Switching device power losses place critical limits on the design and performance of high-frequency integrated DC-DC converters. Especially, the layout of metal interconnects in lateral power MOSFETs has a profound effect on their on-resistances and conduction power losses. This thesis presents an analytical interconnect modeling and layout optimization technique for large-area power MOSFETs. The layout optimization of 24V LDMOS transistors in the area of 1 mm2 has achieved an improvement of 55 % in its on-resistance. The simulation result has been verified by experimental measurements on a test chip fabricated in TSMC 0.25 µm HV CMOS technology. In addition, this thesis presents an optimized output stage design methodology for the implementation of a 4 MHz, 12V to 1V integrated DC-DC converter. A segmented output stage scheme is employed to increase the converter efficiency at light load conditions. The peak efficiency of 84% was achieved at load current of 2 A.

Switching device power losses place critical limits on the design and performance of high-frequency integrated DC-DC converters. Especially, the layout of metal interconnects in lateral power MOSFETs has a profound effect on their on-resistances and conduction power losses. This thesis presents an analytical interconnect modeling and layout optimization technique for large-area power MOSFETs. The layout optimization of 24V LDMOS transistors in the area of 1 mm2 has achieved an improvement of 55 % in its on-resistance. The simulation result has been verified by experimental measurements on a test chip fabricated in TSMC 0.25 µm HV CMOS technology. In addition, this thesis presents an optimized output stage design methodology for the implementation of a 4 MHz, 12V to 1V integrated DC-DC converter. A segmented output stage scheme is employed to increase the converter efficiency at light load conditions. The peak efficiency of 84% was achieved at load current of 2 A.

付記する学位プログラム名: 京都大学卓越大学院プログラム「先端光・電子デバイス創成学」 / 京都大学 / 新制・課程博士 / 博士(工学) / 甲第23905号 / 工博第4992号 / 新制||工||1779(附属図書館) / 京都大学大学院工学研究科電子工学専攻 / (主査)教授 木本 恒暢, 教授 白石 誠司, 准教授 小林 圭 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DFAM

Th. doct.-ing.--Électron.--Toulouse--I.N.P., 1983. N°: 271.

abstract: The first part describes Metal Semiconductor Field Effect Transistor (MESFET) based fundamental analog building blocks designed and fabricated in a single poly, 3-layer metal digital CMOS technology utilizing fully depletion mode MESFET devices. DC characteristics were measured by varying the power supply from 2.5V to 5.5V. The measured DC transfer curves of amplifiers show good agreement with the simulated ones with extracted models from the same process. The accuracy of the current mirror showing inverse operation is within ±15% for the current from 0 to 1.5mA with the power supply from 2.5 to 5.5V. The second part presents a low-power image recognition system with a novel MESFET device fabricated on a CMOS substrate. An analog image recognition system with power consumption of 2.4mW/cell and a response time of 6µs is designed, fabricated and characterized. The experimental results verified the accuracy of the extracted SPICE model of SOS MESFETs. The response times of 4µs and 6µs for one by four and one by eight arrays, respectively, are achieved with the line recognition. Each core cell for both arrays consumes only 2.4mW. The last part presents a CMOS low-power transceiver in MICS band is presented. The LNA core has an integrated mixer in a folded configuration. The baseband strip consists of a pseudo differential MOS-C band-pass filter achieving demodulation of 150kHz-offset BFSK signals. The SRO is used in a wakeup RX for the wake-up signal reception. The all digital frequency-locked loop drives a class AB power amplifier in a transmitter. The sensitivity of -85dBm in the wakeup RX is achieved with the power consumption of 320µW and 400µW at the data rates of 100kb/s and 200kb/s from 1.8V, respectively. The sensitivities of -70dBm and -98dBm in the data-link RX are achieved with NF of 40dB and 11dB at the data rate of 100kb/s while consuming only 600µW and 1.5mW at 1.2V and 1.8V, respectively. / Dissertation/Thesis / Ph.D. Electrical Engineering 2011

