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Passive Component Wire Bonding Evaluation in a Hybrid IC PackageChen, Ying-Chou 12 February 2007 (has links)
As the IC assembly technology fast developing in the modern electrical industries. Demand of high performance electric product is glowing up day by day. New generation of the hybrid IC assembly package has become the major role recently. In order to prevent the package defects occurring in end customer sites, in this paper we try to improve the IC assembly method by using a totally different process to fix the passive component on a BGA substrate. We found that the passive component can be proceeded the current gold wire bonding process.
In case of the Hybrid BGA with the current passive component attaching process, we can find the thermal effect during the surface mount process. Since the solder can be melt every time during each heating process. Therefore, we plan to improve it without solder attachment. The new improvement is to fix the passive component by a non-conductive thermal cure glue. The glue can be done in one time cure, thus the further process would not influence the quality of passive component.
However in the evaluation experiment, the component coated by Gold is the best choice, but we intend to just put it in a comparison model because of the cost consideration. Both works on passive component coated by Gold and Solder were proved. The customer support for the further study on the real products is suggested.
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Beam Switching Reflectarray With Rf Mems TechnologyBayraktar, Omer 01 September 2007 (has links) (PDF)
In this thesis 10x10 reconfigurable reflectarray is designed at 26.5 GHz where the change in the progressive phase shift between elements is obtained with RF MEMS
switches in the transmission lines of unit elements composed of aperture coupled microstrip patch antenna (ACMPA). The reflectarray is illuminated by a horn antenna, and the reflected beam is designed to switch between broadside and 40° / by considering the position of the horn antenna with respect to the reflectarray.
In the design, the transmission line analysis is applied for matching the ACMPA to the free space. The full wave simulation techniques in HFSS are discussed to obtain
the phase design curve which is used in determining two sets of transmission line lengths for each element, one for the broadside and the other for switching to the 40° / at 26.5 GHz.
The switching between two sets of transmission line lengths is
sustained by inserting RF MEMS switches into the transmission lines in each element.
Two types of RF MEMS switches, series and shunt configurations, are designed for the switching purpose in the reflectarray. The phase errors due to nonideal phase design curve and type of the RF MEMS switch are reduced. The possible mutual coupling effects of the bias lines used to actuate the RF MEMS switches are also eliminated by the proper design.
To show the validity of the design procedure, a prototype of 20x20 reflectarray composed of ACMPA elements is designed at 25GHz and produced using Printed Circuit Board (PCB) technology. The measurement results of the prototype reflectarray show that the main beam can be directed to the 40° / as desired.
The process flow for the production of the reconfigurable reflectarray is suggested in terms of integration of the wafer bonding step with the in-house standard surface micromachined RF MEMS process.
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Bonding Efficiency Of Roller Compacted Concrete With Different Bedding MixesOzcan, Sinan 01 December 2008 (has links) (PDF)
Roller Compacted Concrete (RCC) has rapidly evolved from a concept to a material and a process which is used throughout the world for faster and more economical construction of dams. Currently, there are more than 250 RCC dams, completed or under construction, in the world. On the other hand, currently, there are only two RCC dams completed (Suç / ati and Cindere Dams) and two under construction (Beydag and Ç / ine Dam) in Turkey.
RCC dams are constructed in a series of compacted layers usually 30 cm in thickness. Therefore, appropriate bonding of successive layers is important and as a result, in between successive layers a bedding mix is often used to fill the surface voids in both the compacted layer below and the covering layer above, as well as to bond the two successive layers together.
This study presents an experimental investigation on the bonding efficiency of RCC with different bedding mixes. The Beydag Dam RCC mixture was taken as the model for the preparation of laboratory-made RCC specimens. In the experimental study, 15 cm cubic specimens were prepared in two layers. Each layer was compacted using an electro pneumatic demolition hammer for 30 seconds. Four different time intervals between placement and compaction of two successive layers and two different bedding mix types were the selected cases for investigation. While preparing the specimens, the second layer was placed and compacted 0, 4, 8, 12 and 16 hours after the first layer was compacted. In between the two layers, two types of bedding mixes are placed in between previously compacted and freshly placed layer for joint treatment. One of the bedding mixes, having 200 kg/m3 cement content is termed poor while other one is termed rich having 400 kg/m3 cement content.
RCC specimens are then subjected to compressive strength, splitting tensile strength and permeability tests. As a result of the experimental program, it was found that / a rich bedding mix was a more effective bonding agent between compacted RCC layers than the poor bedding mix for all time intervals between layers. Furthermore, it was concluded that bonding efficiency of RCC is not too dependent on time interval between layer compactions up to 16 hours. Finally, splitting tensile strength and sorptivity tests are shown to be applicable test methods for determination of bonding efficiency of RCC specimens if there is a definite bedding layer in between freshly placed and formerly compacted RCC.
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The most appropriate process scheduling for Semiconductor back-end Assemblies--Application for Tabu SearchTsai, Yu-min 25 July 2003 (has links)
Wire Bonder and Molding are the most costive equipments in the investment of IC packaging; and the packaging quality, cost and delivery are concerned most in the assembly processes. An inappropriate process scheduling may result in the wastes of resources and assembly bottleneck. Manager must allocate the resources appropriately to adapt the changeable products and production lines.
