.e. different temperatures, times, ramp rate and ambients, is reported. Quantitative measurement of cavity sizes shows that the annealing temperature largely influences helium out-diffusion from the implanted region. Consequently, different void evolution processes associated with specific annealing temperatures are found. Furthermore, larger voids are formed in oxygen ambient leading us to suggest that the supersaturation of interstitials enhances bubble migration and coalescence during the stage when a large fraction of He atoms remains in the cavities. </p> <p> In recent years, SiGe pseudomorphic alloys have become attractive for heterostructure devices due to their higher mobility, lower noise and lower power consumption, as compared with traditional Si devices. More importantly, SiGe is highly compatible with Si processing technologies. With the continuous improvement of SiGe technology, it has been coupled with complementary metal oxide semiconductor (CMOS) technology and has the potential to replace III-V compound semiconductor devices in the near future. However, many unknowns remain in this material system. The study of point defect injection during various thermal treatments is important in itself, and would also allow additional tools for the study of dopant diffusion in the material under different conditions. With preexistent voids in the buried substrate, we performed furnace wet oxidation on a Si0.98Geo.08 sample at 900 °C for half an hour. A small shrinkage of the voids, as compared to complete annihilation in the case of inert annealing, signifies vacancy injection during the oxidation process. Possible defect generation mechanisms and difference in growth rate enhancement in dry and wet oxidation are discussed. Based on a literature review of Si and SiGe oxidation, we suggest that stress relaxation and the Si replacement mechanism are responsible for the catalytic effect of the oxide growth and the change of point defect generation. </p> / Thesis / Master of Applied Science (MASc)
|
23 |
Air void clustering in concreteVosahlik, Jan January 1900 (has links)
Master of Science / Department of Civil Engineering / Kyle A. Riding / Air void clustering around coarse aggregate in concrete has been identified as a potential source of low strengths in concrete mixes by several Departments of Transportation around the country. Research was carried out to (1) develop a quantitative measure of air void clustering around aggregates, (2) investigate whether air void clustering can be reproduced in a laboratory environment, (3) determine if air void clustering can blamed for lower compressive strengths in concrete mixes, (4) and identify potential factors that may cause clustering.
Five types of coarse aggregate and five different air entraining agents were included in the laboratory study to see if aggregate type or chemical composition of air entraining agent directly relates to air void clustering. A total of 65 mixes were made, implementing the frequently used technique of retempering that has been previously associated with air void clustering around aggregates. Compressive strength specimens as well as samples for hardened void analysis were made. Compressive strength at 7 and 28 days was determined and the automated hardened void analysis (including a new method of clustering evaluation) was performed on all samples.
It was found that it is possible to reproduce air void clustering in laboratory conditions. However, the results have shown that retempering does not always cause air void clustering. It was also observed that air void clustering is not responsible for a decrease in compressive strength of retempered concrete as neither aggregate type nor chemical composition of air entraining agent had a significant impact on severity of void clustering around coarse aggregate particles. It was also found that the total air content and an inhomogeneous microstructure and not air void clustering were responsible for lower strengths.
|
24 |
2D Effects of Anisotropy on the Ductile Fracture of TitaniumAzhar, Mishaal 30 October 2013 (has links)
Titanium is a widely used metal in industrial and commercial applications. It retains anisotropic mechanical properties at room temperature due to its HCP crystal structure. The effects of crystal orientation have been studied theoretically and through modeling though there is a lack of empirical data available on the topic.
The work presented here uses laser-machined voids along with EBSD analysis to study the ductility of grains in different orientations to better understand the microscale fracture process in α-titanium.
Experimental results show that hard grains with their c-axis parallel to the tensile direction behave in a less ductile manner than grains with their c-axis oriented away from the tensile direction. This is due to the basal slip systems activating in the former case and prismatic slip systems in the latter. Models utilized include the McClintock model for void growth, Brown-Embury model for void coalescence and FEM crystal plasticity simulations
|
25 |
2D Effects of Anisotropy on the Ductile Fracture of TitaniumAzhar, Mishaal January 2013 (has links)
Titanium is a widely used metal in industrial and commercial applications. It retains anisotropic mechanical properties at room temperature due to its HCP crystal structure. The effects of crystal orientation have been studied theoretically and through modeling though there is a lack of empirical data available on the topic.
The work presented here uses laser-machined voids along with EBSD analysis to study the ductility of grains in different orientations to better understand the microscale fracture process in α-titanium.
