This work has been concerned with the dimensional stability and the structure-property relationships of thermoplastics reinforced with particulate and fiber fillers. The first part of this study was concerned with ascertaining the main causes of warpage observed for injection-molded thermoplastics reinforced with high aspect ratio fibers. Typically, warpage in injection-molded fiber reinforced thermoplastics is primarily attributed to residual thermal stresses associated with shrinkage and thermal contraction of the parts. Therefore, it is assumed that flow-induced stresses generated during mold filling do not play a significant role in the warpage. The warpage of PP composites reinforced with TLCP fibers was found to increase with an increase in fiber loading. The shrinkage and the thermal expansion of the TLCP/PP composites and, hence, the thermally induced stresses decreased with an increase in fiber loading while the flow-induced stresses increased. The increase in the flow-induced stresses was attributed to an inhibition of stress relaxation and greater generation of orientation of the polymer chains with an increase in fiber loading. Therefore, it was found that in order to accurately predict the warpage of fiber reinforced thermoplastics, the flow-induced residual stresses must be accounted for. The second part of this work was concerned with minimizing the particle loading of reinforced PC/PBT composites while maintaining the stiffness, i.e. modulus, and the dimensional stability of injection molded flat panels. This was accomplished by using high aspect ratio (≈100-150) nano-clays as opposed to micron-size talc (≈5-10). It was found that by using nano-clays surface modified with a quaternary ammonium salt that contained two hydroxyl groups as opposed to fine talc particles, the level of particle reinforcement could be reduced from 6 to 1 wt% without sacrificing the modulus of the reinforced PC/PBT composites. Further benefits included a 26% increase in flexural strength, 77% increase in the tensile toughness and 3% reduction in the density of the reinforced PC/PBT composites. An increase in the modulus and tensile toughness was observed even though there was evidence of loss in molecular weight of the PC/PBT matrix, which was supported by the rheological behavior of the composites. / Ph. D.

The main aim of this study is to extending the holographic interferometry technique to measure the out-of-plane displacement of an object subjected to both temperature and displacement field. It is noted that both the out-of-plane displacement and the ambient temperature change can cause image fringes. Therefore, an auxiliary object is used to identify the fringe numbers caused by the ambient temperature change during the experiment. The warpage measurement of a PBGA package is used as an example. It can be shown that the proposed method works

ABSTRACT Wireless communication products require thinner and small packaging to allow for reductions in Cell Phone and PDA product sizes. Currently, the Film-BGA (Ball Grid Array) package is in production for thinner and small case. The Film-BGA package is a thin package that uses polyimide tape as a substrate to reduce the overall package profile to 1 mm and ball pitch is 0.5 mm. The Film substrate can reach 0.11 mm thick or less. Analysis the Film-BGA model consists of a sequentially coupled thermal- mechanical analysis considering epoxy curing, post molding compound and IR-Reflow by MARC. After these processes Film-BGA will occur warpage and residual stress, we will study the sizes of materials on the warpage and residual stress by Taguchi Method. From the MARC analysis, it is found that due to the coefficient of thermal expansion (CTE) mismatch between solder ball, die, molding compound, epoxy and substrate, there exists very high stress near the interfaces of epoxy and results the maximum warpage (y-displacement) that occurs at the edge of the substrate after IR-Reflow. By means of the Taguchi Method, it is found that die size greatly affect the warpage of Film-BGA more than epoxy size and molding compound size. It is also found that epoxy size has more effect than die size and molding compound size on the residual stress of Film-BGA.

