Nowadays, there is a growing demand for high frequency-bandwidth mm-wave (30-300 GHz) electronic wireless transceiver systems to support applications such as high data-rate wireless communication and high resolution imaging. Such mm-wave systems are becoming more feasible due to the extreme transistor downscaling in silicon-based integrated circuits, which enabled densely-integrated high-speed elec- tronics operating up to more than 100 GHz with low fabrication cost. To further enhance system integrability, it is required to implement all wireless system compo- nents on the chip. Presently, the last major barrier to true System-on-Chip (SoC) realization is the antenna implementation on the silicon chip. Although at mm-wave frequencies the antenna size becomes small enough to fit on chip, the antenna performance is greatly deteriorated due the high conductivity and high relative permittivity of the silicon substrate. The negative e↵ects of the silicon substrate could be avoided by using a metallic reflecting surface on top of silicon, which e↵ectively isolates the antenna from the silicon. However, this approach has the shortcoming of having to implement the antenna on the usually very thin silicon oxide layer of a typical CMOS fabrication process (10’s of μm). This forces the antenna to be in a very close proximity (less than one hundredth of a wavelength) to the reflecting surface. In this regime, the use of conventional metallic reflecting surface for silicon shielding has severe e↵ects on the antenna performance as it tends to reduce the antenna radiation resistance resulting in most of the energy being absorbed rather than radiated. In this work, the use of specially patterned reflecting surfaces for improving on- chip antenna performance is investigated. By using a periodic metallic surface on top of a grounded substrate, the structure can mimic the behavior of a perfect mag- netic conductor, hence called Artificial Magnetic Conductor (AMC) surface. Unlike conventional ground plane reflecting surfaces, AMC surfaces generally enhance the radiation and impedance characteristics of close-by antennas. Based on this property, a ring-based AMC reflecting surface has been designed in the oxide layer for on-chip antennas operating at 94 GHz. Furthermore, a folded dipole antenna with its associ- ated planar feeding structures has been optimized and integrated with the developed ring-based AMC surface. The proposed design is then fabricated at KAUST clean- room facilities. Prototype characterization showed very promising results with good correlation to simulations, with the antenna exhibiting an impedance bandwidth of 10% (90-100 GHz) and peak gain of -1.4 dBi, which is the highest gain reported for on-chip antennas at this frequency band without the use of any external o↵-chip components or post-fabrication steps.

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Superconductivity Centennial Conference 2011- EUCAS–ISEC–ICMC (18-23 Sep 2011, The Hague, The Netherlands)

Gabriel Fauré’s Requiem, Op. 48 was an evolving work, which he continued to revise from its inception in 1887 until the published version of 1900. The focus and intent of this paper is to present a detailed analysis of Requiem, Op. 48 as well as historical background to aid conductors in the preparation and performance of this work. Discussions include the history of the requiem mass as a liturgical form, the evolution of Requiem, Op. 48, the John Rutter edition (1984) and his research, and a conductor’s analysis addressing issues of harmony, form, and style.

Since the discovery of the high temperature superconductor YBa2Cu3O7-δ (YBCO), with transition temperature (Tc = 77 K), above liquid nitrogen point in 1987 many research projects have been dedicated to enhancing the high field performance of this material for practical applications. The 2nd generation YBCO-based coated conductors are believed to be the most promising approach for commercial applications including power transmission, motors, generators, and high field magnets. With the advances of nanotechnologies, different nanoengineering methods have been demonstrated to enhance the performance of YBCO thin films, include doping with 0-dimensional (0-D) self-assembled nanoparticles, 1-dimensional (1-D) nanorods, and 2-dimensional (2-D) nanolayers. Furthermore, dopants with ferromagnetic properties are also reported to provide enhanced pinning effects by Lorentz force, especially under high-applied magnetic fields. The principle of these methods is to generate high-density defects at the heterogeneous interfaces as artificial pinning centers in an effort to improve the flux-pinning properties. The morphology and dimensions of the nanoinclusions play an important role in pining enhancement. Optimized pinning structures are likely to be located at energetically favorable vortex cores, which form a triangular lattice with dimensions close to the YBCO coherence length ξ (ξab ~ 4 nm; ξc ~ 0.5 nm at 77 K.) However, it is challenging to achieve small dimensional nanodopants in the vapor deposited YBCO thin films. The purpose of this research is to utilize nanoengineering methods to produce optimized pinning structure in YBCO thin films. In this thesis, we systematically study the effects of different nanoinclusions on the flux-pinning properties of YBCO thin films. The 0-D ferromagnetic Fe2O3 and CoFe2O4 nanoparticles, 2-D CeO2 multilayers, and tunable vertically aligned nanocomposites (VAN) of (Fe2O3)x:(CeO2)1-x and (CoFe2O4)x:(CeO2)1-x systems are introduced into the YBCO matrix as artificial pinning centers. Results suggest that all nanoinclusions showed significant enhancement in the superconducting properties of YBCO. The ferromagnetic pinning centers dominate at high field and low temperature regimes, however, the defect pinning centers dominate at low field and high temperature regimes. The uniquely arranged VAN structure of alternating magnetic and non-magnetic nanophases, which incorporates both high defect density and tunable distribution of magnetic dopants, is believed to be an ideal solution for flux-pinning enhancement.

