No description available.

No description available.

No description available.

This thesis proposes that compliant mechanism theory can be used to design over-running ratchet and pawl clutches with reduced part count, lower assembly and manufacturing time while maintaining functionality. An extension of the theory to the micro regime is also briefly addressed. The results of the research show that the ratchet and pawl type of over-running clutch is a good choice for the use of compliance, and the clutch pawls should be loaded in compression to get the largest amount of output torque. It was found that com-pliant mechanism theory can be used to design ratchet and pawl clutches with fewer parts and lower manufacturing and assembly costs, and that these clutches perform comparable to traditional rigid-body ratchet and pawl clutches. Compliant ratchet and pawl clutches can replace traditional rigid-body clutches in some applications and now make it possible to be used in applications where it was once not economically feasible to use a over-running clutch. It was also found that these clutches function at the micro level.

Surface micromachining of micro-electro-mechanical systems (MEMS), like all other fabrication processes, has inherent variation that leads to uncertain material and dimensional parameters. To obtain accurate and reliable predictions of mechanism behavior, the effects of these variations need to be analyzed. This thesis expands already existing tolerance and uncertainty analysis methods to apply to micro compliant mechanisms. For simple compliant members, explicit equations can be used in uncertainty analysis. However, for a nonlinear implicit system of equations, the direct linearization method may be used to obtain sensitivities of output parameters to small changes in known variables. This is done by including static equilibrium equations and pseudo-rigid-body model relationships with the kinematic vector loop equations. Examples are used to show a comparison of this method to other deterministic and probabilistic methods and finite element analysis.

The purpose of this research is to present a class of Self-Retracting Fully-compliant Bistable Micromechanisms (SRFBM). Fully-compliant mechanisms are needed to overcome the inherent limitations of microfabricated pin joints, especially in bistable mechanisms. The elimination of the clearances associated with pin joints will allow more efficient bistable mechanisms with smaller travel. Small travel, in a linear path facilitates integration with efficient on-chip actuators. Tensural pivots are developed and used to deal with the compressive loading to which the mechanism is subject. SRFBM are modeled using the Pseudo-Rigid-Body Model and finite element analysis. Suitable configurations of the SRFBM concept have been identified and fabricated using the MUMPs process. Complete systems, including external actuators and electrical contacts are 1140 μm by 625 μm (individual SRFBM are less than 300 μm by 300 μm). These systems have been tested, demonstrating on-chip actuation of bistable mechanisms. Power requirements for these systems are approximately 150 mW. Testing with manual force testers has also been completed and correlates well with finite element modeling. Actuation force is approximately 500 μN for forward actuation. Return actuation can be achieved either by external actuators or by thermal self-retraction of the mechanism. Thermal self-retraction is more efficient, but can result in damage to the mechanism. Fatigue testing has been completed on a single device, subjecting it to approximately 2 million duty cycles without failure. Based on the SRFBM concept a number of improvements and adaptations are presented, including systems with further power and displacement reductions and a G-switch for LIGA fabrication.

This thesis investigates end-effector systems used in a chemomechanical scribing process. Chemomechanical scribing is a method of patterning silicon to selectively deposit a monolayer of material on the surface of the silicon. This thesis details the development of a unique end-effector for chemomechanical scribing using a compliant mechanism solution. The end-effector is developed to scribe lines that have uniform geometry and produce less chipping on the surface of the silicon. The resulting scribing mechanism is passively controlled, has high lateral stiffness, and low axial stiffness. The mechanism is analyzed using the pseudo-rigid-body model and linear-elastic beam method to determine the axial stiffness, finite element methods to determine the lateral stiffness, and fatigue analysis to determine mechanism cycle life. This thesis also investigates the significance of mechanical factors on the chemomechanical scribing process using the compliant end-effector. The factors examined are scribing force, scribing speed, tip geometry, wafer orientation, and wetting liquid. The factors are analyzed using a two-step approach: first, an analysis of the influence of the mechanical factors on line characteristics and second, an analysis of the influence of line characteristics on line performance.

