No description available.

This dissertation describes the development of III-nitride (III-N) bipolar devices for optoelectronic and electronic applications. Research mainly involves device design, fabrication process development, and device characterization for Geiger-mode gallium nitride (GaN) deep-UV (DUV) p-i-n avalanche photodiodes (APDs), indium gallium nitride (InGaN)/GaN-based violet/blue laser diodes (LDs), and GaN/InGaN-based npn radio-frequency (RF) double-heterojunction bipolar transistors (DHBTs). All the epitaxial materials of these devices were grown in the Advanced Materials and Devices Group (AMDG) led by Prof. Russell D. Dupuis at the Georgia Institute of Technology using the metalorganic chemical vapor deposition (MOCVD) technique. Geiger-mode GaN p-i-n APDs have important applications in DUV and UV single-photon detections. In the fabrication of GaN p-i-n APDs, the major technical challenge is the sidewall leakage current. To address this issue, two surface leakage reduction schemes have been developed: a wet-etching surface treatment technique to recover the dry-etching-induced surface damage, and a ledged structure to form a surface depletion layer to partially passivate the sidewall. The first Geiger-mode DUV GaN p-i-n APD on a free-standing (FS) c-plane GaN substrate has been demonstrated. InGaN/GaN-based violet/blue/green LDs are the coherent light sources for high-density optical storage systems and the next-generation full-color LD display systems. The design of InGaN/GaN LDs has several challenges, such as the quantum-confined stark effect (QCSE), the efficiency droop issue, and the optical confinement design optimization. In this dissertation, a step-graded electron-blocking layer (EBL) is studied to address the efficiency droop issue. Enhanced internal quantum efficiency (ɳi) has been observed on 420-nm InGaN/GaN-based LDs. Moreover, an InGaN waveguide design is implemented, and the continuous-wave (CW)-mode operation on 460-nm InGaN/GaN-based LDs is achieved at room temperature (RT). III-N HBTs are promising devices for the next-generation RF and power electronics because of their advantages of high breakdown voltages, high power handling capability, and high-temperature and harsh-environment operation stability. One of the major technical challenges to fabricate high-performance RF III-N HBTs is to suppress the base surface recombination current on the extrinsic base region. The wet-etching surface treatment has also been employed to lower the surface recombination current. As a result, a record small-signal current gain (hfe) > 100 is achieved on GaN/InGaN-based npn DHBTs on sapphire substrates. A cut-off frequency (fT) > 5.3 GHz and a maximum oscillation frequency (fmax) > 1.3 GHz are also demonstrated for the first time. Furthermore, A FS c-plane GaN substrate with low epitaxial defect density and good thermal dissipation ability is used for reduced base bulk recombination current. The hfe > 115, collector current density (JC) > 141 kA/cm², and power density > 3.05 MW/cm² are achieved at RT, which are all the highest values reported ever on III-N HBTs.