We would introduce several heuristic search methods, especially the Tabu search. Tabu search is one of the most popular methods of heuristic search. We also use Tabu list to record several latest moves and avoid to the duplication of the paths or loops. It starts from an initial solution and keep moving the solution to the best neighborhood without stock by Tabu. The iterations would be repeated until the terminating condition is reached.
At last of the report, an example will be designed to approach the best wire bonding and molding scheduling by Tabu search; and verify the output volume is more than those with FIFO in the same period of production time.
Tabu search will be then confirmed to be effective for flexible flow shop.
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Motivation Mechanisms and Member Loyalty in Virtual Communities : An Exploratory Study of On-line GamesLin, Shu-yi 27 August 2009 (has links)
The study investigates whether different motivation mechanisms can affect the quality of relationship and member loyalty of virtual communities. The particular domain is online games on which players often join affiliated virtual communities to exchange information. A questionnaire was designed for the online survey that resulted in a total of 685 valid responses. The results from the partial least square analysis show that relationship quality as measured by Customer satisfaction, trust and commitment have a mediating effect between motivation mechanisms and member loyalty. Among the motivation mechanisms, financial bonds have no effect on relationship quality but social and structural bonds have significant effects. The findings can be used by practitioners when they run virtual communities and have implications for future research in related topics.
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All-copper chip-to-substrate interconnections for flip-chip packagesLightsey, Charles Hunter 09 July 2010 (has links)
Avatrel 8000P's excellent photo-definition properties and mechanical strength make it an ideal polymer collar material. Avatrel 8000P is a high contrast, I-line sensitive mixture that can be developed in traditional aqueous-base developers. The great photolithographical performance of this photopolymer can be partly contributed to the minimal amount of light absorbed by the base norbornene polymer. The processing conditions noted in this work are an optimized version, which have been shown to give superior photolithographical performance. The simple baking procedures make Avatrel 8000P easier to process than SU-8. The ability to develop Avatrel 8000P in aqueous base can reduce chemical waste. As shown by SEM images, high fidelity structures with aspect ratios of 7:1 can be fabricated in thick films with vertical sidewalls. Bonding between two copper surfaces over various gap sizes was achieved by electroless deposition without the addition of surfactants or inhibitors in the bath. The effect of anneal temperature on the electroless bond formed was analyzed. The electroless bond strength increased with anneal temperature. However, the bond strength estimation for samples annealed at 80°C to 120°C is a minimum value due to the failure location of most of the pillars and the resulting area used in the calculation of bond strength. Grain growth from copper recrystallization and removal of small defects improve the bond strength. Large voids at the interface of the two pillars were related to rough starting surfaces for the electroplated pillars.
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Crystal engineering of binary compounds containing pharmaceutical molecules [electronic resource] / by Leslie Ann Morales.Morales, Leslie Ann. January 2003 (has links)
Title from PDF of title page. / Document formatted into pages; contains 80 pages. / Thesis (M.S.)--University of South Florida, 2003. / Includes bibliographical references. / Text (Electronic thesis) in PDF format. / ABSTRACT: The synthesis or the interaction between two or more molecules is known as supramolecular chemistry. The concept of supramolecular chemistry can be applied to the design of new pharmaceutical materials affording new compositions of matter with desirable composition, structure and properties. The design of a two-molecule, or binary, compound using complementary molecules represents an example of an application of crystal engineering. Crystal engineering is the understanding of intermolecular interactions, in the context of crystal packing, in the design of new solid materials. By identifying reliable connectors through molecular recognition or self-assembly, one can build predictable architectures. / ABSTRACT: The study of supramolecular synthesis was accomplished using known pharmaceutical molecules such as Nifedipine (calcium channel blocker used for cardiovascular diseases) and Phenytoin (used as an anticonvulsant drug) and model compounds containing synthons common in pharmaceutical drugs (Crown ethers and Trimesic acid with ether linkages and carboxylic acid dimers, respectively) with complementary molecular additives. The co-crystals formed were characterized by various techniques (IR, m.p., XPD, single X-ray diffraction) and preliminary results were found to exhibit characteristics different from the parent compounds as a direct result of hydrogen bonding and self-assembly interactions. These crystalline assemblies could afford improved solubility, dissolution rate, stability and bioavailability. / System requirements: World Wide Web browser and PDF reader. / Mode of access: World Wide Web.
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Simulation in der Verbindungstechnik – ein ÜberblickReul, Stefan 10 June 2010 (has links) (PDF)
Anforderungen an Verbindungen, Verbindungstechnik, Fügen, Modellierungspraxis, Beispiel Verschraubung, Beispiel Klebverbindung, Beispiel Schweißung, Thesen zu Simulationen in der Verbindungstechnik
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A computational investigation of inorganic systems using ab initio methods /Lawrence, A. Raelene, January 2000 (has links)
Thesis (Ph. D.)--University of Missouri-Columbia, 2000. / Typescript. Vita. Includes bibliographical references (leaves 161-175). Also available on the Internet.
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A computational investigation of inorganic systems using ab initio methodsLawrence, A. Raelene, January 2000 (has links)
Thesis (Ph. D.)--University of Missouri-Columbia, 2000. / Typescript. Vita. Includes bibliographical references (leaves 161-175). Also available on the Internet.
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