Recently the semiconductor industry tends to develop a smaller volume device and system with lower power consumption, lower leakage current, and high speed performance. SOI technology having many unique characteristics is one of the most hopeful methods in the direction. As semiconductor memory is concerned, The 1T-DRAM cell realized by the concept of floating body effect in a PD-SOI nMOSFET, that can allow DRAM cell to be scaled down in depth with less area occupied .In this paper, we will propose a new structure of 1T-DRAM cell, which has the buried oxide and block oxide around its body. It can suppress the junction capacitor between the S/D and the body of the cell. In addition it can also improve the programming window of the 1T-DRAM cell more than 80% by utilizing its own structural characteristic. We fabricated our new device in National Nano Device Laboratories. The device was carried out by depositing oxide and poly film on bulk Si wafer, just like TFT process. But doing by this way it has some issues about the polycrystalline channel and the S/D. Although it has some issues, but we made it successful using bulk Si wafer rather than expensive SOI wafer. It indeed reduces the cost of process.

In this paper, we propose a novel thin film MOSFET with source/drain tie and discontinuously block oxide layers. Improving process is very important, when the gate length of SOI MOSFET is reduced. To overcome the misalignment problem, we use self-aligned technology to fabricate this device. In addition, the device has discontinuously block oxide layers; they can improve short channel effects, reduce the parasitic capacitance, and decrease the leakage current cause by P-N junction between source/drain and body regions. They also supply two pass ways to eliminate carriers and heat which generated by impact ionization resulting in suppression of floating-body effect and self-heating effect. In addition, these two pass ways can be seen as the parallel equivalent resistance results in a reduced series resistance and an increased drain saturation current. According to the ISE TCAD 10.0 simulation results, the discontinuously block oxide layers can not only improve the short channel effects, but also eliminate the floating-body effect and diminish the self-heating effect because of the pass ways.

In this thesis, we present a new Poly - Si TFT process method to overcome Self - heating effect and Floating body effect. The main drawback of a conventional Poly - Si TFT is the existence of self - heating effect and floating body effect. The self - heating effect leads to drain current reduced and the floating body effect leads to premature device breakdown and kink effects. Here, we utilize all kinds of different isolation technologies to form non - continuing buried layer. Between the non - continuing buried layer there are pass ways, which contact the active region and the substrate directly. Because of conventional LOCOS isolation technology has longer bird¡¦s beak, the familiar method of SILO and PBL isolation technologies are used to reduce bird¡¦s beak. Also, we use STI isolation technology to build up non - continuing buried layer, which can control the width of pass way more easily. It is proved from the measurement that the pass way can slow down the self - heating effect and the floating body effect successfully.

Esta dissertação apresenta os resultados obtidos no estudo do funcionamento dinâmico de uma célula de memória composta por um único transistor SOI MOSFET. Este estudo é baseado nos resultados experimentais observados em dispositivos nMOSFET em tecnologia SOI desenvolvidos no imec, Leuven, Bélgica. Os dados experimentais apresentados foram obtidos no Laboratório de Sistemas Integráveis (LSI) da Escola Politécnica da Universidade de São Paulo (EPUSP) e nos laboratórios AMSIMEC do centro de pesquisa imec, Bélgica. No presente trabalho foi levantado o histórico das memórias dinâmicas, assim como as características fundamentais de uma célula de memória dinâmica de um único transistor, tais como tempo de retenção e margem de sensibilidade, que são definidas e posteriormente verificadas para diferentes tipos de transistores. Inicialmente, foram estudados os mecanismos capazes de promover algum tipo de histerese na curva de corrente de fonte-dreno em função da tensão de porta de um transistor SOI em DC. Por meio destas propriedades, muitas vezes vistas como parasitárias, foi possível explorar o comportamento de um único transistor como célula de memória. Em seguida, passou-se às medidas dinâmicas, momento no qual foi necessário desenvolver um arranjo experimental conveniente de forma que fosse possível medir pulsos da ordem de µA com duração da ordem de 10ns. Assim, uma parte desta dissertação é dedicada à descrição dos problemas e soluções encontrados para viabilizar a medida destes rápidos e pequenos sinais. Foram observados dispositivos com tempos de retenção superiores a 100ms e margens de sensibilidades que ultrapassam 