ESD, the discharge of electrostatically generated charges into an IC, is one of the most important reliability problems for ultra-scaled devices. This electrostatic charge can generate voltages of up to tens of kilovolts. These very high voltages can generate very high electric fields and currents across semiconductor devices, which may result in dielectric damage or melting of semiconductors and contacts. It has been reported that up to 70% of IC failures are caused by ESD. Therefore, it’s necessary to design a protection circuit for each pin that discharges the ESD energy to the ground. As the devices are continuously scaling down, while ESD energy remains the same, they become more vulnerable to ESD stress. This higher susceptibility to ESD damage is due to thinner gate oxides and shallower junctions. Furthermore, higher operating frequency of the scaled technologies enforces lower parasitic capacitance of the ESD protection circuits. As a result, increasing the robustness of the ESD protection circuits with minimum additional parasitic capacitance is the main challenge in state of the art CMOS processes. Providing a complete ESD immunity for any circuit involves the design of proper protection circuits for I/O pins in addition to an ESD clamp between power supply pins. In this research both of these aspects are investigated and optimized solutions for them are reported. As Silicon Controlled Rectifier (SCR) has the highest ESD protection level per unit area, ESD protection for I/O pins is provided by optimizing the first breakdown voltage and latch-up immunity of SCR family devices. The triggering voltage of SCR is reduced by a new implementation of gate-substrate triggering technique. Furthermore, a new device based on SCR with internal darlington pair is introduced that can provide ESD protection with very small parasitic capacitance. Besides reducing triggering voltage, latch-up immunity of SCR devices is improved using two novel techniques to increase the holding voltage and the holding current. ESD protection between power rails is provided with transient clamps in which the triggering circuit keeps the clamp “on” during the ESD event. In this research, two new clamps are reported that enhance the triggering circuit of the clamp. The first method uses a CMOS thyristor element to provide enough delay time while the second method uses a flip flop to latch the clamp into “on” state at the ESD event. Moreover, the stability of transient clamps is analyzed and it’s been shown that the two proposed clamps have the highest stability compared to other state of the art ESD clamps. Finally, in order to investigate the impact of ESD protection circuits on high speed applications a current mode logic (CML) driver is designed in 0.13μm CMOS technology. The protection for this driver is provided using both MOS-based and SCR-based protection methods. Measurement results show that, compared to MOS-based protection, SCR-based protection has less impact on the driver performance due to its lower parasitic capacitance.

The floorplanning problem aims to arrange a set of rectangular modules on a rectangular chip area so as to optimize an appropriate measure of performance. This problem is known to be NP-hard, and is particularly challenging if the chip dimensions are fixed. Fixed-outline floorplanning is becoming increasingly important as a tool to design flows in the hierarchical design of Application Specific Integrated Circuits and System-On-Chip. Therefore, it has recently received much attention. A two-stage convex optimization methodology is proposed to solve the fixed-outline floorplanning problem. It is a global optimization problem for wirelength minimization. In the first stage, an attractor-repeller convex optimization model provides the relative positions of the modules on the floorplan. The second stage places and sizes the modules using convex optimization. Given the relative positions of the modules from the first stage, a Voronoi diagram and Delaunay triangulation method is used to obtain a planar graph and hence a relative position matrix connecting the two stages. An efficient method for generating sparse relative position matrices and an interchange-free algorithm for local improvement of the floorplan are also presented. Experimental results on the standard benchmarks MCNC and GSRC demonstrate that we obtain significant improvements on the best results in the literature. Overlap-free and deadspace-free floorplans are achieved in a fixed outline and floorplans with any specified percentage of whitespace can be produced. Most important, our method provides a greater improvement as the number of modules increases. A very important feature of our methodology is that not only do the dimensions of the floorplans in our experiments comply with the original ones provided in the GSRC benchmark, but also zero-deadspace floorplans can be obtained. Thus, our approach is able to guarantee complete area utilization in a fixed-outline situation. Our method is also applicable to area minimization in classical floorplanning.

