Made available in DSpace on 2014-06-11T19:23:28Z (GMT). No. of bitstreams: 0 Previous issue date: 2009-08-24Bitstream added on 2014-06-13T20:50:23Z : No. of bitstreams: 1 santos_jc_me_bauru.pdf: 1909289 bytes, checksum: 46f1166eec4b53fcdc6e5fe6a3b31b70 (MD5) / Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) / Neste trabalho foi realizada a deposição através da técnica de evaporação resistiva, de filmes finos de GaAs (arseneto de gálio) e de Al (alumínio) com posterior oxidação deste último, formando 'Al IND. 2''O IND. 3' (óxido de alumínio ou alumina) e a caracterização dos filmes de GaAs e da heteroestrutura formada por 'Al IND. 2''O IND. 3' e GaAs. A confecção do dispositivo combinando estes compostos serviu para a investigação das características relevantes do sistema para potencial aplicação em transistores. O trabalho compreendeu investigação sobre as condições de deposição, e foram avaliadas principalmente as características elétricas dos filmes produzidos individualmente. Os resultados apresentados incluem: resistividade em função da temperatura, corrente-voltagem em função da temperatura, difração de raios-X e transmitância na região do infravermelho. Para caracterização do desempenho do sistema 'Al IND. 2''O IND. 3'/GaAs, um transistor simples foi construído sob um substrato de vidro borossilicato com uma camada de GaAs e outra de 'Al IND. 2''O IND. 3'. Os contatos de fonte, dreno e gate foram feitos de In. Essa estrutura permite a medida da corrente de fuga e a avaliação de outras características do sistema. Neste dispositivo foram avaliadas as características corrente-voltagem em função da temperatura, e também a interação com luz, já que GaAs, por apresentar gap direto, torna-se atraente para aplicações opto-eletrônicas. Assim medidas de elétricas foto-induzidas foram realizadas com excitação com fontes de luz branca. Com o intuito de se avaliar a qualidade dos filmes de GaAs obtidos pela evaporação resistiva, tanto a caracterização estrutural quando elétrica também foram feitas em filmes finos de GaAs depositados por sputtering, de modo a se ter um padrão de comparação. / In this work, the deposition of GaAs (gallium arsenide) and Al (aluminum) thin films is carried out by the resistive evaporation technique. In the latter case, an oxidation of the film is accomplished, leading to 'Al IND. 2''O IND. 3' (alumina) formation. The characterization of GaAs thin films and the heterostructure formed by 'Al IND. 2''O IND. 3' and GaAs is also carried out. The elaboration of the device combining these compounds allows investigating the relevant characteristics of this system to potential application in transistors. The work evolved investigation on the deposition conditions, and the electrical characteristics of the films were also evaluated separately. Results includes: resistivity as function of temperature, X-ray diffraction and near infrared transmittance. For characterization of the performance of the 'Al IND. 2''O IND. 3'/GaAs system, a simple transistor was built on a borosilicate glass substrate, with a 'Al IND. 2''O IND. 3' layer on top of a GaAs layer. The contacts of source, drain and gate were done using In. This structure allows evaluating the leak current and other characteristics of this system. In this device, it was evaluated the current - voltage characteristics and the interaction with light, because GaAs, due to its direct bandgap, become very attractive for opto-electronic applications. The, the photo-induced electrical measurements were done under excitation with white light. Aiming the evaluation of the quality of films deposited by the resistive evaporation technique, electrical as well as structural characterization were also carried out for GaAs thin films deposited by sputtering, in order to have a comparing parameter.