100µA. Finalmente, são apresentadas as conclusões encontradas e as possibilidades para estudos futuros. / This masters thesis presents the results obtained throughout the study of a memory cell composed of a single SOI MOSFET transistor. This study is based on the experimental results observed on SOI nMOSFET devices developed at imec, Leuven, Belgium. The experimental data presented was obtained both at the Laboratório de Sistemas Integráveis (LSI) from the Escola Politécnica da USP (EPUSP) and the AMSIMEC laboratories in the imec research center, Belgium. In this work, the history of dynamic memories as well as the fundamental characteristics of a single transistor dynamic memory cell, such as retention time and sense margin, which are defined and later verified for different transistors, have been analysed. Initially, the mechanisms capable of leading to some sort of hysteresis on the drain-source current as a function of the gate voltage on a SOI transistor operating in DC were studied. Through these properties many times regarded as parasitic it was possible to explore the behavior of a single SOI transistor operating as a memory cell. Afterwards, this work analyzes dynamic measurements, for which it has been necessary to develop an appropriate experimental setup capable of measuring pulses of some µA and lasting approximately 10ns. Therefore, part of this thesis is reserved for the description of the problems and solutions found in order to enable the measurement of these fast and small signals. Devices with retention times larger than 100ms and sense margins surpassing 100µA were measured. Finally, conclusions and possible future studies are presented.

Esta dissertação apresenta os resultados obtidos no estudo do funcionamento dinâmico de uma célula de memória composta por um único transistor SOI MOSFET. Este estudo é baseado nos resultados experimentais observados em dispositivos nMOSFET em tecnologia SOI desenvolvidos no imec, Leuven, Bélgica. Os dados experimentais apresentados foram obtidos no Laboratório de Sistemas Integráveis (LSI) da Escola Politécnica da Universidade de São Paulo (EPUSP) e nos laboratórios AMSIMEC do centro de pesquisa imec, Bélgica. No presente trabalho foi levantado o histórico das memórias dinâmicas, assim como as características fundamentais de uma célula de memória dinâmica de um único transistor, tais como tempo de retenção e margem de sensibilidade, que são definidas e posteriormente verificadas para diferentes tipos de transistores. Inicialmente, foram estudados os mecanismos capazes de promover algum tipo de histerese na curva de corrente de fonte-dreno em função da tensão de porta de um transistor SOI em DC. Por meio destas propriedades, muitas vezes vistas como parasitárias, foi possível explorar o comportamento de um único transistor como célula de memória. Em seguida, passou-se às medidas dinâmicas, momento no qual foi necessário desenvolver um arranjo experimental conveniente de forma que fosse possível medir pulsos da ordem de µA com duração da ordem de 10ns. Assim, uma parte desta dissertação é dedicada à descrição dos problemas e soluções encontrados para viabilizar a medida destes rápidos e pequenos sinais. Foram observados dispositivos com tempos de retenção superiores a 100ms e margens de sensibilidades que ultrapassam 100µA. Finalmente, são apresentadas as conclusões encontradas e as possibilidades para estudos futuros. / This masters thesis presents the results obtained throughout the study of a memory cell composed of a single SOI MOSFET transistor. This study is based on the experimental results observed on SOI nMOSFET devices developed at imec, Leuven, Belgium. The experimental data presented was obtained both at the Laboratório de Sistemas Integráveis (LSI) from the Escola Politécnica da USP (EPUSP) and the AMSIMEC laboratories in the imec research center, Belgium. In this work, the history of dynamic memories as well as the fundamental characteristics of a single transistor dynamic memory cell, such as retention time and sense margin, which are defined and later verified for different transistors, have been analysed. Initially, the mechanisms capable of leading to some sort of hysteresis on the drain-source current as a function of the gate voltage on a SOI transistor operating in DC were studied. Through these properties many times regarded as parasitic it was possible to explore the behavior of a single SOI transistor operating as a memory cell. Afterwards, this work analyzes dynamic measurements, for which it has been necessary to develop an appropriate experimental setup capable of measuring pulses of some µA and lasting approximately 10ns. Therefore, part of this thesis is reserved for the description of the problems and solutions found in order to enable the measurement of these fast and small signals. Devices with retention times larger than 100ms and sense margins surpassing 100µA were measured. Finally, conclusions and possible future studies are presented.