Atualmente os candidatos mais prováveis para aplicação como dielétrico de porta nas próximas gerações de dispositivos MOSFET são os filmes de silicato e aluminato metálicos com nitrogênio em sua composição. Neste trabalho são investigados filmes de oxinitreto de háfnio e silício (HfSixOyNz), oxinitreto de alumínio (AlOxNy), e oxinitreto de lantânio e alumínio (LaAlxOyNz) depositados sobre Si utilizando diferentes técnicas de preparação. O objetivo deste estudo é avaliar a estabilidade térmica dessas estruturas e o efeito da presença do nitrogênio no que diz respeito ao transporte atômico e reações químicas durante tratamentos térmicos pós-deposição. Os tratamentos térmicos realizados buscam simular as etapas de processamento térmico inerentes do processo de fabricação de um MOSFET, como, por exemplo, a etapa de ativação de dopantes da fonte e do dreno do dispositivo. Esses tratamentos térmicos são realizados em temperaturas que variam de 600oC até 1000oC em atmosfera inerte ou oxidante. Foi observado que a presença de nitrogênio inibe o transporte atômico e, conseqüentemente, instabilidades composicionais quando comparado com filmes sem nitrogênio. Em particular, as espécies oxidantes desempenham um papel importante na compreensão da estabilidade físico-química dessas estruturas durante os tratamentos térmicos, uma vez que o nitrogênio modifica a difusão e a incorporação de oxigênio. Além disso, observa-se que parte do nitrogênio é removido dessas estruturas com o tratamento térmico em atmosfera oxidante. Essa perda acontece principalmente através de um processo de troca entre o nitrogênio do filme e o oxigênio da fase gasosa. Nesta tese foi realizado um estudo sistemático dessas estruturas e as possíveis causas das observações realizadas são discutidas, assim como alguns mecanismos são propostos para explicar os resultados experimentais. Esta tese aporta uma importante contribuição para essa área de pesquisa e para o avanço da tecnologia CMOS nos próximos anos. / High-k metal oxynitrides are currently the most promising candidates under consideration as novel gate dielectrics for MOSFET devices. In this work, hafnium-silicon oxynitride (HfSixOyNz), aluminum oxynitride (AlOxNy), and lanthanum-aluminum oxynitride (LaAlxOyNz) films on silicon prepared by different deposition techniques were experimentally investigated. The aim of this study was to evaluate the thermal stability of these structures and the effect of nitrogen concerning atomic transport and chemical reaction phenomena in view of metal-oxide-semiconductor transistor processing requirements. Such processing steps include post-deposition annealing and source/drain dopant activation annealing, performed at temperatures from around 600oC up to 1000oC, in inert or O2-containing atmospheres. It was observed that nitrogen inhibits atomic transport and compositional instabilities during thermal processing when compared to non-nitrided structures. In particular, oxidant species play an important role in understanding physicochemical stability during thermal processing, since nitrogen modifies the oxygen diffusion and incorporation into these structures. Besides, part of the nitrogen is removed from these structures during thermal annealing by an exchange process with oxygen. A systematic investigation of these structures was performed, the possible chemical/physical causes of these observations are discussed and some mechanisms are proposed to explain the experimental results. This thesis provides new understanding to this area with potential importance to the CMOS technology.