The Fully compliant Tensural Bistable Mechanism (FTBM) class is introduced. The class consists of fully compliant linear bistable mechanisms that achieve much of their displacement and bistable behavior through tension loading of compliant segments. Multiple topologies of designs arising from the FTBM class were designed using a finite element analysis (FEA) model with optimization. In a coupled design approach, thermal actuators were optimized to the force and displacement requirements of the bistable mech-anisms, and selected FTBM devices were combined in switching systems with the result-ing Thermomechanical In-plane Microactuators (TIMs) and Amplified Thermomechanical In-plane Microactuators (ATIMs). Successful on-chip actuation was demonstrated. The bistable mechanisms and actuators in this work were fabricated in the MUMPs and SUMMiT V surface micromachining MEMS fabrication technologies. The Stacked Amplified Thermomechanical In-plane Microactuator (StATIM) is also introduced. The StATIM is a compact linear output actuator based on the ATIM that is capable of large displacements relative to the size of the actuator. The StATIMs presented in this thesis were fabricated in the SUMMiT V technology.

The objective of this work is to demonstrate the feasibility of on-chip sensing of bistable mechanism state using the piezoresistive properties of polysilicon, thus eliminating the need for electrical contacts. Changes in position are detected by observing changes in resistance across the mechanism. Sensing the state of bistable mechanisms is critical in their various applications. The research in this thesis advances the modeling techniques of MEMS devices which use piezoresistivity for position sensing. A fully compliant bistable micro mechanism was designed, fabricated, and tested to demonstrate the feasibility of this sensing technique. Testing results from two fabrication processes, Fairchild's SUMMiT IV and MUMPs, are compared. The Fairchild mechanism was then integrated into various Wheatstone bridge configurations to show the advantages of bridges and to demonstrate various design layouts. Repeatable and detectable results were found with independent mechanisms and with those integrated into Wheatstone bridges. Finite element models were constructed for the different Wheatstone bridges which were used to predict piezoresistive trends. A bistable mechanism for high-acceleration sensing was designed using uncertainty analysis optimization. The piezoresistive effects for this mechanism were also modeled. Discussion concerning nonvolatile memory applications is also presented.

MEMS (MicroElectroMechanical Systems) sensors are used in acceleration, flow, pressure and force sensing applications on the micro and macro levels. Much research has focused on improving sensor precision, range, reliability, and ease of manufacture and operation. One exciting possibility for improving the capability of micro sensors lies in exploiting the piezoresistive properties of silicon, the material of choice in many MEMS fabrication processes. Piezoresistivity—the change of electrical resistance due to an applied strain—is a valuable material property of silicon due to its potential for high signal output and on-chip and feedback-control possibilities. However, successful design of piezoresistive micro sensors requires a more accurate model of the piezoresistive behavior of polycrystalline silicon. This study sought to improve the existing piezoresistive model by investigating the piezoresistive behavior of compliant polysilicon structures subjected to tensile, bending and combined loads. Experimental characterization data showed that piezoresistive sensitivity is greatest and mostly linear for silicon members subject to tensile stresses and nonlinear for beams in bending and combined stress states. The data also illustrated the failure of existing piezoresistance models to accurately account for bending and combined loads. Two MEMS force and displacement sensors, the integral piezoresistive micro-Force And Displacement Sensor (FADS) and Closed-LOop sensor (CLOO-FADS), were designed and fabricated. Although limited in its piezoresistive sensitivity and out-of-plane stability, the FADS design showed promise of future application in microactuator characterization. Similarly, the CLOO-FADS exhibited possible feedback control capability, but was limited by control circuit complexity and implementation challenges. The piezoresistive behavior exhibited by the Thermomechanical In-plane Microactuator (TIM) led to a focused effort to characterize the TIM's behavior in terms of force, displacement, actuation current and mechanism resistance. The gathered data facilitated the creation of an empirical, temperature-dependent model for the specific TIM. Based on the assumption of a nearly constant temperature for each current level, the model predicted the force and displacement for a given fractional change in resistance. Despite the success of the empirical model for the test TIM device, further investigation revealed the necessity of a calibration method to enable the model's application to other TIM devices.