In this thesis, we propose a novel vertical MOSFET device with middle partial insulator (MPI) or VMPI for capacitorless one transistor dynamic random access memory (1T-DRAM) application. In TCAD simulations, we compare the device performances of the planar MPI, conventional silicon-on-insulator SOI, and our proposed VMPI. Based on numerical simulation, we find out that the VMPI device has a large kink phenomenon for improving the programming window. As far as the data retention time is concerned, the hole carriers leaking into the source region are reduced due to the presence of a large pseudo neutral region and an effective blocking oxide layer. The retention time can thus be improved about 5 times when compared with conventional SOI counterpart. Furthermore, it should be noted that the gate-all-around (GAA) VMPI device structure not only increases the body pseudo-neutral region, but also enhances the 1T-DRAM performances, suggesting that the proposed VMPI can become a candidate for 1T-DRAM application.

This thesis is mainly proposed and discussed the characteristics of polycrystalline silicon thin film transistor putting forward and probing into four kinds of novel buried-oxide structures. Because of the shortcoming of the traditional polycrystalline silicon thin film transistor, like leakage current (On/Off state current), subthreshold swing, floating body effect (kink effect), self-heating effect, and short channel effect etc.. Thus, we propose and fabricate four kinds of novel structural polycrystalline silicon thin film transistors that are involved in the following, indicating to improve the critical issues of polycrystalline silicon thin film transistor mentioned above. 1. We propose and fabricate the multiple/dual trenched-body polycrystalline silicon thin film transistor. This proposed structure is demonstrated to obviously suppress the off-state leakage up to 70% reduction, comparing with the conventional device. Also, we survey the reliability of this proposed device included temperature and DC hot-carrier stress effects. We found that the trenched-body TFTs perform more rapid degradation than the conventional TFT does after the temperature and stress durations, but their electrical characteristics are still superior to the conventional counterparts. Importantly, we demonstrate that this proposed device have a dramatic potential to be a novel capacitorless 1T-DRAM, because of its large floating-body-charge storages. As the experiment, the large threshold voltage shift is examined apparently after a certain write and erase operations, leading to a manifest programming window. 2. We propose and fabricate the block-oxide polycrystalline silicon thin film transistor. This proposed structure can not only improve the leakage issue of conventional device seriously, but also avoid fluctuating threshold voltage attributed from the ultra-thin film effect. 3. We propose and fabricate the floating-body contact polycrystalline silicon thin film transistor. This structure is modified by the conventional contact window in order to effectively improve the kink effect, utilizing the bottom gate polycrystalline silicon thin film transistor. 4. Finally, we propose and simulate the non-continuous buried layer polycrystalline silicon thin film transistor. This structure built upon the field oxidation layer can effectively improve the self-heating effect and kink effect. Furthermore, this structure is simple to fabricate, practical, and completely compatible on CMOS technology.