De nombreuses applications modernes nécessitent l’utilisation de matériaux transparents dans le visible et le proche infrarouge. C’est le cas des vitrages pour le bâtiment, des vitres de voitures ou encore d’écrans de téléphone portable. La stratégie mise en place dans ces travaux de thèse est d’obtenir en surface d’un verre sodo-calcique, un matériau barrière aux propriétés similaires à la silice. Deux approches de traitements de surface visent à d’une part, modifier la chimie de surface par un traitement sous champ électrique assisté par voie thermique et d’obtenir une couche riche en SiO2 en surface. D’autre part, un revêtement est déposé sur le verre sodo-calcique, utilisé ici comme substrat. Ce dépôt se fait par pulvérisation cathodique magnétron et permettra de mettre en forme un matériau composite SiO2-TiO2 aux propriétés optiques de transparence et mécaniques de dureté optimisées et d’y associer des propriétés photocatalytiques performantes. / Many applications of the modern wolrd need transparent material especially in the visible range and near-IR. That is the case for windows for building or car, laptop screen. The purpose is to obtain a silica rich layer on the top of a soda-lime glass with similar properties to silica. Two ways have been defined. The first one is thermal poling treatment which consist in a thermal treatment electric field assisted to modify the surface chemistry and monitoring a silica rich layer on the top. The second way is to get a thin film by magnetron sputtering on the top of the soda-lime glass used here as substrate. A SiO2-TiO2 material is got with efficient optical properties of transparencey and mechanical properties (hardness). Photocatalytic activity have been demonstrated and provide self-cleaning properties.

Made available in DSpace on 2014-10-09T12:45:30Z (GMT). No. of bitstreams: 0 / Made available in DSpace on 2014-10-09T13:56:26Z (GMT). No. of bitstreams: 1 07175.pdf: 4800774 bytes, checksum: 7591ed2b66c61d81600006d10b99afb7 (MD5) / Dissertacao (Mestrado) / IPEN/D / Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP

Thin film cadmium telluride (CdTe) technology is the most important competitor for silicon (Si) based solar cells. Pulsed direct current (DC) magnetron sputtering is a new technique has been developed for thin film CdTe deposition. This technique is industrially scalable and provides uniform coating. It is also possible to deposit thin films at low substrate temperatures. A series of experiments are presented for the optimisation of the cadmium chloride (CdCl2) activation process. Thin film CdTe solar cells require CdCl2 activation process to improve conversion efficiencies. The role of this activation process is to increase the grain size by recrystallisation and to remove stacking faults. Compaan and Bohn [1] used the radio-frequency (RF) sputtering technique for CdTe solar cell deposition and they observed small blisters on CdTe layer surface. They reported that blistering occurred after the CdCl2 treatment during the annealing process. Moreover, void formation was observed in the CdTe layer after the CdCl2 activation process. Voids at the cadmium sulphide (CdS)/CdTe junction caused delamination hence quality of the junction is poor. This issue has been known for more than two decades but the mechanisms of the blister formation have not been understood. One reason may be the stress formation during CdTe solar cells deposition or during the CdCl2 treatment. Therefore, the stress analysis was performed to remove the defects observed after the CdCl2 treatment. This was followed by the rapid thermal annealing to isolate the CdCl2 effect by simply annealing. Small bubbles observed in the CdTe layer which is the first step of the blister formation. Using high resolution transmission electron microscopy (HR-TEM), it has been discovered that argon (Ar) working gas trapped during the deposition process diffuses in the lattice which merge and form the bubbles during the annealing process and grow agglomeration mainly at interfaces and grain boundaries (GBs). Blister and void formation were observed in the CdTe devices after the CdCl2 treatment. Therefore, krypton (Kr), neon (Ne) gases were used as the magnetron working gas during the deposition of CdTe layer. The results presented in this thesis indicated that blister and void formation were still existing with the use of Kr an Ne. Xe, which has a higher atomic mass than Kr, Ne, Ar, Cd and Te, was used as the magnetron working gas and it resulted in surface blister and void free devices.

