The McTronX research group at the North-West University is currently researching self-sensing techniques for Active Magnetic Bearings (AMB). The research is part of an ongoing effort to expand the knowledge base on AMBs in the School of Electrical, Electronic and Computer Engineering to support industries that make use of the technology. The aim of this project is to develop an integrated co-processor based power electronic drive with the emphasis placed on the ability of the co-processor to execute AMB self-sensing algorithms. The two primary techniques for implementing self-sensing in AMBs are state estimation and modulation. This research focuses on hardware development to facilitate the implementation of the modulation method. Self-sensing algorithms require concurrent processing power and speed that are well suited to an architecture that combines a digital signal processor (DSP) and a field programmable gate array (FPGA). A comprehensive review of various power amplifier topologies shows that the pulse width modulation (PWM) switching amplifier is best suited for controlling the voltage and current required to drive the AMB coils. Combining DSPs and power electronics to form an integrated co-processor based power electronic drive requires detail attention to aspects of PCB design, including signal integrity and grounding. A conceptual design is conducted and forms part of the process of compiling a subsystem development specification for the integrated drive, in conjunction with the McTronX Research Group. Component selection criteria, trade-off studies and various circuit simulations serve as the basis for this essential phase of the project. The conceptual design and development specification determines the architecture, functionality and interfaces of the integrated drive. Conceptual designs for the power amplifier, digital controller, electronic supply and mechanical layout of the integrated drive is provided. A detail design is performed for the power amplifier, digital controller and electronic supply. Issues such as component selection, power supply requirements, thermal design, interfacing of the various circuit elements and PCB design are covered in detail. The output of the detail design is a complete set of circuit diagrams for the integrated controller. The integrated drive is interfaced with existing AMB hardware and facilitates the successful implementation of two self-sensing techniques. The hardware performance of the integrated coprocessor based power electronic drive is evaluated by means of measurements taken from this experimental self-sensing setup. The co-processor performance is evaluated in terms of resource usage and execution time and performs satisfactorily in this regard. The integrated co-processor based power electronic drive provided sufficient resources, processing speed and flexibility to accommodate a variety of self-sensing algorithms thus contributing to the research currently underway in the field of AMBs by the McTronX research group at the North-West University. / Thesis (M.Ing. (Electrical Engineering))--North-West University, Potchefstroom Campus, 2009.

The main focus of this thesis is placed on high frequency PCB signal Integrity Is-sues and RF/Microwave filters using EBG structures. From the signal Integrity aspect, two topics were mainly discussed. On one hand, the effect of increasing frequency on classical design rules for crosstalk reduction in PCBs was investigated experimentally and by full-wave simulations. An emphasis was placed on the 3×W spacing rule and the use of guard traces. Single-ended and differential transmission lines were considered. S-parameter measurements and simu-lations were carried out at high-frequency (up to 20 GHz). The results emphasize the necessity to reevaluate traditional design rules for their suitability in high frequency applications. Also, the impacts of using guard traces for high frequency crosstalk re-duction were clearly pointed out. On the other hand, the effect of high loss PCB ma-terials on the signal transmission characteristics of microstrip lines at high frequency (up to 20 GHz) was treated. Comparative studies were carried out on different micro-strip configurations using standard FR4 substrate and a high frequency dielectric ma-terial from Rogers, Corporation. The experimental results highlight the dramatic im-pact of high dielectric loss materials (FR4 and solder mask) and magnetic plating metal (nickel) on the high frequency signal attenuation and loss of microstrip trans-mission lines. Besides, the epoxy-based SU8 photoresist was characterized at high frequency (up to 50 GHz) using on-wafer conductor-backed coplanar waveguide transmission lines. A relative dielectric constant of 3.2 was obtained at 30 GHz. Some issues related to the processing of this material, such as cracks, hard-skin, etc, were also discussed. Regarding RF/Microwave filters, the concept of Electromagnetic Band Gap (EBG) was used to design and fabricate novel microstrip bandstop filters using periodically modified substrate. The proposed EBG structures, which don’t suffer conductor backing issues, exhibit interesting frequency response characteristics. The limitations of modeling and simulation tools in terms of speed and accuracy are also examined in this thesis. Experiments and simulations were carried out show-ing the inadequacies of the Spice diode model for the simulations in power electronics. Also, an Artificial Neural Network (ANN) model was proposed as an alternative and a complement to full-wave solvers, for a quick and sufficiently accurate simulation of interconnects. A software implementation of this model using Matlab’s ANN toolbox was shown to considerably reduce (by over 800 times) the simulation time of microstrip lines using full-wave solvers such as Ansoft’s HFSS and CST’s MWS. Finally, a novel cooling structure using a double heatsink for high performance electronics was presented. Methods for optimizing this structure were also discussed. / QC 20100809