Este trabalho apresenta o estudo do efeito de elevação atípica da transcondutância na região linear de polarização devido ao efeito de corpo flutuante induzido pela porta (Gate Induced Floating Body Effect - GIFBE) de transistores da tecnologia SOI nMOSFET. Este estudo foi realizado com base em resultados experimentais e em simulações numéricas, as quais foram essenciais para o entendimento físico deste fenômeno. Além de contribuir com a explicação física deste fenômeno, este trabalho explora o efeito de corpo flutuante em diferentes estruturas (transistor de porta única, transistor de porta gêmea, transistor de múltiplas portas e transistores de canal tensionado), diferentes tecnologias e em função da temperatura (100K a 450K). A partir do estudo realizado em dispositivos SOI de porta única analisouse a influência das componentes da corrente de porta que tunelam através do óxido de porta do dispositivo, o potencial da região neutra do corpo do transistor, a taxa de recombinação de portadores, o impacto da redução da espessura do óxido de porta e também as dimensões físicas do transistor. Na análise feita da redução do comprimento de canal, verificou-se também que o GIFBE tende a ser menos significativo para dispositivos ultra-submicrométricos. Analisou-se também o efeito da elevação atípica da transcondutância para transistores SOI totalmente depletados, para os quais, este efeito ocorre apenas quando a segunda interface está acumulada, para as duas tecnologias estudadas (65nm e 130nm). A análise dos dispositivos de porta gêmea, que tradicionalmente são usados com a finalidade de minimizar o efeito de elevação abrupta de corrente de dreno, mostrou uma redução do GIFBE para este tipo de estrutura quando comparada à de porta única devido ao aumento da resistência série intrínseca à estrutura. O efeito de corpo flutuante também foi avaliado em função da temperatura de operação dos dispositivos. Para temperaturas variando de 100K a 450K, notou-se que o valor do limiar de GIFBE aumentou tanto para temperaturas acima de 300K quanto abaixo da mesma. Quando estes resultados são apresentados graficamente, observa-se que o comportamento do limiar de GIFBE com a temperatura resulta no formato de uma letra C, onde o valor mínimo está a 300K. Este comportamento se deve à competição entre o processo de recombinação e a degradação efetiva da mobilidade. Uma primeira análise do GIFBE em diferentes estruturas de transistores também foi realizada. Apesar dos transistores de canal tensionado apresentarem o efeito para valores menores de tensão de porta, este efeito se manifesta com menor intensidade nestes transistores, devido a alta degradação da mobilidade efetiva apresentada pelo mesmo. Entretanto, quando o foco são os transistores de múltiplas portas, os resultados obtidos demonstram que apesar destes dispositivos terem sido fabricados com dielétrico de porta de alta constante dielétrica, o GIFBE ainda ocorre. Esta ocorrência do GIFBE em FinFETs é fortemente dependente da largura do Fin, da dopagem da região de canal e conseqüentemente do acoplamento das portas laterais com a superior. / This work presents the study of the Gate Induced Floating Body Effect (GIFBE) that occurs in the SOI MOSFET technology. This study has been performed based on experimental results and on numerical simulations, which were an essential auxiliary tool to obtain a physical insight of this effect. Besides the contribution on the physical explanation of this phenomenon, in this work, the floating body effect was evaluated for different structures (single gate and twin-gate transistors), different technologies (130nm and 65nm SOI CMOS technology) and as a function of the temperature (100K to 450K). From the study of the single gate devices, it was evaluated the gate tunneling current influence on GIFBE, the body potential in the neutral region, the recombination rate, the front gate oxide thickness reduction impact, besides the physical dimensions of the transistor. In the performed analysis, taking into account the channel length reduction, it was verified that the GIFBE tends to be less important for ultra-submicron devices. The GIFBE only occurs for fully depleted devices when the second interface is accumulated. In this situation, the floating body effect influence on fully depleted devices was also studied for both technologies (65nm and 130nm). The twin-gate devices analysis, that traditionally are used in order to minimize the Kink effect, show a GIFBE reduction for this structure when it is compared to the single gate one. This enhance in the electrical characteristics is due to the series resistance increase that is intrinsic of this structures. When the temperature variation from 100K to 450K was analyzed, it was obtained the C shape behavior for the floating body effect due to a competition between the recombination process and the effective mobility degradation factor. A first evaluation of the GIFBE occurrence in new devices was also performed. When the focus is the strained silicon transistor, a occurrence of GIFBE was obtained for a lower gate voltage. Although, the GIFBE occurs earlier for strained transistor. This effect is less pronounced in this device because it presents strong effective mobility degradation. When the focus is FinFETs, the results show that although this device was fabricated with a high-k gate dielectric, the GIFBE still occurs and is strongly dependent on the device channel width.

