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Significant progress in reducing the growth temperature of the SiC epitaxial growth became possible in the previous work by using new chloro-carbon epitaxial growth method. However, it was established that even in the new process, homogenous nucleation of Si in the gas phase limited the growth rate. In the present work, new chlorinated silicon precursor SiCl4 was investigated as a replacement for the traditional silicon precursor SiH4 during the low-temperature chlorocarbon epitaxial growth. The new process completely eliminated the homogenous nucleation in the gas phase. Growth rate of 5-6 μm/h was achieved at 1300°C compared to less than 3 μm/h in the SiH4-based growth. The growth dependence on the C/Si ratio revealed that the transition from the C-supply-limited to the Si-supply-limited growth mode takes place at the value of the C/Si ratio much higher than unity, suggesting that certain carbon-containing species are favorably excluded from the surface reactions in the new process. Morphology degradation mechanisms, which are unique for the lowtemperature growth, were observed outside the established process window. Prior to this work, it remained unclear if CH3Cl simply served as a source of Cl to suppress homogeneous nucleation in the gas phase, or if it brought some other unknown improvements. In this work true benefits of CH3Cl in providing unique improvement mechanisms have been revealed. It was established that CH3Cl provided a much wider process window compared to C3H8. In contrast, even a very significant supply of extra Cl from a chlorinated silicon precursor or from HCl during the C3H8-based growth could not provide a similar benefit. The combination of the chloro-carbon and the chloro-silane precursors was also investigated at conventional growth temperature. High-quality thick epitaxial layers, with the growth rate up to 100μm/h were obtained, and the factors influencing the growth rate and morphology were investigated. Extensive optical and electrical characterization of the low-temperature and the regular-temperature epitaxial layers was conducted. The device-quality of the lowtemperature chloro-carbon epilayers was validated for the first time since the development of the chloro-carbon epitaxial process in the year 2005 by fabricating simple Schottky diodes and investigating their electrical characteristics.

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The thesis focuses on designing and characterizing SiC 3.3 kV Diffused Metal-Oxide Semiconductor Field-Effect Transistor (DMOSFET)s with a Ron that is significantly lower than that of current commercial devices. The On-state resistance and breakdown voltage are then adjusted by adding a Super-Junction structure. Because of the pillar structure below the p-base area, the depletion will occur both vertically and horizontally and keeps the electric field distribution throughout the drift layer constant. The Super Junction Metal-Oxide Semiconductor Field-Effect Transistor (SJ MOSFET) has a good advantage compared to DMOSFETs. Due to its capacity to tolerate higher breakdown voltages and the fact that it does not require an increase in cell pitch to reach higher voltages, the Super-Junction approach is now the subject of effective research as compared to IGBTs and DMOSFETs. Silicon Carbide , a material with a wide bandgap that facilitates high temperature operation, high blocking voltage, high current flow and high switching frequency, is used to construct the device. In order to maintain a consistent electric field throughout the device, the concentration of the n and p pillars was chosen with a good charge balance between them. The outcomes of designing and simulating a DMOSFET, a Semi-SJ MOSFET, and a Full SJ MOSFET are compared in this research. The semi SJ device resulted in a Ron of 18.4 mΩcm2 and a Vb of 4.1 kV. The full SJ device reached a Ron of 12.4 mΩcm2 and a breakdown voltage of 4.2 kV. One optimized device was chosen from the semi SJ devices and used in several TCAD simulations, and the outcomes were evaluated based on the JFET width, pillar thickness, and charge imbalance between the p and n pillars. In this study, the device was also modelled for 6.5 kV and 10 kV SiC blocking voltage capabilities; the findings are also discussed. / Denna uppsats fokuserar på att utveckla och karakterisera 3.3 kV kiselkarbidbaserade DMOSFET-transistorer med betydligt lägre framspänningsfall jämfört med kommersiella halvledarkomponenter. Framspänningsfallet och spärrspänningen modifieras genom att använda en pelarliknande halvledarstruktur i drift regionen, dvs. en super-junction [SJ] struktur. På grund av pelarstrukturen under p-bas området, uppträder utarmningsområdet av laddningsbärare både vertikalt och horisontellt och ger ett konstant elektriskt fält genom drift-regionen. Super-junction transistorer har flera fördelar jämfört med komponenter i DMOSFET struktur. På grund av sin kapacitet att motstå högre spärrspänningar och genom att strukturen inte behöver en större enhetscellbredd för att nå högre spärrspänning, så är just nu super-junction strukturer i stort forskningsfokus jämfört med IGBT och DMOSFET komponenter. Kiselkarbid, ett material med ett brett bandgap, möjliggör komponenter för höga temperaturer, höga spärrspänningar, höga elektriska strömmar, samt höga växlingsfrekvenser, har använts för att bygga de undersökta komponenterna. För att generera ett konstant elektriskt fält över drift-regionen, så har dopningsnivåerna för n- och p- pelarna valts för att hålla en bra laddningsbalans mellan dem. Simuleringsresultaten av dessa komponentstrukturer, DMOSFET, halv-SJ MOSFET, och hel-SJ MOSFET är jämförda i detta projekt. Halv-SJ MOSFET transistorn resulterade i ett framspänningsfall på 18.4 mΩcm2 och når en spärrspänning av 4.1 kV. Hel-SJ MOSFET strukturen uppnår ett framspänningsfall på 12.4 mΩcm2 och med spärrspänning av 4.2 kV. En optimerad halv-SJ struktur valdes ut för att genomföra ytterligare TCAD simuleringsstudier om effekterna av JFET bredd, pelartjocklek, samt laddningsobalans mellan n- och p- pelarna. I den här studien simulerades även komponentstrukturer för 6.5 kV och 10 kV spärrspänningsklasser; även dessa resultat diskuteras i rapporten.