Cu2ZnSnS4 (CZTS) is a thin film solar cell material that only contains abundant elements and for which promising conversion efficiencies of 9.2 % have been shown. In this thesis composition measurements and reactive sputtering of precursors for CZTS films have been studied. These precursors can be annealed to create high quality CZTS films. Accurate control and measurement of composition are important for the synthesis process. The composition of a reference sample was determined using Rutherford backscattering spectroscopy. This sample was thereafter used to find the composition of unknown samples with x-ray fluorescence measurements. Pros and cons with this approach were discussed. The reactive sputtering process, and the resulting thin films, from a CuSn- and a Zn-target sputtered in H2S-atmosphere were investigated and described. A process curve of the system was presented and the influence of sputtering pressure and substrate temperature were examined. The pressures tested had little influence on the film properties but the substrate temperature affected both composition and morphology, giving less Zn, Sn and S and a more oriented film with increasingly facetted surface for higher temperatures. The precursors produced with this method are suggested to have a disordered phase with randomized cations, giving a CZTS-like response from Raman spectroscopy but a ZnS-pattern from x-ray diffraction measurements. The films have an excellent homogeneity and it is possible to achieve stoichiometric sulfur content. The complete steps from precursors, to annealed films, to finished solar cells were investigated for three controlled compositions and three substrate temperatures. The films sputtered at room temperature cracked when annealed and thus gave shunted solar cells. For the samples sputtered at higher temperatures the trend was an increased grain size for higher copper content and increased temperature. However, no connection between this and the electrical properties of the solar cells could be found.

No presente trabalho, foram desenvolvidos diferentes regimes de deposição de filmes de nitreto de silício, empregando a técnica de sputtering reativo, para a aplicação em memória não-volátil de aprisionamento de carga (charge trapping memory). Filmes finos de nitreto de silício com diferentes composições químicas e características físicas foram obtidos. As propriedades físicas dos mesmos foram analisadas utilizando-se medidas de elipsometria e caracterização elétrica por corrente-tensão. A composição química dos filmes foi obtida pela técnica de MEIS. Dois dispositivos de memória foram fabricados empregando regimes diferentes. Os dispositivos foram desenvolvidos utilizando oxidação térmica, deposição de filmes de óxido de silício e nitreto de silício por sputtering e evaporação resistiva para a formação de contatos de alumínio com diâmetro de 200 mícrons com o auxílio de uma máscara mecânica. Além disso, uma etapa de recozimento térmico rápido também foi empregada para a densificação dos filmes depositados. A caracterização elétrica dos mesmos mostrou janela de gravação de até 10V para a memória que foi fabricada empregando o filme de nitreto de silício com excesso de silício. Esse mesmo dispositivo apresentou retenção projetada de 10 anos à temperatura ambiente, endurance de mais de 1k ciclos e mostrou-se capaz de ser programado com pulsos de tensão com largura de dezenas de milissegundos. / In this work, we have developed different deposition regimes of silicon nitride thin films, employing reactive sputtering technique, for charge trapping memory applications. We have obtained silicon nitride thin films with different chemical compositions and physical properties. The physical properties were studied employing optical ellipsometry and electrical characterization by currentvoltage curves. The chemical composition was measured with Medium Energy Ion Spectrometry (MEIS) technique. Two memory devices were fabricated using different silicon nitride regimes. We have employed thermal oxidation, sputtering thin film deposition of silicon oxide and silicon nitride and aluminum resistivity evaporation with a mechanical mask to obtain circular contacts with diameter of 200 μm. Furthermore, rapid thermal annealing was also employed for films densification. The electrical characterization of memory devices have shown a program/erase window of 10V for the memory which was fabricated with the silicon nitride film containing silicon excess. The same device presented a projected retention of 10 years at room temperature, endurance of 1k cycles and it was capable to be programmed with voltage pulses width of some milliseconds.