Este trabalho apresenta o estudo do efeito de elevação atípica da transcondutância na região linear de polarização devido ao efeito de corpo flutuante induzido pela porta (Gate Induced Floating Body Effect - GIFBE) de transistores da tecnologia SOI nMOSFET. Este estudo foi realizado com base em resultados experimentais e em simulações numéricas, as quais foram essenciais para o entendimento físico deste fenômeno. Além de contribuir com a explicação física deste fenômeno, este trabalho explora o efeito de corpo flutuante em diferentes estruturas (transistor de porta única, transistor de porta gêmea, transistor de múltiplas portas e transistores de canal tensionado), diferentes tecnologias e em função da temperatura (100K a 450K). A partir do estudo realizado em dispositivos SOI de porta única analisouse a influência das componentes da corrente de porta que tunelam através do óxido de porta do dispositivo, o potencial da região neutra do corpo do transistor, a taxa de recombinação de portadores, o impacto da redução da espessura do óxido de porta e também as dimensões físicas do transistor. Na análise feita da redução do comprimento de canal, verificou-se também que o GIFBE tende a ser menos significativo para dispositivos ultra-submicrométricos. Analisou-se também o efeito da elevação atípica da transcondutância para transistores SOI totalmente depletados, para os quais, este efeito ocorre apenas quando a segunda interface está acumulada, para as duas tecnologias estudadas (65nm e 130nm). A análise dos dispositivos de porta gêmea, que tradicionalmente são usados com a finalidade de minimizar o efeito de elevação abrupta de corrente de dreno, mostrou uma redução do GIFBE para este tipo de estrutura quando comparada à de porta única devido ao aumento da resistência série intrínseca à estrutura. O efeito de corpo flutuante também foi avaliado em função da temperatura de operação dos dispositivos. Para temperaturas variando de 100K a 450K, notou-se que o valor do limiar de GIFBE aumentou tanto para temperaturas acima de 300K quanto abaixo da mesma. Quando estes resultados são apresentados graficamente, observa-se que o comportamento do limiar de GIFBE com a temperatura resulta no formato de uma letra C, onde o valor mínimo está a 300K. Este comportamento se deve à competição entre o processo de recombinação e a degradação efetiva da mobilidade. Uma primeira análise do GIFBE em diferentes estruturas de transistores também foi realizada. Apesar dos transistores de canal tensionado apresentarem o efeito para valores menores de tensão de porta, este efeito se manifesta com menor intensidade nestes transistores, devido a alta degradação da mobilidade efetiva apresentada pelo mesmo. Entretanto, quando o foco são os transistores de múltiplas portas, os resultados obtidos demonstram que apesar destes dispositivos terem sido fabricados com dielétrico de porta de alta constante dielétrica, o GIFBE ainda ocorre. Esta ocorrência do GIFBE em FinFETs é fortemente dependente da largura do Fin, da dopagem da região de canal e conseqüentemente do acoplamento das portas laterais com a superior. / This work presents the study of the Gate Induced Floating Body Effect (GIFBE) that occurs in the SOI MOSFET technology. This study has been performed based on experimental results and on numerical simulations, which were an essential auxiliary tool to obtain a physical insight of this effect. Besides the contribution on the physical explanation of this phenomenon, in this work, the floating body effect was evaluated for different structures (single gate and twin-gate transistors), different technologies (130nm and 65nm SOI CMOS technology) and as a function of the temperature (100K to 450K). From the study of the single gate devices, it was evaluated the gate tunneling current influence on GIFBE, the body potential in the neutral region, the recombination rate, the front gate oxide thickness reduction impact, besides the physical dimensions of the transistor. In the performed analysis, taking into account the channel length reduction, it was verified that the GIFBE tends to be less important for ultra-submicron devices. The GIFBE only occurs for fully depleted devices when the second interface is accumulated. In this situation, the floating body effect influence on fully depleted devices was also studied for both technologies (65nm and 130nm). The twin-gate devices analysis, that traditionally are used in order to minimize the Kink effect, show a GIFBE reduction for this structure when it is compared to the single gate one. This enhance in the electrical characteristics is due to the series resistance increase that is intrinsic of this structures. When the temperature variation from 100K to 450K was analyzed, it was obtained the C shape behavior for the floating body effect due to a competition between the recombination process and the effective mobility degradation factor. A first evaluation of the GIFBE occurrence in new devices was also performed. When the focus is the strained silicon transistor, a occurrence of GIFBE was obtained for a lower gate voltage. Although, the GIFBE occurs earlier for strained transistor. This effect is less pronounced in this device because it presents strong effective mobility degradation. When the focus is FinFETs, the results show that although this device was fabricated with a high-k gate dielectric, the GIFBE still occurs and is strongly dependent on the device channel width.