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<p>The goal of the project work has been to study the symmetry of the phonons in 4H and 6H-SiC for different measuring geometries by using two experimental techniques, Raman and infrared absorption (IR) spectroscopy, and a theoretical model. The Raman spectra were measured in different scattering configurations in order to obtain experimental data for detailed investigation of the phonon symmetries.</p><p>The gross features of the spectra obtained in different geometries can be explained using general group-theoretical arguments. Using a lattice-dynamics model, we have also calculated the angular dependence of the phonon energies near the centre of the Brillouin zone, as well as the phonon displacements in some high-symmetry directions. The theoretical results are used to interpret the Raman lines in different configurations, and it was possible to estimate that if ionicity of the bonding of 12% is taken in the theoretical model for 4H-SiC, the splitting of the polar TO mode and the shift of the polar LO mode observed in our spectra are well reproduced theoretically. It was also observed that these polar modes have to be classified as longitudinal and transversal with respect to the direction of phonon wave vector, while the rest of the modes remain longitudinal or transversal with respect to the c-axis of the crystal. The Raman lines in the case of 4H SiC have been tentatively labelled with the irreducible representations of the point group of the crystal (C6v).</p>

The goal of the project work has been to study the symmetry of the phonons in 4H and 6H-SiC for different measuring geometries by using two experimental techniques, Raman and infrared absorption (IR) spectroscopy, and a theoretical model. The Raman spectra were measured in different scattering configurations in order to obtain experimental data for detailed investigation of the phonon symmetries. The gross features of the spectra obtained in different geometries can be explained using general group-theoretical arguments. Using a lattice-dynamics model, we have also calculated the angular dependence of the phonon energies near the centre of the Brillouin zone, as well as the phonon displacements in some high-symmetry directions. The theoretical results are used to interpret the Raman lines in different configurations, and it was possible to estimate that if ionicity of the bonding of 12% is taken in the theoretical model for 4H-SiC, the splitting of the polar TO mode and the shift of the polar LO mode observed in our spectra are well reproduced theoretically. It was also observed that these polar modes have to be classified as longitudinal and transversal with respect to the direction of phonon wave vector, while the rest of the modes remain longitudinal or transversal with respect to the c-axis of the crystal. The Raman lines in the case of 4H SiC have been tentatively labelled with the irreducible representations of the point group of the crystal (C6v).

In this thesis work several manufacturing methods for graphene is discussed followed by an indepth study of graphene grown by a high temperature sublimation method (sublimation of siliconcarbide). The graphene surfaces studied have been grown by Graphensic AB, both graphenegrown on the Si-face and the C-face of the silicon carbide were studied. Six graphene samplesgrown 4H-SiC substrates were examined for homogeneity and surface morphology as well assome surface roughness parameters using Atomic Force Microscopy (AFM). The graphene wasstudied to get a better understanding of the surfaces and the growth mechanisms to improvemanufacturing parameters while also being informative for graphene sample customers. Anadditional graphene sample grown on 6H-SiC epitaxial layer was also studied to get a betterunderstanding of the sublimation mechanism. If graphene could be manufactured in a cheaprepeatable way the applications are endless and a new era of technology could emerge muchlike the silicon era that began several decades ago. In this thesis work the results are presentedas topography images as well as tables and histograms in the results section. The growth onthe Si-face is found to be well ordered when compared to the C-face which shows signs of alargely complex growth. The graphene on the Si-face lies on top of silicon carbide steps like acarpet with a buer layer interface against the silicon carbide. On the C-face this buer layeris not present but the graphene is deformed by buckling which is suspected to originate fromdierences in thermal properties between the graphene and the C-face. The in uence of AFMsettings for characterization of graphene while using intermittent mode have been evaluated andrecommendations are given. Finally a method for evaluating the homogeneity of the graphenelm is proposed but is in need of further verication.

4H-SiC based Metal-Oxide Semiconductor(MOS) capacitors are promising key components for next generation power devices. For high frequency power applications, however, there is a major drawback of this type of devices, i.e. they have low inversion channel mobility that consequently affects the switching operation in MOS Field-Effect Transistors (MOSFETs). Carbon clusters or excess carbon atoms in the interface between the dielectric layer and SiC is commonly considered to be the carrier trapping and scattering centers that lower the carrier channel mobility. Based on the previous work in the research group, a new fabrication process for forming the dielectric layer with a lower density of the trap states is investigated. The process consists of standard semiconductor cleaning, pre-treatments, pre-oxidation, plasma enhanced chemical vapor deposition (PECVD) and post oxidation annealing. I-V measurements of the dielectric strength showed that the resulting layers can sustain proper working condition under an electric field of at least 5MV/cm. C-V characteristics measurements provided the evidence that the proposed method can effectively reduce the interfacial states, which are main culprit for a large flat band voltage shift of C-V characteristics, in particular under annealing at 900°C in nitrogen atmosphere.