Die Existenz metallreicher Perowskite der Zusammensetzung (SE3X)M (X = O, N; SE = La, Ce, Pr, Nd, Sm, Gd, Tb, Dy, Er, Ho, Tm, Lu; M = Al, Ga, In, Sn) wurde untersucht. Die Charakterisierung der Proben erfolgte mit Röntgenpulverdiffraktometrie und Elementaranalysen (O und N). Oxide (SE3O)Al mit SE = La, Ce, Pr, Nd und Sm und (SE3O)In mit SE = Ce, Pr und Nd wurden erhalten. Die Reihe der Verbindungen (SE3N)Al (SE = La, Ce, Pr, Nd, Sm) wurde um die Seltenerd-Metalle SE = Gd, Tb, Dy, Ho, Er und Tm erweitert. Die metallreichen Perowskite (SE3N)Sn (SE = La, Ce, Pr, Sm) und (SE3N)Ga (SE = Ce, Pr, Sm, Gd, Tb) wurden erstmals beschrieben. Die thermische Stabilität (DSC) der Phasen (SE3X)M ist für die Nitride allgemein am höchsten. Nitride von Al und Ga zersetzen zwischen 1000 °C und 1200 °C, Stannide bleiben bis 1250 °C thermisch stabil. Messungen der magnetischen Suszeptibilität und der LIII-Absorbtionskanten sind in Einklang mit einer Elektronenkonfiguration SE3+. Die gemessenen elektrischen Widerstände sind charakteristisch für schlechte metallische Leiter. Verschiedene Gehaltschnitte SE3Al-(SE3X)Al und SE3In-(SE3X)In wurden mit Röntgenpulverdiffraktometrie und DTA untersucht. Die Oxide und Nitride (SE3X1-y)M (SE = La, Ce; X = N, O) weisen nur geringe Phasenbreiten auf. Die Carbide (Ce3C1-y)In zeigen hingegen signifikante Phasenbreiten. In den Systemen EA-In-N wurden röntgenografisch phasenreine Pulver von (Ca4N)[In]2 und (EA19N7)[In4]2 (EA = Ca, Sr) erhalten. Durch Elementaranalysen auf H, C, N, O, EA und In und Neutronenbeugung am Pulver können alternative Zusammensetzungen mit einer ausgeglichenen Ladungsbilanz im Sinne des Zintl-Konzepts für diese Phasen ausgeschlossen werden. Im System La-Al wurde die neue Phase La16Al13 beobachtet und an Einkristallen sowie an Pulvern charakterisiert. Das in der Literatur im Cu3Au-Strukturtyp beschrieben kubische Polymorph von Ce3Al wurde auf einen ternären metallreichen Perowskit (Ce3X)Al zurückgeführt.

Thesis (Ph.D.)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Graham, Samuel; Committee Co-Chair: Nair, Sankar; Committee Member: Grover - Gallivan, Martha; Committee Member: McDowell, David; Committee Member: Schelling, Patrick; Committee Member: Zhang, Zhuomin

Light from the sun is an attractive source of energy for its renewability, supply, scalability, and cost. Silicon solar cells are the dominant technology of choice for harnessing solar energy in the form of electricity, but the designs are approaching their practical efficiency limits. New multijunction designs which use the tunable properties of the more expensive III-V semiconductors have historically been relegated to space applications where absolute power conversion efficiency, resilience to radiation, and weight are more important considerations than cost. Some of the more recent developments in the field of semiconductor materials are the so-called III-nitride materials which mainly use either indium, aluminum or gallium in combination with nitrogen. Indium gallium nitride (InGaN) is one of these III-nitride semiconductor alloys that can be tailored to span the vast majority of the solar spectrum. While InGaN growth traditionally requires expensive substrate materials such as sapphire, three-dimensional nanowire growth modes enable high quality lattice mismatched growth of InGaN directly on silicon without a metamorphic buffer layer. The absorption and electronic properties of InGaN can also be tuned by incorporating it into quantum confined regions in a GaN host material. This opens up a route towards cost-effective, high efficiency devices such as light emitted diodes and solar cells which can operate over a large range of wavelengths. The combination of the two material systems of InGaN/GaN and silicon can marry the low cost of silicon wafers with the desirable optoelectronic properties of III-nitride semiconductors. This thesis investigates the potential for highly nanostructured InGaN/GaN based devices using quantum-dot-in-nanowire designs as novel solar cells which can enable intermediate band absorption effects and multiple junctions within a single nanowire to absorb more of the solar spectrum and operating more efficiently. Such semiconductor nanostructures can in principle reach power conversion efficiencies of over 40\% on silicon, with a cost closer to conventional silicon solar cells as opposed to methods which use non-silicon substrates. In the primary strategy, the nanowires contain InGaN quantum dots which act as photon absorption/carrier generation centres to sequentially excite photons within the large band gap semiconductor. By using this intermediate band of states, large operating voltages between contacts can be maintained without sacrificing the collection of long wavelength solar photons. In this work, we characterize the properties of such nanowires and experimentally demonstrate sub-bandgap current generation in a large area InGaN/GaN dot-in-nanowire solar cell. Experimental characterization of InGaN / GaN quantum dots in nanowires as both LEDs and solar cells is performed to determine the nanowire material parameters to understand how they relate to the nanowire device performance. Multiple microscopy techniques are performed to determine the nanowire morphology and contact effectiveness. Optical characterization of bare and fabricated nanowires is used to determine the anti-reflection properties of nanowire arrays. Photoluminescence and electroluminescence spectroscopy are performed. Illuminated current-voltage characteristics and quantum efficiencies are determined. Specular and diffuse reflectivities are measured as a function of wavelength. Technology computer-aided design (TCAD) software is used to simulate the performance of the overall nanowire device. The contribution from quantum dots or quantum wells is simulated by solving for the carrier wavefunctions and density of states with the quantum structures. The discretized density of states from the quantum dots is modelled and used in a complete drift-diffusion device simulation to reproduce electroluminescence results. The carrier transport properties are modified to demonstrate effects on the overall device performance. An alternate design is also proposed which uses an InGaN nanowire subcell on top of a silicon bottom subcell. The dual-junction design allows a broader absorption of the solar spectrum, increasing the operating voltage through monolithically grown series-connected, current-matched subcells. The performance of such a cell is simulated through drift-diffusion simulations of a dual-junction InGaN/Si solar cell. The effects of switching to a nanowire subcell based on the nanowires studied in this thesis is discussed.

