Most people’s perceptions of the Second World War leave little room for static, attritional fighting; instead, free-flowing manoeuvre warfare, such as Blitzkrieg, is seen as the norm. In reality, however, much of the terrain fought over in 1939-45 was unsuitable for such a war and, as a result, bloody attritional battles and trench fighting were common. Thus ordinary infantrymen spent the majority of their time at the front burrowing underground for protection. Although these trenches were never as fixed or elaborate as those on the Western Front a generation earlier, the men who served in Italy, Normandy, Holland and Germany, nonetheless shared an experience remarkably similar to that of their predecessors in Flanders, Picardy, Champagne and Artois. This is an area which has been largely neglected by scholars. While the first war produced a mountain of books on the experience of trench warfare, the same cannot be said of the second war. This thesis will attempt to fill that gap by providing a comprehensive analysis of static warfare in the Second World War from the point of view of British infantry morale. It draws widely on contemporary letters and diaries, psychiatric and medical reports and official documentation – not to mention personal narratives and accounts published after the war – and will attempt to interpret these sources in light of modern research and organise them into a logical framework. Ultimately it is hoped that this will provide fresh insight into a relatively under-researched area of twentieth century history.

<p>This thesis is a chronological survey over the hut and house remains from the Stone Age to the Early Middle Ages in Eastern Central Sweden. The thesis also contains a test which I have conducted to see which investigation method had the best results in identifying house remains at an archaeological site. I subsequently discuss the result of this test, what it represents and also what may be done differently in order to get other types of results.</p>

This thesis is a chronological survey over the hut and house remains from the Stone Age to the Early Middle Ages in Eastern Central Sweden. The thesis also contains a test which I have conducted to see which investigation method had the best results in identifying house remains at an archaeological site. I subsequently discuss the result of this test, what it represents and also what may be done differently in order to get other types of results.

This thesis analyses the governing equation of elastic wave propagation by the finite difference method , and considered absorbing boundary condition and the material damping to simulate behavior of wave propagation. Otherwise, we combined with the mechanics of the soil pore water pressure raised by shear stress effected repeatedly and the soil property is changed by water pressure effected to simulate physical phenomenon in half-space, and probe into the soil liquefaction process during different force types. Using the developed numerical wave propagation model probe into reducing vibration by dug trench and filler trench, and analyzed data by 1/3 octave band method. This thesis discuss with reducing vibration effect by different trench disposed¡Bdifferent filler material property, complex filler, and extending the force source pile length.

Arc-continent collisions are believed to be an important mechanism for the growth of continents. Taiwan is one of the modern day examples of this process, and as such, it is an ideal natural laboratories to investigate the uncertain behavior of continental crust during collision. The obliquity of collision between the northern South China Sea (SCS) rifted margin and Luzon arc in the Manila trench subduction zone allows for glimpses into different temporal stages of collision at different spatial locations, from the mature mountain-belt in central-northern Taiwan to the 'pre-collision' rifted margin and subduction zone south of Taiwan. Recently acquired seismic reflection and wide-angle seismic refraction data document the crustal-scale structure of the mountain belt through these different stages. These data reveal a wide rifted margin near Taiwan with half-graben rift basins along the continental shelf and a broad distal margin consisting of highly-extended continental crust modified by post-rift magmatism. Magmatic features in the distal margin include sills in the post-rift sediments, intruded crust, and a high-velocity lower crustal layer that likely represents mafic magmatism. Post-rift magmatism may have been induced by thermal erosion of lithospheric mantle following breakup and the onset of seafloor spreading. Geophysical profiles across the early-stage collision offshore southern Taiwan show evidence the thin crust of the distal margin is subducting at the Manila trench and structurally underplating the growing orogenic wedge ahead of the encroaching continental shelf. Subduction of the distal margin may induce a pre-collision flexural response along the continental shelf as suggested by a recently active major rift fault and a geodynamic model of collision. The weak rift faults may be inverted during the subsequent collision with the continental shelf. These findings support a multi-phase collision model where the early growth of the mountain belt is driven in part by underplating of the accretionary prism by crustal blocks from the distal margin. The wedge is subsequently uplift and deformed during a collision with the continental shelf that involves both thin-skinned and thick-skinned structural styles. This model highlights the importance of rifting styles on mountain-building. / text