This master’s thesis deals with the design of six channel SD, HD and 3G HD-SDI digital video signal converter to 10-Gigabit Ethernet. In the introductory part, the conception of designed device is formulated. The theoretical background is provided in four chapters, where main standards and design rules related to digital electronics’ design are analyzed. The emphasis is placed on signal integrity at high-speed interconnects. There mostly practical examples, calculations and simulations are utilized. The design part contains thorough description of main subsystems’ design, implementation of FPGA, SDI input channels and 10-Gigabit Ethernet PHY. In the final part, the first tests and measurements of the build prototype are summarized. As an example, the comparison of signal integrity simulation to measurement is provided.

Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. Recently however, three- dimensional (3-D) integration has emerged as a leading contender in the challenge to meet performance, heterogeneous integration, cost, and size demands through this decade and beyond. Through silicon via (TSV) based 3-D wafer-level integration is an emerging vertical interconnect methodology that is used to route the signal and power supply links through all chips in the stack vertically. Delay and signal integrity (SI) calculation for signal propagation through TSVs is a critical analysis step in the physical design of such systems. In order to reduce design time and mirror well established practices, it is desirable to carry this out in two stages, with the physical structures being modelled by parasitic parameters in equivalent circuits, and subsequent analysis of the equivalent circuits for the desired metric. This thesis addresses both these issues. Parasitic parameter extraction is carried out using a field solver to explore trends in typical technologies to gain an insight into the variation of resistive, capacitive and inductive parasitics including coupling effects. A set of novel closed-form equations are proposed for TSV parasitics in terms of physical dimensions and material properties, allowing the electrical modelling of TSV bundles without the need for computationally expensive field-solvers. Suitable equivalent circuits including capacitive and inductive coupling are derived, and comparisons with field solver provided values are used to show the accuracy of the proposed parasitic parameter models for the purpose of performance and SI analysis. The deep submicron era saw the interconnection delay rather than the gate delay become the major bottleneck in modern digital design. The nature of this problem in 3-D circuits is studied in detail in this thesis. The ubiquitous technique of repeater insertion for reducing propagation delay and signal degradation is examined for TSVs, and suitable strategies and analysis techniques are proposed. Further, a minimal power smart repeater suitable for global on-chip interconnects, which has the potential to reduce power consumption by as much as 20% with respect to a traditional inverter is proposed. A modeling and analysis methodology is also proposed, that makes the smart repeater easier to amalgamate in CAD flows at different levels of hierarchy from initial signal planning to detailed place and route when compared to alternatives proposed in the literature. Finally, the topic of system-level performance estimation for massively integrated systems is discussed. As designers are presented with an extra spatial dimension in 3-D integration, the complexity of the layout and the architectural trade-offs also increase. Therefore, to obtain a true improvement in performance, a very careful analysis using detailed models at different hierarchical levels is crucial. This thesis presents a cohesive analysis of the technological, cost, and performance trade-offs for digital and mixed-mode systems, outlining the choices available at different points in the design and their ramifications / QC 20100916

Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integration, especially in mobile and wireless systems. Due to the presence of multiple dissimilar modules, each having unique power supply requirements, the design of the power distribution network (PDN) becomes critical. Typically, this PDN is designed as alternating layers of power and ground planes with signal interconnects routed in between or on top of the planes. The goal for the simulation of multi-layer power/ground planes, is the following: Given a stack-up and other geometrical information, it is required to find the network parameters (S/Y/Z) between port locations. Commercial packages have extremely complicated stack-ups, and the trend to increasing integration at the package level only points to increasing complexity. It is computationally intractable to solve these problems using these existing methods. The approach proposed in this thesis for obtaining the response of the PDN is the multi-layer finite difference method (M-FDM). A surface mesh / finite difference based approach is developed, which leads to a system matrix that is sparse and banded, and can be solved efficiently. The contributions of this research are the following: 1. The development of a PDN modeler for multi-layer packages and boards called the the multi-layer finite difference method. 2. The enhancement of M-FDM using multi-port connection networks to include the effect of fringe fields and gap coupling. 3. An adaptive triangular mesh based scheme called the multi-layer finite element method (MFEM) to address the limitations of M-FDM 4. The use of modal decomposition for the co-simulation of signal nets with the PDN. 5. The use of a robust GA-based optimizer for the selection and placement of decoupling capacitors in multi-layer geometries. 6. Implementation of these methods in a tool called MSDT 1.