Experimental results show that hard grains with their c-axis parallel to the tensile direction behave in a less ductile manner than grains with their c-axis oriented away from the tensile direction. This is due to the basal slip systems activating in the former case and prismatic slip systems in the latter. Models utilized include the McClintock model for void growth, Brown-Embury model for void coalescence and FEM crystal plasticity simulations
|
26 |
Permeability Characterization and Fluorescent Void Flow Monitoring for Processing SimulationLystrup, John Caleb 01 August 2018 (has links)
Liquid composite molding (LCM) is growing in importance alternative to traditional prepreg-autoclave methods for manufacture aerospace composites. The most significant roadblock to industry's implementation of LCM is the optimization of resin flow to ensure high quality parts. This study developed process optimization tools to foster the adaptation of LCM. The following dissertation characterized the permeability of reinforcement fabrics under various processing conditions, and investigated in-situ bubble flow with carbon fiber. The purpose of this research is to extend the understanding of LCM and push forward the state of the art via sub-studies captured in five chapters, or manuscripts. Research from these manuscripts is as follows. Chapter 3 sets the groundwork for LCM optimization by extending the current theory for assessing 3D permeability of reinforcement fabrics using an ellipsoidal point infusion experiment. The aim was to improve 3D permeability measurement accuracy for LCM processing models. This work is the first to compare solutions in the context of 75 experiments. Chapters 4 and 5 extend permeability analysis to curved and sheared geometries, typical to real-world aerostructures. Chapter 4 demonstrates a method for measurement of curvature effects on permeability with vacuum infusion. A correlation was shown between curvature (as evaluated over four radii) and effective permeability. Chapter 5 researches the shearing of reinforcement fabric (e.g. when reinforcements are draped over double curvature). The study shows that permeability actually increases for mid-range shear angles beyond the shear-locking angle, and develops a technique for obtaining the 3D permeability of sheared fabric.Chapter 6 investigates carbon fiber voids in situ. LCM optimization requires improved void monitoring for carbon fiber. It is challenging to monitor void flow in situ with carbon fiber reinforcements because of fiber opacity. The research builds upon a new automated fluorescent imaging method to monitor void flow in-situ. Results include high-resolution and high-contrast images and 230 data points for infusion velocity vs. void content data.Chapter 7 contributes to the growing interest in LCM processes for aerospace applications by providing a short cost summary of typical processes for manufacturing aerospace composite parts. Data shows that LCM is a financially wise alternative to automated fiber placement (prepreg-autoclave) manufacturing when a void content of 2-2.5% is acceptable. Work on LCM processes optimization indicates that these percentages will reduce in coming years.
|
27 |
Etude de l’impact de micro-cavités (voids) dans les attaches de puces des modules électroniques de puissance / Evaluation of Impact of Voids in Die Attach on Electro-thermal Behavior of Power ModulesTran, Son Ha 24 November 2015 (has links)
Les convertisseurs électroniques de puissance sont voués à fonctionner sous des conditions applicatives de plus en plus sévères tout en respectant les impératifs d’efficacité énergétique et de fiabilité. Or, les besoins industriels tendent vers un plus haut niveau d’intégration fonctionnelle tout en améliorant le rapport qualité-prix. Dès lors, la solution utilisée pour le report des puces semi-conductrices est le siège de densités de courant importantes et d’un flux thermique élevé. La présence de défauts dans cette couche d’interconnexion peut conduire à la dégradation de ses performances et au vieillissement prématuré du composant. L’objectif de nos recherches est d’évaluer la pertinence d’une méthodologie basée sur la confrontation de simulations numériques et de campagnes expérimentales. L’objectif est d’améliorer la compréhension du comportement électrothermique en régime de conduction d’un transistor MOSFET en présence d’un void dans sa brasure. Dans cette manuscrite, nous présenterons la construction d’un modèle intégrant le couplage électrothermique de la partie active qui sera confronté à la réponse de résultats expérimentaux. Puis, une étude numérique basée sur la théorie des plans fractionnaires, qui minimise le nombre de simulations, sera exploitée afin de quantifier l’impact de la taille et de la position du défaut sur la réponse électrothermique du composant et de ses liaisons électriques. Les détails de la mise en place d’une étude expérimentale analogue permettront de mettre en perspective la complémentarité de cette approche. / Power converters nowadays are required to function under harsh conditions in meeting energy efficiency and reliability requirement. Whereas, industrial specifications tend toward a higher level of power integration in respect to the cost constraint. As a result, the die attach is one of the key elements in power module packaging because of high current densities and high heat flow which are transported through. Void formation in the die attach may lead to performance degradation and premature aging of the component. This study introduces a methodology based on the comparison of numerical simulations and experimental campaigns. The obtained results help to improve our understanding on the electro-thermal behaviour of MOSFETs with solder voids. In this thesis, we depict a finite element model in which electro-thermal coupling of a MOSFET active layer is taken in to account. Simulation results will be correlated to the experimental responses. Later on, a parametric numerical study based on the response surface method (RSM) which minimizes the number of simulations and future tests will be exploited to quantify the impact of void position and size on several selective performance criteria. A future serial experimental study in respect to the same RSM design is expected in prospect, in order to fulfil the complementarity for this approach.