The state of stress in forearc regions depends on the balance of two competing factors: the plate coupling force that generates margin-normal compression, and the gravitational force, that generates margin-normal tension. Widespread reversal of the focal mechanisms of small earthquakes after the 2011 Tohoku-oki earthquake indicate a reversal in the dominant state of stress of the forearc, from compressive before the earthquake to tensional afterwards. This implies that the plate coupling force dominated before the earthquake, and that the coseismic weakening of the fault lowered the amount of stress exerted on the forearc, such that the gravitational force became dominant in the post-seismic period. This change requires that the average stress drop along the fault represents a significant portion of the fault strength. Two cases are possible: (1) The fault was strong and the stress drop was large or nearly-complete (e.g. from 50 MPa to 10 MPa), or (2) that the fault was weak and the stress drop was small (e.g. from 15 MPa to 10 MPa). The first option appears to be consistent with the dramatic weakening associated with high-rate rock friction experiments, while the second option is consistent with seismological observations that large earthquakes are characterized by low average stress drops. In this work, we demonstrate that the second option is correct. A very weak fault, represented by an apparent coefficient of friction of 0.032, is sufficient to put the Japan Trench forearc into margin-normal compression. Lowering this value by ~0.01 causes the reversal of the state of stress as observed after the earthquake. A slightly stronger fault, with a strength of 0.045, does not agree well with the observed spatial extent of normal faulting for the same coseismic reduction in strength. We also calculate distributions of stress change on the fault and average stress drop values for the Tohoku-oki earthquake, as predicted from 20 published rupture models which were constrained by seismic, tsunami, and geodetic data. Our results reconcile seismic observations that average stress drops for large megathrust events are low with laboratory work on high-rate weakening that predicts very high or complete stress drop. We find that, in all rupture models, regions of high stress drop (20 – 55 MPa) are probably indicative of dynamic weakening during seismic slip, but that the heterogeneous nature of fault slip does not allow these regions to become widespread. Also, coseismic stress increase on the fault occurs in many parts of the fault, including parts of the area that experienced high slip (> 30 m). These two factors ensure that the average stress drop remains low (< 5 MPa). The low average stress drop during the Tohoku earthquake, consistent with values reported for other large earthquakes, makes it unambiguous that the Japan Trench megathrust is very weak. / Graduate

名古屋大学年代測定総合研究センターシンポジウム報告

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Les mémoires flash sont intégrées dans presque tous les aspects de la vie moderne car leurs uns et zéros représentent les données stockées sur les cartes à puce et dans les capteurs qui nous entourent. Dans les mémoires flash à grille flottante ces données sont représentées par la quantité de charge stockée sur une grille en poly-Si, isolée par un oxyde tunnel et un diélectrique entre grilles (IGD). Au fur et à mesure que les chercheurs et les ingénieurs de l'industrie microélectronique poussent continuellement les limites de mise à l'échelle, la capacité des dispositifs à contenir leurs informations risque de devenir compromise. Même la perte d'un électron par jour est trop élevée et entraînerait l'absence de conservation des données pendant dix ans. Étant trop faibles, les courants de fuite sont impossible à mesurer directement. Cette thèse présente une nouvelle méthode, la séparation du stress aux oxydes (OSS), pour mesurer ces courants en suivant les changements de la tension de seuil de la cellule flash. La nouveauté de la technique est que les conditions de polarisation sont sélectionnées afin que le stress se produise entièrement dans l'IGD, permettant la reconstruction d'une courbe IV de l'IGD à des tensions faibles. Cette thèse décrit également les changements de processus nécessaires pour intégrer la première mémoire flash embarquée de 40 nm basée sur un IGD d'alumine, en remplacement du SiO2/ Si3N4/SiO2 standard. L'intérêt pour les matériaux high-k vient de la motivation de créer un IGD qui est électriquement mince pour augmenter le couplage tout en étant physiquement épais pour bloquer le transport de charge. Comme la flash intégrée au noeud de 40 nm se rapproche de la production, l'approche à prendre dans les nœuds futurs doit également être discutée. Cela fournit la motivation pour le chapitre final de la thèse qui traite de la co-intégration des différents IGD avec des dispositifs logiques ayant les gilles « high-k metal » nécessaires à 28 nm et au-delà. / Flash memory circuits are embedded in almost every aspect of modern life as their ones and zeros represent the data that is stored on smart cards and in the sensors around us. In floating gate flash memories this data is represented by the amount of charge stored on a poly-Si gate, isolated by a tunneling oxide and an Inter Gate Dielectric (IGD). As the microelectronics industry’s researchers and engineering continuously push the scaling limits, the ability of the devices to hold their information may become compromised. Even the loss of one electron per day is too much and would result in the failure to retain the data for ten years. At such low current densities, the direct measurement of the leakage current is impossible. This thesis presents a new way, Oxide Stress Separation, to measure these currents by following the changes in the threshold voltage of the flash cell. The novelty of the technique is that the biasing conditions are selected such that the stress occurs entirely in the IGD, allowing for the reconstruction of an IV curve of the IGD at low biases. This thesis also describes the process changes necessary to integrate the world’s first 40 nm embedded flash based on an alumina IGD, in replacement of the standard SiO2/Si3N4/SiO2. The interest in high-k materials comes from the motivation to make an IGD that is electrically thin to increase coupling while being physically thick to block charge transport. As embedded flash at the 40 nm node nears production, the approach to be taken in future nodes must also be discussed. This provides the motivation for the final chapter of the thesis which discusses the co-integration of the different IGDs with logic devices having the high-k metal gates necessary at 28 nm and beyond.