abstract: The state of the solar industry has reached a point where significant advancements in efficiency will require new materials and device concepts. The material class broadly known as the III-N's have a rich history as a commercially successful semiconductor. Since discovery in 2003 these materials have shown promise for the field of photovoltaic solar technologies. However, inherent material issues in crystal growth and the subsequent effects on device performance have hindered their development. This thesis explores new growth techniques for III-N materials in tandem with new device concepts that will either work around the previous hindrances or open pathways to device technologies with higher theoretical limits than much of current photovoltaics. These include a novel crystal growth reactor, efforts in production of better quality material at faster rates, and development of advanced photovoltaic devices: an inversion junction solar cell, material work for hot carrier solar cell, ground work for a selective carrier contact, and finally a refractory solar cell for operation at several hundred degrees Celsius. / Dissertation/Thesis / Doctoral Dissertation Materials Science and Engineering 2016

Cette thèse se place dans le contexte des recherches menées sur l'élaboration de support de haute qualité cristalline pour des applications optoélectronique et piézoélectrique. Les nitrures d'aluminium, AlN, et de bore, BN sont deux matériaux présentant des propriétés physiques intéressantes pour leurs utilisations en tant que substrat et partiellement comme couche active dans de telles applications. Les objectifs de cette thèse étaient de continuer les travaux en cours sur l'hétéroépitaxie d'AlN (avec le mélange H2 – NH3 – AlCl3 en phase gazeuse) sur substrat saphir et silicium, et d'explorer la croissance de BN par dépôt chimique en phase vapeur (CVD) à haute température avec une chimie chlorée (mélange.H2 – NH3 – BCl3 en phase gazeuse). Des études thermodynamiques ont été menées pour évaluer les équilibres ayant lieu entre la phase gazeuse et les matériaux en présence sur une large gamme de température. Ces premiers résultats ont permis d'en déduire des conditions opératoires favorables afin d'éviter toutes réactions parasites qui nuiraient à la croissance des nitrures. Plusieurs études expérimentales ont été effectuées sur les réacteurs du SIMaP. Une étude de l'influence du ratio N/Al dans la phase gazeuse sur la croissance d'AlN a été entreprise. Par la suite les mécanismes de croissance de ces couches sont expliqués afin de comprendre l'effet de ce paramètre. Suite à cela, des dépôts avec plusieurs étapes de croissances à différente température ont permis l'obtention de couches d'AlN peu fissurées, peu contraintes et avec des qualités cristallines satisfaisantes. Concernant le dépôt de BN, des essais ont été menés sur substrats AlN et métalliques (chrome et tungstène). À haute température (1600 °C), le dépôt sur AlN a permis l'obtention de couche turbostratique peu désorientée. La croissance sur substrats métalliques a été effectuée à basse température, ne favorisant pas l'épitaxie de BN sur ces substrats. Enfin, des comparaisons ont été menées entre température de dépôt, vitesse de croissance des couches et sursaturation de la phase gazeuse, permettant la délimitation de domaine de conditions opératoire où l'épitaxie est favorisée. / This work takes place in the context of the development of high crystalline quality supports for optoelectronic and piezoelectric fields. Aluminum and boron nitrides (AlN, and BN) are both materials with interesting physical properties that are used like substrate or active layers in such devices. The aims of this thesis were to continue the work in progress about AlN epitaxy in SIMaP, and to explore the growth of BN by chemical vapor deposition (CVD) with halide chemistry at high temperature. Thermodynamical studies were lead in order to evaluate the equilibrium between the gas phase and the materials in a wide range of temperature. The results were used to choose operating conditions in order to avoid parasitic reactions that could decrease the nitrides growth quality. Several experimental studies were done to evaluate the influence of the N/Al ratios in the gas phase. Growth mechanisms of these layers are explained and consequences of the growth are linked to crystal quality and strain states of the films. Next, multi-steps growth with several temperatures was lead and shows an interesting improvement of the crystal quality and strain state. BN deposits were done on AlN and metallic substrates (chromium and tungsten). High temperature growth was performed on AlN and lead high quality turbostratic films. For lower temperature, BN deposits were done on metallic substrates and lead to the growth of the turbostratic phase. Finally, a comparison between deposition temperature, the growth speed of the films and supersaturation of the gas phase allow to estimate operating conditions domains were the epitaxy of the nitrides are predominant.

