This critical review summarizes recent developments in the fabrication of patterned polymer brushes. As top-down lithography reaches the length scale of a single macromolecule, the combination with the bottom-up synthesis of polymer brushes by surface-initiated polymerization becomes one main avenue to design new materials for nanotechnology. Recent developments in surface-initiated polymerizations are highlighted along with diverse strategies to create patterned polymer brushes on all length scales based on irradiation (photo- and interference lithography, electron-beam lithography), mechanical contact (scanning probe lithography, soft lithography, nanoimprinting lithography) and on surface forces (capillary force lithography, colloidal lithography, Langmuir–Blodgett lithography) (116 references). / Dieser Beitrag ist mit Zustimmung des Rechteinhabers aufgrund einer (DFG-geförderten) Allianz- bzw. Nationallizenz frei zugänglich.

Thin film copper, indium, gallium, selenide (CIGS) solar cells are promising in the field of photovoltaic technology. To reduce material and fabrication cost, as well as increasing electrical properties of the cell, research is ongoing towards ultra-thin film solar cells (absorption layer thickness less than 500 nm). Ultra-thin CIGS solar cells has shown a decrease in interface recombination and improved optical properties when adding a rear contact passivation layer of aluminium oxide. In this work, the process of creating sub-micrometer features of a passivation layer using conventional optical lithography is investigated. To specify, the objective was to optimize the development conditions in the optical lithography process when fabricating equidistant line contacts in aluminium oxide with 800 nm feature size. It was found that line contacts with smaller feature sizes require longer development time, than line contacts with larger feature sizes. The experiments conducted showed that the pre-set development and exposure conditions used by the NOA group are not optimized for 800 nm or smaller line contacts. Further, for the optical lithography process, silicon substrates are not comparable with substrates of soda lime glass coated with molybdenum. Slight underdevelopment of a sample, showed line contacts smaller than the resolution of the laser used in the exposure – suggesting an alternative method of processing small line contacts with optical lithography.

Este trabalho trata do estudo das condições para a produção de padrões em escala nano e micrométricas, utilizando o processo de litografia eletrônica. A parte inicial refere-se ao estudo do elétron-resiste de PMMA incluindo a preparação da solução, o recobrimento do substrato e a secagem. Em seguida, são apresentados estudos sobre o funcionamento do sistema de litografia por feixe de elétrons em detalhe. São tratados problemas com o resiste, o substrato e a interação com a amostra. São apresentados os aspectos mais importantes dos substratos utilizados, sendo dado um enfoque a heteroestruturas semicondutoras com gás de elétrons bidimensionais. As condições para revelação do resiste e das etapas de processamento para que seja feita a replicação para o substrato do padrão gerado no resiste são também abordadas. Diversos estudos foram realizados para mostrar a influência de alguns efeitos comuns na litografia como a influência da espessura do filme de resiste e os efeitos de proximidade. Também trata da produção de padrões sobre substratos diversos como GaAs, VIDRO, ALUMINA e PRATA. A última etapa estuda a utilização de um resiste híbrido PMMA-Sílica como um método de conformação cerâmica. Finalmente é apresentado um estudo relativo a produção de diversos padrões diferentes sobre heteroestruturas semicondutoras de AlGaAs/GaAs. / The work describe the conditions for pattern production at nano and micrometric scale using the electronic lithographic process. In the first part many types of lithographic technics are compared and the aim why the electron beam lithographic nanostructured production was chosen. Detailed results about operation with the lithographic system and some problems related to electron resist, substrate and interaction between electron beam and sample are presented. The most important substrate aspects are shown. The two dimensional electron gas (2DEG) semiconductors heterostrutures and the M B E process to grow samples are discussed too. The conditions to develop electron resist and steps for pattern transfer over the substrate are discussed. Many experimental studies were realized to show the influence and some effects, common to the lithographic process, such as electron resist thickness and the proximity effect. A production of pattern on some kind of substrate like GaAs, Glass, Aluminum, Silver can also be observed. In the last part of this work some discussion about utilisation of hybrid electron resist composite PMMA-Silica was done, as well as very important technics for ceramic conformation. Finally, the main goal of this work is presented: the production of different nanostructure samples using AlGaAs/GaAs substrates.