Les assemblages PoP pour « Package on Package » permettent d’augmenter fortement la densité d’intégration des circuits et systèmes microélectroniques, par superposition de plusieurs éléments semi-conducteurs actifs. Les interconnexions internes de ces systèmes sont alors soumises à des contraintes jamais atteintes. Nous avons pu identifier, caractériser, modéliser et simuler les mécanismes de défaillance potentiels propres à ces assemblages, et leur évolution : • Les gauchissements dans la phase d’assemblage du « PoP » et ses contraintes thermomécaniques sont plus importants que ceux de chacun des composants individuels. Un modèle analytique original a été construit et mis en ligne afin d’évaluer a priori ce gauchissement. • Les comportements hygroscopiques et hygromécaniques sont simulés et mesurés par une approche originale. L’assemblage « PoP » absorbe plus d’humidité que la somme des deux composants individuels, mais son gauchissement hygromécanique et ses contraintes hygromécaniques sont moins élevées. • Deux types d’essais de vieillissement accéléré sont réalisés pour étudier la fiabilité du « PoP » assemblé sur circuit imprimé : des cycles thermiques et des tests sous fort courant et température élevée. Dans ces deux types d’essais, l’assemblage d’un composant « top » sur un autre composant « bottom » pour former un PoP augmente les risques de défaillances. • L’évolution de la microstructure selon le type de vieillissement est comparée par des analyses physiques et physico-chimiques. Les fissures sont toujours situées dans l’interface substrat/billes, qui correspond aux zones critiques prédites par les simulations. / The assemblies PoP (Package on Package) can greatly increase the integration density of microelectronic circuits and systems, by vertically combining discrete semiconductor elements. The interconnections of these systems suffer the stresses never reached before. We were able to identify, characterize, model and simulate the potential failure mechanisms of these assemblies and their evolution: • The warpage in the assembly phase and thermomechanical stress of "PoP" are more serious than the individual components. An original analytical model has been built and put online for pre-estimating this warpage. • The hygroscopic and hygromechanical behaviors are simulated and measured by an original method. The assembly "PoP" absorbs more moisture than the sum of the individual components, but its hygromechanical warpage and stress are smaller. • Two types of accelerated aging tests are performed to study the reliability of "PoP" at the board level: the thermal cycling and the testing under current and temperature. In both types of tests, assembly a component "top" on another component "bottom" to form a “PoP” increases the risk of failure. • The microstructure evolution depending on the type of aging is compared by the physical and physico-chemical analysis. The cracks are always located in the interface substrate/balls, which corresponds to the critical areas predicted by the simulations.

A microestrutura de uma peça temperada determina suas características mecânicas. Dessa forma, torna-se fundamental conhecer os parâmetros que influenciam na formação da estrutura do componente tratado com função dos tratamentos térmicos aplicados, permitindo obter melhorias de qualidade de uma peça frente a sua aplicação. Métodos distintos podem ser empregados para obtenção da camada de têmpera. Entretanto, esses métodos devem ser parametrizados adequadamente para garantir a qualidade do produto final. No trabalho em questão, aplicaram-se dois metódos distintos de têmpera: por indução e por condução para obtenção da camada martensítica, dureza e durabilidade requerida em cremalheiras de aço SAE 1045, utilizadas em mecanismo de direção automotiva. Fabricou-se um lote de peças, do qual metade das peças foram tratadas por indução e a outra por condução. Após a têmpera e após o revenido, foi avaliado o nível de empenamento, a dureza superficial, a microdureza, a microestrutura formada. A peças após o término do processo de fabricação, foram montadas no sistema caixa de direção, sendo realizados ensaios de durabilidade e impacto dos mesmos. Os tratamentos realizados demonstraram resultados de empenamento, dureza, microestrutura e ensaios de durabilidade e impacto no produto final, dentro das especificações. O processo de têmpera por condução levou a melhor micrestrutura, mais alta dureza e menores níveisde empenamento comparado com o processo de têmpera por indução. Mas, também constatou-se que é possível desenvolver melhorias no processo de indução para atingir-se resultados melhores. / The microstructure of a hardened part is determining its mechanical characteristiscs. Thus, the knowledge of pararameters influencing the heat treated part’s microstructure is of fundamental importance. This allows to obtain quality improvements for specific applications. Diferent methods can be used for the obtation of a hardened layer. However, in these methods the parameters have to be correctly set to reach the final product quality. In this work, two diferente techniques were applied, induction and conduction surface hardening to obtain a required martensitic layer depth, hardness and durability of SAE 1045 steel racks used in automotive driving systems. A batche of parts were manufactured, being half of the parts surface hardened by Induction and half by conduction. After hardening and after tempering, the warpage level, surface hardness, microhardness and microstructure were investigated. The parts were mounted in a steering gear system and then endurance tests and impact tests were carried out. The results of warpage levels, hardness, microstructure and endurance tests, as well as the impact tests were in the range of the specifications. The conduction hardening process leads to better microstructure, higher hardness and lower warpage levels compared to induction hardening. But it was found that the Induction hardening can be optimized to reach better results.