ESD, the discharge of electrostatically generated charges into an IC, is one of the most important reliability problems for ultra-scaled devices. This electrostatic charge can generate voltages of up to tens of kilovolts. These very high voltages can generate very high electric fields and currents across semiconductor devices, which may result in dielectric damage or melting of semiconductors and contacts. It has been reported that up to 70% of IC failures are caused by ESD. Therefore, it’s necessary to design a protection circuit for each pin that discharges the ESD energy to the ground. As the devices are continuously scaling down, while ESD energy remains the same, they become more vulnerable to ESD stress. This higher susceptibility to ESD damage is due to thinner gate oxides and shallower junctions. Furthermore, higher operating frequency of the scaled technologies enforces lower parasitic capacitance of the ESD protection circuits. As a result, increasing the robustness of the ESD protection circuits with minimum additional parasitic capacitance is the main challenge in state of the art CMOS processes. Providing a complete ESD immunity for any circuit involves the design of proper protection circuits for I/O pins in addition to an ESD clamp between power supply pins. In this research both of these aspects are investigated and optimized solutions for them are reported. As Silicon Controlled Rectifier (SCR) has the highest ESD protection level per unit area, ESD protection for I/O pins is provided by optimizing the first breakdown voltage and latch-up immunity of SCR family devices. The triggering voltage of SCR is reduced by a new implementation of gate-substrate triggering technique. Furthermore, a new device based on SCR with internal darlington pair is introduced that can provide ESD protection with very small parasitic capacitance. Besides reducing triggering voltage, latch-up immunity of SCR devices is improved using two novel techniques to increase the holding voltage and the holding current. ESD protection between power rails is provided with transient clamps in which the triggering circuit keeps the clamp “on” during the ESD event. In this research, two new clamps are reported that enhance the triggering circuit of the clamp. The first method uses a CMOS thyristor element to provide enough delay time while the second method uses a flip flop to latch the clamp into “on” state at the ESD event. Moreover, the stability of transient clamps is analyzed and it’s been shown that the two proposed clamps have the highest stability compared to other state of the art ESD clamps. Finally, in order to investigate the impact of ESD protection circuits on high speed applications a current mode logic (CML) driver is designed in 0.13μm CMOS technology. The protection for this driver is provided using both MOS-based and SCR-based protection methods. Measurement results show that, compared to MOS-based protection, SCR-based protection has less impact on the driver performance due to its lower parasitic capacitance.

The floorplanning problem aims to arrange a set of rectangular modules on a rectangular chip area so as to optimize an appropriate measure of performance. This problem is known to be NP-hard, and is particularly challenging if the chip dimensions are fixed. Fixed-outline floorplanning is becoming increasingly important as a tool to design flows in the hierarchical design of Application Specific Integrated Circuits and System-On-Chip. Therefore, it has recently received much attention. A two-stage convex optimization methodology is proposed to solve the fixed-outline floorplanning problem. It is a global optimization problem for wirelength minimization. In the first stage, an attractor-repeller convex optimization model provides the relative positions of the modules on the floorplan. The second stage places and sizes the modules using convex optimization. Given the relative positions of the modules from the first stage, a Voronoi diagram and Delaunay triangulation method is used to obtain a planar graph and hence a relative position matrix connecting the two stages. An efficient method for generating sparse relative position matrices and an interchange-free algorithm for local improvement of the floorplan are also presented. Experimental results on the standard benchmarks MCNC and GSRC demonstrate that we obtain significant improvements on the best results in the literature. Overlap-free and deadspace-free floorplans are achieved in a fixed outline and floorplans with any specified percentage of whitespace can be produced. Most important, our method provides a greater improvement as the number of modules increases. A very important feature of our methodology is that not only do the dimensions of the floorplans in our experiments comply with the original ones provided in the GSRC benchmark, but also zero-deadspace floorplans can be obtained. Thus, our approach is able to guarantee complete area utilization in a fixed-outline situation. Our method is also applicable to area minimization in classical floorplanning.

A system for extracellular neural interfacing that had the capability for stimulation and recording at multiple electrodes was presented. As the core of this system was a custom integrated circuit (IC) that contained low-noise amplifiers, stimulation buffers, and artifact-elimination circuitry. The artifact-elimination circuitry was necessary to prevent the activity of the stimulation buffers from interfering with the normal functioning of the low-noise amplifiers. The integrated circuits were fabricated in in a 0.35 micron CMOS process. We measured input-referred noise levels for the amplifiers as low as 3.50 microvolts (rms) in the in the bandwidth 30 Hz-3 kHz, corresponding to the frequency range of neural action potentials. The power consumption was 120 microwatts, corresponding to a noise-efficiency factor of 14.5. It was possible to resume recording signals within 2 ms of a stimulation, using the same electrode for both stimulation and recording. A filtering algorithm to remove the post-discharge artifact was also presented. The filtering was implemented using a field-programmable gate array (FPGA). The filtering algorithm itself consisted of blanking for the duration of the stimulation and artifact-elimination, followed by a wavelet de-noising. The wavelet de-noising split the signal into frequency ranges, discarded those ranges that did not correspond to neural signals, applied a threshold to the retained signals, and recombined the different frequency ranges into a single signal. The combination of the filtering with the artifact-elimination IC resulted in the capability for artifact-free recordings.