Tato disertační práce je obsahově zaměřená na problematiku integrity signálů v moderních čipových obvodech. Na základě provedených simulací a praktických experimentů byl proveden návrh equalizační techniky druhého řádu pro efektivnější vysokorychlostní komunikaci. Předložený návrh respektuje současné požadavky na vyvíjené signalizační techniky, které zahrnují efektivnější využití šířky pásma přenosového kanálu a energetickou úsporu. Provedené analýzy podrobně ukazují možnost zvýšení přenosové rychlosti při přenosu signálu skrz nízkonákladové přenosové kanály s využitím navržené signální metody. Výkonnost navrhované signalizační techniky je demonstrována na různých typech přenosových kanálů s přenosovou funkcí vyššího řádu. Diskutovány jsou rovněž možnosti omezení rušivých vlivů na přenosové kanály během návrhu.

Ce travail de recherche intitulé " Contribution à la modélisation de l'Intégrité des Alimentations dans les System-in-Package", effectué chez NXP semi-conducteurs, se propose d'étudier l'intégrité des alimentations et des signaux dans un système complexe tel que le System-in-Package(SiP), les System-on-Chip(SoC) ou autres (PoP,...). C'est-à-dire la générations de perturbations électromagnétiques conduites dues à l'activité d'un système complexe sur son environnement d'intégration. Un bilan de puissance statique et dynamique permet de considérer l’influence de l’activité des fonctions numériques sur le système SiP. L’activité dynamique est représentée sous forme de profils canoniques caractérisés par la technologie de conception des fonctions logiques. Cette représentation en base tient compte du cadencement multi fréquentiel (ou multi-harmonique) du système. Un logiciel a été développé permettant d'extraire un profil d'activité numérique définit suivant la géométrie de la fonction, sa technologie et ses fréquences d'activation. Les fonctions analogiques et le réseau passif d'interconnexions sont modélisés au travers de fonctions de transfert et validés par une approche expérimentale (domaine fréquentiel et temporel) et en simulation. Cette analyse a permis de souligner les potentialités de la modélisation BBS (Broad Band Spice Model). Ceci a permis une modélisation multi-port globale de l'environnement d'intégration modélisé depuis le PCB jusqu’aux fonctions actives (PCB-Boitier-interconnexions-circuits). Les modèles extraits sont utilisables dans un environnement SPICE où l’ensemble du système est modélisé dans un environnement unique. La CO-MODÉLISATION et la CO-SIMULATION GLOBALES permettent la proposition de règles de conception et l’optimisation du découplage souligné par le potentiel du substrat de report PICS (Passive Integrating Component Substrate). / This thesis, performed in NXP Semiconductors, presents an analysis on POWER INTEGRITY and SIGNAL INTEGRITY in complex systems (System-in-Package SiP, System-on-Chip SoC, PoP, etc). This subject takes in account the propagation and its effects of conducted electromagnetic interferences due to digital activities in power distribution network. A statement of static and dynamic power consumption allows to consider effects of digital activities through a multi-clock and multi harmonic model based on technologies, clocks and geometries of a dedicated functions, blocks or dices. A global distributed CO-SIMULATION/CO-MODELISATION methodology for concurrent/simultaneous analysis of passif distribution network have been successfully applied to a full complex system. An original "power signature" concept is used to model high speed digital modules temporal and spatial distribution of their power switching activity for analog-mixed-digital co-simulations. Analysis of coupling effects at systems level have been studied through access ports with and without active SiP modules. The measured coupling is validated with predicted simulation results based on electromagnetic simulations and broad band SPICE extractions. Correlations are validated between observed spurs in presence of SiP active modules and the behavioral response (transfer function) of the active die multiport, and multi-port de-embedding analysis. The full model of complex system, available in SPICE environnement, allows to analyse propagation and its effects of conducted electromagnetic interferences on dices, functions and system of the SiP. Thanks to this work, it will possible to supply new design rules and optimize of decoupling capacities values. A dedicated software was elaborated to generate a quick digital activity model easy-to-implement in SPICE environment.