En raison de leur impact sur la fiabilité des systèmes, les effets du rayonnement cosmique sur l’électronique ont été étudiés dès le début de l’exploration spatiale. Néanmoins, de récentes évolutions industrielles bouleversent les pratiques dans le domaine, les technologies standard devenant de plus en plus attrayantes pour réaliser des circuits durcis aux radiations. Du fait de leurs fréquences élevées, des nouvelles architectures de transistor et des temps de durcissement réduits, les puces fabriquées suivant les derniers procédés CMOS posent de nombreux défis. Ce travail s’attelle donc à la simulation des aléas logiques permanents (SEU) et transitoires (SET), en technologies FD-SOI et bulk Si avancées. La réponse radiative des transistors FD-SOI 28 nm est tout d’abord étudiée par le biais de simulations TCAD, amenant au développement de deux modèles innovants pour décrire les courants induits par particules ionisantes en FD-SOI. Le premier est principalement comportemental, tandis que le second capture des phénomènes complexes tels que l’amplification bipolaire parasite et la rétroaction du circuit, à partir des premiers principes de semi-conducteurs et en accord avec les simulations TCAD poussées.Ces modèles compacts sont alors couplés à une plateforme de simulation Monte Carlo du taux d’erreurs radiatives (SER) conduisant à une large validation sur des données expérimentales recueillies sous faisceau de particules. Enfin, des études par simulation prédictive sont présentées sur des cellules mémoire et portes logiques en FD-SOI 28 nm et bulk Si 65 nm, permettant d’approfondir la compréhension des mécanismes contribuant au SER en orbite des circuits intégrés modernes / The effects of cosmic radiation on electronics have been studied since the early days of space exploration, given the severe reliability constraints arising from harsh space environments. However, recent evolutions in the space industry landscape are changing radiation effects practices and methodologies, with mainstream technologies becoming increasingly attractive for radiation-hardened integrated circuits. Due to their high operating frequencies, new transistor architectures, and short rad-hard development times, chips manufactured in latest CMOS processes pose a variety of challenges, both from an experimental standpoint and for modeling perspectives. This work thus focuses on simulating single-event upsets and transients in advanced FD-SOI and bulk silicon processes.The soft-error response of 28 nm FD-SOI transistors is first investigated through TCAD simulations, allowing to develop two innovative models for radiation-induced currents in FD-SOI. One of them is mainly behavioral, while the other captures complex phenomena, such as parasitic bipolar amplification and circuit feedback effects, from first semiconductor principles and in agreement with detailed TCAD simulations.These compact models are then interfaced to a complete Monte Carlo Soft-Error Rate (SER) simulation platform, leading to extensive validation against experimental data collected on several test vehicles under accelerated particle beams. Finally, predictive simulation studies are presented on bit-cells, sequential and combinational logic gates in 28 nm FD-SOI and 65 nm bulk Si, providing insights into the mechanisms that contribute to the SER of modern integrated circuits in orbit