Atualmente os candidatos mais prováveis para aplicação como dielétrico de porta nas próximas gerações de dispositivos MOSFET são os filmes de silicato e aluminato metálicos com nitrogênio em sua composição. Neste trabalho são investigados filmes de oxinitreto de háfnio e silício (HfSixOyNz), oxinitreto de alumínio (AlOxNy), e oxinitreto de lantânio e alumínio (LaAlxOyNz) depositados sobre Si utilizando diferentes técnicas de preparação. O objetivo deste estudo é avaliar a estabilidade térmica dessas estruturas e o efeito da presença do nitrogênio no que diz respeito ao transporte atômico e reações químicas durante tratamentos térmicos pós-deposição. Os tratamentos térmicos realizados buscam simular as etapas de processamento térmico inerentes do processo de fabricação de um MOSFET, como, por exemplo, a etapa de ativação de dopantes da fonte e do dreno do dispositivo. Esses tratamentos térmicos são realizados em temperaturas que variam de 600oC até 1000oC em atmosfera inerte ou oxidante. Foi observado que a presença de nitrogênio inibe o transporte atômico e, conseqüentemente, instabilidades composicionais quando comparado com filmes sem nitrogênio. Em particular, as espécies oxidantes desempenham um papel importante na compreensão da estabilidade físico-química dessas estruturas durante os tratamentos térmicos, uma vez que o nitrogênio modifica a difusão e a incorporação de oxigênio. Além disso, observa-se que parte do nitrogênio é removido dessas estruturas com o tratamento térmico em atmosfera oxidante. Essa perda acontece principalmente através de um processo de troca entre o nitrogênio do filme e o oxigênio da fase gasosa. Nesta tese foi realizado um estudo sistemático dessas estruturas e as possíveis causas das observações realizadas são discutidas, assim como alguns mecanismos são propostos para explicar os resultados experimentais. Esta tese aporta uma importante contribuição para essa área de pesquisa e para o avanço da tecnologia CMOS nos próximos anos. / High-k metal oxynitrides are currently the most promising candidates under consideration as novel gate dielectrics for MOSFET devices. In this work, hafnium-silicon oxynitride (HfSixOyNz), aluminum oxynitride (AlOxNy), and lanthanum-aluminum oxynitride (LaAlxOyNz) films on silicon prepared by different deposition techniques were experimentally investigated. The aim of this study was to evaluate the thermal stability of these structures and the effect of nitrogen concerning atomic transport and chemical reaction phenomena in view of metal-oxide-semiconductor transistor processing requirements. Such processing steps include post-deposition annealing and source/drain dopant activation annealing, performed at temperatures from around 600oC up to 1000oC, in inert or O2-containing atmospheres. It was observed that nitrogen inhibits atomic transport and compositional instabilities during thermal processing when compared to non-nitrided structures. In particular, oxidant species play an important role in understanding physicochemical stability during thermal processing, since nitrogen modifies the oxygen diffusion and incorporation into these structures. Besides, part of the nitrogen is removed from these structures during thermal annealing by an exchange process with oxygen. A systematic investigation of these structures was performed, the possible chemical/physical causes of these observations are discussed and some mechanisms are proposed to explain the experimental results. This thesis provides new understanding to this area with potential importance to the CMOS technology.

Atualmente os candidatos mais prováveis para aplicação como dielétrico de porta nas próximas gerações de dispositivos MOSFET são os filmes de silicato e aluminato metálicos com nitrogênio em sua composição. Neste trabalho são investigados filmes de oxinitreto de háfnio e silício (HfSixOyNz), oxinitreto de alumínio (AlOxNy), e oxinitreto de lantânio e alumínio (LaAlxOyNz) depositados sobre Si utilizando diferentes técnicas de preparação. O objetivo deste estudo é avaliar a estabilidade térmica dessas estruturas e o efeito da presença do nitrogênio no que diz respeito ao transporte atômico e reações químicas durante tratamentos térmicos pós-deposição. Os tratamentos térmicos realizados buscam simular as etapas de processamento térmico inerentes do processo de fabricação de um MOSFET, como, por exemplo, a etapa de ativação de dopantes da fonte e do dreno do dispositivo. Esses tratamentos térmicos são realizados em temperaturas que variam de 600oC até 1000oC em atmosfera inerte ou oxidante. Foi observado que a presença de nitrogênio inibe o transporte atômico e, conseqüentemente, instabilidades composicionais quando comparado com filmes sem nitrogênio. Em particular, as espécies oxidantes desempenham um papel importante na compreensão da estabilidade físico-química dessas estruturas durante os tratamentos térmicos, uma vez que o nitrogênio modifica a difusão e a incorporação de oxigênio. Além disso, observa-se que parte do nitrogênio é removido dessas estruturas com o tratamento térmico em atmosfera oxidante. Essa perda acontece principalmente através de um processo de troca entre o nitrogênio do filme e o oxigênio da fase gasosa. Nesta tese foi realizado um estudo sistemático dessas estruturas e as possíveis causas das observações realizadas são discutidas, assim como alguns mecanismos são propostos para explicar os resultados experimentais. Esta tese aporta uma importante contribuição para essa área de pesquisa e para o avanço da tecnologia CMOS nos próximos anos. / High-k metal oxynitrides are currently the most promising candidates under consideration as novel gate dielectrics for MOSFET devices. In this work, hafnium-silicon oxynitride (HfSixOyNz), aluminum oxynitride (AlOxNy), and lanthanum-aluminum oxynitride (LaAlxOyNz) films on silicon prepared by different deposition techniques were experimentally investigated. The aim of this study was to evaluate the thermal stability of these structures and the effect of nitrogen concerning atomic transport and chemical reaction phenomena in view of metal-oxide-semiconductor transistor processing requirements. Such processing steps include post-deposition annealing and source/drain dopant activation annealing, performed at temperatures from around 600oC up to 1000oC, in inert or O2-containing atmospheres. It was observed that nitrogen inhibits atomic transport and compositional instabilities during thermal processing when compared to non-nitrided structures. In particular, oxidant species play an important role in understanding physicochemical stability during thermal processing, since nitrogen modifies the oxygen diffusion and incorporation into these structures. Besides, part of the nitrogen is removed from these structures during thermal annealing by an exchange process with oxygen. A systematic investigation of these structures was performed, the possible chemical/physical causes of these observations are discussed and some mechanisms are proposed to explain the experimental results. This thesis provides new understanding to this area with potential importance to the CMOS technology.