Avui dia cada vegada s'ha de tenir més en compte com es realitza el traçat de pistes en les plaques de circuit imprès (PCB). Això és degut a que cada vegada més hi viatgen senyals amb components freqüencials més elevades. Per tant, paràmetres com la desadaptació per impedància característica, acoblaments, ressonàncies i comportaments complexes de les transicions que es troben els senyals en la seva propagació per les pistes, han de ser considerats per evitar problemes d'integritat del senyal i garantir la compatibilitat electromagnètica (EMC) amb el seu entorn. El present treball de tesi s'ha centrat en l'estudi del comportament d'una situació particular, però molt habitual, de pistes: dues pistes sobre un pla de massa, formant el que es coneix com una línia de transmissió microstrip acoblada. Els senyals que viatgen a través d'una línia microstrip acoblada es poden descompondre en dos modes bàsics de propagació: mode comú (on la tensió està definida entre el pla de massa i cada pista) i el mode diferencial (on la tensió està definida entre les pistes). Aquesta descomposició és molt habitual en el món de la compatibilitat electromagnètica ja que les tècniques de filtratge de les interferències varien depenent si aquestes viatgen en mode comú o en mode diferencial. El treball desenvolupat s'ha focalitzat en l'estudi, des d'aquest punt de vista multimodal (que té en compte simultàniament tant el mode comú com el diferencial), de les diferents transicions que es pot trobar el senyal en la seva propagació degut al traçat de pistes. Com a resultat d'aquest estudi s'han obtingut uns models circuitals que permeten l'anàlisi i simulació dels diferents modes que intervenen i que han estat validats de forma experimental. Aquest fet ha permès l'ús d'aquests models en l'anàlisi de problemes d'integritat del senyal que són comuns en el entorn de la compatibilitat electromagnètica (EMC). Els resultats obtinguts han estat presentats en congressos nacionals i internacionals. / Hoy en día cada vez se debe tener más en cuenta como se realiza el trazado de pistas en las placas de circuito impreso (PCB). Esto es así debido a que cada vez más viajan por ellas señales con componentes frecuenciales más elevadas. Por lo tanto, parámetros como la desadaptación por impedancia característica, acoplamientos, resonancias y comportamientos complejos de las transiciones que se encuentran las señales mientras se propagan por las pistas, deben ser tenidos en consideración para evitar problemas de integridad de la señal y garantizar la compatibilidad electromagnética (EMC) con su entorno. En el presente trabajo de tesis se ha centrado en el estudio del comportamiento de una situación particular, pero habitual, de pistas: dos pistas sobre un plano de masa, formando lo que se conoce como línea de transmisión microstrip acoplada. Las señales que viajan a través de una línea microstrip acoplada se pueden descomponer en dos modos básicos de propagación: modo común (donde la tensión está definida entre el plano de masa y cada pista) y modo diferencial (donde la tensión está definida entre pistas). Esta descomposición es muy habitual en el mundo de la compatibilidad electromagnética ya que las técnicas de filtrado de las interferencias varían dependiendo si estas viajan en modo común o en modo diferencial. El trabajo desarrollado se ha focalizado en el estudio, desde este punto de vista multimodal (que tiene en cuenta simultáneamente tanto el modo común como el diferencial), de las diferentes transiciones que puede encontrarse la señal durante su propagación debido al trazado de pistas. Como resultado se han obtenido unos modelos circuitales que permiten el análisis y simulación de los diferentes modos que intervienen y que han sido validados de forma experimental. Este hecho ha permitido el uso de dichos modelos en el análisis de problemas de integridad de la señal que son comunes en el entorno de la compatibilidad electromagnética (EMC). Los resultados obtenidos han sido mostrados en congresos nacionales e internacionales. / Nowadays, the placement of the strips in a printed circuit board (PCB) has to be performed with increasing care, because of the rise of the spectral content of the signals propagating through the strips. Due