Les nanostructures périodiques jouent un rôle important dans le domaine des nanotechnologies, en particulier dans le contrôle des photons. Bien qu'il existe de nombreuses techniques d'usage général pour la fabrication et la simulation optique, nous avons développé une technique de fabrication sur mesure et une méthode de simulation optiques pour les structures périodiques pour accélérer le prototypage à l’échelle du laboratoire et la conception optique. Dans la première partie de cette thèse, nous décrivons une technique lithographique nommée « Laser Interference Lithography » (LIL) à faible coût pour la fabrication de nanostructures périodiques. La technique LIL est combinée avec gravure sèche, gravure humide et technique de gravure électrochimique pour réaliser, respectivement, des trous cylindriques, des pyramides inversées et des réseaux taux de pores bi-périodiques à facteur d’aspect élevé sur le substrat à base de silicium. Les modèles unidimensionnels sur des substrats en verre sont également utilisés comme nanofiltres dans la réalisation de la puce de pré-concentration à faible coût. Dans la deuxième partie, nous décrivons d'abord une méthode de calcul électromagnétique rigoureuse Rigorous Coupled-Wave Analysis (RCWA) conçu pour les structures périodiques. Une description détaillée est donnée pour expliquer la méthode numérique. Ensuite, nous combinons la méthode RCWA et une nouvelle approche proposée de la conception des modèles pseudo-désordonnée pour améliorer le piégeage des photons. A titre d'exemple, nous démontrons que, en ajoutant des structures désordonnées à petite échelle sur des arrangements périodiques à grande échelle, la performance quant à l’absorption des couches minces de silicium peut être grandement améliorée. / Periodic nanostructures play an important role in the domain of nanotechnology, especially in photon control. While there exist many general purpose techniques for fabrication and optical simulation, we show tailored fabrication and optical simulation methods for periodic structures to accelerate lab-scale prototyping and optical design. In the first part of this dissertation, we describe a low-cost lithographic technique named Laser Interference Lithography (LIL) for fabricating periodic nanostructures. LIL technique is combined with dry-etching, wet-etching and electrochemical etching technique to realize, respectively, cylindrical holes, inverted pyramids and high aspect ratio pore arrays on silicon based substrate. The one-dimensional patterns on glass substrates are also used as nanofilters in realizing low-cost preconcentration chip. In the second part, we first describe Rigorous Coupled-Wave Analysis (RCWA), a rigorous electromagnetic calculation method designed for periodic structures. A detailed derivation is given to explain the numerical method. Then, we combine the RCWA method and a new proposed pseudo-disordered patterns design approach to investigate photon control. As an example, we demonstrate that by adding ‘appropriate’ engineered fine stripes to each long period the absorption performance of thin silicon slab can be largely enhanced.

Many problems exist in current photoresist designs that will limit their ability to obtain the performance required for future generations of integrated circuit devices. In order to overcome these challenges, novel resist designs are required, along with advancement in the fundamental understanding of the source of these problems. A mesoscale kinetic Monte Carlo simulation of resists was developed to probe the effects of changes in resist formulation and processing. A detailed SEM simulator was developed in order to better understand the effect of metrology on the characterization of the final resist relief image. Several important structure-property relations were developed for the prediction of glass transition temperature in molecular resists and the prediction of the solubility of molecular resists in developer. Five new families of molecular resists were developed that provide solutions to some of the limitations in current resist designs. Single component molecular resists have all of the functional groups required to act as a chemically amplified resist contained in a single molecule. This eliminates inhomogeneities in the resist and provides improved line edge roughness. Non-chemically amplified molecular resists were developed that have very good sensitivity due to the unique dissolution properties of molecular resists. Negative tone molecular resists were developed that have an excellent combination of resolution, sensitivity, and line edge roughness with better resolution than has been previously seen in negative tone resists. Control methods were also developed to improve the resolution of these types of negative tone resists even further.

