Les HEMT AlGaN/GaN sont en passe de devenir incontournables dans le monde de l'amplification de puissance radiofréquence, grâce à leurs performances exceptionnelles. Cependant,en raison de la relative jeunesse de cette technologie, des études de fiabilité dans plusieurs modes de fonctionnement sont toujours nécessaires pour comprendre les mécanismes de défaillance propres à ces composants et responsables de leur vieillissement. Cette étude porte sur l'analyse des défaillances dans les transistors HEMT AlGaN/GaN de puissance,en régime de fonctionnement de type RADAR (pulsé et saturé). Elle s'appuie sur la conception d'amplificateurs de test, leur caractérisation et leur épreuve sur bancs de vieillissement. La mise en place d'une méthodologie visant à discriminer les mécanismes de dégradation prépondérants, conjointement à une analyse micro-structurale des composants vieillis, permet d'établir le lien entre l'évolution des performances électriques et l'origine physique de ces défauts.

InGaN based blue and near-ultraviolet light emitting diodes and laser diodes have been successfully commercialized for many applications such as general lighting, display backlighting and high density optical storage devices. Despite having a comparably high defect density, these devices are known for their efficient operation, which is attributed to localization in potential fluctuations preventing carriers from reaching the centers of nonradiative recombination. Nitride research is currently headed towards improving deep ultraviolet AlGaN and green InGaN emitters with higher Al and In molar fractions. The efficiency of these devices trails behind the blue counterparts as the carrier localization does not seem to aid in supressing nonradiative losses. In addition, the operation of ternary nitride heterostructure based devices is further complicated by the presence of large built-in electric fields. Although the problem can be ameliorated by growing structures in nonpolar or semipolar directions, the step from research to production still awaits. In this thesis, carrier dynamics and localization effects have been studied in three different nitride ternary compounds: AlGaN epitaxial layers and quantum wells with high Al content, nonpolar m-plane InGaN/GaN quantum wells and lattice matched AlInN/GaN heterostructures. The experimental methods of this work mainly consist of spectroscopy techniques such as time-resolved photoluminescence and differential transmission pump-probe measurements as well as spatial photoluminescence mapping by means of scanning near-field microscopy. The comparison of luminescence and differential transmission measurements has allowed estimating the localization depth in AlGaN quantum wells. Additionally, it has been demonstrated that the polarization degree of luminescence from m-InGaN quantum wells decreases as carriers diffuse to localization centers.What is more, dual-scale localization potential has been evidenced by near-field measurements in both AlGaN and m-InGaN. Larger scale potential fluctuation have been observed directly and the depth of nanoscopic localization has been estimated theoretically from the recorded linewidth of the near-field spectra. Lastly, efficient carrier transport has been observed through AlInN layer despite large alloy inhomogeneities evidenced by broad luminescence spectra and the huge Stokes shift. Inhomogeneous luminescence from the underlying GaN layer has been linked to the fluctuations of the built-in electric field at the AlInN/GaN interface. / <p>QC 20121101</p>

This thesis presents the development of III-nitride materials for deep-ultraviolet (DUV) light emitting devices. The goal of this research is to develop a DUV laser diode (LD) operating at room temperature. Epitaxial structures for these devices are grown by metalorganic chemical vapor deposition (MOCVD) and several material analysis techniques were employed to characterize these structures such as atomic force microscopy, electroluminescence, Hall-effect measurement, photoluminescence, secondary ion mass spectrometry, transmission electron microscopy, transmission line measurement, and X-ray diffraction. Each of these will be discussed in detail. The active regions of III-nitride based UV emitters are composed of AlxGa1-xN alloys, the bandgap of which can be tuned from 3.4 eV to 6.2 eV, which allows us to attain the desired wavelength in the DUV by engineering the molar fraction of aluminum and gallium. In order to emit photons in the DUV wavelength range (> 4.1 eV), high aluminum molar fraction AlxGa1-xN alloys are required. Since aluminum has very low ad-atom mobility on the growth surface, a very low group V to group III precursor ratio (known as V/III ratio), high growth temperature, and low growth pressure is required to form a smooth surface and subsequently abrupt heterointerfaces. The first part of this work focuses on developing high-quality multi-quantum well structures using high aluminum molar fraction ([Al] > 60%) AlxGa1-xN alloys. Optically pumped DUV lasers were demonstrated with threshold power density as low as 250 kW/cm² for the emission wavelength as short as 248.3 nm. Transverse electric (TE) -like emission dominates when the lasers were operating above threshold power density, which suggests the diode design requires the active region to be fully strained to promote better confinement of the optical mode in transverse direction. The second phase of this project is to achieve an electrically driven injection diode laser. Owing to their large bandgap, low intrinsic carrier concentration, and relatively high dopant activation energy, the nature of these high aluminum molar fraction materials are highly insulating; therefore, efficiently transport carriers into active region is one of the main challenges. Highly conducting p-type material is especially difficult to achieve because the activation energy for magnesium, a typical dopant, is relatively large and some of the acceptors are compensated by the hydrogen during the growth. Furthermore, due to the lack of a large work function material to form a p-type ohmic contact, the p-contact layer design is limited to low aluminum molar fraction material or gallium nitride. Besides the fabrication challenges, these low aluminum molar fraction materials are not transparent to the laser wavelength causing relatively high internal loss (αi). In this work, an inverse tapered p-waveguide design is employed to transport holes to active region efficiently while the graded-index separate-confinement heterostructure (GRINSCH) is employed for the active region design. Together, a multi-quantum well (MQW) ultraviolet emitter was demonstrated.