Title: Characterization of highly porous Pd-modified SnO2 sputtered thin films for H2 detection Autor: Mgr. Mykhailo Chundak Department/Institute: Department of Surface and Plasma Science Supervisor of the doctoral thesis: RNDr. Kateřina Veltruská, CSc., Department of Surface and Plasma Science Abstract: This doctoral thesis contains the study of tin dioxide and Pd-doped tin dioxide samples deposited by magnetron sputtering utilizing glancing angle deposition (GLAD). Influence of the deposition parameters on the change of morphology, crystalline structure and chemical state was studied. The samples were characterized by a variety of techniques, such as: X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), synchrotron radiation photoelectron spectroscopy (SRPES), scanning electron microscopy (SEM) and high resolution transmission electron microscopy (HRTEM). Prepared samples showed high porosity which could be controlled by deposition parameters (angle of the deposition, gas pressure and power of magnetron discharge). Highly porous SnO2 GLAD samples and Pd modified SnO2 GLAD samples were deposited on the substrates at room temperature and 300 řC. These samples were found to be polycrystalline with certain fraction of amorphous contribution, given by preparation conditions. The size of the...

Cette thèse présente une étude de l'élaboration et des propriétés structurales, ainsi que des propriétés électriques, des couches minces de matériaux thermoélectriques de type Mg2Si-Mg2Sn. Les couches minces polycristallines du composé Mg2Sn et des solutions solides Mg2Si1-xSnx ont été réalisées sur plusieurs types de substrat, à température ambiante, par la technique de dépôt par co-pulvérisation assistée par plasma micro-onde multi-dipolaire. L'influence des paramètres de dépôt sur les propriétés structurales et électriques des couches élaborées a été étudiée. Ainsi, la composition chimique des couches a été parfaitement contrôlée par le biais de la polarisation indépendante des cibles des éléments constituants. La composition de phase, ainsi que la microstructure des couches, ont été trouvées dépendant de la pression de dépôt, de la distance entre des cibles et le substrat, de la puissance micro-onde et de la configuration du réacteur de dépôt. Ces propriétés structurales, à leur tour, ont un fort impact sur les propriétés électriques des couches déposées. Les couches minces Mg2Sn dopé en Ag, déposées avec la condition de dépôt optimale, ont présenté un facteur de puissance à température ambiante comparable à celui des matériaux actuellement utilisés. Les couches minces des solutions solides Mg2Si1-xSnx présentent, pourtant, des facteurs de puissance encore modestes résultant notamment des faibles conductivités électriques. / This thesis presents a study of the deposition and structural as well as electrical properties of thin films of thermoelectric materials Mg2Sn-Mg2Si. Polycrystalline thin films of the Mg2Sn compound and solid solutions Mg2Si1-xSnx were deposited on several types of substrate at room temperature, by co-sputtering assisted by microwave plasma. The influence of deposition parameters on structural and electrical properties of deposited films was studied. Thus, the chemical composition of layers was fully controlled by the means of the independent polarization of target of constituent elements. Phase composition and microstructure of deposited films were found depending on the deposition pressure, on the distance between targets and the substrate, on the microwave power, as well as on the configuration of the deposition reactor. These structural properties, in turn, have a strong impact on the electrical properties of the deposited films. Mg2Sn thin films doped with Ag, deposited under optimal condition, presented a power factor at room temperature comparable to conventional thermoelectric materials. Thin films of solid solutions Mg2Si1-xSnx present, however, power factors still modest due in particular to low electrical conductivities.

An aim of this work is a research of a deposition process of indium tin oxide by plasma assisted methods. The thesis deals with plasma diagnostics, e.g. Langmuir probe diagnostics and optical emission spectroscopy, as well as describes experiments of film deposition including their diagnostics, e.g. absorption spectroscopy, X-ray diffractometry and atomic force microscopy.