No description available.

Das Wachstum von monolagen dünnen Schichten von InN und GaN/InN auf ZnO wurde untersucht. Ebenso der Einfluss der Verspannung, welche durch das Substrat bedingt ist, auf den Indiumgehalt von (In, Ga)N Heterostrukturen, welche auf GaN und ZnO gewachsen wurden. Alle Proben wurden mittels Molekularstrahlepitaxy gewachsen. Es wurde eine Prozedur entwickelt zum Glühen von ZnO Substraten, um glatte Oberflächen mit Stufenfluss-Morphologie zu erhalten, welche sich für das Wachstum von monolage-dünnen Heterostrukturen eignen. Solche Zn-ZnO und O-ZnO Oberflächen konnten produziert werden, wenn die Proben bei 1050 °C in einer O2 Atmosphäre bei 1 bar für eine Stunde geglüht wurden. Reflection high energy electron diffraction wurde eingesetzt, um in situ den Wachstumsmodus und die Entwicklung des a-Gitterabstandes zu untersuchen. Die kritische Schichtdicke, ab welcher ein Übergang im Wachstumsmodus von glattem zu rauhem Wachstum statt findet, war für das Wachstum von InN auf ZnO geringer als 2 ML und setzt gemeinsam mit dem Beginn der Relaxation ein. Für das Wachstum von GaN auf monolagen-dünnem InN/ZnO konnte gezeigt werden, dass höchstens wenige ML abgeschieden werden können, bevor Relaxation eintritt und/oder eine Vermischung zu (In, Ga)N stattfindet. Untersuchungen durch Röntgenbeugung und Raman Spektroskopie geben Hinweise darauf, dass das Abscheidung der nominalen Struktur 100x(1 ML InN/2 MLs GaN) vermutlich zum Wachstum von (In, Ga)N führte. Die chemische Zusammensetzung war für alle Proben sehr ähnlich mit einem indium Gehält von etwa x: 0.36 und einem Relaxationsgrad von 65% - 73% für Proben, die auf ZnO gewachsen wurde und 95% für Wachstum auf 300 nm In0.19Ga0.81N/GaN. Ein unbeabsichtigter Unterschied im V/III-Verhältnis während des Wachstums von (In, Ga)N Heterostrukturen, auf welchen die Anwesenheit von Metalltröpchen auf manchen Proben hinwies, lies auf einen möglichen Einfluss auf das Relaxationsverhalten und die Oberflächenrauhigkeit schließen. / Several thin InN and GaN/InN films and (In, Ga)N heterostructures were grown using molecular beam epitaxy to investigate their growth mode. InN and GaN/InN films were grown on ZnO substrates and (In, Ga)N heterostructures were grown on (In, Ga)N buffers and ZnO substrates. Fabricating the heterostructures on two different types of substrates was a means of strain engineering to possibly increase the indium content in the (In, Ga)N layers. An annealing procedure was established to treat ZnO substrate to gain smooth, stepped surfaces suitable for ML thin heterostructure devices. Reflection high energy electron diffraction was used to investigate in situ the growth mechanism and evolution of the a-lattice spacing. The critical layer thickness for growth mode transition of InN from smooth to rough is below 2 MLs and fairly coincides with the onset of main relaxation. The deposition of GaN on ML thin InN/ZnO shows that at best a few MLs can be deposited before relaxation and/or intermixing into (In, GaN) takes place. Investigations by X-ray diffraction and Raman spectroscopy indicate that the deposition of a nominal structure of 100x(1 ML InN/2 MLs GaN) seems to result in the growth of (In, Ga)N instead. The average chemical composition was similar for all samples with an indium content close to x: 0.36 and a degree of relaxation between 65%-73% for samples grown on ZnO and 95% for the sample grown on 300 nm In0.19Ga0.81N/GaN pseudo-substrate. The surface was probed with atomic force microscopy and showed that starting with smooth surfaces with root mean square roughness around 0.2 nm there was a considerable roughening during growth and surfaces with grain like morphology and a roughness around 2 to 3 nm was produced. Unintentional differences in V/III ratio during growth of (In, Ga)N heterostructures, indicated by the presence of droplets on some of the sample surfaces, were possible, impacting on the sample relaxation behavior and the surface roughness.