Miniaturization and functionality have always governed advances in electronic system technology. To truly achieve the goal of a multi mega-functional system, advances must be made not just at the IC level, but at the system level too. This concept of tighter integration at the system level is called System-on-Package (SOP). While SOP has a wide range of applications, this work targets the mobile application space. The main driver in the mobile application space is package profile. Reduction in thickness is very critical for enabling next-generation ultra-high density mobile products. In order to pack more functionality into a smaller volume, it is absolutely imperative that package profiles are reduced. The NEMI roadmap projects that the package profile should be reduced to 200µm from the current 500µm by 2014. This work attempts to demonstrate the feasibility of ultra-thin substrates (<200µm) using a new advanced material system tailored for high-frequency mobile applications. The main barriers to adoption of thin substrates include processing challenges, concerns about via and through hole reliability and warpage. Each of these factors is studied and a full-fledged test vehicle built to demonstrate the reliability of thin substrates using the advanced low-loss RXP-4/RXP-1 material system. Finite element models are developed to provide an understanding of the factors that affect the reliability of these substrates. Finally, IC assembly is demonstrated on these substrates.

A microestrutura de uma peça temperada determina suas características mecânicas. Dessa forma, torna-se fundamental conhecer os parâmetros que influenciam na formação da estrutura do componente tratado com função dos tratamentos térmicos aplicados, permitindo obter melhorias de qualidade de uma peça frente a sua aplicação. Métodos distintos podem ser empregados para obtenção da camada de têmpera. Entretanto, esses métodos devem ser parametrizados adequadamente para garantir a qualidade do produto final. No trabalho em questão, aplicaram-se dois metódos distintos de têmpera: por indução e por condução para obtenção da camada martensítica, dureza e durabilidade requerida em cremalheiras de aço SAE 1045, utilizadas em mecanismo de direção automotiva. Fabricou-se um lote de peças, do qual metade das peças foram tratadas por indução e a outra por condução. Após a têmpera e após o revenido, foi avaliado o nível de empenamento, a dureza superficial, a microdureza, a microestrutura formada. A peças após o término do processo de fabricação, foram montadas no sistema caixa de direção, sendo realizados ensaios de durabilidade e impacto dos mesmos. Os tratamentos realizados demonstraram resultados de empenamento, dureza, microestrutura e ensaios de durabilidade e impacto no produto final, dentro das especificações. O processo de têmpera por condução levou a melhor micrestrutura, mais alta dureza e menores níveisde empenamento comparado com o processo de têmpera por indução. Mas, também constatou-se que é possível desenvolver melhorias no processo de indução para atingir-se resultados melhores. / The microstructure of a hardened part is determining its mechanical characteristiscs. Thus, the knowledge of pararameters influencing the heat treated part’s microstructure is of fundamental importance. This allows to obtain quality improvements for specific applications. Diferent methods can be used for the obtation of a hardened layer. However, in these methods the parameters have to be correctly set to reach the final product quality. In this work, two diferente techniques were applied, induction and conduction surface hardening to obtain a required martensitic layer depth, hardness and durability of SAE 1045 steel racks used in automotive driving systems. A batche of parts were manufactured, being half of the parts surface hardened by Induction and half by conduction. After hardening and after tempering, the warpage level, surface hardness, microhardness and microstructure were investigated. The parts were mounted in a steering gear system and then endurance tests and impact tests were carried out. The results of warpage levels, hardness, microstructure and endurance tests, as well as the impact tests were in the range of the specifications. The conduction hardening process leads to better microstructure, higher hardness and lower warpage levels compared to induction hardening. But it was found that the Induction hardening can be optimized to reach better results.