Since Shuji Nakamura, Hiroshi Amano, and Isamu Akasaki won the 2014 Nobel prize in Physics owing to theircontributions on the invention of efficient blue GaN light emitting diodes, GaN became an even more appealingmaterial system in the research field of optoelectronics. On the other hand, quantum structures or low-dimensionalstructures with properties derived from quantum physics demonstrate superior and unique electrical and opticalproperties, providing a significant potential on novel optoelectronic applications based on the employment of quantumconfinement.   In 2012, our research team at Linköping University utilized pyramid templates, which is an established approach toform quantum structures, to successfully grow GaN pyramids with InGaN hybrid quantum structures, includingquantum wells, quantum wires, and quantum dots. This growth enabled site-controlled pyramids based on selectivearea growth (SAG). After numerous studies on the photoluminescence properties, the mature and controlled growthtechnique was proposed to be adapted for fabrication of AlGaN pyramids on which GaN hybrid quantum structurescan be hosted.   This thesis is dedicated to the subsequent problems of the growth of AlGaN pyramids. It was found that there wasan undesired deposition of a considerable thickness on top the desired AlGaN pyramid with GaN multiple quantumwells. In this thesis, two different directions are explored to find the key solution with a potential of furtheroptimization. On one hand, the growth parameters such as precursors cut-off, carrier gas during cooling, temperatureholding, cooling pressure, III/V ratio, and the possible effect of GaN surfaces are investigated. However, due to theactual inherent properties of the metal-organic chemical vapor deposition reactor used, no promising parameter tuningcan been identified. On the other hand, from post-growth point of view, a KOH aqueous etching solution exhibits apositive result toward removing the undesired deposition. This etching process is suggested to be further optimized toachieve the final goal of eliminating the undesired deposition.

Afin de répondre à l’exigence croissante de densité de puissance aux hautes fréquences, les chercheurs se sont intéressés aux matériaux à large bande interdite tels que le nitrure de gallium GaN. Les HEMTs (transistors à haute mobilité électronique) AlGaN/GaN ne sont pas stabilisées et donc l’analyse de défaillance de ces composants est difficile (défauts multiples).Les mécanismes de défaillance des HEMTs GaAs sont difficilement transposables sur les HEMTs GaN et nécessitent donc une étude approfondie. De plus que les données actuelles sur les effets de pièges ne permettent pas d’expliquer facilement des effet parasites comme l’effet de coude. Ce qui nécessité de développer de nouvelles procédures d’analyse de défaillance adaptées aux composant GaN. Les dégradations induites par les électrons chauds sont difficilement détectables par la technique d ‘émission de lumière standard ce qui a nécessité le développement de la microscopie à émission de lumière dans le domaine de l’UV. L’objectif principal de ce travail est la mise au point d'une méthodologie d'analyse de défaillance pour les filières GaN et l’optimisation des techniques electro-optiques non destructives de localisation de défauts. En vue de l’amélioration des procédés technologiques, et de la fiabilité des HEMT GaN. / There are several economic and technological stakes, which require the development of suitable techniques for failure analysis on microwave devices, the HEMT (High Electron Mobility Transistor) AlGaN/GaN play a key role for power and RF low noise applications.The technologies are not completely stabilized and the failure analysis is difficult. Which need the development of a non destructive investigation techniques such as electroluminescence technics. To improve the GaN HEMT performance and reliability, understanding the failure mechanisms is critical. The standard emission light is not sufficient for hot-elctron detection in GaN material. And the development of UV light emission become necessary in the AlGaN/GaN HEMT.

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<p>  </p> <p>Research that seeks to understand and develop the growth of III-nitride materials by molecular beam epitaxy (MBE) is beneficial to a broad range of the device community. MBE and the III-nitrides have been used to develop transistors, diodes, electroacoustic devices, solar cells, LEDs, LDs, intersubband devices, and quantum-cascade lasers. In this work we focus on the growth of III-nitride materials specifically for applications in near-infrared intersubband (NIR ISB) optical devices, however all this work is broadly applicable. </p> <p><br></p> <p>We begin by investigating the reduced indium incorporation in non-polar m-plane InGaN films. We find that InGaN grown on m-plane GaN has an effective activation energy for thermal decomposition of 1 eV, nearly half that reported for similar c-plane films. We produce high quality m-plane In0.16Ga0.84N and utilize it in AlGaN/InGaN devices designed for near-infrared ISB absorption measurements. We continue this work by exploring the growth of low-temperature AlGaN, necessary for these devices. We find that the utilization of an indium surfactant during low-temperature AlGaN growth enhances adatom diffusion, resulting in smoother surface morphologies, sharper interfaces, and reduced defects within the material. This growth method also prevents the anomalous suppression of the AlGaN growth rate, which we link to a reduction in the formation of high-aluminum containing defects. These investigations result in the demonstration of an Al0.24Ga0.76N/In0.16Ga0.84N heterostructure with a conduction band offset large enough to enable NIR ISB transitions.</p> <p><br></p> <p>Lastly, we explore the novel material ScAlN. This material’s large bandgap, large spontaneous polarization, ferroelectricity, and ability to be lattice matched to GaN at ~18% scandium composition make it an ideal candidate for a variety of devices, including NIR ISB devices. We investigate the reported temperature dependence of ScAlN’s <em>c</em>-lattice constant and confirm this dependence is present for high growth-temperature ScxAl1-xN with 0.11 < x < 0.23. We find that this temperature dependence is no longer present below a certain composition-dependent growth temperature. This finding, coupled with observations that samples grown at lower temperatures exhibit lower defect densities, smoother surfaces, and homogeneous chemical compositions suggest that high growth temperatures lead to defect generation that may cause the observed change in lattice parameters. We demonstrate lattice-matched, 50 repeat Sc0.18Al1-xN/GaN heterostructures with ISB absorption in excess of 500 meV with FWHM as little as 45 meV. </p>

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