京都大学 / 新制・課程博士 / 博士(理学) / 甲第23721号 / 理博第4811号 / 新制||理||1689(附属図書館) / 京都大学大学院理学研究科化学専攻 / (主査)教授 北川 宏, 教授 吉村 一良, 教授 竹腰 清乃理 / 学位規則第4条第1項該当 / Doctor of Science / Kyoto University / DGAM

Les composants semi-conducteurs à base de matériaux à grand gap (SiC et GaN) présentent des caractéristiques intéressantes pour la réalisation de convertisseurs d’électronique de puissance toujours plus intégrés. Cependant, le packaging des composants traditionnels en silicium ne semble plus adapté pour ces nouveaux composants et apparaît même comme un facteur limitant. Le développement d’un packaging adapté aux caractéristiques des composants à grand gap est alors nécessaire. Les travaux développés dans cette thèse proposent un nouveau packaging tridimensionnel basé sur un procédé de fabrication de circuit imprimé. L’architecture du module est basé sur le concept « Power Chip On Chip » dont le principe de base permet de réduire les perturbations électromagnétiques. Le procédé de fabrication des circuits imprimés offre une grande flexibilité pour le routage en trois dimensions et permet de s’affranchir de l’interconnexion par fil de bonding entre le package et la puce. La démarche de conception du module s’appuie sur une approche multi-physique afin de qualifier le comportement électromagnétique et thermique du module puis de proposer des voies d’optimisation. Un prototype d’un module implémentant quatre cellules de commutation en parallèle, à base de MOSFET SiC, a été produit avec des moyens de production industriels. Les différents tests réalisés valident l’approche retenue dans ce projet mais soulignent également les aspects technologiques à approfondir pour la réalisation d’un module de puissance industriel. / Wide-band-gap (WBG) semiconductors (SiC and Gan) offer interesting characteristics to realize high density power electronics converters. Conventional packaging used for silicon devices is no more adapted for those now components. Development of dedicated packaging for WBG devices is absolutely required. This PhD thesis presents a new 3D package based on Printed Circuit Board (PCB) industrial process. The module architecture is based on “Power Chip On Chip” concept which allows reducing electromagnetic perturbations. PCB fabrication process offers high design flexibility in three dimensions and allows removing wire bonding to interconnect power die and package. The power module design process is buit on multi-physics design tools in the aim to quantify electromagnetic and thermal behavior of the module. Furthermore, several optimization parameters are highlighted. A power module prototype, with four commutation cells in parallel based on SiC MOSFET, has been produced thanks to industrial facilities. Tests realized on new power module confirm the validity of the concept but furthermore to highlight critical technological parameters to realize an industrial power module.

abstract: Antennas are required now to be compact and mobile. Traditional horizontally polarized antennas are placed in a quarter wave distance from a ground plane making the antenna system quite bulky. High impedance surfaces are proposed for an antenna ground in close proximity. A new method to achieve a high impedance surface is suggested using a metamaterial comprising an infinite periodic array of conducting loops each of which is loaded with a non-Foster element. The non-Foster element cancels the loop's inductance resulting in a material with high effective permeability. Using this material as a spacer layer, it is possible to achieve a high impedance surface over a broad bandwidth. The proposed structure is different from Sievenpiper's high impedance surface because it has no need for a capacitive layer. As a result, however, it does not suppress the propagation of surface wave modes. The proposed structure is compared to another structure with frequency selective surface loaded with a non-Foster element on a simple spacer layer. In particular, the sensitivity of each structure to component tolerances is considered. The proposed structure shows a high impedance surface over broadband frequency but is much more sensitive than the frequency selective surface structure. / Dissertation/Thesis / M.S. Electrical Engineering 2010

One of the central themes of modern Number Theory is to study properties of Galois and automorphic representations and connections between them. In our dissertation, we describe two different projects that study properties of these objects. In our first project, which is analytic in nature, we consider Artin representations of Q of dimension 3 that are self-dual. We show that these occur with density 0 when counted using the conductor. This provides evidence that self-dual representations should be rare in all dimensions. Our second project, which is more algebraic in nature, is related to automorphic representations. We show the existence of canonical models for certain unitary Shimura varieties. This should help us in computing certain cohomology groups of these varieties, in which regular algebraic automorphic representations having useful properties should be found.