to this fact, mismatches of the characteristic impedances, crosstalks, resonances and complex behavior of the transitions that the signals may encounter in their propagation have to be considered in order to avoid signal integrity problems and to guarantee the electromagnetic compatibility with their environment. This work is focused on the study of the behavior of a particular, but also a very common way of routing strips: two close strips above a ground plane, forming a extit{coupled microstrip transmission line}. The signals present at this transmission line can be decomposed into two basic signals known as common mode (where its voltage is defined between the ground plane and each strip) and differential mode (where its voltage is defined between the two strips). This decomposition is often found in electromagnetic compatibility because the different techniques of filtering interferences depend on their main mode of propagation. The study carried out in this thesis is focused on the analysis from a multimodal point of view of different transitions that signals encounter during their propagation in a coupled microstrip transmission line. As a result of this analysis, a number of circuit models for different transitions have been obtained and experimentally validated. These models have been used to successfully study signal integrity problems found in EMC and they have been presented in national and international symposiums.

Una línia de transmissió three-line-microstrip consisteix en tres pistes paral·leles practicades sobre la cara d'un dielèctric amb un pla de massa inferior. La propagació en aquesta línia es pot descriure en termes de tres modes fonamentals anomenats ee, oo i oe. Tot i que aquests modes són ortogonals interaccionen entre sí a qualsevol transició, discontinuïtat o asimetria. En el pla d'una transició o asimetria es genera un intercanvi d'energia o conversió modal en el que prenen part tots els modes.En aquest treball s'analitza la conversió modal que s'origina en un conjunt de transicions i asimetries construïdes sobre línies three-line-microstrip. L'estudi es realitza aplicant la tècnica de l'anàlisi multimodal. L'ús d'aquesta tècnica permet la deducció d'una sèrie de models multimodals (un per a cada transició) que proporcionen una anàlisi simple, rigorosa i quantitativa d'aquest fenomen.La validesa d'aquest estudi es verifica de manera experimental. Els bons resultats obtinguts demostren que els models multimodals proposats prediuen de manera precisa el comportament de les transicions. Aquest fet permet el seu ús per analitzar circuits o estructures constituïts per trams de tres pistes acoblades. En el cas d'aquesta tesi, han estat aplicats als camps de l'EMC i de les microones. Pel que fa a l'EMC, s'ha realitzat un estudi de l'acoblament i la integritat del senyal en configuracions de PCB amb trams de tres pistes acoblades. Aquest estudi ha permès identificar les transicions i asimetries en aquests circuits com a possibles fonts d'interferència i de degradació dels senyals ja que la conversió modal es pot interpretar com a un procés d'interferència que involucra tots els senyals presents. Pel que fa a les microones, s'ha realitzat una anàlisi multimodal de filtres spurline. Aquesta anàlisi ha permès desenvolupar dues noves estructures, la principal característica de les quals és la seva compacitat que, a diferència d'altres estructures similars, s'aconsegueix permetent la presència d'un nou mode en el procés de ressonància. L'ús dels models multimodals per a l'anàlisi d'aquestes estructures ha permès una interpretació clara i senzilla del seu funcionament així com el desenvolupament d'una sèrie de regles de disseny que permeten un ajust fàcil i ràpid de certs paràmetres dels filtres com ara la freqüència central i l'ample de banda. / Una línea de transmisión three-line-microstrip consiste en tres pistas paralelas practicadas sobre la cara de un dieléctrico con un plano de masa inferior. La propagación en esta línea se puede describir en términos de tres modos fundamentales llamados ee, oo i oe. Aunque estos modos son ortogonales interaccionan entre se en cualquier transición, discontinuidad o asimetría. En el plano de una transición o asimetría se genera un