" Because technology provides the tools and biology the problems, the two should enjoy a happy marriage ! "1 . Cette phrase resume parfaitement l'esprit du projet qui a motive ces travaux de these. En effet, le couplage des biotechnologies et des micro et nano technologies, resume sous le vocable < Nanobiotechnologies > est une activite en plein essor qui laisse presager de nombreuses applications en particulier dans le domaine de la biodetection. Lobjectif principal de ces travaux est dedie au developpement de strategies d'adressage de biomolecules a l'echelle nanometrique pour des applications de biodetection. Le premier aspect de ce travail est d'ordre technologique. Il concerne la fabrication de dispositifs d'adressage bases sur des reseaux de nanoelectrodes planaires. En utilisant un procede reposant sur lutilisation de la lithographie electronique haute resolution sur un microscope TEM/STEM, nous avons pu demontrer la fabrication de dispositifs a base de nanoelectrodes presentant des espaces inter-electrodes controlables entre 100 et 15nm. Une technique de lithographie alternative, la Nano-Impression est egalement presentee comme une solution possible a la replication de nanodispositifs fabriques par lithographie electronique. La deuxieme partie des travaux est dediee a la mise en place dun schema de detection de nanoparticules que nous avons developpe autour de dispositifs bases sur des reseaux delectrodes inter-digitees. Avant de nous interesser a l'utilisation de ces dispositifs pour une application biologique, nous avons etudie leur reponse electrique vis-a-vis de l'absorption de nanoparticules d'Or par interaction electrostatique. Les premiers resultats obtenus montrent que le schema de detection permet d'atteindre un niveau de sensibilite ultime au travers d'une mesure directe de la conductance des dispositifs. Certaines experiences montrent en effet la possibilite de mesurer electriquement l'adsorption d'une seule nanoparticule. Enfin, la derniere partie de ces travaux est dediee a l'adaptation de ce protocole pour la detection de biomolecules fonctionnalisees par des nanoparticules d'Or. Pour cela, nous avons employe une approche simple basee sur un systeme de reconnaissance entre une molecule cible et une molecule sonde. Ce schema a ete applique a la detection d'interaction antigene/anticorps et nous a permis de transcrire la selectivite de la reconnaissance entre les anticorps dans le depot des nanoparticules qui se traduit par une modification importante de la conductance du dispositif. Les possibilites d'integration ainsi que la compatibilite des dispositifs avec des systemes de microfluidique rendent ce schema de detection particulierement adapte pour le developpement d'un systeme integre de biodetection a tres haute sensibilite. 1 S. Fields, Proc. Natl. Acad. Sci. USA, vol 98, pp 10051-10054 (2001)

This work builds up on the greatest minds of Cambridge Holography: Adrian Cable, Edward Buckley, Jonathan Freeman, and Christoph Bay. Cable and Buckley, developed an OSPR algorithm which was the first to provide high-quality real-time hologram generation using general-purpose hardware while Freeman designed a method to correct arbitrary aberrations. As ingenious as the method was, the calculations were extensively lengthy. Addressing this issue, a variant of OSPR suited for correcting spatially-varying aberration is presented. The algorithm combines the approaches of Cable, Buckley and Freeman to provide real-time hologram generation while incorporating various corrections (aberration, distortion, and pixel shape envelope). A high-performance implementation on a mid-range GPU achieved hologram generation up to 12 fps. Following topic studied is an adaptive optical correction. This work attempts to construct a set of methods, forming an automated testbed for holographic projectors. Each model, after exiting the production line is placed on such testbed, having all of its imperfections characterized. Once calibrated, each model is able to display highest-quality image throughout its life-span. An application of this work to industry was carried in collaboration with Dr Phillip Hands (University of Edinburgh) and LumeJET. Three demonstrators are constructed intending for a cost-effective system for holographic lithography. They are characterized using the developed testbed. Using the supersampled Adaptive OSPR algorithm, the diffraction limit was surpassed 2.75 times allowing to increase the patterning area. This combines approaches of Cable, Buckley, Freeman and Bay to achieve a wide field-of-view and high pixel-count replay field using off-the-shelf components. This thesis is finished describing the work on 3D holography carried with Penteract28. It is shown that the 2D hologram in the presence of spatially-varying aberrations is mathematically equivalent to a 3D hologram. The same implementation of the algorithm can be used to provide real-time 3D hologram generation.