|
28 |
Simulation of Void Nucleation in Single-Phase Copper PolycrystalsLieberman, Evan 01 August 2016 (has links)
A systematic investigation is presented into the microstructural and micromechanical influences on ductile damage nucleation with an emphasis on grain boundaries in polycrystals. Microstructures obtained from experiments on copper polycrystals are characterized using Electron Backscatter Diffraction (EBSD) and near-field High-Energy Diffraction Microscopy (nf-HEDM) and the occurrence of damage is compared with micromechanical values obtained using an elasto-viscoplastic model based on the Fast- Fourier Transform (EVPFFT). The model produces full-field solutions for the stress and strain in voxelized polycrystalline microstructures. In order to resolve the fields onto interfaces, local Cartesian moments of the polycrystalline grain structure are used to extract the normals of grain boundaries and the tangents of triple junctions directly from the voxelized microstructure. Thus projecting the stress yields a parameter with potential significance, i.e. the grain boundary surface tractions. We identify “traction hotspots”, i.e. regions with tractions that are significantly above the mean, for the case of uniaxial tension. These show correlations with the angle between the grain boundary normal and the loading axis, a trend that some experiments also show when boundaries that nucleated voids are analyzed using EBSD, though differences present between the simulation and experiment hint that further criteria are needed. Nf-HEDM was used to record microstructure images of a polycrystalline sample before and after it undergoes damage. The damage locations in the post-shocked image are mapped onto the pre-shocked image, allowing stress and strain values from the EVPFFT model in the regions that eventually nucleated damage to be correlated with the locations of the void. The unexpected result was that differences in plastic work across boundaries correlated with voids, whereas vi quantities such as triaxiality and normal forces across boundaries did not.
|
29 |
La Notion de nullité / The concept of nullitéLe Faou-Villarbu, Valérie 12 December 2013 (has links)
Dans sa définition traditionnelle, c'est-à-dire définie comme la sanction des conditions de formation des actes juridiques, la nullité est entièrement construite autour de la figure de l’autorité et du pouvoir. La rétroactivité de la nullité pouvant s’analyser d’ailleurs comme une manière d’asseoir cette autorité. Cette conception demeure nous semble t-il prisonnière du fondement de l’inexistence : il s’agit de faire comme si l’acte n’avait jamais existé ; d’anéantir l’acte. Les Modernes n’ont pas réussi à se défaire complètement de cette vision qui témoigne d'une analyse réductionniste du droit. Lorsqu’ils raisonnent en termes de validité, ils ne raisonnent qu’en termes de validité formelle. La validité se définissant dès lors comme le mode spécifique d'existence des normes semble devoir être rattachée à la logique de l'impérativité alors qu'elle reposait chez JAPIOT sur la logique de l'ordre public ce qui lui conférait une certaine souplesse. Associée à l’idée d’autorité, d’impérativité, de pouvoir la nullité semble une figure appartenant au passé tant la planète contractuelle dominée par la pluralité semble désormais attirée vers la flexibilité. L’introduction du concept de « nullité partielle » n’a guère remporté le succès escompté et nécessaire pour renverser cette tendance. Les sanctions dites alternatives à la nullité se sont multipliées afin de palier l’incapacité de la nullité à rendre compte des transformations de notre droit. Et pourtant, définie non plus comme une sanction mais comme une norme de reconnaissance, la nullité apparaît non seulement comme un outil particulièrement souple - et donc adapté à notre modernité - mais comme le seul véritable instrument de justice contractuelle. / Abstract
|
30 |
Microgravity flow pattern identification using void fraction signalsValota, Luca 29 August 2005 (has links)
Knowledge of the two-phase flow state is fundamental for two-phase flow system design and operation. In traditional two-phase flow studies, the flow regime refers to the physical location of the gas and liquid in a conduit. Flow configuration is important for engineering correlations of heat and mass transfer, pressure drop, and wall shear. However, it is somewhat subjective since it is mostly defined by experimental observation, resulting in an approximate and equivocal definition. Thus, there is need for a better, objective flow regime identification. The void fraction is a key parameter in monitoring the operating state of a two-phase system and several tools have been developed in order to measure it. The purpose of this study is to use the void fraction and other parameters of the system to achieve a model for flow pattern identification. Recently, an experimental program using the Foster-Miller two-phase flow test bed and Creare Inc. capacitance void fraction sensors was conducted in the microgravity environment of the NASA KC-135 aircraft. Several data types were taken for each phase, such as flow rate, superficial velocity, density and transient void fraction at 100Hz. Several analytical approaches were pursued, including a statistical approach of the fluctuation of the void fraction, Martinelli analysis, and Drift Flux analysis, in order to reach a model for flow pattern identification in microgravity conditions. Several parameters were found to be good flow pattern identifiers such as the statistical moments variance and skewness, Signal -to- noise ratio (SNR), Half Height Value (HHV) and Linear Area Difference (LAD). Moreover, relevant conclusions were achieved using the Martinelli parameter and the Drift Flux model in microgravity conditions. These results were compared with the basic literature.
|
Page generated in 0.0521 seconds