intercambio de energía o conversión modal en el que toman parte todos los modos.En este trabajo se analiza la conversión modal que se origina en un conjunto de transiciones i asimetrías construidas sobre líneas three-line-microstrip. El estudio se realiza aplicando la técnica del análisis multimodal. El uso de esta técnica permite la deducción de una serie de modelos multimodales (un per a cada transición) que proporcionan un análisis simple, riguroso i cuantitativo de este fenómeno.La validez de este estudio se verifica de manera experimental. Los buenos resultados obtenidos demuestran que los modelos multimodales propuestos predicen de manera precisa el comportamiento de las transiciones. Este hecho permite su uso para analizar circuitos o estructuras constituidos por tramos de tres pistas acopladas. En esta tesis doctoral, han sido aplicados a los campos de la EMC i de las microondas. En el primero de ellos, se ha realizado un estudio del acoplamiento y la integridad de la señal en configuraciones de PCB con tramos de tres pistas acopladas. Este estudio ha permitido identificar las transiciones y asimetrías en estos circuitos como posibles fuentes de interferencia y de degradación de las señales ya que la conversión modal se puede interpretar como a un proceso de interferencia que involucra todas las señales presentes. En el campo de las microondas, se ha realizado un análisis multimodal de filtros spurline. Este análisis ha permitido desarrollar dos nuevas estructuras, cuya principal característica es su compacidad que, a diferencia de otras estructuras similares, se consigue permitiendo la presencia de un nuevo modo en el proceso de resonancia. El uso de los modelos multimodales para el análisis de estas estructuras ha permitido una interpretación clara i sencilla del su funcionamiento así como el desarrollo de una serie de reglas de diseño que permiten un ajuste fácil i rápido de ciertos parámetros de los filtros como por ejemplo la frecuencia central y el ancho de banda. / A three-line-microstrip transmission line consists of three parallel coupled strips printed on a grounded dielectric substrate. The propagation in this line can be described in terms of three fundamental modes, namely the ee, oo and oe modes. These modes are orthogonal and propagate independently unless a transition or asymmetry is present in the line. Any transition or asymmetry will generate an energy exchange or modal interaction among all the propagating modes. In this work, the modal interaction of a set of transitions and asymmetries in three-line-microstrip transmission lines is analyzed. The study is carried out by using the multimodal analysis. By means of this technique a set of multimodal circuit models (one for each transition) is derived. These models provide a simple and a quantitative interpretation of the modal interaction.The proposed multimodal analysis is experimentally validated. The obtained results show that the derived multimodal models accurately predict the behavior of the transitions. Due to this fact, they can be used for the analysis of circuits and structures composed of three-coupled-strip sections. In this work, the models have been applied to both the EMC and microwave fields. In the former, they have been employed to study the cross-talk and signal-integrity problems in PCB configurations involving tree-coupled-trace sections. The performed analysis has shown that transitions and asymmetries in these circuits must be considered as a source of interference and signal degradation since the modal interaction can be interpreted as an interference process that involves all the present signals. In the latter, a multimodal analysis of spurline filters has been performed. This study has allowed the derivation of two new filter structures whose main feature is their compactness, which, in contrast to other analogous filters, is achieved by allowing the presence of an additional mode in the resonance process. The use of the multimodal models for the analysis of these structures has permitted both a simple interpretation of the filter operation and the derivation of a set of design rules which allows a rapid fine tuning of some filter parameters such as the center frequency and the bandwidth.