Após quatro décadas de sucesso do SiO2 (e SiOxNy), as novas gerações de Transistores de Efeito de Campo Metal-Óxido-Semicondutor utilizarão dielétricos de porta de materiais alternativos, dentre os quais se destacam o óxido (HfO2) e os silicatos de háfnio (HfSixOy). Para implementar esses novos dielétricos, é crucial controlar seus defeitos, em particular aqueles relacionados a hidrogênio, que é um elemento químico onipresente e que influencia as características elétricas dos transistores. Nesse contexto, esta Tese investiga a físico-química do hidrogênio em filmes de HfO2 e HfSixOy (2,5–73 nm) depositados sobre silício. Tratamentos térmicos, substituição isotópica, Análise por Reação Nuclear e Espectroscopia de Fotoelétrons Induzidos por Raios-X são algumas das técnicas que foram utilizadas. Observouse que as superfícies dos filmes de HfO2 são particularmente reativas, incorporando H com tratamentos em H2 a 400–600 °C e formando hidroxilas de superfície por exposição a vapor de água à temperatura ambiente. Além disso, no volume dos filmes de HfO2 e HfSixOy foram detectados 1021–1022 H cm-3 (comparados a 1018–1019 H cm-3 no volume de SiO2 crescido sobre Si) cujas origens são os precursores metalorgânicos das deposições por vapor químico, H residual da deposição por sputtering ou absorção de vapor de água. Pelo menos parte desse H no volume do HfO2 e do HfSixOy foi atribuída a hidroxilas, que são parcialmente removidas com tratamento em H2 a 500–600 °C. No caso particular das interações com vapor de água, observou-se que espécies derivadas da água difundem através do HfO2 a temperatura ambiente. Absorção de água no volume dos filmes só foi observada para HfO2 com regiões amorfas ou para HfO2 cristalizado do qual O fora previamente removido. Além disso, em filmes de HfSixOy, foi estabelecida uma relação entre incorporação de H e pré-existência de deficiência de O. Essa relação também foi explorada por cálculos de primeiros princípios, os quais mostraram que vacâncias de O em HfSixOy capturam átomos de H exotermicamente, embasando a relação entre incorporação de H e deficiência de O que fora observada experimentalmente. / After four successful decades employing SiO2 (and SiOxNy), new generations of Metal- Oxide-Semiconductor Field-Effect Transistors will employ gate dielectrics of alternative materials, among which hafnium oxide (HfO2) and hafnium silicates (HfSixOy) are prominent. In order to implement these novel gate dielectrics, it is crucial to control their defects, particularly those related to hydrogen, which is a ubiquitous chemical element and influences the transistors electrical characteristics. In this scenario, this Thesis investigates the physical chemistry of hydrogen in HfO2 and HfSixOy films (2.5–73 nm thick) deposited on silicon. Thermal treatments, isotopic substitution, Nuclear Reaction Analysis, and X-Ray Photoelectron Spectroscopy are a few techniques that were employed. It was observed that HfO2 film surfaces are particularly reactive, incorporating H by annealing in H2 at 400– 600 °C and forming surface hydroxyls by exposing to water vapor at room temperature. Moreover, 1021–1022 H cm-3 were detected in bulk regions of the HfO2 and HfSixOy films (compared with 1018–1019 H cm-3 in bulk regions of SiO2 grown on Si). The origins of this H are the metalorganic precursors from the chemical vapor depositions, residual H from the sputtering deposition, or water vapor absorption. At least part of this H in bulk regions of HfO2 and HfSixOy was assigned to hydroxyls, which are partially removed by annealing in H2 at 500–600 °C. Particularly in the case of water vapor interactions, it was observed that waterderived species diffuse through HfO2 at room temperature. Water absorption in bulk regions of the films was only observed for HfO2 with amorphous regions or for crystallized HfO2 from where O had been previously removed. In addition, in HfSixOy films a relation between H incorporation and pre-existent O deficiency was established. This relation was further explored by first-principles calculations, which showed that oxygen vacancies in HfSixOy exothermically trap H atoms, supporting the relation between H incorporation and O deficiency that had been experimentally observed.