A microestrutura de uma peça temperada determina suas características mecânicas. Dessa forma, torna-se fundamental conhecer os parâmetros que influenciam na formação da estrutura do componente tratado com função dos tratamentos térmicos aplicados, permitindo obter melhorias de qualidade de uma peça frente a sua aplicação. Métodos distintos podem ser empregados para obtenção da camada de têmpera. Entretanto, esses métodos devem ser parametrizados adequadamente para garantir a qualidade do produto final. No trabalho em questão, aplicaram-se dois metódos distintos de têmpera: por indução e por condução para obtenção da camada martensítica, dureza e durabilidade requerida em cremalheiras de aço SAE 1045, utilizadas em mecanismo de direção automotiva. Fabricou-se um lote de peças, do qual metade das peças foram tratadas por indução e a outra por condução. Após a têmpera e após o revenido, foi avaliado o nível de empenamento, a dureza superficial, a microdureza, a microestrutura formada. A peças após o término do processo de fabricação, foram montadas no sistema caixa de direção, sendo realizados ensaios de durabilidade e impacto dos mesmos. Os tratamentos realizados demonstraram resultados de empenamento, dureza, microestrutura e ensaios de durabilidade e impacto no produto final, dentro das especificações. O processo de têmpera por condução levou a melhor micrestrutura, mais alta dureza e menores níveisde empenamento comparado com o processo de têmpera por indução. Mas, também constatou-se que é possível desenvolver melhorias no processo de indução para atingir-se resultados melhores. / The microstructure of a hardened part is determining its mechanical characteristiscs. Thus, the knowledge of pararameters influencing the heat treated part’s microstructure is of fundamental importance. This allows to obtain quality improvements for specific applications. Diferent methods can be used for the obtation of a hardened layer. However, in these methods the parameters have to be correctly set to reach the final product quality. In this work, two diferente techniques were applied, induction and conduction surface hardening to obtain a required martensitic layer depth, hardness and durability of SAE 1045 steel racks used in automotive driving systems. A batche of parts were manufactured, being half of the parts surface hardened by Induction and half by conduction. After hardening and after tempering, the warpage level, surface hardness, microhardness and microstructure were investigated. The parts were mounted in a steering gear system and then endurance tests and impact tests were carried out. The results of warpage levels, hardness, microstructure and endurance tests, as well as the impact tests were in the range of the specifications. The conduction hardening process leads to better microstructure, higher hardness and lower warpage levels compared to induction hardening. But it was found that the Induction hardening can be optimized to reach better results.

This project is dealt with optimalization of moulding procedure of plastic housing of headlamp for project DCW 204 Mopf halogen. The aim is reach a shorter injection moulding cycle time with keeping of claim quality of plastic part. Optimalization will be done based on modification of moulding pressing time. We observe warpage in axis X in the most problematical points of housing by using of contactless measuring optical technologie ATOS III Triple Scan. Simulation analysis for injection moulding was used for prediction of housing warpage up to unforming in every chosen moulding pressing time. According to reaching data in this way comparison of predicted warpage was able to done up to unforming time and real warpage of housing after unforming. According to reaching data in a different period of time warpage of housing during time flowing was observed.