Este trabalho trata do estudo das condições para a produção de padrões em escala nano e micrométricas, utilizando o processo de litografia eletrônica. A parte inicial refere-se ao estudo do elétron-resiste de PMMA incluindo a preparação da solução, o recobrimento do substrato e a secagem. Em seguida, são apresentados estudos sobre o funcionamento do sistema de litografia por feixe de elétrons em detalhe. São tratados problemas com o resiste, o substrato e a interação com a amostra. São apresentados os aspectos mais importantes dos substratos utilizados, sendo dado um enfoque a heteroestruturas semicondutoras com gás de elétrons bidimensionais. As condições para revelação do resiste e das etapas de processamento para que seja feita a replicação para o substrato do padrão gerado no resiste são também abordadas. Diversos estudos foram realizados para mostrar a influência de alguns efeitos comuns na litografia como a influência da espessura do filme de resiste e os efeitos de proximidade. Também trata da produção de padrões sobre substratos diversos como GaAs, VIDRO, ALUMINA e PRATA. A última etapa estuda a utilização de um resiste híbrido PMMA-Sílica como um método de conformação cerâmica. Finalmente é apresentado um estudo relativo a produção de diversos padrões diferentes sobre heteroestruturas semicondutoras de AlGaAs/GaAs. / The work describe the conditions for pattern production at nano and micrometric scale using the electronic lithographic process. In the first part many types of lithographic technics are compared and the aim why the electron beam lithographic nanostructured production was chosen. Detailed results about operation with the lithographic system and some problems related to electron resist, substrate and interaction between electron beam and sample are presented. The most important substrate aspects are shown. The two dimensional electron gas (2DEG) semiconductors heterostrutures and the M B E process to grow samples are discussed too. The conditions to develop electron resist and steps for pattern transfer over the substrate are discussed. Many experimental studies were realized to show the influence and some effects, common to the lithographic process, such as electron resist thickness and the proximity effect. A production of pattern on some kind of substrate like GaAs, Glass, Aluminum, Silver can also be observed. In the last part of this work some discussion about utilisation of hybrid electron resist composite PMMA-Silica was done, as well as very important technics for ceramic conformation. Finally, the main goal of this work is presented: the production of different nanostructure samples using AlGaAs/GaAs substrates.

Optical elements are the fundamental components in photonic systems and are used to transform an input optical beam into a desired beam profile or to couple the input beam into waveguides, fibers, or other optical systems or devices. Macroscopic optical elements are easily fabricated using grinding and polishing techniques, but few methods exist for inexpensive fabrication of micro optical elements. In this work we present an innovative technique termed Additive Lithography that makes use of binary masks and controlled partial exposures to sculpt photoresist into the desired optical surface relief profile. We explore various masking schemes for fabricating a variety of optical elements with unprecedented flexibility and precision. These masking schemes used in conjunction with the additive lithographic method allows us to carefully control the photoresist exposure and reflow processes for fabricating complex aspheric lens elements, including aspheric elements whose fabrication often proves highly problematic. It will be demonstrated that employing additive lithography for volume sculpting followed by controlled reflow can also allow us to fabricate refractive beam shaping elements. Finally we will discuss the dry etching techniques used to transfer these optical elements into the glass substrate. Thus the additive lithography technique will be demonstrated as an inexpensive, high throughput and efficient process in the fabrication of micro optical elements.

No description available.