Gate sizing and threshold voltage (Vt) assignment are very popular and useful techniques in current very large scale integration (VLSI) design flow for timing and power optimization. Lagrangian relaxation (LR) is a common method for handling multi-objectives and proven to reach optimal solution under continuous solution space. However, it is more complex to use Lagrangian relaxation under discrete solution space. The Lagrangian dual problem is non-convex and previously a sub-gradient method was used to solve it. The sub-gradient method is a greedy approach for substituting gradient method in the deepest descent method, and has room for further improvement. In addition, Lagrangian sub-problem cannot be solved directly by mathematical approaches under discrete solution space. Here we propose a new Lagrangian relaxation-based method for simultaneous gate sizing and Vt assignment under discrete solution space. In this work, some new approaches are provided to solve the Lagrangian dual problem considering not only slack but also the relationship between Lagrangian multipliers and circuit timing. We want to solve the Lagrangian dual problem more precisely than did previous methods, such as the sub-gradient method. In addition, a table-lookup method is provided to replace mathematical approaches for solving the Lagrangian sub-problem under discrete size and Vt options. The experimental results show that our method can lead to about 50 percent and 58 percent power reduction subject to the same timing constraints compared with a Lagrangian relaxation method using sub-gradient method and a state-of-the-art previous work. These two methods are implemented by us for comparison. Our method also results in better circuit timing subject to tight timing constraints.

Track assignment is a critical step between global routing and detailed routing in modern VLSI chip designs. It greatly affects some very important design characteristics, such as routability, via usage and timing performance. Crosstalk, which is largely decided by wire adjacency, has significant impact on interconnect delay and circuit performance. Therefore, the amount of crosstalk should be restrained in order to satisfy timing constraints. In this work, a track assignment approach is proposed to control crosstalk-induced performance degradation. The problem is formulated as a Traveling Salesman Problem (TSP) and solved by a graph-based heuristic. The proposed approach is implemented and tested on benchmark circuits from the ISPD2011 contest and the experimental results are quite promising.

The paper proposes that Embedded Zreotree Wavelet algorithm and the architecture of the modified EZW algorithm will have the property of regularity, modularity ,and scalablity, and also posses the function , which can allow a detected watermark to be embedded. The methods to realize the algorithm and the function of watermark are to analyze the theory of algorithm and the order of output and input data and then to use queue and stack, the unit of memory, and the control of circuit. The modified EZW architecture needs a half less memory units than the original one, and functions nearly as effective as the original architecture. Besides, this paper points out that the whole architecture of the transform CODEC system can be applied properly to HDTV, MPEG-4 system, or QoS network.

A high throughput scalable decoder architecture, a tiling approach to reduce the complexity of the scalable architecture, and two low power decoding schemes have been proposed in this research. The proposed scalable design is generated from a serial architecture by scaling the combinational logic; memory partitioning and constructing a novel H matrix to make parallelization possible. The scalable architecture achieves a high throughput for higher values of the parallelization factor M. The switch logic used to route the bit nodes to the appropriate checks is an important constituent of the scalable architecture and its complexity is high with higher M. The proposed tiling approach is applied to the scalable architecture to simplify the switch logic and reduce gate complexity. The tiling approach generates patterns that are used to construct the H matrix by repeating a fixed number of those generated patterns. The advantages of the proposed approach are two-fold. First, the information stored about the H matrix is reduced by onethird. Second, the switch logic of the scalable architecture is simplified. The H matrix information is also embedded in the switch and no external memory is needed to store the H matrix. Scalable architecture and tiling approach are proposed at the architectural level of the LDPC decoder. We propose two low power decoding schemes that take advantage of the distribution of errors in the received packets. Both schemes use a hard iteration after a fixed number of soft iterations. The dynamic scheme performs X soft iterations, then a parity checker cHT that computes the number of parity checks in error. Based on cHT value, the decoder decides on performing either soft iterations or a hard iteration. The advantage of the hard iteration is so significant that the second low power scheme performs a fixed number of iterations followed by a hard iteration. To compensate the bit error rate performance, the number of soft iterations in this case is higher than that of those performed before cHT in the first scheme.

As the continuous trend of Very Large Scale Integration (VLSI) circuits technology scaling and frequency increases, delay optimization techniques for interconnect are increasingly important for achieving timing closure of high performance designs. For the gigahertz microprocessor and multi-million gate ASIC designs it is crucial to have fast algorithms in the design automation tools for many classical problems in the field to shorten time to market of the VLSI chip. This research presents algorithmic techniques and constructive models for two such problems: (1) Fast buffer insertion for delay optimization, (2) Wire sizing for delay optimization and variation minimization on non-tree networks. For the buffer insertion problem, this dissertation proposes several innovative speedup techniques for different problem formulations and the realistic requirement. For the basic buffer insertion problem, an O(n log2 n) optimal algorithm that runs much faster than the previous classical van Ginneken’s O(n2) algorithm is proposed, where n is the number of buffer positions. For modern design libraries that contain hundreds of buffers, this research also proposes an optimal algorithm in O(bn2) time for b buffer types, a significant improvement over the previous O(b2n2) algorithm by Lillis, Cheng and Lin. For nets with small numbers of sinks and large numbers of buffer positions, a simple O(mn) optimal algorithm is proposed, where m is the number of sinks. For the buffer insertion with minimum cost problem, the problem is first proved to be NP-complete. Then several optimal and approximation techniques are proposed to further speed up the buffer insertion algorithm with resource control for big industrial designs. For the wire sizing problem, we propose a systematic method to size the wires of general non-tree RC networks. The new method can be used for delay optimization and variation reduction.