Warped wafers and all the issues arise with them. are known issue in semiconductor industry. To solve those issues, the shape of the wafer needs to be known precisely. Current way of working when it comes to warped wafers is far from ideal within the company. A batch of wafers is acquired at customer’s site and it is assumed, that all the wafers in the batch are warped identically. A single specimen, representing the whole batch, is then taken to external company to be measured. As the method of measuring currently used contaminates and scratches the wafer, wafer must be scrapped afterwards. All the logistics and scrapped wafers add unnecessary costs to the company.  To optimize the warpage measuring procedure, a graduation internship project was initiated with a goal to develop a prototype of the tool, enabling inhouse warpage measuring.  The report contains all the methodology used to reach the final concept and results and includes methods such as: WBS, GANTT chart, Functional breakdown, Design requirement specification, Morphological matrix and PUGH’s matrix.  Final concept of warpage measuring tool consisted of implementing wafer sorting apparatus for wafer handling and enclosing the measuring tool to a custom housing, resembling a FOUP (Front Opening Unified Pod), allowing wafer sorting apparatus to load and unload test specimen for measuring. The measuring concept consists of rotary stage, where the wafer is loaded and rotated in addition to linear stage, that holds a confocal sensor above the wafer and moves it across the surface of the wafer, measuring the profile of the wafer, rotated every defined number of degrees between the measurements. Gravity induced deflection is eliminated by flipping the wafer using same wafer sorting apparatus and measuring the wafer inverted, thus allowing to estimate the true shape of the wafer.  The concept was developed in more detail, drawings for manufacturing the parts were created and the parts for building a functional prototype were ordered. Because of the COVID-19 pandemic, there were inevitable communication difficulties and delays in lead times, resulting in parts arriving on the last days of the internship, leaving no time for assembling and testing the actual prototype, therefore proof of concept is yet left to be tested by the employees of the company. / Vrängda kiselplattor och de problem som uppstår på grund av det är ett känt fenomen inom halvledarindustrin. För att kringgå dessa problem behövs god mätnoggranhet och det nuvarande sättet att hantera vrängda kiselplattor på inom företaget är långt från idealt. En batch kiselplattor hämtas hos kunden med antagandet att alla kiselplattor är identiskt vrängda. Ett enda exemplar som representerar hela batchen väljs sedan ut och skickas till ett externt mätföretag. Metoden som används för att mäta kiselplattan innehåller föroreningar och metoden repar även kiselplattan, som därmed inte kan användas efteråt. Utöver mätmetodens brister tillkommer även en utökad logistik och större materialspill som tillför kostnader för företaget.  Examensarbetets syfte är att förbättra mätmetoden som används för att utvärdera kiselplattornas vrängning och målet med projektet är att utveckla en prototyp som tillåter att mätmetoden görs internt inom företaget.  Rapporten innehåller metodiken som användes för att uppnå det slutgiltiga konceptet samt resultatet, och innehåller planeringsmoment samt projektets delmoment som: WBS, GANNT, funktionsnedbrytning, kravspecifikationer samt urvalsmatriser.  Det valda konceptet består av en sorteringsmaskin kombinerat med mätutrustningen och liknar en FOUP (Front Opening Unified Pod), vilket tillåter sorteringsmaskinen att tillföra och byta ut kiselplattorna som ska mätas. Mätutrustningen består av en roterande rörelse hos kiselplattan och en linjär rörelse hos en konfokal sensor placerad ovanför kiselplattan. Kombinationen av de båda rörelserna tillåter att hela kiselplattans yta mäts med ett givet vinkel- och radiellt steg. Genom att vända kiselplattan uppochner med sorteringsmaskinen och utföra samma mätning igen kan kiselplattans korrekta form estimeras genom att eliminera gravitationseffekten.  Konceptet utvecklades i detalj och tillverkningsunderlag och ritningar togs fram samt komponenter avsedda för tillverkning av en prototyp beställdes. På grund av COVID-19 pandemin uppstod dock kommunikationssvårigheter och förseningar i ledtider. Detta påverkade leveranserna och en del komponenter kom inte fram förrän i slutet av examensarbetet och det fanns därmed ingen tid över för montering eller tester som kan styrka konceptet, vilket får lämnas över till företagets anställda.