This thesis presents a cross-layer design and optimization for emerging wideband wireless networks supporting multimedia applications, considering the interactions of the wireless channel characteristics, the physical and link layer protocols, and the user-perceived Quality-of-Service (QoS). As wireless channels are error-prone and broadcast in nature, both the error control mechanisms and the Media Access Control (MAC) protocols are critical for resource utilization and QoS provisioning. How to analyze, design and optimize the high-rate wireless networks by considering the characteristics of the propagation channels and wideband communication technologies is an open, challenging issue. In this thesis, we consider two important wideband wireless systems, the Ultra-Wideband (UWB) and the Orthogonal Frequency-Division Multiplexing (OFDM) systems. First, we propose the packet-level channel models based on Finite State Markov Chains (FSMCs) for the two systems, which present the statistical properties of the propagation channels and the transmission systems. Second, by incorporating the proposed packet-level channel models, we develop analytical frameworks for quantifying the performance of the high-rate wireless networks, combining the channel fading, physical- and link-layer error-control mechanisms and MAC protocols. Third, to mitigate the impact of channel fading and impairments, a cross-layer joint error-control mechanism is proposed. In addition, we also investigate the impact of channel fading on the video streaming applications, and propose a simple admission control algorithm to ensure QoS. As considering the physical-layer characteristics is critical for ensuring QoS and efficiency of resource utilization, the packet-level channel models, cross-layer analytical frameworks, networking protocols and simulation methodologies proposed in this dissertation are essential for future proliferation of high-rate wireless networks.

2016年全球半導體產值約 3,270 億美元，台灣半導體產值佔全球的23%，繼續蟬聯全球第二大半導體產業大國，排行僅次於美國。此外，台灣以出口為導向，根據我國財政部統計，2017上半年積體電路出口金額占整體出口總值的27.6%，是我國最主要的出口產品，可見半導體產業對台灣的影響力不言而喻。 近年來半導體併購浪潮興起，台灣廠商也無法置身事外，最受矚目非日月光與矽品的非合意併購案莫屬。一般學術論文對於非合意併購案的探討，著重於併購前的動機與併購後的綜效，鮮少討論雙方在併購過程中的攻防。故本研究欲以動態競爭觀點，並考量政府對併購成敗的影響，來找出矽品最後同意日月光共組控股公司之提案的原因，並分析此合併案對全球封測產業所造成的影響。 本研究發現雙方在合併前，應用產品及地區的市場共同性，分別呈現上升及下降趨勢，透過收購矽品，日月光不僅能追趕其主要競爭對手在車用電子的領先地位，更可以降低營收過度集中於北美的風險。另外，雙方在台灣及中國的專利申請數量有下降趨勢，但在美國專利的申請數有明顯增加且資源相似性也呈上升趨勢，故推論日月光收購矽品可鞏固其在北美市場的領導地位。總而言之，雖然日矽合併案被外界視為雙贏結果，但客戶轉單、中國商務部的限制條件及收購溢價偏高可能使得此合併綜效有限。在面對中國封測產商崛起、封測產業的市場集中度上升及半導體產業中下游界限越來越不明確的情況下，雙方合併為必然之勢。 / The worldwide semiconductor market grew 1.1% in 2016 to $338.9 billion USD, in which Taiwan accounts for 23% of the total output. Taiwan continues to rank as the world's second largest semiconductor industry, with the first being America. Taiwan is export oriented, and from the statistical data provided by the Ministry of Finance, the shipment of integrated circuit exports accounted for 27.6% of gross export value in the first two quarters of 2017. This indicates that integrated circuit is an important export product and that the semiconductor industry is of great importance to Taiwan. The recent and unprecedented M&A waves in the semiconductor industry caused major changes and created impact on Taiwanese semiconductor firm. The recent case that drew most attention is the M&A between ASE (Advanced Semiconductor Engineering, Inc.) and SPIL (Siliconware Precision Industries Co., Ltd). While most academic theses focus on the acquiring firm’s motive and post-M&A synergy, the offense and defense strategies during the M&A process are rarely explored. This research aims to focus on reasons why SPIL agreed on ASE’s proposal to form a joint venture holding company and the impact on the global OSAT (Outsourced Semiconductor Assembly and Test) industry after this M&A. This thesis utilized the dynamic competitive perspective and identifies government’s impact on M&A. The study finds that before the merger, the commonality of product shows an upward trend while the commonality of region market presents a downward direction. This merger not only assists ASE to catch up with its leading competitors in the automotive electronics sectors, but also reduce the revenue concentration risk, given that its major sales is in North America. In addition, the number of patents filed by both companies in Taiwan and China has declined, but the number in the United States has increased significantly along with an escalating resource similarity. Therefore, the research concludes that the acquisition of SPIL can consolidate ASE’s leading position in the North American market. To sum up, the merger of ASE and SPIL is regarded as win-win outcome. However, the M&A has risks, such as customer attrition, restriction from The Ministry of Commerce of the People's Republic of China (MOFCOM) and merger overpayment. Such uncertainties may reduce synergy. Nevertheless, in the face of the rise of China's OSAT business, the market concentration of OSAT industry, and the increasingly unclear boundary between the middle and downstream firms, the merger of the two firms is inevitable.

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