Gallium Nitride (GaN) based transistors have been in the spotlight for power electronics due to promising properties like high bandgap, high breakdown field, high electron mobility, and high-frequency applications. While there are some commercial devices based on these transistors available, there is still room for improvement in these devices for widespread usage. In this project, GaN-based transistors fabricated at RISE AB were investigated. These devices had previously shown high leakage current. Different approaches taken to reduce the said leakage current were analysed. The main scope of the thesis was static electrical testing of a new batch of these transistors at room temperature, mainly investigating their leakage current. The new transistors were subjected to surface treatments and also a new in-situ dielectric layer was used. The surface treatments did not show much improvement but the in-situ grown dielectric showed almost half of the initial leakage current. In addition to this different device architectures with varying gate length, gate width, and gate to drain distance were tested and compared. It was found that devices with 3 μm gate length and 12 μm gate to drain distance showed the best performance. The blocking characteristic of the transistors was also tested and the devices could withstand up to 350V. Suggestions to further identify the sources of the leakage current are presented. Possible improvement in the design of the transistors to increase the blocking voltage is also described. / Transistorer baserade på galliumnitrid (GaN) har varit i strålkastaren för kraftelektronik på grund av lovande egenskaper som högt bandgap, högt nedbrytningsfält, hög elektronmobilitet. Dessa egenskaper gör materialet synnerligen lämpligt för komponentapplikationer vid höga effekter och, framför allt, höga frekvenser. Även om det finns några kommersiella applikationer baserade på dessa transistorer finns det fortfarande stort utrymme för förbättringar. I detta projekt undersöktes GaN-baserade transistorer tillverkade vid RISE AB. Dessa komponenter hade tidigare visat hög läckström och olika tillvägagångssätt för att minska nämnda läckström har analyserats. Transistorerna i detta projekt var ytbehandlade på ett nytt sätt och dielektirkat i styrelektroden var ocskå tillverkat på ett nytt sätt. Ytbehandlingarna visade inte mycket förbättring men det dielektrikat visade nästan hälften av den initiala läckströmmen. Utöver detta testades och jämfördes olika layouter med varierande geometri, gate-längd, gate-bredd och avstånd mellan gate/source. Det visade sig att komponenter med 3 μm gate-längd och 12 μm mellan gate och drain visade bästa prestanda. Transistorernas blockeringskaraktäristik testades också och visade sig tåla upp till 350V. Förslag för att ytterligare identifiera källorna till läckströmmen presenteras. Eventuell förbättring av utformningen av transistorerna för att öka blockeringsspänningen beskrivs också.