Cette thèse présente un nouveau système de stabilisation de la tension batterie spécialement destinés aux véhicules Stop-Start, économique et compact, nommé LVSS (Linear Voltage Stabilization System). Le LVSS se comporte comme une résistance variable et limite le courant à l’aide de transistors MOSFET fonctionnant en mode linéaire. Il permet donc de stabiliser la tension de la batterie pendant le démarrage du moteur à combustion interne (ICE). Un prototype a été conçu et testé sur une voiture. Les résultats ont montré que la tension était stabilisée tout en limitant le courant de démarrage. De plus la solution proposée n’impacte pas sur les performances globales du système Stop-Start et comme les transistors fonctionnent en mode linéaire, cette solution n’émet pas de perturbations CEM. / This thesis presents a new Linear Voltage Stabilization System (LVSS) specially designed for µ-hybrid vehicles using the Stop-Start function. The LVSS stabilizes the battery voltage during the start-up of the Internal Combustion Engine (ICE) limiting the start-up current using parallels MOSFETs working in linear mode. A prototype was developed and tested in a car. Results have shown the battery voltage properly stabilized limiting the start-up current. Furthermore the proposed solution does not impact on the overall performance of the Stop-Start. Main advantages are its small volume, low price and the fact that there is no EMC perturbation as transistors work in linear mode.

Dans les nombreuses études actuelles sur le photovoltaïque, on assiste à de grands progrès tant dans le domaine des cellules à haut rendement énergétique, que sur les structures liées à l'exploitation. Afin de tirer parti de toute l'énergie produite, il a paru de tout premier ordre d'orienter les recherches sur les architectures parallèles en bus haute tension. Pour la génération de hautes tensions il est impératif d'utiliser des convertisseurs spécialement adaptés. En effet, si on utilise des convertisseurs classiques on se heurte à la problématique des pertes dans les composants de puissance, et notamment le transistor MOSFET de commutation utilisé pour le découpage. Une première étude a permis de vérifier que les contraintes de tension entraînent pour le transistor des pertes importantes aux tensions élevées. Cette première étude montre que seuls les transistors de faible tension inférieure à 100V ont des caractéristiques intéressantes pour notre application. Une recherche systématique a abouti à l'élaboration d'un convertisseur Boost à couplage magnétique. Grâce au recyclage des énergies parasites, les essais montrent que ce montage est bien adapté à notre application permettant d'obtenir des rendements de plus de 90%. Parmi les différentes stratégies d'extraction de puissance, le MPPT à incrément de conductance a été choisi pour ses qualités de précision et de facilité de mise en œuvre. Chaque panneau équipé d'un convertisseur envoie la puissance recueillie sur le bus haute tension, lui même relié à un onduleur de type SMA / In various studies on photovoltaic, major progresses have been observed, both concerning the cells and also in the field of their use. In order to take advantage of the energy it has been paramount to focus on parallel High Voltage bus. This High Voltage generation requires dedicated converters. In fact, using classical converters implicates important losses in the MOSFET used for switching. In a prior study we could ascertain important losses on transistors when submitted to high voltages as we assumed. It was shown then that only the transistors supporting a voltage less than 100V can be used for our application. A systematic investigation led to the Magnetically Coupled Boost converters. Thanks to the recycling of parasitic losses, our tests show an efficiency superior than 90%. Among the different power extraction strategies, the incremental conductance MPPT was used because of its top of the arts performances and convenience. Every DC/DC implemented panel converter supplies the HVDC bus which, itself, is connected to the SMA inverter